ES2049831T3 - Un procedimiento de realizacion de tarjetas de memoria principalmente electronica y tarjetas obtenidas por el mencionado procedimiento. - Google Patents
Un procedimiento de realizacion de tarjetas de memoria principalmente electronica y tarjetas obtenidas por el mencionado procedimiento.Info
- Publication number
- ES2049831T3 ES2049831T3 ES89401173T ES89401173T ES2049831T3 ES 2049831 T3 ES2049831 T3 ES 2049831T3 ES 89401173 T ES89401173 T ES 89401173T ES 89401173 T ES89401173 T ES 89401173T ES 2049831 T3 ES2049831 T3 ES 2049831T3
- Authority
- ES
- Spain
- Prior art keywords
- procedure
- cards
- carrying
- electronic memory
- out mainly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14827—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Instructional Devices (AREA)
Abstract
EL INVENTO SE REFIERE A LA REALIZACION DE UN MAPA CON MEMORIA ELECTRONICA POR MOLDEADO DEL CUERPO DEL MAPA SOBRE EL MODULO ELECTRONICO. PARA MANTENER EN SITUACION EL MODULO ELECTRONICO (32) EN EL MOLDE (50, 52), EL MODULO ESTA FIJADO SOBRE UNA PELICULA SOPORTE (12) AJUSTADO ENTRE LAS DOS PARTES (50, 52) DEL MOLDE. LA PELICULA 12 PUEDE IGUALMENTE INCLUIR ELEMENTOS DE IMPRESION (16) PARA REALIZAR UN GRAFISMO SOBRE UN LADO DEL CUERPO DEL MAPA.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8805671A FR2630843B1 (fr) | 1988-04-28 | 1988-04-28 | Procede de realisation de cartes comportant des elements graphiques et cartes obtenues par ledit procede |
FR8812088A FR2636755B1 (fr) | 1988-09-16 | 1988-09-16 | Procede de realisation de cartes a memoire et cartes obtenues par ledit procede |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2049831T3 true ES2049831T3 (es) | 1994-05-01 |
Family
ID=26226631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES89401173T Expired - Lifetime ES2049831T3 (es) | 1988-04-28 | 1989-04-25 | Un procedimiento de realizacion de tarjetas de memoria principalmente electronica y tarjetas obtenidas por el mencionado procedimiento. |
Country Status (5)
Country | Link |
---|---|
US (2) | US5030407A (es) |
EP (2) | EP0340100B1 (es) |
JP (2) | JPH0238099A (es) |
DE (1) | DE68911738T2 (es) |
ES (1) | ES2049831T3 (es) |
Families Citing this family (86)
Publication number | Priority date | Publication date | Assignee | Title |
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US5387306A (en) * | 1988-06-21 | 1995-02-07 | Gec Avery Limited | Manufacturing integrated circuit cards |
JPH0767874B2 (ja) * | 1989-03-31 | 1995-07-26 | リズム時計工業株式会社 | Icカードの製造方法 |
US5244840A (en) * | 1989-05-23 | 1993-09-14 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing an encapsulated IC card having a molded frame and a circuit board |
FR2659157B2 (fr) * | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
US5417905A (en) * | 1989-05-26 | 1995-05-23 | Esec (Far East) Limited | Method of making a card having decorations on both faces |
FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
DE3926578C1 (es) * | 1989-08-11 | 1990-07-26 | Leonhard Kurz Gmbh & Co, 8510 Fuerth, De | |
DE3929299A1 (de) * | 1989-08-11 | 1991-02-14 | Kurz Leonhard Fa | Verfahren zur herstellung von karten |
JP2602343B2 (ja) * | 1990-05-07 | 1997-04-23 | 三菱電機株式会社 | Icカード |
JP2560895B2 (ja) * | 1990-07-25 | 1996-12-04 | 三菱電機株式会社 | Icカードの製造方法およびicカード |
US5377077A (en) * | 1990-08-01 | 1994-12-27 | Staktek Corporation | Ultra high density integrated circuit packages method and apparatus |
US5446620A (en) | 1990-08-01 | 1995-08-29 | Staktek Corporation | Ultra high density integrated circuit packages |
US5475920A (en) * | 1990-08-01 | 1995-12-19 | Burns; Carmen D. | Method of assembling ultra high density integrated circuit packages |
US5367766A (en) * | 1990-08-01 | 1994-11-29 | Staktek Corporation | Ultra high density integrated circuit packages method |
WO1992003035A1 (en) * | 1990-08-01 | 1992-02-20 | Staktek Corporation | Ultra high density integrated circuit packages, method and apparatus |
FR2668096B1 (fr) * | 1990-10-19 | 1993-01-22 | Schlumberger Ind Sa | Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue. |
DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
FR2673017A1 (fr) * | 1991-02-18 | 1992-08-21 | Schlumberger Ind Sa | Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu. |
JP3290986B2 (ja) * | 1991-05-10 | 2002-06-10 | ゲーアーオー ゲゼルシャフト フュア アウトマツィオーン ウント オルガニザツィオーン ミット ベシュレンクテル ハフツング | 壁面の厚さを部分的に薄くしたプラスチック成形物の製造方法及び製造装置 |
JPH05169885A (ja) * | 1991-12-26 | 1993-07-09 | Mitsubishi Electric Corp | 薄型icカード |
US5702985A (en) * | 1992-06-26 | 1997-12-30 | Staktek Corporation | Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method |
JP2774906B2 (ja) * | 1992-09-17 | 1998-07-09 | 三菱電機株式会社 | 薄形半導体装置及びその製造方法 |
FR2702067B1 (fr) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Procédé et dispositif de fabrication de cartes à mémoire. |
FR2704961A1 (fr) * | 1993-05-04 | 1994-11-10 | Schlumberger Ind Sa | Procédé de fabrication de cartes à mémoire. |
DE59404205D1 (de) * | 1993-10-26 | 1997-11-06 | Siemens Ag | Verfahren zur Herstellung von Chipkarten mittels Spritzgiessen |
US5783134A (en) * | 1994-01-13 | 1998-07-21 | Citizen Watch Co., Ltd. | Method of resin-sealing semiconductor device |
US5980400A (en) * | 1994-02-03 | 1999-11-09 | Huffy Corporation | Compression molded basketball components with inmold graphics |
US5916047A (en) * | 1994-02-03 | 1999-06-29 | Huffy Corporation | Portable basketball goal support system with separate ballast tank |
US5626339A (en) * | 1994-02-03 | 1997-05-06 | Huffy Corporation | Structural foam basketball backboard with inmold graphics |
JP3442877B2 (ja) * | 1994-02-21 | 2003-09-02 | 富士通株式会社 | 樹脂成形品及びその製造方法 |
DE4435802A1 (de) * | 1994-10-06 | 1996-04-11 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens |
US5475919B1 (en) * | 1994-10-07 | 2000-10-17 | Three View Technology Co Ltd | Pcmcia card manufacturing process |
US5846477A (en) * | 1994-12-08 | 1998-12-08 | Nitto Denko Corporation | Production method for encapsulating a semiconductor device |
DE29502080U1 (de) * | 1995-02-09 | 1995-03-23 | Interlock Ag, Schlieren | Vorrichtung zur Herstellung von Ausweiskarten und danach hergestellte Ausweiskarte |
US5819394A (en) * | 1995-02-22 | 1998-10-13 | Transition Automation, Inc. | Method of making board matched nested support fixture |
JP3337847B2 (ja) * | 1995-02-27 | 2002-10-28 | 株式会社東芝 | 電子部品内蔵カードの製造方法 |
DE19519899A1 (de) * | 1995-05-31 | 1996-12-12 | Richard Herbst | Verfahren und Vorrichtung zum Herstellen einer Smart Card |
DE19519901C2 (de) * | 1995-05-31 | 1998-06-18 | Richard Herbst | Verfahren zum taktweisen Spritzgießen von Gegenständen aus Kunststoff und Halbzeug zur Verwendung bei diesem Verfahren |
FR2735714B1 (fr) * | 1995-06-21 | 1997-07-25 | Schlumberger Ind Sa | Procede pour imprimer un graphisme sur une carte a memoire |
US6025642A (en) * | 1995-08-17 | 2000-02-15 | Staktek Corporation | Ultra high density integrated circuit packages |
GB9520072D0 (en) * | 1995-10-02 | 1995-12-06 | Dewhurst Plc | Indicators and push-button members and method of forming the same |
US5632408A (en) * | 1995-11-21 | 1997-05-27 | Mitchell; Jerry B. | Apparatus for securing and dispensing currency |
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US6157870A (en) * | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
FR2760998B1 (fr) | 1997-03-21 | 1999-05-21 | Equisecurite Sa | Procede d'inclusion d'une etiquette electronique dans un objet realise en plastique, au moment de la fabrication de l'objet |
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US6025054A (en) * | 1997-09-08 | 2000-02-15 | Cardxx, Inc. | Smart cards having glue-positioned electronic components |
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US6256873B1 (en) | 1998-03-17 | 2001-07-10 | Cardxx, Inc. | Method for making smart cards using isotropic thermoset adhesive materials |
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US7607249B2 (en) * | 2005-07-15 | 2009-10-27 | Innovatier Inc. | RFID bracelet and method for manufacturing a RFID bracelet |
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DE102012000370B4 (de) | 2012-01-11 | 2017-02-02 | Pfanner Schutzbekleidung Gmbh | Schutzhelm, insbesondere für Bergsteiger und Baumkletterer |
JP6528198B2 (ja) * | 2015-04-24 | 2019-06-12 | パナソニックIpマネジメント株式会社 | 射出成形方法 |
US11034068B2 (en) | 2018-04-30 | 2021-06-15 | Raytheon Company | Encapsulating electronics in high-performance thermoplastics |
CN110696275B (zh) * | 2019-10-31 | 2022-06-21 | 奇点新源国际技术开发(北京)有限公司 | 一种线缆节点的塑封方法 |
CN113276359B (zh) * | 2020-02-19 | 2022-11-08 | 长鑫存储技术有限公司 | 注塑模具及注塑方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL255667A (es) * | 1959-09-17 | |||
US3122598A (en) * | 1960-11-03 | 1964-02-25 | Foster Grant Co Inc | Plastic decorating method |
US3839129A (en) * | 1970-09-25 | 1974-10-01 | Pictorial Prod Inc | Reflective foil and process |
US3654062A (en) * | 1970-09-28 | 1972-04-04 | Standard Products Co | Injection molded decorative plaques |
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
FR2442480A1 (fr) * | 1978-11-21 | 1980-06-20 | Ruwa Bell Sarl | Procede de realisation de cartes personnalisees, dispositif pour la mise en oeuvre de ce procede, et carte ainsi obtenue |
DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
DK146709C (da) * | 1980-12-09 | 1984-05-21 | Eskesen Brdr As | Fremgangsmaade til fremstilling af sproejtestoebte plastemner med indstoebte folier med dekorative og/eller beskrivende tryk samt apparat til brug ved udoevelse af fremgangsmaaden |
DE3153769C2 (de) * | 1981-04-14 | 1995-10-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
JPS5819740A (ja) * | 1981-07-24 | 1983-02-04 | Dainippon Printing Co Ltd | 磁気カ−ド及びその製造方法 |
DE3466108D1 (en) * | 1983-06-09 | 1987-10-15 | Flonic Sa | Method of producing memory cards, and cards obtained thereby |
US4801561A (en) * | 1984-07-05 | 1989-01-31 | National Semiconductor Corporation | Method for making a pre-testable semiconductor die package |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
JPS62140896A (ja) * | 1985-12-13 | 1987-06-24 | 日本写真印刷株式会社 | Icカ−ドの製造方法 |
US4779145A (en) * | 1986-02-03 | 1988-10-18 | Lemelson Jerome H | Record member for magnetic and optical recording |
JPS62244139A (ja) * | 1986-04-17 | 1987-10-24 | Citizen Watch Co Ltd | 樹脂封止型ピングリツドアレイ及びその製造方法 |
FR2605144B1 (fr) * | 1986-10-14 | 1989-02-24 | Flonic Sa | Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede |
FR2609821B1 (fr) * | 1987-01-16 | 1989-03-31 | Flonic Sa | Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede |
JPS6442295A (en) * | 1987-08-10 | 1989-02-14 | Seiko Epson Corp | Memory card mounting structure |
JPH01159295A (ja) * | 1987-12-16 | 1989-06-22 | Dainippon Printing Co Ltd | Icカード用カード基材の製造方法 |
US4812633A (en) * | 1988-04-08 | 1989-03-14 | Minnesota Mining And Manufacturing Company | Optical data card |
-
1989
- 1989-04-21 US US07/341,183 patent/US5030407A/en not_active Expired - Lifetime
- 1989-04-21 US US07/341,182 patent/US4961893A/en not_active Expired - Lifetime
- 1989-04-25 ES ES89401173T patent/ES2049831T3/es not_active Expired - Lifetime
- 1989-04-25 EP EP89401173A patent/EP0340100B1/fr not_active Revoked
- 1989-04-25 DE DE89401173T patent/DE68911738T2/de not_active Revoked
- 1989-04-25 EP EP89401172A patent/EP0340099A1/fr not_active Ceased
- 1989-04-28 JP JP1111933A patent/JPH0238099A/ja active Pending
- 1989-04-28 JP JP1111934A patent/JP2812485B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5030407A (en) | 1991-07-09 |
DE68911738T2 (de) | 1994-05-05 |
EP0340100A1 (fr) | 1989-11-02 |
US4961893A (en) | 1990-10-09 |
EP0340100B1 (fr) | 1993-12-29 |
DE68911738D1 (de) | 1994-02-10 |
JPH0224197A (ja) | 1990-01-26 |
JPH0238099A (ja) | 1990-02-07 |
JP2812485B2 (ja) | 1998-10-22 |
EP0340099A1 (fr) | 1989-11-02 |
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