ES2125393T3 - Procedimiento y dispositivo de fabricacion de tarjetas de memoria. - Google Patents

Procedimiento y dispositivo de fabricacion de tarjetas de memoria.

Info

Publication number
ES2125393T3
ES2125393T3 ES94200273T ES94200273T ES2125393T3 ES 2125393 T3 ES2125393 T3 ES 2125393T3 ES 94200273 T ES94200273 T ES 94200273T ES 94200273 T ES94200273 T ES 94200273T ES 2125393 T3 ES2125393 T3 ES 2125393T3
Authority
ES
Spain
Prior art keywords
sides
card
manufacture
main
thermoplastic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94200273T
Other languages
English (en)
Inventor
Rene Rose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger SA
Atos Origin IT Services Inc
Original Assignee
Schlumberger SA
Atos Origin IT Services Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger SA, Atos Origin IT Services Inc filed Critical Schlumberger SA
Application granted granted Critical
Publication of ES2125393T3 publication Critical patent/ES2125393T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

PROCESO PARA LA FABRICACION DE UNA TARJETA DE MEMORIA ELECTRONICA QUE COMPRENDE: A) UN CUERPO DE TARJETA (12) REALIZADA EN UN MATERIAL TERMOPLASTICO Y QUE PRESENTA DOS CARAS LATERALES SENSIBLEMENTE PARALELAS ENTRE SI: B) UN ELEMENTO-SOPORTE QUE COMPRENDE UN GRAFISMO SOBRE UNA DE SUS CARAS AL MENOS; C) UN MODULO ELECTRONICO QUE COMPRENDE UNA ZONA DE CONTACTOS SOBRE UNA DE LAS CARAS DE LA CUAL ESTA FIJADA UNA PLAQUITA QUE COMPRENDE UN CIRCUITO INTEGRADO, CARACTERIZADO POR LA SIGUIENTES ETAPAS: EN UN MOLDE PROVISTO DE UNA IMPRONTA QUE DEFINE LA FORMA DE DICHA TARJETA Y LIMITADA POR DOS PAREDES PRINCIPALES QUE CORRESPONDEN A LAS CARAS PRINCIPALES DE DICHA TARJETA, SE DISPONE Y SE MANTIENE DICHO ELEMENTO DE SOPORTE CONTRA UNA PRIMERA PARED PRINCIPAL DEL MOLDE; ICHA IMPRONTA, UN MATERIAL TERMOPLASTICO LLAMADO A LLENAR DICHO VOLUMEN NO OCUPADO POR DICHO ELEMENTO DE SOPORTE; Y CA DICHO MODULO ELECTRONICO EN EL INTERIOR DE LA IMPRONTA HASTA UNA POSICION ADECUADA DE DICHO MODULO, ANTES DE QUE DICHO MATERIAL INYECTADO SE HAYA SOLIDIFICADO COMPLETAMENTE.
ES94200273T 1993-02-23 1994-02-02 Procedimiento y dispositivo de fabricacion de tarjetas de memoria. Expired - Lifetime ES2125393T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9302059A FR2702067B1 (fr) 1993-02-23 1993-02-23 Procédé et dispositif de fabrication de cartes à mémoire.

Publications (1)

Publication Number Publication Date
ES2125393T3 true ES2125393T3 (es) 1999-03-01

Family

ID=9444338

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94200273T Expired - Lifetime ES2125393T3 (es) 1993-02-23 1994-02-02 Procedimiento y dispositivo de fabricacion de tarjetas de memoria.

Country Status (6)

Country Link
US (1) US5510074A (es)
EP (1) EP0618548B1 (es)
JP (1) JPH06270580A (es)
DE (1) DE69414292T2 (es)
ES (1) ES2125393T3 (es)
FR (1) FR2702067B1 (es)

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US5776278A (en) 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
USRE42773E1 (en) 1992-06-17 2011-10-04 Round Rock Research, Llc Method of manufacturing an enclosed transceiver
US7158031B2 (en) * 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US6306348B1 (en) * 1993-11-01 2001-10-23 Nanogen, Inc. Inorganic permeation layer for micro-electric device
EP0688650B1 (en) * 1994-01-13 2000-11-02 Citizen Watch Co. Ltd. Method of resin-sealing semiconductor devices
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
US5975420A (en) * 1995-04-13 1999-11-02 Dai Nippon Printing Co., Ltd. Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
US5762853A (en) * 1996-04-01 1998-06-09 Morton International, Inc. Method of encapsulating a sensor into a panel body
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
US5988510A (en) * 1997-02-13 1999-11-23 Micron Communications, Inc. Tamper resistant smart card and method of protecting data in a smart card
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
WO1998052772A1 (fr) * 1997-05-19 1998-11-26 Hitachi Maxell, Ltd. Module de circuit integre flexible et son procede de production, procede de production de support d'information comprenant ledit module
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
DE19749243C1 (de) * 1997-11-07 1998-11-19 Richard Herbst Verfahren und Vorrichtung zum Herstellen von Verbundkörpern aus einer Kunststoffmasse
US6154947A (en) * 1998-02-17 2000-12-05 Eger Products, Inc. Method for manufacturing a cover for a connector bar and the cover
DE69901886T3 (de) * 1998-03-10 2008-01-24 De La Rue International Ltd., Basingstoke Verfahren zur herstellung eines sicherheitsgegenstands
US6256873B1 (en) 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials
US6241153B1 (en) 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
US6145035A (en) * 1999-02-25 2000-11-07 Dallas Semiconductor Corporation Card cradle system and method
US6273339B1 (en) 1999-08-30 2001-08-14 Micron Technology, Inc. Tamper resistant smart card and method of protecting data in a smart card
CA2386622A1 (en) * 1999-09-30 2001-04-05 John R. Havens Biomolecular attachment sites on microelectronic arrays
US6303082B1 (en) * 1999-12-15 2001-10-16 Nanogen, Inc. Permeation layer attachment chemistry and method
US6524517B1 (en) * 1999-12-15 2003-02-25 Nanogen, Inc. Methods for molding and grafting highly uniform polymer layers onto electronic microchips
DE10109993A1 (de) * 2001-03-01 2002-09-05 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Moduls
US6960298B2 (en) * 2001-12-10 2005-11-01 Nanogen, Inc. Mesoporous permeation layers for use on active electronic matrix devices
US7037455B2 (en) * 2001-12-21 2006-05-02 Mattel, Inc. Insert molding method
EP1369815A1 (en) * 2002-06-03 2003-12-10 Dialog Semiconductor GmbH Battery pack with electronics assembly
US20030177051A1 (en) * 2003-03-13 2003-09-18 Robin Driscoll Method and system for managing worker resources
US6857552B2 (en) * 2003-04-17 2005-02-22 Intercard Limited Method and apparatus for making smart card solder contacts
US7573048B2 (en) * 2004-10-08 2009-08-11 Patel Gordhanbhai N Tamper resistant self indicating instant alert radiation dosimeter
WO2006101493A1 (en) * 2005-03-23 2006-09-28 Cardxx, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
FR2895547B1 (fr) * 2005-12-26 2008-06-06 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit
AU2007243634A1 (en) * 2006-04-10 2007-11-08 Innovatier, Inc. An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US7687103B2 (en) * 2006-08-31 2010-03-30 Gamida For Life B.V. Compositions and methods for preserving permeation layers for use on active electronic matrix devices
US7736568B2 (en) * 2006-09-19 2010-06-15 Mattel, Inc. Systems and methods of incorporating preformed items into a molded article
US20080237356A1 (en) * 2007-03-23 2008-10-02 Innovatier, Inc. Step card and method for making a step card
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card
JP2013524364A (ja) 2010-04-05 2013-06-17 イノベイティア インコーポレイテッド 電子カードおよびタグのためのプレラミネーションコアならびにプレラミネーションコアの製造方法
JP5418684B2 (ja) * 2011-03-08 2014-02-19 トヨタ自動車株式会社 繊維強化樹脂材の製造方法

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US3320345A (en) * 1965-02-15 1967-05-16 Howmet Corp Method for the production of cored patterns
DE3130206A1 (de) * 1981-07-30 1983-02-17 Siemens AG, 1000 Berlin und 8000 München Tragbare karte zur informationsverarbeitung
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
FR2605144B1 (fr) * 1986-10-14 1989-02-24 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede
US4810444A (en) * 1987-06-08 1989-03-07 The Dow Chemical Company Method for making mat-molded rim parts
JPH0825349B2 (ja) * 1987-10-22 1996-03-13 日本ユーロテック株式会社 カードの製造法
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
JPH03500033A (ja) * 1988-06-21 1991-01-10 ダブリュー　アンド　ティー　エイヴァリー　リミテッド ポータブル電子トークンの製造法
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
FR2664076A1 (fr) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Procede de fabrication d'une carte a memoire electronique.
DE4038126C2 (de) * 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
JPH05228970A (ja) * 1992-02-21 1993-09-07 Sony Corp 射出圧縮成形法、これに用いる射出成形金型及び射出圧縮成形機

Also Published As

Publication number Publication date
EP0618548A1 (fr) 1994-10-05
EP0618548B1 (fr) 1998-11-04
DE69414292T2 (de) 1999-06-17
US5510074A (en) 1996-04-23
DE69414292D1 (de) 1998-12-10
FR2702067A1 (fr) 1994-09-02
FR2702067B1 (fr) 1995-04-14
JPH06270580A (ja) 1994-09-27

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