ES2128872T3 - Modulo de chip. - Google Patents

Modulo de chip.

Info

Publication number
ES2128872T3
ES2128872T3 ES96929186T ES96929186T ES2128872T3 ES 2128872 T3 ES2128872 T3 ES 2128872T3 ES 96929186 T ES96929186 T ES 96929186T ES 96929186 T ES96929186 T ES 96929186T ES 2128872 T3 ES2128872 T3 ES 2128872T3
Authority
ES
Spain
Prior art keywords
chip
module
metal contacts
heat flow
chip module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96929186T
Other languages
English (en)
Spanish (es)
Inventor
Detlef Houdeau
Josef Kirschbauer
Hans-Georg Mensch
Peter Stampka
Hans-Hinnerk Steckhan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7773352&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2128872(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Application granted granted Critical
Publication of ES2128872T3 publication Critical patent/ES2128872T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Credit Cards Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
ES96929186T 1995-09-27 1996-09-12 Modulo de chip. Expired - Lifetime ES2128872T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19535989A DE19535989C3 (de) 1995-09-27 1995-09-27 Chipmodul

Publications (1)

Publication Number Publication Date
ES2128872T3 true ES2128872T3 (es) 1999-05-16

Family

ID=7773352

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96929186T Expired - Lifetime ES2128872T3 (es) 1995-09-27 1996-09-12 Modulo de chip.

Country Status (11)

Country Link
EP (1) EP0852774B1 (OSRAM)
JP (1) JP3199747B2 (OSRAM)
KR (1) KR100438876B1 (OSRAM)
CN (1) CN1153174C (OSRAM)
AT (1) ATE176537T1 (OSRAM)
DE (2) DE19535989C3 (OSRAM)
ES (1) ES2128872T3 (OSRAM)
IN (1) IN188648B (OSRAM)
RU (1) RU2145732C1 (OSRAM)
UA (1) UA44809C2 (OSRAM)
WO (1) WO1997012341A1 (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19602436B4 (de) * 1996-01-24 2006-09-14 Infineon Technologies Ag Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens
DE19731737A1 (de) * 1997-07-23 1998-09-17 Siemens Ag Chipmodul für einen kartenförmigen Datenträger, entsprechender Kartenkörper sowie Verfahren zur Befestigung des Chipmoduls im Kartenkörper
RU2242798C2 (ru) * 2001-07-03 2004-12-20 Блинов Геннадий Андреевич Идентификационное устройство
DE102005032489B3 (de) * 2005-07-04 2006-11-16 Schweizer Electronic Ag Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren
DE102006060411B3 (de) * 2006-12-20 2008-07-10 Infineon Technologies Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls
DE102007048237A1 (de) * 2007-10-08 2009-04-09 Giesecke & Devrient Gmbh Chipmodul für Chipkarte
DE102013106181A1 (de) * 2013-06-13 2014-12-18 Bundesdruckerei Gmbh Chipkarte und Verfahren zum Herstellen einer Chipkarte
CN112216622B (zh) * 2019-07-10 2022-09-30 广东精毅科技股份有限公司 一种用冷胶粘贴芯片的装置及其工作方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0128822B1 (fr) * 1983-06-09 1987-09-09 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
SU1251138A1 (ru) * 1984-12-27 1986-08-15 Рижское Ордена Ленина Производственное Объединение "Вэф" Им.В.И.Ленина Идентификационна карта
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2617668B1 (fr) * 1987-07-03 1995-07-07 Radiotechnique Compelec Dispositif comportant un circuit electronique monte sur un support souple et carte souple le comprenant
FR2626846B1 (fr) * 1988-02-04 1990-06-15 Saint Gobain Vitrage Dispositif de manutention d'articles en feuilles
FR2639763B1 (fr) * 1988-11-29 1992-12-24 Schlumberger Ind Sa Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
DE9110057U1 (de) * 1991-08-14 1992-02-20 Orga Kartensysteme GmbH, 6072 Dreieich Datenträgerkarte mit eingeklebtem Schaltkreisträger
DE4232625A1 (de) * 1992-09-29 1994-03-31 Siemens Ag Verfahren zur Montage von integrierten Halbleiterschaltkreisen
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
DE4325712C2 (de) * 1993-07-30 1996-03-21 Siemens Ag Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul

Also Published As

Publication number Publication date
KR100438876B1 (ko) 2004-07-16
DE19535989A1 (de) 1997-04-03
IN188648B (OSRAM) 2002-10-26
DE19535989C3 (de) 2003-03-27
DE19535989C2 (de) 1997-07-17
JP3199747B2 (ja) 2001-08-20
DE59601281D1 (de) 1999-03-18
JPH10512380A (ja) 1998-11-24
ATE176537T1 (de) 1999-02-15
RU2145732C1 (ru) 2000-02-20
EP0852774A1 (de) 1998-07-15
UA44809C2 (uk) 2002-03-15
KR19990063588A (ko) 1999-07-26
CN1198229A (zh) 1998-11-04
CN1153174C (zh) 2004-06-09
WO1997012341A1 (de) 1997-04-03
EP0852774B1 (de) 1999-02-03

Similar Documents

Publication Publication Date Title
ES2141552T3 (es) Etiqueta provista de una capa metalica de espesor controlado.
ES2120155T3 (es) Conjunto de plato de freno de disco o friccion.
CA2419437A1 (en) Thermally insulated container
ES2143667T3 (es) Revestimiento de espuma reflectante.
ES2113982T3 (es) Luna de vidrio compuesto para automoviles, con hilos incluidos en la capa intermedia y cable de conexion.
ES2128872T3 (es) Modulo de chip.
ES2134467T5 (es) Pañal braga o braga higienica que tiene una parte frontal unida de modo que puede soltarse.
SE8603831L (sv) Ultraviolett bestralningsanordning
PE41999A1 (es) Material laminado selectivamente activable para distribuir y dispersar una sustancia sobre una superficie prevista
ES2194160T3 (es) Dispositivo de ostomia y aposito adhesivo contorneado para el mismo.
ES2130004T3 (es) Elemento calorifico.
DE69534968D1 (de) Halbleiteranordnungen vom Druckkontakttyp
DE69900274D1 (de) Mehrchip-Halbleiter-Leistungsbauelement vom Druckkontakttyp
ES2149842T3 (es) Ensamblaje de extension de paneles.
ES2166451T3 (es) Bayeta.
ES2147313T3 (es) Articulo absorbente que tiene un elemento preconformado.
ES2117241T3 (es) Elemento absorbente para un articulo higienico absorbente y procedimiento de fabricacion de este elemento.
ES2095115T3 (es) Caja de rotor, en especial caja para turbopropulsores.
AR017621A1 (es) Instalacion de conveccion-radiacion para tratamiento termico de una banda continua
ES2189138T3 (es) Asiento de bicicleta y cubierta.
ES2145461T3 (es) Soporte de datos que presenta un modulo y un holograma.
DE59912629D1 (de) Gerät mit evakuierbarer Kammer
ES2106048T3 (es) Soporte de datos con circuito integrado.
ES2152592T3 (es) Cubierta tipo fuelle con organo de sujecion integrado.
ES2113595T3 (es) Aparato refrigerador y/o congelador con un cuerpo moldeado de aislamiento termico.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 852774

Country of ref document: ES