ES2141954T3 - Dispositivo de plaqueado. - Google Patents
Dispositivo de plaqueado.Info
- Publication number
- ES2141954T3 ES2141954T3 ES95928975T ES95928975T ES2141954T3 ES 2141954 T3 ES2141954 T3 ES 2141954T3 ES 95928975 T ES95928975 T ES 95928975T ES 95928975 T ES95928975 T ES 95928975T ES 2141954 T3 ES2141954 T3 ES 2141954T3
- Authority
- ES
- Spain
- Prior art keywords
- laser
- rectangular cross
- section
- metallic plates
- lightning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0732—Shaping the laser spot into a rectangular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/26—Seam welding of rectilinear seams
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
LA INVENCION SE REFIERE A UN DISPOSITIVO PARA CHAPEADO DE DOS O MAS PLACAS METALICAS, CINTAS, ETC. MEDIANTE ABSORCION DE ENERGIA LASER. EL DISPOSITIVO ESTA EQUIPADO CON OPTICA DE FORMACION DE RAYO QUE FORMA LA RADIACION LASER DENTRO DE UN RAYO CON SECCION TRANSVERSAL RECTANGULAR. COMO FUENTE DE RADIACION SE UTILIZA UNA DISPOSICION DE DIODO LASER EN DONDE VARIOS DIODOS LASER ESTAN DISPUESTOS DE FORMA PROXIMA UNO CON OTRO EN EL MISMO PLANO PARA SUMINISTRAR BARRAS QUE PUEDEN SER COLOCADAS UNA AL LADO DE OTRA, ASI COMO APILADAS UNA SOBRE OTRA EN CUALQUIER NUMERO. PARA HOMOGENEIZAR LA RADIACION DEL LASER PRODUCIDA MEDIANTE LA DISPOSICION A FIN DE SUMINISTRAR UNA SECCION TRANSVERSAL RECTANGULAR, EL DISPOSITIVO PROPUESTO ESTA EQUIPADO CON MEDIOS ESPECIALES TALES COMO UN PRISMA QUE CONVERGE EN EL PERFIL DE UNA CUÑA, UNA PLACA DE GAS CON SECCION TRANSVERSAL RECTANGULAR, ACCIONAMIENTO DE CONTORNO REFLECTIVO, ETC. EL RAYO DE SECCION TRANSVERSAL RECTANGULAR GOLPEA LAS DOS SUPERFICIES DE LAS PLACAS METALICAS QUE SON CHAPEADAS SOLO LOCALMENTE, SOBRE AREAS LIMITADAS Y CON PROFUNDIDAD PEQUEÑA, EN ESTADO PLASTICO. ADICIONALMENTE SE DISPONE DE SENSORES Y DISPOSITIVOS DE CONTROL PARA EL CONTROL DE LA POTENCIA DE LA DISPOSICION DE DIODO LASER Y/O PARA EL CAMBIO DE LA VELOCIDAD DE AVANCE DE LAS CHAPAS METALICAS QUE SON CHAPEADAS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4429913A DE4429913C1 (de) | 1994-08-23 | 1994-08-23 | Vorrichtung und Verfahren zum Plattieren |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2141954T3 true ES2141954T3 (es) | 2000-04-01 |
Family
ID=6526376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95928975T Expired - Lifetime ES2141954T3 (es) | 1994-08-23 | 1995-08-21 | Dispositivo de plaqueado. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5886313A (es) |
EP (1) | EP0777549B1 (es) |
DE (1) | DE4429913C1 (es) |
ES (1) | ES2141954T3 (es) |
WO (1) | WO1996005937A1 (es) |
Families Citing this family (86)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2737814B1 (fr) * | 1995-08-11 | 1997-09-12 | Soc D Production Et De Rech Ap | Procede et dispositif de commande d'une source laser a plusieurs modules laser pour optimiser le traitement de surface par laser |
DE19640612C1 (de) * | 1996-10-01 | 1998-06-18 | Thyssen Stahl Ag | Verfahren und Vorrichtung zum Fügen von überlappend miteinander zu verbindenden Flachprodukten |
US6331692B1 (en) * | 1996-10-12 | 2001-12-18 | Volker Krause | Diode laser, laser optics, device for laser treatment of a workpiece, process for a laser treatment of workpiece |
JPH11218412A (ja) * | 1998-02-02 | 1999-08-10 | Shinkawa Ltd | ボンディング装置 |
DE19942250A1 (de) * | 1999-09-04 | 2001-03-08 | Hella Kg Hueck & Co | Lichtwellenleitung für die Laser-Schweißung |
US6528755B2 (en) * | 2000-04-11 | 2003-03-04 | Branson Ultrasonics Corporation | Light guide for laser welding |
US6451152B1 (en) | 2000-05-24 | 2002-09-17 | The Boeing Company | Method for heating and controlling temperature of composite material during automated placement |
WO2002009904A1 (en) * | 2000-07-31 | 2002-02-07 | Toyota Jidosha Kabushiki Kaisha | Laser beam machining method |
US6795605B1 (en) * | 2000-08-01 | 2004-09-21 | Cheetah Omni, Llc | Micromechanical optical switch |
US6455804B1 (en) * | 2000-12-08 | 2002-09-24 | Touchstone Research Laboratory, Ltd. | Continuous metal matrix composite consolidation |
US7186948B1 (en) * | 2000-12-08 | 2007-03-06 | Touchstone Research Laboratory, Ltd. | Continuous metal matrix composite consolidation |
CA2332190A1 (en) * | 2001-01-25 | 2002-07-25 | Efos Inc. | Addressable semiconductor array light source for localized radiation delivery |
US7145704B1 (en) * | 2003-11-25 | 2006-12-05 | Cheetah Omni, Llc | Optical logic gate based optical router |
DE10290217B4 (de) * | 2001-02-19 | 2009-06-10 | Toyota Jidosha Kabushiki Kaisha, Toyota-shi | Laserbearbeitungsvorrichtung und damit durchführbares Bearbeitungsverfahren |
FR2823459B1 (fr) * | 2001-04-11 | 2003-08-22 | Renault | Dispositif ameliore et procede associe de soudage dit bi-passes |
US20030102070A1 (en) * | 2001-11-30 | 2003-06-05 | The Boeing Company | System, method, and computer program product for providing control for high speed fiber placement |
US7110671B1 (en) * | 2001-12-03 | 2006-09-19 | Cheetah Omni, Llc | Method and apparatus for scheduling communication using a star switching fabric |
US7209657B1 (en) * | 2001-12-03 | 2007-04-24 | Cheetah Omni, Llc | Optical routing using a star switching fabric |
US7260655B1 (en) | 2001-12-03 | 2007-08-21 | Cheetah Omni, Llc | Optical routing using star switching fabric with reduced effective switching time |
US6799619B2 (en) * | 2002-02-06 | 2004-10-05 | The Boeing Company | Composite material collation machine and associated method for high rate collation of composite materials |
FR2836081B1 (fr) * | 2002-02-20 | 2004-06-25 | Abb Body In White | Procede de soudage de deux toles par laser |
FR2836080A1 (fr) * | 2002-02-20 | 2003-08-22 | Abb Body In White | Procede de configuration d'un faisceau laser et procedes de soudage de toles par laser |
EP2009676B8 (en) | 2002-05-08 | 2012-11-21 | Phoseon Technology, Inc. | A semiconductor materials inspection system |
US20040033024A1 (en) * | 2002-08-14 | 2004-02-19 | Ford Global Technologies, Inc. | Linear diode laser array light coupling apparatus |
TWI332682B (en) * | 2002-09-19 | 2010-11-01 | Semiconductor Energy Lab | Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device |
CN100383573C (zh) * | 2002-12-02 | 2008-04-23 | 3M创新有限公司 | 多光源照明系统 |
US7327916B2 (en) * | 2003-03-11 | 2008-02-05 | Semiconductor Energy Laboratory Co., Ltd. | Beam Homogenizer, laser irradiation apparatus, and method of manufacturing a semiconductor device |
SG137674A1 (en) * | 2003-04-24 | 2007-12-28 | Semiconductor Energy Lab | Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device |
US7245802B2 (en) * | 2003-08-04 | 2007-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device |
US7169630B2 (en) * | 2003-09-30 | 2007-01-30 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device |
WO2005041632A2 (en) * | 2003-10-31 | 2005-05-12 | Phoseon Technology, Inc. | Collection optics for led array with offset hemispherical or faceted surfaces |
US7329887B2 (en) * | 2003-12-02 | 2008-02-12 | 3M Innovative Properties Company | Solid state light device |
US7250611B2 (en) * | 2003-12-02 | 2007-07-31 | 3M Innovative Properties Company | LED curing apparatus and method |
BRPI0417172A (pt) * | 2003-12-02 | 2007-03-06 | 3M Innovative Properties Co | aparelho de irradiação, e, sistema de irradiação |
US7403680B2 (en) * | 2003-12-02 | 2008-07-22 | 3M Innovative Properties Company | Reflective light coupler |
US20050116235A1 (en) * | 2003-12-02 | 2005-06-02 | Schultz John C. | Illumination assembly |
US20050116635A1 (en) * | 2003-12-02 | 2005-06-02 | Walson James E. | Multiple LED source and method for assembling same |
US7456805B2 (en) * | 2003-12-18 | 2008-11-25 | 3M Innovative Properties Company | Display including a solid state light device and method using same |
DE102004001276A1 (de) * | 2004-01-08 | 2005-08-04 | Mtu Aero Engines Gmbh | Verfahren zur Erwärmung von Bauteilen |
DE102004003696B4 (de) * | 2004-01-24 | 2017-02-16 | Limo Patentverwaltung Gmbh & Co. Kg | Vorrichtung zum simultanen Laserschweißen |
WO2005091392A1 (en) | 2004-03-18 | 2005-09-29 | Phoseon Technology, Inc. | Micro-reflectors on a substrate for high-density led array |
US7820936B2 (en) * | 2004-07-02 | 2010-10-26 | Boston Scientific Scimed, Inc. | Method and apparatus for controlling and adjusting the intensity profile of a laser beam employed in a laser welder for welding polymeric and metallic components |
DE102004042337A1 (de) * | 2004-09-01 | 2006-03-30 | Innovavent Gmbh | Vorrichtung und Verfahren zum Homogenisieren von Laserstrahlung sowie eine Laseranlage unter Verwendung einer solchen Vorrichtung und eines solchen Verfahrens |
US20060048881A1 (en) * | 2004-09-08 | 2006-03-09 | Evans Richard B | Laser-assisted placement of veiled composite material |
US20060073311A1 (en) * | 2004-10-05 | 2006-04-06 | The Boeing Company | Apparatus and method for composite tape profile cutting |
US7842145B2 (en) * | 2004-10-05 | 2010-11-30 | The Boeing Company | Method for laying composite tape |
US7664365B2 (en) * | 2004-10-27 | 2010-02-16 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, and laser irradiation method, laser irradiation apparatus, and laser annealing method of non-single crystalline semiconductor film using the same |
US20060108340A1 (en) * | 2004-11-08 | 2006-05-25 | Jan Lipson | Apparatus for dynamic control of laser beam profile |
US7910499B2 (en) * | 2004-11-12 | 2011-03-22 | Applied Materials, Inc. | Autofocus for high power laser diode based annealing system |
US7422988B2 (en) * | 2004-11-12 | 2008-09-09 | Applied Materials, Inc. | Rapid detection of imminent failure in laser thermal processing of a substrate |
FR2878185B1 (fr) * | 2004-11-22 | 2008-11-07 | Sidel Sas | Procede de fabrication de recipients comprenant une etape de chauffe au moyen d'un faisceau de rayonnement electromagnetique coherent |
US7425296B2 (en) * | 2004-12-03 | 2008-09-16 | Pressco Technology Inc. | Method and system for wavelength specific thermal irradiation and treatment |
US10857722B2 (en) * | 2004-12-03 | 2020-12-08 | Pressco Ip Llc | Method and system for laser-based, wavelength specific infrared irradiation treatment |
KR101288758B1 (ko) * | 2004-12-30 | 2013-07-23 | 포세온 테크날러지 인코퍼레이티드 | 산업 공정에서 광원을 사용하는 시스템 및 방법 |
DE102005001435A1 (de) * | 2005-01-07 | 2006-07-20 | Andreas Link | Absorber für einen thermischen Solarkollektor und Verfahren zum Herstellen eines derartigen Absorbers |
US7538295B2 (en) * | 2005-04-21 | 2009-05-26 | Hewlett-Packard Development Company, L.P. | Laser welding system |
US7897891B2 (en) * | 2005-04-21 | 2011-03-01 | Hewlett-Packard Development Company, L.P. | Laser welding system |
US8318291B2 (en) * | 2005-09-07 | 2012-11-27 | The Boeing Company | Composite member defining a contour surface |
WO2007055691A1 (en) * | 2005-11-10 | 2007-05-18 | Quintessence Photonics Corporation | Apparatus for dynamic control of laser beam profile |
DE102006030245B4 (de) * | 2006-06-30 | 2017-05-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Teiltransparenter Sonnenkollektor mit Sonnenschutzfunktion |
FR2913210B1 (fr) * | 2007-03-02 | 2009-05-29 | Sidel Participations | Perfectionnements a la chauffe des matieres plastiques par rayonnement infrarouge |
FR2917005B1 (fr) * | 2007-06-11 | 2009-08-28 | Sidel Participations | Installation de chauffage des corps de preformes pour le soufflage de recipients |
EP2090395B1 (de) | 2008-02-13 | 2016-09-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Herstellen von metallischen Werkstoffverbunden und Verbund-Halbzeugen |
DE102008036435B4 (de) | 2008-02-13 | 2010-08-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Herstellen von metallischen Werkstoffverbunden und Verbund-Halbzeugen |
DE102009003717A1 (de) * | 2009-04-01 | 2010-10-14 | Reis Gmbh & Co. Kg Maschinenfabrik | Verfahren und Vorrichtung zum stoffschlüssigen Verbinden |
DE102009050859A1 (de) * | 2009-10-27 | 2011-04-28 | Ima Klessmann Gmbh Holzbearbeitungssysteme | Vorrichtung und Verfahren zur Bekantung von Werkstücken |
BR112012023775B1 (pt) * | 2010-03-23 | 2019-12-17 | Nippon Steel & Sumitomo Metal Corp | dispositivo e método de gerenciamento de operação para soldagem por resistência com alta frequência e soldagem por indução |
DE102010013351A1 (de) * | 2010-03-30 | 2011-12-15 | Li-Tec Battery Gmbh | Kontaktelement für Ableiter galvanischer Zellen |
ES2453200T3 (es) * | 2010-08-24 | 2014-04-04 | Homag Holzbearbeitungssysteme Ag | Dispositivo de transmisión para radiación |
KR101247106B1 (ko) * | 2010-11-24 | 2013-03-29 | 주식회사 성우하이텍 | 롤 포밍 시스템용 레이저 용접장치의 제어방법 |
US10201877B2 (en) | 2011-10-26 | 2019-02-12 | Titanova Inc | Puddle forming and shaping with primary and secondary lasers |
CN103163739B (zh) * | 2011-12-14 | 2015-07-22 | 上海微电子装备有限公司 | 一种紫外led照明装置 |
US9696091B2 (en) * | 2012-07-13 | 2017-07-04 | Adc Acquisition Company | Superimposed zones process heating |
US8840742B2 (en) * | 2012-11-07 | 2014-09-23 | The Boeing Company | System and method of detecting a missing tow in a composite layup |
JP5619268B1 (ja) * | 2013-12-26 | 2014-11-05 | トタニ技研工業株式会社 | 製袋機 |
US10137526B2 (en) * | 2014-03-11 | 2018-11-27 | Shimadzu Corporation | Laser machining device |
EP3212382A1 (en) * | 2014-10-28 | 2017-09-06 | Tecnofive s.r.l. | Method and apparatus for applying a heat-activated double-sided adhesive tape to a support |
JP6536842B2 (ja) * | 2015-02-06 | 2019-07-03 | 株式会社島津製作所 | レーザ装置 |
DE102016203969A1 (de) | 2016-03-10 | 2017-09-14 | Thyssenkrupp Ag | Verfahren zur Wärmebehandlung eines Flachproduktes aus Stahl, wärmebehandeltes Flachprodukt aus Stahl sowie seine Verwendung |
DE102018115126B4 (de) * | 2018-06-22 | 2020-02-13 | Trumpf Laser- Und Systemtechnik Gmbh | Optische Anordnung zur Umwandlung eines Eingangslaserstahls in einen linienartigen Ausgangsstrahl sowie Lasersystem mit einer solchen optischen Anordnung |
CN109014580B (zh) * | 2018-08-14 | 2020-06-09 | 哈尔滨工业大学 | 一种施加滚轧辅助的搭接激光间隙填粉焊方法 |
CN110202853A (zh) * | 2019-04-25 | 2019-09-06 | 吉林省中赢高科技有限公司 | 一种铜铝复合基材及其激光束焊接加工方法和应用 |
US11919111B1 (en) | 2020-01-15 | 2024-03-05 | Touchstone Research Laboratory Ltd. | Method for repairing defects in metal structures |
DE102020004652B3 (de) | 2020-07-31 | 2021-12-16 | Wieland-Werke Aktiengesellschaft | Verfahren zur Herstellung eines Gleitelements |
CN112894135A (zh) * | 2021-02-08 | 2021-06-04 | 浙江工业大学 | 一种激光轧制复合增材制造装置及制造方法 |
DE102021103830A1 (de) | 2021-02-18 | 2022-08-18 | a.i.m. all in metal GmbH | Verfahren zum Verschweißen von zwei länglichen Materialbändern |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4744615A (en) * | 1986-01-29 | 1988-05-17 | International Business Machines Corporation | Laser beam homogenizer |
EP0282593B1 (en) * | 1986-07-08 | 1993-09-15 | Kabushiki Kaisha Komatsu Seisakusho | Laser beam forming apparatus |
DE3713975A1 (de) * | 1987-04-25 | 1988-11-03 | Fraunhofer Ges Forschung | Vorrichtung und verfahren zum fuegen mit laserstrahlung |
JPS6422482A (en) * | 1987-07-17 | 1989-01-25 | Nippon Steel Corp | Heating method using laser beam |
US4963714A (en) * | 1988-10-24 | 1990-10-16 | Raytheon Company | Diode laser soldering system |
JPH069751B2 (ja) * | 1989-03-18 | 1994-02-09 | 株式会社日立製作所 | レーザ加工装置 |
ES2081965T3 (es) * | 1989-12-27 | 1996-03-16 | Ciba Geigy Ag | Dispositivo para homogenizar la distribuccion no homogenea de la luz de un haz de rayos laser. |
CA2043760A1 (en) * | 1990-06-05 | 1991-12-06 | Katsuhiro Minamida | Method of producing corrugated metal sheeting and method of producing honeycomb structure therefrom for carrying catalystic agents used for purifying exhaust gases |
JPH04258390A (ja) * | 1991-02-07 | 1992-09-14 | Sumitomo Metal Ind Ltd | フェライト系ステンレス鋼溶接管の製造方法 |
DE4220705C2 (de) * | 1992-06-24 | 2003-03-13 | Lambda Physik Ag | Vorrichtung zum Aufteilen eines Lichtstrahles in homogene Teilstrahlen |
DE4234342C2 (de) * | 1992-10-12 | 1998-05-14 | Fraunhofer Ges Forschung | Verfahren zur Materialbearbeitung mit Laserstrahlung |
DE4301689A1 (de) * | 1993-01-22 | 1994-07-28 | Deutsche Forsch Luft Raumfahrt | Leistungsgesteuertes fraktales Lasersystem |
DE59403740D1 (de) * | 1993-05-19 | 1997-09-18 | Fraunhofer Ges Forschung | Verfahren zur materialbearbeitung mit diodenstrahlung |
US5548444A (en) * | 1994-07-06 | 1996-08-20 | Hughes Danbury Optical Systems, Inc. | Optical beam homogenizing apparatus and method |
-
1994
- 1994-08-23 DE DE4429913A patent/DE4429913C1/de not_active Expired - Lifetime
-
1995
- 1995-08-21 EP EP95928975A patent/EP0777549B1/de not_active Expired - Lifetime
- 1995-08-21 WO PCT/DE1995/001126 patent/WO1996005937A1/de active IP Right Grant
- 1995-08-21 US US08/793,254 patent/US5886313A/en not_active Expired - Lifetime
- 1995-08-21 ES ES95928975T patent/ES2141954T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE4429913C1 (de) | 1996-03-21 |
WO1996005937A1 (de) | 1996-02-29 |
EP0777549B1 (de) | 1999-12-29 |
EP0777549A1 (de) | 1997-06-11 |
US5886313A (en) | 1999-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2141954T3 (es) | Dispositivo de plaqueado. | |
JP5394243B2 (ja) | 発光ダイオード照明器具 | |
RU2012104543A (ru) | Модуль системы освещения свободной формы | |
TW351801B (en) | Surface light source and asymmetric prism sheet | |
WO2005067570A3 (en) | Internally illuminated light panel with led modules having light redirecting devices | |
ES2032494T3 (es) | Disposicion de fibra optica para la transmision y la radiacion lateral de energia de laser, particularmente para angioplastia. | |
WO2001067163A3 (en) | Apparatus for projecting a line of light from a diode-laser array | |
ATE396423T1 (de) | Lichtquelleneinrichtung | |
DE69922224D1 (de) | Beleuchtungssystem mit einem kantenbeleuchteten hohllichtleiter und linsenförmigen optische strukturen | |
SE9302951D0 (sv) | Laseranordning med i en optisk kavitet seriekopplade laserstrukturer | |
MY113843A (en) | Illumination system employing an array of microprisms | |
ATE447139T1 (de) | Verbesserungen an einer beleuchtungseinrichtung | |
SE9302950D0 (sv) | Ytemitterande laseranordning med vertikal kavitet | |
ZA953144B (en) | Eye movement sensing method and system | |
AR006148A1 (es) | Procedimiento para la mecanizacion de piezas de trabajo de vidrio, particularmente de configuracion tubular y dispositivo para poner en práctica el procedimiento | |
ES2178159T3 (es) | Procedimiento para el calculo de una forma teorica de al menos una superficie de una parte artificial o natural de un ojo cortada por un hazde rayos a traves de la pupila de un ojo, y dispositivo para la fabricacion de un cristalino artificial. | |
CA2882380C (en) | Universal traffic light luminaire | |
DE60333173D1 (de) | Hochleistungslasersystem | |
WO2009016586A1 (en) | Tir collimator with improved uniformity | |
BRPI0410627A (pt) | desinfecção fotoativada | |
JPH08202300A (ja) | 発光表示装置 | |
ATE426228T1 (de) | Beleuchtetes ruckstrahlschild | |
CN210573030U (zh) | 一种光源系统 | |
CN101865425B (zh) | 导光板及其入光结构 | |
DE60128546D1 (de) | Halbleiterdiodenlaser mit verbesserter Strahldivergenz |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 777549 Country of ref document: ES |