ES2143932B1 - Mejoras introducidas en el procedimiento de fabricacion de circuitos impresos objeto de la patente principal n. 9700184 (8) por un procedimiento de fabricacion de circuitos impresos. - Google Patents
Mejoras introducidas en el procedimiento de fabricacion de circuitos impresos objeto de la patente principal n. 9700184 (8) por un procedimiento de fabricacion de circuitos impresos.Info
- Publication number
- ES2143932B1 ES2143932B1 ES9702533A ES9702533A ES2143932B1 ES 2143932 B1 ES2143932 B1 ES 2143932B1 ES 9702533 A ES9702533 A ES 9702533A ES 9702533 A ES9702533 A ES 9702533A ES 2143932 B1 ES2143932 B1 ES 2143932B1
- Authority
- ES
- Spain
- Prior art keywords
- printed circuits
- procedure
- manufacture
- main patent
- improvements introduced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
Mejoras introducidas en el procedimiento de fabricación de circuitos impresos objeto de la patente principal nº 9700184(8) por un procedimiento de fabricación de circuitos impresos. El procedimiento se iniciará tal y como se describe en la patente principal con el mecanizado de una lámina de cobre por su base superior de manera que con los procedimientos de corte o fresado químico se producirán en la misma unos surcos o entrepistas, ello se efectuará por partida doble, es decir, utilizándose dos láminas de cobre, las que una vez mecanizadas por las formas descritas y mediante los medios adecuados se inmovilizarán para producir el dieléctrico entre las mismas a base de un moldeo o inyección o método similar, con lo cual se evitará la doble producción de sustrato dieléctrico y posterior enganchado del mismo.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000524962A JP2002503878A (ja) | 1997-12-05 | 1998-11-30 | プリント回路及び製造方法 |
PCT/US1998/025395 WO1999030541A1 (en) | 1997-12-05 | 1998-11-30 | Printed circuits and method for making |
KR1020007005566A KR20010015829A (ko) | 1997-12-05 | 1998-11-30 | 인쇄회로와 제조방법 |
EP98500259A EP0923278A1 (fr) | 1997-12-05 | 1998-12-01 | Procédé de fabrication de circuits imprimés |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES9700184A ES2125821B1 (es) | 1997-01-31 | 1997-01-31 | Un procedimiento de fabricacion de circuitos impresos. |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2143932A1 ES2143932A1 (es) | 2000-05-16 |
ES2143932B1 true ES2143932B1 (es) | 2000-12-01 |
Family
ID=8298051
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES9700184A Expired - Lifetime ES2125821B1 (es) | 1997-01-31 | 1997-01-31 | Un procedimiento de fabricacion de circuitos impresos. |
ES9702533A Expired - Lifetime ES2143932B1 (es) | 1997-01-31 | 1997-12-05 | Mejoras introducidas en el procedimiento de fabricacion de circuitos impresos objeto de la patente principal n. 9700184 (8) por un procedimiento de fabricacion de circuitos impresos. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES9700184A Expired - Lifetime ES2125821B1 (es) | 1997-01-31 | 1997-01-31 | Un procedimiento de fabricacion de circuitos impresos. |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0857010B1 (es) |
JP (1) | JPH10224011A (es) |
CA (1) | CA2279340A1 (es) |
DE (1) | DE69735750T2 (es) |
ES (2) | ES2125821B1 (es) |
WO (1) | WO1998034444A1 (es) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002503878A (ja) * | 1997-12-05 | 2002-02-05 | リア オートモーティヴ ディアボーン インコーポレイテッド | プリント回路及び製造方法 |
EP1257157B1 (en) | 1999-12-31 | 2004-11-24 | Lear Automotive (EEDS) Spain, S.L. | Method for manufacturing printed circuit boards |
ES2188381B1 (es) * | 2001-06-05 | 2004-12-16 | Lear Automotive (Eeds) Spain, S.L. | Procedimiento de fabricacion de placas de circuito impreso a partir de un polimero extrusionado. |
CN105282974B (zh) * | 2015-10-14 | 2018-05-11 | 深圳崇达多层线路板有限公司 | 一种阶梯式印制电路板的制作方法 |
CN109195340A (zh) * | 2018-09-18 | 2019-01-11 | 桑尼维尔新材料科技(南京)有限公司 | 一种制作金属化陶瓷基板超窄线宽、线距图形的方法 |
CN110098302A (zh) * | 2019-05-06 | 2019-08-06 | 华南理工大学 | 一种用于微型led器件的柔性聚酰亚胺衬底及其制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3085295A (en) * | 1957-04-30 | 1963-04-16 | Michael A Pizzino | Method of making inlaid circuits |
FR1260804A (fr) * | 1960-03-31 | 1961-05-12 | Electronique & Automatisme Sa | Procédé de réalisation de circuits imprimés |
GB971775A (en) * | 1961-07-17 | 1964-10-07 | Borg Warner | Electrical terminal board |
US3177103A (en) * | 1961-09-18 | 1965-04-06 | Sauders Associates Inc | Two pass etching for fabricating printed circuitry |
US3264152A (en) * | 1963-03-26 | 1966-08-02 | Tri Tech | Method for fabricating electrical circuit components |
DE1665944A1 (de) * | 1967-05-13 | 1971-04-08 | Siemens Ag | Verfahren zum Herstellen elektrischer Schaltkreise |
JPH02138793A (ja) * | 1988-11-18 | 1990-05-28 | Shinko Electric Ind Co Ltd | 回路基板の製造方法 |
ES2071540B1 (es) * | 1992-01-29 | 1996-02-01 | Mecanismos Aux Ind | Perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes. |
-
1997
- 1997-01-31 ES ES9700184A patent/ES2125821B1/es not_active Expired - Lifetime
- 1997-10-09 DE DE1997635750 patent/DE69735750T2/de not_active Expired - Fee Related
- 1997-10-09 EP EP19970500169 patent/EP0857010B1/fr not_active Expired - Lifetime
- 1997-11-05 JP JP30293197A patent/JPH10224011A/ja active Pending
- 1997-12-05 ES ES9702533A patent/ES2143932B1/es not_active Expired - Lifetime
-
1998
- 1998-01-28 WO PCT/US1998/001067 patent/WO1998034444A1/en active Application Filing
- 1998-01-28 CA CA002279340A patent/CA2279340A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
ES2143932A1 (es) | 2000-05-16 |
EP0857010B1 (fr) | 2006-04-26 |
EP0857010A1 (fr) | 1998-08-05 |
DE69735750T2 (de) | 2007-05-10 |
WO1998034444A1 (en) | 1998-08-06 |
CA2279340A1 (en) | 1998-08-06 |
ES2125821A1 (es) | 1999-03-01 |
ES2125821B1 (es) | 1999-12-01 |
JPH10224011A (ja) | 1998-08-21 |
DE69735750D1 (de) | 2006-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC2A | Transfer granted | ||
EC2A | Search report published |
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