ES2125821B1 - Un procedimiento de fabricacion de circuitos impresos. - Google Patents

Un procedimiento de fabricacion de circuitos impresos.

Info

Publication number
ES2125821B1
ES2125821B1 ES9700184A ES9700184A ES2125821B1 ES 2125821 B1 ES2125821 B1 ES 2125821B1 ES 9700184 A ES9700184 A ES 9700184A ES 9700184 A ES9700184 A ES 9700184A ES 2125821 B1 ES2125821 B1 ES 2125821B1
Authority
ES
Spain
Prior art keywords
printed circuits
milling
procedure
manufacture
chemical cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES9700184A
Other languages
English (en)
Other versions
ES2125821A1 (es
Inventor
Nieto Rodolfo Kroebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to ES9700184A priority Critical patent/ES2125821B1/es
Priority to EP19970500169 priority patent/EP0857010B1/fr
Priority to DE1997635750 priority patent/DE69735750T2/de
Priority to JP30293197A priority patent/JPH10224011A/ja
Priority to ES9702533A priority patent/ES2143932B1/es
Priority to PCT/US1998/001067 priority patent/WO1998034444A1/en
Priority to US09/355,570 priority patent/US6182359B1/en
Priority to CA002279340A priority patent/CA2279340A1/en
Publication of ES2125821A1 publication Critical patent/ES2125821A1/es
Application granted granted Critical
Publication of ES2125821B1 publication Critical patent/ES2125821B1/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

Un procedimiento de fabricación de circuitos impresos. Las operaciones que integran la fabricación de los circuitos impresos preconizados, consisten básicamente y tal y como puede verse de la forma secuencial en las figuras que se acompañan, en la disposición de una lámina de cobre (10) de base superior (11) y base inferior (12), en la que mediante el corte o fresado químico se producen unos surcos o entrepistas (13) tal y como indican las flechas, en las que en la figura nº 2, se representa una realización puramente esquemática e ilustrativa. Sigue a continuación y después de este corte o fresado químico, una inyección por moldeo de una sustancia o material de tipo plástico totalmente dieléctrico y resistente a altas temperaturas.
ES9700184A 1997-01-31 1997-01-31 Un procedimiento de fabricacion de circuitos impresos. Expired - Lifetime ES2125821B1 (es)

Priority Applications (8)

Application Number Priority Date Filing Date Title
ES9700184A ES2125821B1 (es) 1997-01-31 1997-01-31 Un procedimiento de fabricacion de circuitos impresos.
EP19970500169 EP0857010B1 (fr) 1997-01-31 1997-10-09 Procédé de fabrication de circuits imprimés
DE1997635750 DE69735750T2 (de) 1997-01-31 1997-10-09 Verfahren zur Herstellung von Leiterplatten
JP30293197A JPH10224011A (ja) 1997-01-31 1997-11-05 プリント回路の製造方法
ES9702533A ES2143932B1 (es) 1997-01-31 1997-12-05 Mejoras introducidas en el procedimiento de fabricacion de circuitos impresos objeto de la patente principal n. 9700184 (8) por un procedimiento de fabricacion de circuitos impresos.
PCT/US1998/001067 WO1998034444A1 (en) 1997-01-31 1998-01-28 A manufacturing process for printed circuits
US09/355,570 US6182359B1 (en) 1997-01-31 1998-01-28 Manufacturing process for printed circuits
CA002279340A CA2279340A1 (en) 1997-01-31 1998-01-28 A manufacturing process for printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES9700184A ES2125821B1 (es) 1997-01-31 1997-01-31 Un procedimiento de fabricacion de circuitos impresos.

Publications (2)

Publication Number Publication Date
ES2125821A1 ES2125821A1 (es) 1999-03-01
ES2125821B1 true ES2125821B1 (es) 1999-12-01

Family

ID=8298051

Family Applications (2)

Application Number Title Priority Date Filing Date
ES9700184A Expired - Lifetime ES2125821B1 (es) 1997-01-31 1997-01-31 Un procedimiento de fabricacion de circuitos impresos.
ES9702533A Expired - Lifetime ES2143932B1 (es) 1997-01-31 1997-12-05 Mejoras introducidas en el procedimiento de fabricacion de circuitos impresos objeto de la patente principal n. 9700184 (8) por un procedimiento de fabricacion de circuitos impresos.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES9702533A Expired - Lifetime ES2143932B1 (es) 1997-01-31 1997-12-05 Mejoras introducidas en el procedimiento de fabricacion de circuitos impresos objeto de la patente principal n. 9700184 (8) por un procedimiento de fabricacion de circuitos impresos.

Country Status (6)

Country Link
EP (1) EP0857010B1 (es)
JP (1) JPH10224011A (es)
CA (1) CA2279340A1 (es)
DE (1) DE69735750T2 (es)
ES (2) ES2125821B1 (es)
WO (1) WO1998034444A1 (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2188381A1 (es) * 2001-06-05 2003-06-16 Lear Automotive Eeds Spain Procedimiento de fabricacion de placas de circuito impreso a partir de un polimero extrusionado

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002503878A (ja) * 1997-12-05 2002-02-05 リア オートモーティヴ ディアボーン インコーポレイテッド プリント回路及び製造方法
EP1257157B1 (en) 1999-12-31 2004-11-24 Lear Automotive (EEDS) Spain, S.L. Method for manufacturing printed circuit boards
CN105282974B (zh) * 2015-10-14 2018-05-11 深圳崇达多层线路板有限公司 一种阶梯式印制电路板的制作方法
CN109195340A (zh) * 2018-09-18 2019-01-11 桑尼维尔新材料科技(南京)有限公司 一种制作金属化陶瓷基板超窄线宽、线距图形的方法
CN110098302A (zh) * 2019-05-06 2019-08-06 华南理工大学 一种用于微型led器件的柔性聚酰亚胺衬底及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3085295A (en) * 1957-04-30 1963-04-16 Michael A Pizzino Method of making inlaid circuits
FR1260804A (fr) * 1960-03-31 1961-05-12 Electronique & Automatisme Sa Procédé de réalisation de circuits imprimés
GB971775A (en) * 1961-07-17 1964-10-07 Borg Warner Electrical terminal board
US3177103A (en) * 1961-09-18 1965-04-06 Sauders Associates Inc Two pass etching for fabricating printed circuitry
US3264152A (en) * 1963-03-26 1966-08-02 Tri Tech Method for fabricating electrical circuit components
DE1665944A1 (de) * 1967-05-13 1971-04-08 Siemens Ag Verfahren zum Herstellen elektrischer Schaltkreise
JPH02138793A (ja) * 1988-11-18 1990-05-28 Shinko Electric Ind Co Ltd 回路基板の製造方法
ES2071540B1 (es) * 1992-01-29 1996-02-01 Mecanismos Aux Ind Perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2188381A1 (es) * 2001-06-05 2003-06-16 Lear Automotive Eeds Spain Procedimiento de fabricacion de placas de circuito impreso a partir de un polimero extrusionado

Also Published As

Publication number Publication date
ES2143932B1 (es) 2000-12-01
ES2143932A1 (es) 2000-05-16
EP0857010B1 (fr) 2006-04-26
EP0857010A1 (fr) 1998-08-05
DE69735750T2 (de) 2007-05-10
WO1998034444A1 (en) 1998-08-06
CA2279340A1 (en) 1998-08-06
ES2125821A1 (es) 1999-03-01
JPH10224011A (ja) 1998-08-21
DE69735750D1 (de) 2006-06-01

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