ES2169212T3 - Aparato para enfriar placas de circuito impreso en la soldadura por ola. - Google Patents
Aparato para enfriar placas de circuito impreso en la soldadura por ola.Info
- Publication number
- ES2169212T3 ES2169212T3 ES96306340T ES96306340T ES2169212T3 ES 2169212 T3 ES2169212 T3 ES 2169212T3 ES 96306340 T ES96306340 T ES 96306340T ES 96306340 T ES96306340 T ES 96306340T ES 2169212 T3 ES2169212 T3 ES 2169212T3
- Authority
- ES
- Spain
- Prior art keywords
- wave
- card
- welding
- printed circuit
- circuit plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
SE PRESENTA UN APARATO Y UN METODO PARA SOLDAR COMPONENTES A UNA TARJETA DE CIRCUITO (15). EL APARATO INCLUYE UN DISPOSITIVO TRANSPORTADOR EN UN TUNEL (14) PARA TRANSPORTAR LA TARJETA (15) A TRAVES DE UNA ZONA DE PRECALENTAMIENTO (16), ONDAS FUNDIDAS DE SOLDADURA QUE INCLUYEN UNA ONDA TURBULENTA (18) Y UNA OLA LAMINAR (20), Y UNA ZONA DE ENFRIAMIENTO (22) A TRAVES DE LA CUAL LA TARJETA (15) PASA DESPUES DE SALIR DE LA ONDA DE FLUJO LAMINAR (20) DE LA ONDA DE SOLDADURA. EL APARATO COMPRENDE ADEMAS AL MENOS UN DISTRIBUIDOR (24) MONTADO EN EL TUNEL (14) QUE TIENE UN PUERTO DE ENTRADA (26) PARA RECIBIR UN GAS FRIO BAJO PRESION Y AL MENOS UNA BOQUILLA DE SALIDA (28) PARA DIRIGIR EL GAS FRIO HACIA LA TARJETA DE CIRCUITO (15), ENFRIANDO RAPIDAMENTE DE ESTA FORMA LA TARJETA DE CIRCUITO Y SUS COMPONENTES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/524,662 US5685475A (en) | 1995-09-08 | 1995-09-08 | Apparatus for cooling printed circuit boards in wave soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2169212T3 true ES2169212T3 (es) | 2002-07-01 |
Family
ID=24090165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96306340T Expired - Lifetime ES2169212T3 (es) | 1995-09-08 | 1996-09-02 | Aparato para enfriar placas de circuito impreso en la soldadura por ola. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5685475A (es) |
EP (1) | EP0761361B1 (es) |
JP (1) | JPH0983125A (es) |
DE (1) | DE69616912T2 (es) |
ES (1) | ES2169212T3 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4416788C2 (de) * | 1994-05-06 | 1999-08-19 | Siemens Ag | Verfahren zum Wellenlöten von Leiterplatten |
DE19632335C2 (de) * | 1996-08-10 | 1999-01-21 | Messer Griesheim Gmbh | Verfahren und Vorrichtung zur mechanischen Beseitigung von Lotkugeln auf der Obfläche von Leiterplatten |
JP3638415B2 (ja) * | 1997-01-20 | 2005-04-13 | 日本電熱計器株式会社 | ガス雰囲気はんだ付け装置 |
US5993500A (en) * | 1997-10-16 | 1999-11-30 | Speedline Technololies, Inc. | Flux management system |
JP2000244108A (ja) * | 1999-02-22 | 2000-09-08 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置 |
TW516346B (en) * | 1999-04-06 | 2003-01-01 | Eighttech Tectron Co Ltd | Device for heating printed-circuit board |
JP4332281B2 (ja) * | 2000-04-26 | 2009-09-16 | 株式会社日立製作所 | 電子装置の製造方法およびはんだ付け装置 |
US6648216B2 (en) * | 2000-08-21 | 2003-11-18 | Matsushita Electric Industrial Co., Ltd. | Process and apparatus for flow soldering |
EP1405687B1 (en) * | 2000-09-26 | 2009-12-09 | Panasonic Corporation | Method and device for flow soldering |
US6401463B1 (en) | 2000-11-29 | 2002-06-11 | Marconi Communications, Inc. | Cooling and heating system for an equipment enclosure using a vortex tube |
US7565808B2 (en) * | 2005-01-13 | 2009-07-28 | Greencentaire, Llc | Refrigerator |
ATE501805T1 (de) | 2006-05-23 | 2011-04-15 | Linde Ag | Vorrichtung und verfahren zum wellenlöten |
US7726135B2 (en) * | 2007-06-06 | 2010-06-01 | Greencentaire, Llc | Energy transfer apparatus and methods |
US9198300B2 (en) * | 2014-01-23 | 2015-11-24 | Illinois Tool Works Inc. | Flux management system and method for a wave solder machine |
DE102015106298B4 (de) * | 2015-04-24 | 2017-01-26 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579853A (en) * | 1968-12-05 | 1971-05-25 | Joseph J Martino | Circuit board drier |
US3724418A (en) * | 1971-08-20 | 1973-04-03 | Lain J Mc | Solder coating apparatus |
DE2932398C2 (de) * | 1979-08-09 | 1981-10-15 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum Kühlen von Leiterplatten nach dem maschinellen Einlöten von elektrischen Bauteilen |
US4390120A (en) * | 1980-12-15 | 1983-06-28 | Bell Telephone Laboratories, Incorporated | Soldering methods and apparatus |
DE3171729D1 (en) * | 1981-02-23 | 1985-09-12 | Matsushita Electric Ind Co Ltd | Soldering apparatus |
JPS6281264A (ja) * | 1985-10-02 | 1987-04-14 | Alps Electric Co Ltd | 半田付装置 |
DE3611180C1 (en) * | 1986-04-03 | 1987-01-29 | Siemens Ag | Device for cooling soldered-work carrier and solder deposit in soldering units |
US4679720A (en) * | 1986-10-23 | 1987-07-14 | Hollis Automation, Inc. | Mass soldering system providing a sweeping fluid blast |
DE8700269U1 (es) * | 1987-01-07 | 1987-02-19 | Ersa Ernst Sachs Kg, Gmbh & Co, 6980 Wertheim, De | |
DE3737563A1 (de) * | 1987-11-05 | 1989-05-18 | Ernst Hohnerlein | Loetmaschine |
DE3843191C2 (de) * | 1988-12-22 | 1994-09-15 | Broadcast Television Syst | Vorrichtung zum Löten |
JPH0446666A (ja) * | 1990-05-31 | 1992-02-17 | Eiteitsuku Tekutoron Kk | リフロ―半田付け方法及び装置 |
US5240169A (en) * | 1991-12-06 | 1993-08-31 | Electrovert Ltd. | Gas shrouded wave soldering with gas knife |
JP2567336B2 (ja) * | 1993-04-23 | 1996-12-25 | 一郎 川勝 | 不活性雰囲気中のハンダ付け装置 |
US5520320A (en) * | 1994-04-22 | 1996-05-28 | Air Liquide America Corporation | Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere |
-
1995
- 1995-09-08 US US08/524,662 patent/US5685475A/en not_active Expired - Fee Related
-
1996
- 1996-07-17 JP JP8187752A patent/JPH0983125A/ja active Pending
- 1996-09-02 ES ES96306340T patent/ES2169212T3/es not_active Expired - Lifetime
- 1996-09-02 DE DE69616912T patent/DE69616912T2/de not_active Expired - Fee Related
- 1996-09-02 EP EP96306340A patent/EP0761361B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5685475A (en) | 1997-11-11 |
EP0761361B1 (en) | 2001-11-14 |
JPH0983125A (ja) | 1997-03-28 |
EP0761361A1 (en) | 1997-03-12 |
DE69616912D1 (de) | 2001-12-20 |
DE69616912T2 (de) | 2002-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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