ES2143085T3 - Limpieza de piezas de aluminio. - Google Patents
Limpieza de piezas de aluminio.Info
- Publication number
- ES2143085T3 ES2143085T3 ES95941183T ES95941183T ES2143085T3 ES 2143085 T3 ES2143085 T3 ES 2143085T3 ES 95941183 T ES95941183 T ES 95941183T ES 95941183 T ES95941183 T ES 95941183T ES 2143085 T3 ES2143085 T3 ES 2143085T3
- Authority
- ES
- Spain
- Prior art keywords
- cleaning
- aluminum parts
- workpiece
- anodization
- dissolve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title abstract 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 title 1
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 238000002048 anodisation reaction Methods 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
- C25F1/04—Pickling; Descaling in solution
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Photoreceptors In Electrophotography (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- ing And Chemical Polishing (AREA)
Abstract
SE PRESENTA UN METODO PARA LIMPIAR PIEZAS DE TRABAJO DE AL QUE COMPRENDE LA ANODIZACION DE LA PIEZA DE TRABAJO EN UN ELECTROLITO ACIDICO CAPAZ DE DISOLVER EL OXIDO DE ALUMINIO Y MANTENIDO A UNA TEMPERATURA DE AL MENOS 70 (GRADOS) C BAJO CONDICIONES TALES QUE LA SUPERFICIE DE LA PIEZA DE TRABAJO SE LIMPIE SIENDO CUALQUIER PELICULA DE OXIDO SOBRE LA MISMA NO POROSA Y NO MAYOR DE ALREDEDOR DE 20 NM DE GRUESA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94309501 | 1994-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2143085T3 true ES2143085T3 (es) | 2000-05-01 |
Family
ID=8217953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95941183T Expired - Lifetime ES2143085T3 (es) | 1994-12-19 | 1995-12-18 | Limpieza de piezas de aluminio. |
Country Status (9)
Country | Link |
---|---|
US (1) | US5997721A (es) |
EP (1) | EP0795048B1 (es) |
JP (1) | JP3647461B2 (es) |
AT (1) | ATE190678T1 (es) |
AU (1) | AU4267096A (es) |
CA (1) | CA2208109C (es) |
DE (1) | DE69515691T2 (es) |
ES (1) | ES2143085T3 (es) |
WO (1) | WO1996019596A1 (es) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1304643C (zh) * | 2001-04-20 | 2007-03-14 | 克里斯铝轧制品有限公司 | 镀覆和预处理铝件方法 |
DE50101194D1 (de) * | 2001-06-20 | 2004-01-29 | Wolf-Dieter Franz | Verfahren zum Reinigen und Passivieren von Leichtmetalllegierungsoberflächen |
ATE277207T1 (de) * | 2001-10-11 | 2004-10-15 | Franz Oberflaechentechnik Gmbh | Beschichtungsverfahren für leichtmetalllegierungsoberflächen |
US6994919B2 (en) | 2002-01-31 | 2006-02-07 | Corus Aluminium Walzprodukte Gmbh | Brazing product and method of manufacturing a brazing product |
US7294411B2 (en) | 2002-01-31 | 2007-11-13 | Aleris Aluminum Koblenz Gmbh | Brazing product and method of its manufacture |
WO2004035876A1 (de) * | 2002-10-09 | 2004-04-29 | Wolf-Dieter Franz | Verfahren zum reinigen und passivieren von leichtmetalllegierungsoberflächen |
US7056597B2 (en) * | 2002-12-13 | 2006-06-06 | Corus Aluminium Walzprodukte Gmbh | Brazing sheet product and method of its manufacture |
US7078111B2 (en) | 2002-12-13 | 2006-07-18 | Corus Aluminium Walzprodukte Gmbh | Brazing sheet product and method of its manufacture |
US20060157352A1 (en) * | 2005-01-19 | 2006-07-20 | Corus Aluminium Walzprodukte Gmbh | Method of electroplating and pre-treating aluminium workpieces |
BRPI0610826B8 (pt) | 2005-05-19 | 2023-01-10 | Hydro Aluminium Deutschland Gmbh | Método de condicionamento da superfície de uma litofaixa consistindo de uma liga de alumínio |
JP2007270217A (ja) * | 2006-03-30 | 2007-10-18 | Fujifilm Corp | 電解処理方法及び装置、並びに平版印刷版の製造方法及び装置 |
CN101484322A (zh) * | 2006-03-31 | 2009-07-15 | 美铝公司 | 生产平版印刷片材的制造方法 |
EP2024190B9 (en) * | 2006-06-06 | 2012-09-05 | Hydro Aluminium Rolled Products GmbH | Method of conditioning the surface of a litho-sheet or litho-strip |
EP1880861B1 (de) * | 2006-07-21 | 2015-11-04 | Hydro Aluminium Rolled Products GmbH | Aluminiumband für lithografische Druckplattenträger |
CN101591797B (zh) * | 2008-05-30 | 2012-08-08 | 中芯国际集成电路制造(上海)有限公司 | 铝垫电化学刻蚀方法 |
WO2011059341A1 (en) * | 2009-11-13 | 2011-05-19 | Norsk Hydro Asa | Process for production of magnesium containing aluminium strip or web material with improved adhesion |
US9132436B2 (en) | 2012-09-21 | 2015-09-15 | Applied Materials, Inc. | Chemical control features in wafer process equipment |
US10256079B2 (en) | 2013-02-08 | 2019-04-09 | Applied Materials, Inc. | Semiconductor processing systems having multiple plasma configurations |
US9966240B2 (en) | 2014-10-14 | 2018-05-08 | Applied Materials, Inc. | Systems and methods for internal surface conditioning assessment in plasma processing equipment |
US9355922B2 (en) | 2014-10-14 | 2016-05-31 | Applied Materials, Inc. | Systems and methods for internal surface conditioning in plasma processing equipment |
US11637002B2 (en) | 2014-11-26 | 2023-04-25 | Applied Materials, Inc. | Methods and systems to enhance process uniformity |
US9741593B2 (en) | 2015-08-06 | 2017-08-22 | Applied Materials, Inc. | Thermal management systems and methods for wafer processing systems |
US9691645B2 (en) | 2015-08-06 | 2017-06-27 | Applied Materials, Inc. | Bolted wafer chuck thermal management systems and methods for wafer processing systems |
US10504700B2 (en) | 2015-08-27 | 2019-12-10 | Applied Materials, Inc. | Plasma etching systems and methods with secondary plasma injection |
US10504754B2 (en) | 2016-05-19 | 2019-12-10 | Applied Materials, Inc. | Systems and methods for improved semiconductor etching and component protection |
US9865484B1 (en) | 2016-06-29 | 2018-01-09 | Applied Materials, Inc. | Selective etch using material modification and RF pulsing |
US10629473B2 (en) | 2016-09-09 | 2020-04-21 | Applied Materials, Inc. | Footing removal for nitride spacer |
US10546729B2 (en) | 2016-10-04 | 2020-01-28 | Applied Materials, Inc. | Dual-channel showerhead with improved profile |
US10163696B2 (en) | 2016-11-11 | 2018-12-25 | Applied Materials, Inc. | Selective cobalt removal for bottom up gapfill |
US10026621B2 (en) | 2016-11-14 | 2018-07-17 | Applied Materials, Inc. | SiN spacer profile patterning |
US10431429B2 (en) | 2017-02-03 | 2019-10-01 | Applied Materials, Inc. | Systems and methods for radial and azimuthal control of plasma uniformity |
US10943834B2 (en) | 2017-03-13 | 2021-03-09 | Applied Materials, Inc. | Replacement contact process |
US11276590B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Multi-zone semiconductor substrate supports |
US11276559B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Semiconductor processing chamber for multiple precursor flow |
US10920320B2 (en) | 2017-06-16 | 2021-02-16 | Applied Materials, Inc. | Plasma health determination in semiconductor substrate processing reactors |
US10727080B2 (en) | 2017-07-07 | 2020-07-28 | Applied Materials, Inc. | Tantalum-containing material removal |
US10297458B2 (en) | 2017-08-07 | 2019-05-21 | Applied Materials, Inc. | Process window widening using coated parts in plasma etch processes |
US10903054B2 (en) | 2017-12-19 | 2021-01-26 | Applied Materials, Inc. | Multi-zone gas distribution systems and methods |
US11328909B2 (en) | 2017-12-22 | 2022-05-10 | Applied Materials, Inc. | Chamber conditioning and removal processes |
US10854426B2 (en) | 2018-01-08 | 2020-12-01 | Applied Materials, Inc. | Metal recess for semiconductor structures |
US10964512B2 (en) | 2018-02-15 | 2021-03-30 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus and methods |
US10679870B2 (en) | 2018-02-15 | 2020-06-09 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus |
TWI716818B (zh) | 2018-02-28 | 2021-01-21 | 美商應用材料股份有限公司 | 形成氣隙的系統及方法 |
US10593560B2 (en) | 2018-03-01 | 2020-03-17 | Applied Materials, Inc. | Magnetic induction plasma source for semiconductor processes and equipment |
US10319600B1 (en) | 2018-03-12 | 2019-06-11 | Applied Materials, Inc. | Thermal silicon etch |
US10699879B2 (en) | 2018-04-17 | 2020-06-30 | Applied Materials, Inc. | Two piece electrode assembly with gap for plasma control |
US20190323127A1 (en) * | 2018-04-19 | 2019-10-24 | Applied Materials, Inc. | Texturing and plating nickel on aluminum process chamber components |
US10886137B2 (en) | 2018-04-30 | 2021-01-05 | Applied Materials, Inc. | Selective nitride removal |
US10872778B2 (en) | 2018-07-06 | 2020-12-22 | Applied Materials, Inc. | Systems and methods utilizing solid-phase etchants |
US10755941B2 (en) | 2018-07-06 | 2020-08-25 | Applied Materials, Inc. | Self-limiting selective etching systems and methods |
US10672642B2 (en) | 2018-07-24 | 2020-06-02 | Applied Materials, Inc. | Systems and methods for pedestal configuration |
EP3850129A1 (en) * | 2018-09-11 | 2021-07-21 | Novelis, Inc. | Highly deformable and thermally treatable continuous coils and method of producing the same |
US11049755B2 (en) | 2018-09-14 | 2021-06-29 | Applied Materials, Inc. | Semiconductor substrate supports with embedded RF shield |
US10892198B2 (en) | 2018-09-14 | 2021-01-12 | Applied Materials, Inc. | Systems and methods for improved performance in semiconductor processing |
US11062887B2 (en) | 2018-09-17 | 2021-07-13 | Applied Materials, Inc. | High temperature RF heater pedestals |
US11417534B2 (en) | 2018-09-21 | 2022-08-16 | Applied Materials, Inc. | Selective material removal |
US11682560B2 (en) | 2018-10-11 | 2023-06-20 | Applied Materials, Inc. | Systems and methods for hafnium-containing film removal |
US11121002B2 (en) | 2018-10-24 | 2021-09-14 | Applied Materials, Inc. | Systems and methods for etching metals and metal derivatives |
US11437242B2 (en) | 2018-11-27 | 2022-09-06 | Applied Materials, Inc. | Selective removal of silicon-containing materials |
US11721527B2 (en) | 2019-01-07 | 2023-08-08 | Applied Materials, Inc. | Processing chamber mixing systems |
US10920319B2 (en) | 2019-01-11 | 2021-02-16 | Applied Materials, Inc. | Ceramic showerheads with conductive electrodes |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1191437A (fr) * | 1958-02-11 | 1959-10-20 | Procédé de préparation de l'aluminium et de ses alliages pour le chromage | |
US3929591A (en) * | 1974-08-26 | 1975-12-30 | Polychrome Corp | Novel lithographic plate and method |
US4097342A (en) * | 1975-05-16 | 1978-06-27 | Alcan Research And Development Limited | Electroplating aluminum stock |
DE2949807B1 (de) * | 1979-12-11 | 1981-07-16 | Schenk Filterbau Gmbh, 7076 Waldstetten | Elektrolytloesung zum Elektropolieren |
-
1995
- 1995-12-18 AT AT95941183T patent/ATE190678T1/de not_active IP Right Cessation
- 1995-12-18 US US08/849,674 patent/US5997721A/en not_active Expired - Lifetime
- 1995-12-18 AU AU42670/96A patent/AU4267096A/en not_active Abandoned
- 1995-12-18 WO PCT/GB1995/002956 patent/WO1996019596A1/en active IP Right Grant
- 1995-12-18 CA CA002208109A patent/CA2208109C/en not_active Expired - Fee Related
- 1995-12-18 JP JP51958996A patent/JP3647461B2/ja not_active Expired - Fee Related
- 1995-12-18 DE DE69515691T patent/DE69515691T2/de not_active Expired - Lifetime
- 1995-12-18 EP EP95941183A patent/EP0795048B1/en not_active Expired - Lifetime
- 1995-12-18 ES ES95941183T patent/ES2143085T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
MX9704286A (es) | 1997-09-30 |
CA2208109C (en) | 2006-06-20 |
DE69515691T2 (de) | 2000-07-20 |
EP0795048A1 (en) | 1997-09-17 |
JPH10510881A (ja) | 1998-10-20 |
WO1996019596A1 (en) | 1996-06-27 |
AU4267096A (en) | 1996-07-10 |
EP0795048B1 (en) | 2000-03-15 |
ATE190678T1 (de) | 2000-04-15 |
JP3647461B2 (ja) | 2005-05-11 |
CA2208109A1 (en) | 1996-06-27 |
US5997721A (en) | 1999-12-07 |
DE69515691D1 (de) | 2000-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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