ES2135807T3 - Procedimiento y dispositivo para el tratamiento de objetos en forma de placa, por ejemplo de circuitos impresos. - Google Patents

Procedimiento y dispositivo para el tratamiento de objetos en forma de placa, por ejemplo de circuitos impresos.

Info

Publication number
ES2135807T3
ES2135807T3 ES96103716T ES96103716T ES2135807T3 ES 2135807 T3 ES2135807 T3 ES 2135807T3 ES 96103716 T ES96103716 T ES 96103716T ES 96103716 T ES96103716 T ES 96103716T ES 2135807 T3 ES2135807 T3 ES 2135807T3
Authority
ES
Spain
Prior art keywords
treatment
objects
station
procedure
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96103716T
Other languages
English (en)
Inventor
Dieter C Dipl-Ing Schmid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gebrueder Schmid GmbH and Co
Original Assignee
Gebrueder Schmid GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebrueder Schmid GmbH and Co filed Critical Gebrueder Schmid GmbH and Co
Application granted granted Critical
Publication of ES2135807T3 publication Critical patent/ES2135807T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PARA EL TRATAMIENTO DE PLACAS DE CIRCUITO IMPRESO (17) POR ROCIADO O SALPICADO POR SU CARA INFERIOR SE PREVE UNA INSTALACION DE TRANSPORTE POR ASPIRACION (19) QUE TRANSPORTA LOS OBJETOS COLGADOS EN UNA CINTA TRANSPORTADORA DE ASPIRACION (18). ASI ESTA LA CARA INFERIOR DE LOS OBJETOS TOTALMENTE LIBRE Y PUEDE SER TRATADA LIBREMENTE POR UN CHORRO DE MEDIO DE TRATAMIENTO (27) QUE SALE POR UNAS BOQUILLAS DE ROCIADO (29). UNA ESTACION DE INVERSION (14) VUELVE LOS OBJETOS, PARA QUE SE VUELVAN A TRANSPORTAR EN LA MISMA ESTACION DE TRATAMIENTO (12) O PARA QUE SE SIGAN TRATATANDO EN OTRA ESTACION DE TRATAMIENTO (13), Y EN CADA CASO POR LA CARA INFERIOR.
ES96103716T 1995-03-15 1996-03-09 Procedimiento y dispositivo para el tratamiento de objetos en forma de placa, por ejemplo de circuitos impresos. Expired - Lifetime ES2135807T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19509313A DE19509313A1 (de) 1995-03-15 1995-03-15 Verfahren und Vorrichtung zum Behandeln von plattenförmigen Gegenständen, insbesondere Leiterplatten

Publications (1)

Publication Number Publication Date
ES2135807T3 true ES2135807T3 (es) 1999-11-01

Family

ID=7756700

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96103716T Expired - Lifetime ES2135807T3 (es) 1995-03-15 1996-03-09 Procedimiento y dispositivo para el tratamiento de objetos en forma de placa, por ejemplo de circuitos impresos.

Country Status (3)

Country Link
EP (1) EP0732424B1 (es)
DE (2) DE19509313A1 (es)
ES (1) ES2135807T3 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19645760A1 (de) * 1996-11-06 1998-05-07 Schmid Gmbh & Co Geb Verfahren und Vorrichtung zur Erzeugung eines definierten Stroms horizontal geführter Leiterplatten
EP0959153A3 (en) 1998-05-20 2000-09-13 Process Automation International Limited An electroplating machine
US6261425B1 (en) 1998-08-28 2001-07-17 Process Automation International, Ltd. Electroplating machine
DE19930207C2 (de) * 1999-06-22 2001-12-06 Schulz Harder Juergen Verfahren zum Herstellen von Substraten mit strukturierten Metallisierungen sowie Halte- und Fixierelement zur Verwendung bei diesem Verfahren
EP1063873A3 (de) 1999-06-22 2003-04-23 Dr.-Ing. Jürgen Schulz-Harder Verfahren zum Herstellen von Substraten mit strukturierten Metallisierungen sowie Halte-und Fixierelement zur Verwendung bei dem Verfahren
DE10154884C5 (de) * 2001-11-05 2009-11-19 Gebr. Schmid Gmbh & Co. Vorrichtung zum Transport von flexiblem Flachmaterial, insbesondere Leiterplatten
IT1392993B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica
IT1403971B1 (it) * 2011-01-21 2013-11-08 Airone S R L Impianto per la verniciatura pentole
CN102916075A (zh) * 2012-09-27 2013-02-06 奥特斯维能源（太仓）有限公司 一种制绒深度稳定的方法
CN108097502A (zh) * 2018-01-04 2018-06-01 海宁德阳高分子材料科技有限公司 一种高物性可压纹干法环保沙发革生产防腐装置
CN110055577B (zh) * 2019-05-07 2021-03-12 重庆平伟实业股份有限公司 一种轴向引线电子元器件的电镀装置和方法
CN118207612B (zh) * 2024-05-22 2024-07-12 深圳市晨翰科技有限公司 一种适用于手机保护膜的单面电镀设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2937388A1 (de) * 1979-09-15 1981-04-16 Hugo 6419 Eiterfeld Isert Einrichtung zum behandeln von beschichteten platten
US4339297A (en) * 1981-04-14 1982-07-13 Seiichiro Aigo Apparatus for etching of oxide film on semiconductor wafer
DE3602078A1 (de) * 1986-01-24 1987-07-30 Riba Prueftechnik Gmbh Haltevorrichtung insbesondere fuer leiterplatten
JPH0451474Y2 (es) * 1986-05-15 1992-12-03
EP0269566B1 (de) * 1986-11-10 1990-06-13 Haas-Laser Systems AG Transportvorrichtung für perforierte plattenförmige Objekte
EP0267874B1 (de) * 1986-11-10 1990-06-27 Haas-Laser Systems AG Verfahren zum Transportieren von perforierten plattenförmigen Objekten
JPH0719944B2 (ja) * 1991-02-05 1995-03-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 微細電子回路パッケージの製造方法

Also Published As

Publication number Publication date
EP0732424B1 (de) 1999-06-30
DE19509313A1 (de) 1996-09-19
EP0732424A1 (de) 1996-09-18
DE59602307D1 (de) 1999-08-05

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