ES2146237T3 - Cuerpos microestructurados y procedimiento para su fabricacion. - Google Patents

Cuerpos microestructurados y procedimiento para su fabricacion.

Info

Publication number
ES2146237T3
ES2146237T3 ES94102351T ES94102351T ES2146237T3 ES 2146237 T3 ES2146237 T3 ES 2146237T3 ES 94102351 T ES94102351 T ES 94102351T ES 94102351 T ES94102351 T ES 94102351T ES 2146237 T3 ES2146237 T3 ES 2146237T3
Authority
ES
Spain
Prior art keywords
application
microstructure
mold
procedure
requirements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94102351T
Other languages
English (en)
Inventor
Christoph Dr Lessmollmann
Joachim Dr Eicher
Holger Dr Reinecke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boehringer Ingelheim Microparts GmbH
Original Assignee
Microparts Gesellschaft fuer Mikrostrukturtechnik mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6482617&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2146237(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Microparts Gesellschaft fuer Mikrostrukturtechnik mbH filed Critical Microparts Gesellschaft fuer Mikrostrukturtechnik mbH
Application granted granted Critical
Publication of ES2146237T3 publication Critical patent/ES2146237T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/1208—Containers or coating used therefor
    • B22F3/1258—Container manufacturing
    • B22F3/1283—Container formed as an undeformable model eliminated after consolidation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0005—Separation of the coating from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Adornments (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

2.1 LOS CUERPOS DE MICROESTRUCTURA SON CONFORMADOS POR MEDIO DE UNA APLICACION DE MOLDE ELABORABLE POR EJEMPLO SEGUN EL PROCEDIMIENTO LIGA. EL PROCEDIMIENTO ES COSTOSO EN MUCHOS CASOS, LOS MOLDES DE ESTRUCTURA QUE SE OBTIENEN SON LIMITADOS. MEDIANTE LA ELECCION DEL MATERIAL ES UN COMPROMISO A TENER EN CUENTA ENTRE LAS EXIGENCIAS EN EL PROCESO DE FABRICACION Y LAS EXIGENCIAS MEDIANTE LA APLICACION DEL CUERPO DE MICROESTRUCTURA. 2.2 LA APLICACION DE MOLDE DE MICROESTRUCTURA SE ELABORA A PARTIR DE UN CUERPO SOLIDO (METAL, CERAMICA, VIDRIO, PIEDRA O MATERIAL MONOCRISTALINO) A TRAVES DE MECANIZACION DE PRECISION DE MAQUINA DE AJUSTE FIJO, EFECTUANDOSE ESTRUCTURACION ADITIVA O SUBTRACTIVA. LA APLICACION DE MOLDE SE RELLENA CON UN MATERIAL CON CAPACIDAD DE FLUIR Y SE RECUBRE EL MATERIAL SOLIDIFICADO PREVIAMENTE QUE ES SEPARADO A PARTIR DE LA APLICACION DE MOLDE, CON LO CUAL SE OBTIENE EL CUERPO DE MICROESTRUCTURA. PARA LA ELABORACION DE LA APLICACION DE MOLDE SE ELIGE UN MATERIAL, QUE EN BASE A SUS PROPIEDADES PARA ESTE PROCEDIMIENTO DE ESTRUCTURACION DEBE SER LO MAS ADECUADO POSIBLE. PARA EL CUERPO DE MICROESTRUCTURA SE ELIGEN MATERIALES QUE CUMPLEN DE FORMA OPTIMA CON ESTAS EXIGENCIAS AJUSTADAS. 2.3 ELABORACION DE CUERPOS DE MICROESTRUCTURA CON PROPIEDADES DE MATERIALES OPTIMAS Y EN UNA MULTIPLICIDAD DE FORMA AMPLIADA.
ES94102351T 1993-03-12 1994-02-17 Cuerpos microestructurados y procedimiento para su fabricacion. Expired - Lifetime ES2146237T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4307869A DE4307869C2 (de) 1993-03-12 1993-03-12 Mikrostrukturkörper und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
ES2146237T3 true ES2146237T3 (es) 2000-08-01

Family

ID=6482617

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94102351T Expired - Lifetime ES2146237T3 (es) 1993-03-12 1994-02-17 Cuerpos microestructurados y procedimiento para su fabricacion.

Country Status (6)

Country Link
US (2) US5501784A (es)
EP (1) EP0620092B1 (es)
JP (1) JPH06320550A (es)
KR (1) KR100313048B1 (es)
DE (2) DE4307869C2 (es)
ES (1) ES2146237T3 (es)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804314A (en) * 1994-03-22 1998-09-08 Hewlett-Packard Company Silicon microstructures and process for their fabrication
JP3016348B2 (ja) * 1995-03-23 2000-03-06 株式会社ニッショー 複室容器
US5944974A (en) * 1995-07-01 1999-08-31 Fahrenberg; Jens Process for manufacturing mold inserts
DE19608824A1 (de) * 1996-03-07 1997-09-18 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung von Mikrowärmetauschern
JP3269827B2 (ja) * 1997-04-04 2002-04-02 ユニバーシティ・オブ・サザン・カリフォルニア 電気化学製造のための物品、方法、および装置
US6214192B1 (en) * 1998-12-10 2001-04-10 Eastman Kodak Company Fabricating ink jet nozzle plate
DE19858531C1 (de) * 1998-12-18 2000-03-23 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung eines hochpräzisen keramischen oder/und metallischen Bauteils sowie danach hergestelltes Bauteil
US6835184B1 (en) 1999-09-24 2004-12-28 Becton, Dickinson And Company Method and device for abrading skin
US6331266B1 (en) * 1999-09-29 2001-12-18 Becton Dickinson And Company Process of making a molded device
US6251248B1 (en) * 1999-10-15 2001-06-26 Ching-Bin Lin Microfabrication process for making microstructures having high aspect ratio
US6221227B1 (en) * 1999-11-02 2001-04-24 Ching-Bin Lin Microfabrication process for making microstructures as geometrically miniaturized from three-dimensional orientations
US6595947B1 (en) 2000-05-22 2003-07-22 Becton, Dickinson And Company Topical delivery of vaccines
US6491481B1 (en) * 2000-10-31 2002-12-10 Eastman Kodak Company Method of making a precision microlens mold and a microlens mold
US6476971B1 (en) * 2000-10-31 2002-11-05 Eastman Kodak Company Method of manufacturing a microlens array mold and a microlens array
JP4125889B2 (ja) * 2000-12-04 2008-07-30 日本板硝子株式会社 光学素子、成形型及びそれらの製造方法
DE10064093C1 (de) * 2000-12-21 2002-05-29 Alfred Friedrich Mayr Oberflächenstrukturierung für Gegenstände
AUPR245501A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM08)
AUPR244901A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd A method (WSM02)
FR2816525A1 (fr) * 2001-02-26 2002-05-17 Commissariat Energie Atomique Dispositif dispensateur de fluide et procede de realisation d'un tel dispositif
US7416961B2 (en) 2001-03-14 2008-08-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for structuring a flat substrate consisting of a glass-type material
DE10118529C1 (de) * 2001-03-14 2002-10-17 Fraunhofer Ges Forschung Verfahren zur Strukturierung eines aus glasartigem Material bestehenden Flächensubstrats
DE10241390B3 (de) * 2001-04-14 2004-04-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Strukturierung eines aus glasartigem Material bestehenden Flächensubstrats, glasartiges Flächensubstrat und Verwendung des glasartigen Flächensubstrats
WO2002100476A2 (en) * 2001-06-08 2002-12-19 Becton, Dickinson And Company Device for manipulating a needle or abrader array
ES2319625T3 (es) * 2001-10-29 2009-05-11 Becton, Dickinson And Company Dispositivo para la administracion de una sustancia.
US20040120964A1 (en) * 2001-10-29 2004-06-24 Mikszta John A. Needleless vaccination using chimeric yellow fever vaccine-vectored vaccines against heterologous flaviviruses
US9614266B2 (en) 2001-12-03 2017-04-04 Microfabrica Inc. Miniature RF and microwave components and methods for fabricating such components
US20050023145A1 (en) * 2003-05-07 2005-02-03 Microfabrica Inc. Methods and apparatus for forming multi-layer structures using adhered masks
WO2003049514A2 (en) 2001-12-03 2003-06-12 Memgen Corporation Miniature rf and microwave components and methods for fabricating such components
CN1329285C (zh) * 2002-04-15 2007-08-01 肖特股份公司 用于制造一种具有构造表面的产品的方法
US6644537B1 (en) * 2002-05-01 2003-11-11 Taiwan Green Point Enterprise Co., Ltd. Manufacturing method for bonded electroforming metallic mold
EP1576207A2 (en) * 2002-05-07 2005-09-21 Microfabrica Inc. Methods of and apparatus for molding structures
US6899838B2 (en) * 2002-07-12 2005-05-31 Becton, Dickinson And Company Method of forming a mold and molding a micro-device
KR100476317B1 (ko) * 2002-10-24 2005-03-16 한국전자통신연구원 광결합 소자 및 그 제작 방법, 광결합 소자 제작을 위한마스터 및 그 제작 방법
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US8613846B2 (en) * 2003-02-04 2013-12-24 Microfabrica Inc. Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
DE10314373A1 (de) * 2003-03-28 2004-10-07 Rwth Aachen Urfomverfahren für ein Bauteil mit Mikrostruktur-Funktionselement
US9671429B2 (en) 2003-05-07 2017-06-06 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US10297421B1 (en) 2003-05-07 2019-05-21 Microfabrica Inc. Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures
US7040016B2 (en) * 2003-10-22 2006-05-09 Hewlett-Packard Development Company, L.P. Method of fabricating a mandrel for electroformation of an orifice plate
DE10353060A1 (de) * 2003-11-13 2005-06-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur freiformenden Herstellung von dreidimensionalen Hohlräumen oder Hinterschneidungen aufweisenden Mikrobauteilen
DE10359102A1 (de) * 2003-12-17 2005-07-21 Carl Zeiss Smt Ag Optische Komponente umfassend ein Material mit einer vorbestimmten Homogenität der thermischen Längsausdehnung
US9040090B2 (en) 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
EP3242318A1 (en) 2003-12-19 2017-11-08 The University of North Carolina at Chapel Hill Monodisperse micro-structure or nano-structure product
US10641792B2 (en) 2003-12-31 2020-05-05 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
WO2005079986A1 (en) 2004-02-18 2005-09-01 Applera Corporation Multi-step bioassays on modular microfluidic application platforms
JP2005347675A (ja) * 2004-06-07 2005-12-15 Fujitsu Ltd 微小な構造を有する素子の製造方法
TWI287479B (en) * 2004-12-24 2007-10-01 Foxconn Tech Co Ltd Method for producing vapor chamber
JP2006205332A (ja) * 2005-01-31 2006-08-10 Towa Corp 微細構造体、その製造方法、その製造に使用されるマスター型、及び発光機構
KR101222946B1 (ko) * 2005-06-24 2013-01-17 엘지디스플레이 주식회사 백 프레인이 부착된 소프트 몰드의 제조방법
WO2008013952A2 (en) 2006-07-27 2008-01-31 The University Of North Carolina At Chapel Hill Nanoparticle fabrication methods, systems, and materials for fabricating artificial red blood cells
DE102006043774A1 (de) * 2006-09-14 2008-03-27 Fachhochschule Jena Verfahren zur Herstellung eines Formeinsatzes für Werkzeuge zur Produktion von Formteilen aus Kunststoff
US20090004840A1 (en) * 2007-06-27 2009-01-01 Farinelli Matthew J Method of Creating Molds of Variable Solder Volumes for Flip Attach
CN101691052B (zh) * 2009-09-01 2012-07-18 深圳和而泰智能控制股份有限公司 灌胶脱模装置及灌胶脱模的制作方法
KR101132679B1 (ko) * 2010-03-16 2012-04-03 한국지질자원연구원 첨가제를 이용한 미세구조 패턴이 형상 제어된 탄산칼슘 박막의 제조방법
TWI404615B (zh) * 2010-04-01 2013-08-11 A method of manufacturing an in-mold formed film having a metal surface
FR2960339B1 (fr) * 2010-05-18 2012-05-18 Commissariat Energie Atomique Procede de realisation d'elements a puce munis de rainures d'insertion de fils
EP2588287A4 (en) * 2010-07-01 2018-01-17 Inmold Biosystems A/S Method and apparatus for producing a nanostructured or smooth polymer article
JP5631160B2 (ja) * 2010-11-09 2014-11-26 株式会社東京精密 ワークのダイシング装置及びワークのダイシング方法
US20140023430A1 (en) * 2012-07-19 2014-01-23 Apple Inc. Attachment Techniques
US20150069667A1 (en) * 2013-09-12 2015-03-12 Yi Li Nano-parts fabrication method
WO2017094021A1 (en) * 2015-12-04 2017-06-08 Indian Institute Of Technology Bombay Controlled spontaneous three dimensional fabrication of micro/meso structures
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
CN111809217B (zh) * 2020-07-10 2023-03-31 长春理工大学 电化学沉积与金刚石切削增减材制造装置及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4142001A1 (de) * 1991-12-19 1993-06-24 Microparts Gmbh Verfahren zum herstellen gestufter formeinsaetze, gestufte formeinsaetze und damit abgeformte mikrostrukturkoerper
US3993515A (en) * 1975-03-31 1976-11-23 Rca Corporation Method of forming raised electrical contacts on a semiconductor device
DE3335171A1 (de) * 1983-09-28 1985-04-04 Siemens AG, 1000 Berlin und 8000 München Doppelentformungsverfahren zur herstellung von trennduesenstrukturen
DE3518829A1 (de) * 1985-05-24 1986-11-27 Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen Verfahren zur herstellung von formkoerpern aus siliciumgranulat fuer die erzeugung von siliciumschmelzen
DE3537483C1 (de) * 1985-10-22 1986-12-04 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe Verfahren zum Herstellen einer Vielzahl plattenfoermiger Mikrostrukturkoerper aus Metall
JPS63307909A (ja) * 1987-05-29 1988-12-15 Omron Tateisi Electronics Co 樹脂円板の製造方法
US4793953A (en) * 1987-10-16 1988-12-27 Galic/Maus Ventures Mold for optical thermoplastic high-pressure molding
DE3842610C1 (es) * 1988-12-17 1990-06-21 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De
JPH0445205A (ja) * 1990-06-12 1992-02-14 Kobe Steel Ltd 粉末成形体の製造方法
US5358909A (en) * 1991-02-27 1994-10-25 Nippon Steel Corporation Method of manufacturing field-emitter
DE4107851A1 (de) * 1991-03-12 1992-09-17 Basf Ag Verfahren zur herstellung von mikroformkoerpern mit hohem aspektverhaeltnis
DE4126877C1 (en) * 1991-08-14 1992-11-26 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds
US5702810A (en) * 1992-03-10 1997-12-30 Mitsubishi Chemical Corporation Cushioning composite molded article and a process for production thereof
US5244143A (en) * 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
CA2076578A1 (en) * 1992-08-21 1994-02-22 Miroslav Milinkovic Mandrel for use in nickel vapour deposition processes and nickel molds made therefrom
US5348616A (en) * 1993-05-03 1994-09-20 Motorola, Inc. Method for patterning a mold

Also Published As

Publication number Publication date
DE4307869C2 (de) 1996-04-04
JPH06320550A (ja) 1994-11-22
DE4307869A1 (de) 1994-09-15
US6660151B1 (en) 2003-12-09
DE59409280D1 (de) 2000-05-18
EP0620092A1 (de) 1994-10-19
US5501784A (en) 1996-03-26
EP0620092B1 (de) 2000-04-12
KR100313048B1 (ko) 2002-02-19

Similar Documents

Publication Publication Date Title
ES2146237T3 (es) Cuerpos microestructurados y procedimiento para su fabricacion.
ES2041942T3 (es) Componente ligero.
AR035263A1 (es) Metodo para el revestimiento de articulos por transferencia de molde, articulos y lentes de contacto preparados por el metodo
ES2141239T3 (es) Composicion de hormigon de fibras metalicas para moldear un elemento de hormigon, elementos obtenidos y procedimiento de curado termico.
MX172497B (es) Metodo para fabricar un cuerpo de matriz metalica y cuerpo compuesto asi obtenido
BR0010074A (pt) Processo e material para produção de corpos de moldes
MX9305590A (es) Un metodo para fabricar un lente de contacto.
ITTO930621A0 (it) Materiale a base di politetrafluoroetilene densificato e procedimento per la produzione di articoli sagomati a base di politetrafluoroetile-ne densificato.
ES2055588T3 (es) Captador capacitivo integrable de presion y su procedimiento de produccion.
ES2032855T3 (es) Estructuras ceramicas modificadas y procedimientos para hacerlas.
DE3880433D1 (de) Poroese anorganische materialien.
DE60216196D1 (de) Kosmetischer Artikel und dessen Herstellungsverfahren
ES2157336T3 (es) Procedimiento y dispositivo para realizar la solidificacion orientada de una masa de material fundido.
AR248235A1 (es) Metodo de fabricacion de peliculas polimericas delgadas y orientadas y las peliculas polimericas obtenidas con dicho metodo.
ES2036595T3 (es) Metodo para producir cuerpos de ceramica autoportantes dotados de propiedades variables.
DK481787A (da) Kereamisk genstand med en polymer komponent og fremgangsmaade til fremstilling af samme
ES8308251A1 (es) Molde y procedimiento para la fabricacion de objetos con ma-terias plasticas no polares,expansionadas,con la ayuda de radiacion uhf
DK0484386T3 (da) Keramiske legemer med kontrolleret porøsitet og fremgangsmåde til fremstilling deraf
FR2373355A1 (fr) Materiau stratifie et procede pour sa fabrication par placage thermocinetique
EP0314142A3 (en) Process for the fabrication of a porous shaped body
ES2027009T3 (es) Modelos para fundicion de metal.
ES2182341T3 (es) Procedimiento para la fabricacion de cuerpos moldeados a partir de una estructura ceramica compuesta.
FR1475082A (fr) Procédé pour la fabrication, en fine division, de couches de catalyseur sur les surfaces exemptes de pores de corps métalliques absorbant de l'hydrogène, et corps ainsi revêtus
DE60020854D1 (de) Verfahren zur herstellung einer matrix und nach diesem verfahren hergestellte matrix
ES2015949B3 (es) Refractarios colados por fusion con forma cercana a la prevista y proceso para su fabricacion por fusion rapida/enfriamiento rapido controlado.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 620092

Country of ref document: ES