ATE190678T1 - Reinigung von aluminium werkstücken - Google Patents

Reinigung von aluminium werkstücken

Info

Publication number
ATE190678T1
ATE190678T1 AT95941183T AT95941183T ATE190678T1 AT E190678 T1 ATE190678 T1 AT E190678T1 AT 95941183 T AT95941183 T AT 95941183T AT 95941183 T AT95941183 T AT 95941183T AT E190678 T1 ATE190678 T1 AT E190678T1
Authority
AT
Austria
Prior art keywords
pct
cleaning
workpiece
sec
aluminum workpieces
Prior art date
Application number
AT95941183T
Other languages
English (en)
Inventor
Peter Karl Ferdinand Limbach
Armin Kumpart
Nigel Cleaton Davies
Jonathan Ball
Original Assignee
Alcan Int Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8217953&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE190678(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Alcan Int Ltd filed Critical Alcan Int Ltd
Application granted granted Critical
Publication of ATE190678T1 publication Critical patent/ATE190678T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
    • C25F1/02—Pickling; Descaling
    • C25F1/04—Pickling; Descaling in solution
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • ing And Chemical Polishing (AREA)
AT95941183T 1994-12-19 1995-12-18 Reinigung von aluminium werkstücken ATE190678T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94309501 1994-12-19
PCT/GB1995/002956 WO1996019596A1 (en) 1994-12-19 1995-12-18 Cleaning aluminium workpieces

Publications (1)

Publication Number Publication Date
ATE190678T1 true ATE190678T1 (de) 2000-04-15

Family

ID=8217953

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95941183T ATE190678T1 (de) 1994-12-19 1995-12-18 Reinigung von aluminium werkstücken

Country Status (9)

Country Link
US (1) US5997721A (de)
EP (1) EP0795048B1 (de)
JP (1) JP3647461B2 (de)
AT (1) ATE190678T1 (de)
AU (1) AU4267096A (de)
CA (1) CA2208109C (de)
DE (1) DE69515691T2 (de)
ES (1) ES2143085T3 (de)
WO (1) WO1996019596A1 (de)

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EP1383943A1 (de) 2001-04-20 2004-01-28 Corus Aluminium Walzprodukte GmbH Verfahren zum platieren und vorbehandeln von aluminium werkstücken
DE50101194D1 (de) * 2001-06-20 2004-01-29 Wolf-Dieter Franz Verfahren zum Reinigen und Passivieren von Leichtmetalllegierungsoberflächen
EP1302565B1 (de) * 2001-10-11 2004-09-22 FRANZ Oberflächentechnik GmbH & Co KG Beschichtungsverfahren für Leichtmetalllegierungsoberflächen
US6994919B2 (en) 2002-01-31 2006-02-07 Corus Aluminium Walzprodukte Gmbh Brazing product and method of manufacturing a brazing product
US7294411B2 (en) 2002-01-31 2007-11-13 Aleris Aluminum Koblenz Gmbh Brazing product and method of its manufacture
AU2002338880A1 (en) * 2002-10-09 2004-05-04 Wolf-Dieter Franz Method for cleaning and passivating light alloy surfaces
US7078111B2 (en) * 2002-12-13 2006-07-18 Corus Aluminium Walzprodukte Gmbh Brazing sheet product and method of its manufacture
US7056597B2 (en) * 2002-12-13 2006-06-06 Corus Aluminium Walzprodukte Gmbh Brazing sheet product and method of its manufacture
US20060157352A1 (en) * 2005-01-19 2006-07-20 Corus Aluminium Walzprodukte Gmbh Method of electroplating and pre-treating aluminium workpieces
CN101203629B (zh) 2005-05-19 2012-01-18 海德鲁铝业德国有限责任公司 石印条的处理
JP2007270217A (ja) * 2006-03-30 2007-10-18 Fujifilm Corp 電解処理方法及び装置、並びに平版印刷版の製造方法及び装置
KR101152169B1 (ko) * 2006-03-31 2012-06-15 알코아 인코포레이티드 리소 시트 생산을 위한 제조 방법
CN103924252B (zh) 2006-06-06 2017-08-18 海德鲁铝业德国有限责任公司 清理铝加工件的方法
EP2998126A1 (de) 2006-07-21 2016-03-23 Hydro Aluminium Rolled Products GmbH Verfahren zur herstellung eines lithografischen druckplattenträgers
CN101591797B (zh) * 2008-05-30 2012-08-08 中芯国际集成电路制造(上海)有限公司 铝垫电化学刻蚀方法
NO2499272T3 (de) * 2009-11-13 2018-01-13
US9132436B2 (en) 2012-09-21 2015-09-15 Applied Materials, Inc. Chemical control features in wafer process equipment
US10256079B2 (en) 2013-02-08 2019-04-09 Applied Materials, Inc. Semiconductor processing systems having multiple plasma configurations
US9355922B2 (en) 2014-10-14 2016-05-31 Applied Materials, Inc. Systems and methods for internal surface conditioning in plasma processing equipment
US9966240B2 (en) 2014-10-14 2018-05-08 Applied Materials, Inc. Systems and methods for internal surface conditioning assessment in plasma processing equipment
US11637002B2 (en) 2014-11-26 2023-04-25 Applied Materials, Inc. Methods and systems to enhance process uniformity
US9741593B2 (en) 2015-08-06 2017-08-22 Applied Materials, Inc. Thermal management systems and methods for wafer processing systems
US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
US10504754B2 (en) 2016-05-19 2019-12-10 Applied Materials, Inc. Systems and methods for improved semiconductor etching and component protection
US10629473B2 (en) 2016-09-09 2020-04-21 Applied Materials, Inc. Footing removal for nitride spacer
US10546729B2 (en) 2016-10-04 2020-01-28 Applied Materials, Inc. Dual-channel showerhead with improved profile
US10163696B2 (en) 2016-11-11 2018-12-25 Applied Materials, Inc. Selective cobalt removal for bottom up gapfill
US10026621B2 (en) 2016-11-14 2018-07-17 Applied Materials, Inc. SiN spacer profile patterning
US10431429B2 (en) 2017-02-03 2019-10-01 Applied Materials, Inc. Systems and methods for radial and azimuthal control of plasma uniformity
US10943834B2 (en) 2017-03-13 2021-03-09 Applied Materials, Inc. Replacement contact process
US11276559B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Semiconductor processing chamber for multiple precursor flow
US11276590B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Multi-zone semiconductor substrate supports
US10920320B2 (en) 2017-06-16 2021-02-16 Applied Materials, Inc. Plasma health determination in semiconductor substrate processing reactors
US10727080B2 (en) 2017-07-07 2020-07-28 Applied Materials, Inc. Tantalum-containing material removal
US10297458B2 (en) 2017-08-07 2019-05-21 Applied Materials, Inc. Process window widening using coated parts in plasma etch processes
US10903054B2 (en) 2017-12-19 2021-01-26 Applied Materials, Inc. Multi-zone gas distribution systems and methods
US11328909B2 (en) 2017-12-22 2022-05-10 Applied Materials, Inc. Chamber conditioning and removal processes
US10854426B2 (en) 2018-01-08 2020-12-01 Applied Materials, Inc. Metal recess for semiconductor structures
US10679870B2 (en) 2018-02-15 2020-06-09 Applied Materials, Inc. Semiconductor processing chamber multistage mixing apparatus
US10964512B2 (en) 2018-02-15 2021-03-30 Applied Materials, Inc. Semiconductor processing chamber multistage mixing apparatus and methods
TWI716818B (zh) 2018-02-28 2021-01-21 美商應用材料股份有限公司 形成氣隙的系統及方法
US10593560B2 (en) 2018-03-01 2020-03-17 Applied Materials, Inc. Magnetic induction plasma source for semiconductor processes and equipment
US10319600B1 (en) 2018-03-12 2019-06-11 Applied Materials, Inc. Thermal silicon etch
US10699879B2 (en) 2018-04-17 2020-06-30 Applied Materials, Inc. Two piece electrode assembly with gap for plasma control
US20190323127A1 (en) * 2018-04-19 2019-10-24 Applied Materials, Inc. Texturing and plating nickel on aluminum process chamber components
US10886137B2 (en) 2018-04-30 2021-01-05 Applied Materials, Inc. Selective nitride removal
US10755941B2 (en) 2018-07-06 2020-08-25 Applied Materials, Inc. Self-limiting selective etching systems and methods
US10872778B2 (en) 2018-07-06 2020-12-22 Applied Materials, Inc. Systems and methods utilizing solid-phase etchants
US10672642B2 (en) 2018-07-24 2020-06-02 Applied Materials, Inc. Systems and methods for pedestal configuration
US11049755B2 (en) 2018-09-14 2021-06-29 Applied Materials, Inc. Semiconductor substrate supports with embedded RF shield
US10892198B2 (en) 2018-09-14 2021-01-12 Applied Materials, Inc. Systems and methods for improved performance in semiconductor processing
US11062887B2 (en) 2018-09-17 2021-07-13 Applied Materials, Inc. High temperature RF heater pedestals
US11417534B2 (en) 2018-09-21 2022-08-16 Applied Materials, Inc. Selective material removal
US11682560B2 (en) 2018-10-11 2023-06-20 Applied Materials, Inc. Systems and methods for hafnium-containing film removal
US11121002B2 (en) 2018-10-24 2021-09-14 Applied Materials, Inc. Systems and methods for etching metals and metal derivatives
US11437242B2 (en) 2018-11-27 2022-09-06 Applied Materials, Inc. Selective removal of silicon-containing materials
US11721527B2 (en) 2019-01-07 2023-08-08 Applied Materials, Inc. Processing chamber mixing systems
US10920319B2 (en) 2019-01-11 2021-02-16 Applied Materials, Inc. Ceramic showerheads with conductive electrodes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1191437A (fr) * 1958-02-11 1959-10-20 Procédé de préparation de l'aluminium et de ses alliages pour le chromage
US3929591A (en) * 1974-08-26 1975-12-30 Polychrome Corp Novel lithographic plate and method
US4097342A (en) * 1975-05-16 1978-06-27 Alcan Research And Development Limited Electroplating aluminum stock
DE2949807B1 (de) * 1979-12-11 1981-07-16 Schenk Filterbau Gmbh, 7076 Waldstetten Elektrolytloesung zum Elektropolieren

Also Published As

Publication number Publication date
US5997721A (en) 1999-12-07
CA2208109C (en) 2006-06-20
MX9704286A (es) 1997-09-30
EP0795048B1 (de) 2000-03-15
ES2143085T3 (es) 2000-05-01
DE69515691T2 (de) 2000-07-20
JP3647461B2 (ja) 2005-05-11
WO1996019596A1 (en) 1996-06-27
DE69515691D1 (de) 2000-04-20
CA2208109A1 (en) 1996-06-27
EP0795048A1 (de) 1997-09-17
AU4267096A (en) 1996-07-10
JPH10510881A (ja) 1998-10-20

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