ES2030751T3 - Procedimiento de realizacion de una tarjeta de memoria electronica. - Google Patents

Procedimiento de realizacion de una tarjeta de memoria electronica.

Info

Publication number
ES2030751T3
ES2030751T3 ES198787402286T ES87402286T ES2030751T3 ES 2030751 T3 ES2030751 T3 ES 2030751T3 ES 198787402286 T ES198787402286 T ES 198787402286T ES 87402286 T ES87402286 T ES 87402286T ES 2030751 T3 ES2030751 T3 ES 2030751T3
Authority
ES
Spain
Prior art keywords
realization
procedure
electronic memory
memory card
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198787402286T
Other languages
English (en)
Inventor
Marc Brignet
Emile Droche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCHLUMBERGER INDUSTRIES
Original Assignee
SCHLUMBERGER INDUSTRIES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9339813&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2030751(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by SCHLUMBERGER INDUSTRIES filed Critical SCHLUMBERGER INDUSTRIES
Application granted granted Critical
Publication of ES2030751T3 publication Critical patent/ES2030751T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K21/00—Information retrieval from punched cards designed for manual use or handling by machine; Apparatus for handling such cards, e.g. marking or correcting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

EL INVENTO SE REFIERE A LA FABRICACION DE TARJETAS DE MEMORIA Y EN ESPECIAL A LAS TARJETAS DE MEMORIA ELECTRONICA. SEGUN EL INVENTO, EL CUERPO DE LA TARJETA ESTA REALIZADO POR VACIADO DE UN MATERIAL PLASTICO, COMO EL ABS. EL MOLDE (20,22) TIENE UN RESALTE (24) QUE SIRVE PARA DEFINIR EN EL CUERPO DE LA TARJETA UNA CAVIDAD DESTINADA A RECIBIR EL MODULO ELECTRONICO DE LA MISMA.
ES198787402286T 1986-10-14 1987-10-13 Procedimiento de realizacion de una tarjeta de memoria electronica. Expired - Lifetime ES2030751T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8614231A FR2605144B1 (fr) 1986-10-14 1986-10-14 Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede

Publications (1)

Publication Number Publication Date
ES2030751T3 true ES2030751T3 (es) 1992-11-16

Family

ID=9339813

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198787402286T Expired - Lifetime ES2030751T3 (es) 1986-10-14 1987-10-13 Procedimiento de realizacion de una tarjeta de memoria electronica.

Country Status (17)

Country Link
US (1) US5030309A (es)
EP (1) EP0267826B1 (es)
JP (1) JP2524606B2 (es)
KR (1) KR950007894B1 (es)
AR (1) AR243696A1 (es)
AT (1) ATE73561T1 (es)
AU (1) AU603142B2 (es)
BR (1) BR8705434A (es)
DE (1) DE3777336D1 (es)
DK (1) DK537387A (es)
ES (1) ES2030751T3 (es)
FI (1) FI94000C (es)
FR (1) FR2605144B1 (es)
GR (1) GR3004726T3 (es)
IN (1) IN169843B (es)
NO (1) NO174605C (es)
ZA (1) ZA877497B (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
US5030407A (en) * 1988-04-28 1991-07-09 Schlumberger Industries Method of making cards having graphics elements thereon
US5387306A (en) * 1988-06-21 1995-02-07 Gec Avery Limited Manufacturing integrated circuit cards
JP2730181B2 (ja) * 1989-05-27 1998-03-25 三菱化学株式会社 Ｉｃカード用基板の製法
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
FR2668096B1 (fr) * 1990-10-19 1993-01-22 Schlumberger Ind Sa Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue.
DE4142410C2 (de) * 1991-12-20 2000-11-09 Gao Ges Automation Org Vorrichtung zum Herstellen von flachen Kunststoff-Formstücken, beispielsweise Ausweiskarten durch Spritzgießen
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
US5476629A (en) * 1992-12-25 1995-12-19 Citizen Watch Co. Ltd. Method for manufacturing IC card substrate
FR2702067B1 (fr) * 1993-02-23 1995-04-14 Schlumberger Ind Sa Procédé et dispositif de fabrication de cartes à mémoire.
US5871683A (en) * 1994-01-18 1999-02-16 First Team Sports, Inc. Method of molding skate components
US5475919B1 (en) * 1994-10-07 2000-10-17 Three View Technology Co Ltd Pcmcia card manufacturing process
DE69511359T2 (de) † 1994-11-14 2000-03-02 Mitsubishi Plastics, Inc. Kunststoffzusammensetzungen und die daraus hergestellten Kunststoffkarten
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
DE19750344C2 (de) * 1997-11-13 2000-05-18 Ods Landis & Gyr Gmbh & Co Kg Verfahren zum Herstellen eines flachen Kartengrundkörpers für eine Chipkarte
DE19824699B4 (de) * 1998-06-03 2004-01-15 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Kunststoffkarte
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
CN108698289A (zh) 2015-10-14 2018-10-23 第资本服务有限责任公司 交易卡结构中的模制的袋形区

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3553787A (en) * 1968-07-18 1971-01-12 Moore Business Forms Inc Apparatus for embossing alpha-numeric characters
NL7511123A (nl) * 1975-09-19 1977-03-22 Picanol Nv Verbeterde lade voor weefmachines.
US4500777A (en) * 1981-02-27 1985-02-19 Drexler Technology Corporation High data capacity, scratch and dust resistant, infrared, read-write data card for automatic teller machines
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
JPS6115289A (ja) * 1984-06-29 1986-01-23 Mitsubishi Plastics Ind Ltd メモリ−カ−ド
JPS61133489A (ja) * 1984-12-03 1986-06-20 Mitsubishi Plastics Ind Ltd メモリ−カ−ド
DE3446412C2 (de) * 1984-12-20 1995-08-10 Hartmann Gmbh Co Kg Georg Identkarte zum Lesen unter Verwendung eines magnetischen Systems
JPS61183791A (ja) * 1985-02-08 1986-08-16 Mitsubishi Plastics Ind Ltd メモリ−カ−ド
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
JPH0662026B2 (ja) * 1985-04-22 1994-08-17 三菱樹脂株式会社 Ｉｃメモリ−カ−ド

Also Published As

Publication number Publication date
DK537387A (da) 1988-04-15
EP0267826B1 (fr) 1992-03-11
NO874273D0 (no) 1987-10-13
FR2605144B1 (fr) 1989-02-24
FI874481A0 (fi) 1987-10-12
FI94000B (fi) 1995-03-15
BR8705434A (pt) 1988-05-24
NO174605C (no) 1994-06-08
DE3777336D1 (de) 1992-04-16
EP0267826A1 (fr) 1988-05-18
FI94000C (fi) 1995-06-26
JP2524606B2 (ja) 1996-08-14
NO874273L (no) 1988-04-15
GR3004726T3 (es) 1993-04-28
US5030309A (en) 1991-07-09
ZA877497B (en) 1988-04-14
FR2605144A1 (fr) 1988-04-15
KR950007894B1 (ko) 1995-07-21
KR880005541A (ko) 1988-06-29
DK537387D0 (da) 1987-10-14
IN169843B (es) 1991-12-28
ATE73561T1 (de) 1992-03-15
AU7938087A (en) 1988-04-21
AU603142B2 (en) 1990-11-08
JPS63183893A (ja) 1988-07-29
NO174605B (no) 1994-02-21
AR243696A1 (es) 1993-08-31
FI874481L (fi) 1988-04-15

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