ES2036865T3 - Disposicion para el tratamiento y/o la limpieza de material, principalmente placas de circuito impreso equipadas con taladros (caso a). - Google Patents
Disposicion para el tratamiento y/o la limpieza de material, principalmente placas de circuito impreso equipadas con taladros (caso a).Info
- Publication number
- ES2036865T3 ES2036865T3 ES199090109053T ES90109053T ES2036865T3 ES 2036865 T3 ES2036865 T3 ES 2036865T3 ES 199090109053 T ES199090109053 T ES 199090109053T ES 90109053 T ES90109053 T ES 90109053T ES 2036865 T3 ES2036865 T3 ES 2036865T3
- Authority
- ES
- Spain
- Prior art keywords
- provision
- cleaning
- treatment
- printed circuit
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Apparatuses For Bulk Treatment Of Fruits And Vegetables And Apparatuses For Preparing Feeds (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating With Molten Metal (AREA)
Abstract
EL INVENTO SE REFIERE A UNA DISPOSICION PARA EL TRATAMIENTO MANIPULACION Y/O LIMPIEZA DE ARTICULOS O MERCANCIAS (5) Y EN PARTICULAR, PARA PLACAS DE CIRCUITOS IMPRESOS QUE POSEAN ORIFICIOS. A TAL FIN SE EMPLEA EL FLUJO DE UN LIQUIDO. PARA PODER APLICAR EL PRINCIPIO DEL MOVIMIENTO DE FLUJO A DETERMINADOS CASOS DE EMPLEO O DE USO, DE MANERA FAVORABLE Y A LA VEZ ECONOMICA, SE HA PREVISTO QUE LA TRAYECTORIA/S DEL FLUJO (2) VAYA/N UNICAMENTE POR ENCIMA DEL CARRIL DE LAS MERCANCIAS (5) O ARTICULOS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3916693A DE3916693A1 (de) | 1989-05-23 | 1989-05-23 | Anordnung zur behandlung und/oder reinigung von gut, insbesondere von mit bohrungen versehenen leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2036865T3 true ES2036865T3 (es) | 1993-06-01 |
Family
ID=6381190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES199090109053T Expired - Lifetime ES2036865T3 (es) | 1989-05-23 | 1990-05-14 | Disposicion para el tratamiento y/o la limpieza de material, principalmente placas de circuito impreso equipadas con taladros (caso a). |
Country Status (7)
Country | Link |
---|---|
US (1) | US5063950A (es) |
EP (1) | EP0399325B1 (es) |
JP (1) | JPH03101879A (es) |
KR (1) | KR900018415A (es) |
CA (1) | CA2017290A1 (es) |
DE (2) | DE3916693A1 (es) |
ES (1) | ES2036865T3 (es) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4324330C2 (de) * | 1992-08-01 | 1994-11-17 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Behandeln von insbesondere flachem Behandlungsgut, sowie Anordnung, insbesondere zur Durchführung dieses Verfahrens |
JP2752028B2 (ja) * | 1993-01-25 | 1998-05-18 | 矢崎総業株式会社 | 多極コネクタ |
US5378307A (en) * | 1993-04-28 | 1995-01-03 | International Business Machines Corporation | Fluid treatment apparatus |
TW406138B (en) * | 1994-03-04 | 2000-09-21 | Ibm | Apparatus, and corresponding method, for chemically etching substrates |
US5484108A (en) * | 1994-03-31 | 1996-01-16 | Siemens Automotive L.P. | Fuel injector having novel multiple orifice disk members |
US5837067A (en) * | 1995-06-07 | 1998-11-17 | International Business Machines Corporation | Precision fluid head transport |
DE19941399A1 (de) * | 1999-08-31 | 2001-04-19 | Infineon Technologies Ag | Reinigung von Stencilmasken mit Hilfe einer durch Maskenöffnungen hindurchtretenden Gasströmung |
US6344106B1 (en) * | 2000-06-12 | 2002-02-05 | International Business Machines Corporation | Apparatus, and corresponding method, for chemically etching substrates |
BRPI0406545A (pt) * | 2003-02-27 | 2005-12-13 | Tredegar Film Prod Corp | Pelìcula macia aperfeiçoada |
WO2008084224A2 (en) * | 2007-01-11 | 2008-07-17 | Peter Philip Andrew Lymn | Liquid treatment apparatus |
AT10792U1 (de) | 2008-10-03 | 2009-10-15 | Austria Tech & System Tech | Verfahren zum behandeln der oberfläche eines flächigen gegenstands, flächiger gegenstand sowie verwendung |
JP4803466B2 (ja) * | 2009-03-06 | 2011-10-26 | 大正電機販売株式会社 | 家庭用食材撹拌装置 |
CN112934816B (zh) * | 2021-01-28 | 2023-06-09 | 爱阔特(上海)清洗设备制造有限公司 | 一种电路板电镀线循环节水清洗装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2606984C3 (de) * | 1976-02-20 | 1978-08-24 | Siemens Ag | Verfahren und Einrichtung zum chemischen Reinigen von Kontaktierungslöchern in Leiterplatten |
GB1537924A (en) * | 1976-03-04 | 1979-01-10 | Buckbee Mears Co | Apparatus for the distribution of fluid to the surface of an article |
DE3011061C2 (de) * | 1980-03-21 | 1983-12-22 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Intensivierung von Spül- und Reinigungsprozessen für Perforationen in Formstücken in Spül- und Reinigungsautomaten |
JPS60798B2 (ja) * | 1981-06-09 | 1985-01-10 | 株式会社石井表記 | 超音波洗滌装置 |
DE3305564C1 (de) * | 1983-02-15 | 1984-03-22 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Aufbau von metallisierten Leiterbahnen und Durchkontaktierungen an gelochten Leiterplatten |
SE440719B (sv) * | 1983-06-17 | 1985-08-12 | Holmstrands Plaatindustri Ab | Sett och anordning vid rengoring av kretskort, som tidigare underkastats en lodningsoperation med flussmedel |
JPS609129A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | ウエツト処理装置 |
DE3528575A1 (de) * | 1985-08-06 | 1987-02-19 | Schering Ag | Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten |
US4724856A (en) * | 1986-03-17 | 1988-02-16 | Pender Don P | Dynamic flood conveyor |
US4709716A (en) * | 1986-09-16 | 1987-12-01 | Rca Corporation | Rinse tank |
US4938257A (en) * | 1986-11-21 | 1990-07-03 | Teledyne Industries, Inc. | Printed circuit cleaning apparatus |
DE8703114U1 (es) * | 1987-02-25 | 1987-04-09 | Schering Ag, 1000 Berlin Und 4709 Bergkamen, De | |
US4922938A (en) * | 1989-09-06 | 1990-05-08 | Siegmund, Inc. | Apparatus for single side spray processing of printed circuit boards |
-
1989
- 1989-05-23 DE DE3916693A patent/DE3916693A1/de not_active Ceased
-
1990
- 1990-05-14 EP EP90109053A patent/EP0399325B1/de not_active Expired - Lifetime
- 1990-05-14 ES ES199090109053T patent/ES2036865T3/es not_active Expired - Lifetime
- 1990-05-14 DE DE9090109053T patent/DE59000530D1/de not_active Expired - Fee Related
- 1990-05-21 KR KR1019900007244A patent/KR900018415A/ko not_active Application Discontinuation
- 1990-05-22 CA CA002017290A patent/CA2017290A1/en not_active Abandoned
- 1990-05-23 US US07/528,573 patent/US5063950A/en not_active Expired - Fee Related
- 1990-05-23 JP JP2131473A patent/JPH03101879A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CA2017290A1 (en) | 1990-11-23 |
DE59000530D1 (de) | 1993-01-14 |
KR900018415A (ko) | 1990-12-21 |
DE3916693A1 (de) | 1990-11-29 |
US5063950A (en) | 1991-11-12 |
JPH03101879A (ja) | 1991-04-26 |
EP0399325A1 (de) | 1990-11-28 |
EP0399325B1 (de) | 1992-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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