DE3611180C1 - Device for cooling soldered-work carrier and solder deposit in soldering units - Google Patents

Device for cooling soldered-work carrier and solder deposit in soldering units

Info

Publication number
DE3611180C1
DE3611180C1 DE19863611180 DE3611180A DE3611180C1 DE 3611180 C1 DE3611180 C1 DE 3611180C1 DE 19863611180 DE19863611180 DE 19863611180 DE 3611180 A DE3611180 A DE 3611180A DE 3611180 C1 DE3611180 C1 DE 3611180C1
Authority
DE
Germany
Prior art keywords
cooling
soldering
air
soldered
solder deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19863611180
Other languages
German (de)
Inventor
Helmut Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19863611180 priority Critical patent/DE3611180C1/en
Application granted granted Critical
Publication of DE3611180C1 publication Critical patent/DE3611180C1/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means

Abstract

The invention relates to a device for cooling soldered-work carrier and solder deposit in soldering units by means of cooling-air supply. To avoid the vaporisation of cleaning medium, it is necessary to cool down the soldered-work carrier and the solder deposit as quickly as possible. This is effected by the invention by air nozzles 2 being arranged downstream of the soldering station 1, the openings of which air nozzles 2 are directed at an angle and in the opposite direction to the transport direction of the solder deposit and are arranged on both sides of the transport section. <IMAGE>

Description

Die Erfindung betrifft eine Vorrichtung zum Kühlen von Lötwerkstückträger und Lötgut bei Lötanlagen mittels Kühlluftzufuhr.The invention relates to a device for cooling of soldering workpiece carriers and items to be soldered in soldering systems by means of cooling air supply.

Bei dem maschinellen Löten werden Lötwerkstück­ träger und Lötgut je nach Verfahrensparameter auf über 120°C aufgeheizt. Elektronische Bauelemente sol­ len aus Zuverlässigkeitsgründen diesem erhöhten Tem­ peraturbereich nur kurzzeitig ausgesetzt werden. Das Lötgut kann nach Verlassen der Lötanlage wegen der erhöhten Temperatur nur mit Handschuhen entnom­ men werden. Folgt dem Lötvorgang ein Reinigungspro­ zeß, so verdunstet ein relativ hoher Anteil des Reini­ gungsmediums zur Abkühlung von Lötwerkstückträger und Lötgut. Außerdem dunsten bei erhöhten Tempera­ turen die Flußmittelrückstände sehr stark ab. Diese Flußmitteldämpfe sind oft gesundheitsschädigend.Mechanical soldering becomes a workpiece carrier and solder depending on the process parameters heated above 120 ° C. Electronic components sol len for reasons of reliability this increased tem temperature range are only temporarily exposed. The After leaving the soldering system, soldering good can occur remove elevated temperature only with gloves men. A cleaning pro follows the soldering process zeß, so a relatively high proportion of Reini evaporates medium for cooling soldering workpiece carriers and solder. In addition, steam at elevated temperatures depreciate the flux residues very strongly. These Flux vapors are often harmful to health.

Aufgabe der vorliegenden Erfindung ist es, eine Vor­ richtung zu schaffen, die Lötgut und Lötträger nach dem Verlassen der Lötmaschine möglichst schnell abkühlt.The object of the present invention is to provide a direction to create the solder and solder carrier after the Leaving the soldering machine cools down as quickly as possible.

Zur Lösung dieser Aufgabe wird die Vorrichtung ge­ mäß der Erfindung derart ausgebildet, daß der Lötsta­ tion Luftdüsen nachgeordnet sind, deren Öffnungen schräg und entgegegengesetzt zur Transportrichtung des Lötgutes gerichtet und beidseitig der Transport­ strecke angeordnet sind.To solve this problem, the device is ge According to the invention designed such that the soldering tion air nozzles are arranged, the openings diagonally and opposite to the direction of transport the soldered goods and the transport on both sides Route are arranged.

Vorteil dieser Anordnung ist, daß die Kühlluft auf der gesamten Länge beidseitig am Lötgut entlang geführt wird und dadurch eine gleitende und trotzdem rasche Abkühlung erreicht wird. Dadurch kann auf einer mög­ lichst kurzen Wegstrecke Lötgut und Lötträger auf un­ ter 40° abgekühlt werden.The advantage of this arrangement is that the cooling air on the entire length along both sides of the item to be soldered becomes and thereby a smooth but still quick Cooling is achieved. This can be done on a poss The shortest possible distance between solder and solder carrier on un be cooled to 40 ° C.

Ordnet man unterhalb des Transportweges ein Ab­ deckblech an, das zugleich als Luftleitblech dient und mit einer Ablenköffnung für den Luftstrom versehen ist, so läßt sich dadurch in einfacher Weise die Luftströ­ mung von der Lötwelle ablenken.If you assign a Ab below the transport route cover plate, which also serves as an air baffle and is provided with a deflection opening for the air flow, so the air flows can be done in a simple manner distract from the solder wave.

Die Kühlluft läßt sich durch einen Lüfter in einfacher Weise aus der Raumluft erzeugen.The cooling air can be simplified by a fan Generate way from the room air.

Anhand des Ausführungsbeispieles nach der Figur wird die Erfindung näher erläutert. Über die Lötstation 1, in der die Lötwelle erzeugt wird, wird der Lötwerk­ stückträger 5, auf dem sich das Lötgut 7 befindet, hin­ wegbewegt und der Lötvorgang durchgeführt. Hinter der Lötstation 1 sind Luftdüsen 2 beidseitig des Trans­ portweges so angeordnet, daß ihre Offnungen schräg und entgegengesetzt zur Transportrichtung liegen. Da­ durch werden beidseitig vom Lötgut gerichtete Luft­ ströme entgegen der Transportrichtung erzeugt, die ei-­ ne rasche Abkühlung von Lötträger und Lötgut bewir­ ken. Die Kühlluft für die Luftdüsen 2 wird über einen Lüfter 6 aus der Raumluft gewonnen.The invention is explained in more detail using the exemplary embodiment according to the figure. About the soldering station 1 , in which the solder wave is generated, the Lötwerk piece carrier 5 , on which the item to be solder 7 is located, is moved away and the soldering process is carried out. Behind the soldering station 1 , air nozzles 2 are arranged on both sides of the transport path so that their openings are oblique and opposite to the transport direction. Since air flows on both sides of the item to be soldered are generated counter to the transport direction, which causes the solder carrier and the item to be cooled down rapidly. The cooling air for the air nozzles 2 is obtained from the room air via a fan 6 .

Claims (3)

1. Vorrichtung zum Kühlen von Lötwerkstückträ­ ger und Lötgut bei Lötanlagen mittels Kühlluftzu­ fuhr, dadurch gekennzeichnet, daß der Lötsektion (1) Luftdüsen (2) nachgeordnet sind, deren Öffnun­ gen schräg und entgegengesetzt zur Transportrich­ tung des Lötgutes gerichtet und beidseitig der Transportstrecke angeordnet sind.1. Device for cooling Lötwerkstückträ ger and soldered goods in soldering systems by means of cooling air, characterized in that the soldering section ( 1 ) air nozzles ( 2 ) are arranged downstream, the openings of which are directed obliquely and opposite to the transport direction of the soldered goods and are arranged on both sides of the transport route . 2. Vorrichtung nach Anspruch 1, dadurch gekenn­ zeichnet, daß unterhalb des Transportweges ein Abdeckblech (3) angeordnet ist, das zugleich als Luftleitblech dient und das mit einer Ablenköff­ nung (4) für den Luftstrom versehen ist.2. Device according to claim 1, characterized in that a cover plate ( 3 ) is arranged below the transport path, which also serves as an air baffle and which is provided with a deflection opening ( 4 ) for the air flow. 3. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Kühl­ luft von einem Lüfter (6) aus der Raumluft erzeugt wird.3. Device according to one of the preceding claims, characterized in that the cooling air is generated by a fan ( 6 ) from the room air.
DE19863611180 1986-04-03 1986-04-03 Device for cooling soldered-work carrier and solder deposit in soldering units Expired DE3611180C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19863611180 DE3611180C1 (en) 1986-04-03 1986-04-03 Device for cooling soldered-work carrier and solder deposit in soldering units

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863611180 DE3611180C1 (en) 1986-04-03 1986-04-03 Device for cooling soldered-work carrier and solder deposit in soldering units

Publications (1)

Publication Number Publication Date
DE3611180C1 true DE3611180C1 (en) 1987-01-29

Family

ID=6297835

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863611180 Expired DE3611180C1 (en) 1986-04-03 1986-04-03 Device for cooling soldered-work carrier and solder deposit in soldering units

Country Status (1)

Country Link
DE (1) DE3611180C1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416788A1 (en) * 1994-05-06 1995-11-09 Siemens Ag Process for wave soldering of printed circuit boards
EP0761361A1 (en) * 1995-09-08 1997-03-12 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS-ERMITTELT *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416788A1 (en) * 1994-05-06 1995-11-09 Siemens Ag Process for wave soldering of printed circuit boards
WO1995030509A1 (en) * 1994-05-06 1995-11-16 Siemens Aktiengesellschaft Process for wave-soldering printed circuit boards
US5813595A (en) * 1994-05-06 1998-09-29 Siemens Aktiengesellschaft Method for wave-soldering printed circuit boards
DE4416788C2 (en) * 1994-05-06 1999-08-19 Siemens Ag Process for wave soldering of printed circuit boards
EP0761361A1 (en) * 1995-09-08 1997-03-12 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering

Similar Documents

Publication Publication Date Title
DE69916744T2 (en) Filter system of a reflow soldering furnace
US4115601A (en) Flexible circuit reflow soldering process and machine
US7708183B2 (en) Reflow solder oven with cooling diffuser
US5228614A (en) Solder nozzle with gas knife jet
US4580716A (en) Apparatus and method for vapor phase solder reflow
US8424743B2 (en) Solder return for wave solder nozzle
DE3720912A1 (en) METHOD AND ARRANGEMENT FOR REFLOW-SOLDERING AND REFLOW-DESOLDERING CIRCUIT BOARDS
DE2737397A1 (en) HOLDER FOR WORKPIECES
US3604611A (en) Soldering apparatus
JP2007067061A (en) Flux recovery system
KR100738499B1 (en) Soldering method and automatic soldering apparatus
DE3611180C1 (en) Device for cooling soldered-work carrier and solder deposit in soldering units
DE3840098C1 (en)
DE60013935T2 (en) Method for soldering printed circuit boards
US4698915A (en) Method and apparatus for condensation heating
DE2932398C2 (en) Device for cooling printed circuit boards after electrical components have been soldered in by machine
US20020011511A1 (en) Apparatus and method for soldering electronic components to printed circuit boards
JP2009148816A (en) Flux recovery device
DE3843191C1 (en) Device for soldering
US4256512A (en) Flexible circuit reflow soldering machine
US4766677A (en) Method and apparatus for vapor phase soldering
JP3597878B2 (en) Atmosphere furnace exhaust gas suction device
JP5395940B2 (en) Reflow device
JPS60257987A (en) Method and device for cooling surface of molding welding work in front and in rear of or before and behind position of welding by water-air mixture
DE19541445A1 (en) Method and apparatus for wave soldering under protective gas

Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee