ES2124634T3 - Procedimiento mejorado y aparato para fabricar un dispositivo fusible de montaje en superficie. - Google Patents

Procedimiento mejorado y aparato para fabricar un dispositivo fusible de montaje en superficie.

Info

Publication number
ES2124634T3
ES2124634T3 ES96919129T ES96919129T ES2124634T3 ES 2124634 T3 ES2124634 T3 ES 2124634T3 ES 96919129 T ES96919129 T ES 96919129T ES 96919129 T ES96919129 T ES 96919129T ES 2124634 T3 ES2124634 T3 ES 2124634T3
Authority
ES
Spain
Prior art keywords
manufacturing
surface mount
mount fuse
fuse device
improved procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96919129T
Other languages
English (en)
Inventor
Vladimir Blecha
Katherine M Mcguire
Andrew J Neuhalfen
Daniel B Onken
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Littelfuse Inc
Original Assignee
Littelfuse Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/482,829 external-priority patent/US5943764A/en
Application filed by Littelfuse Inc filed Critical Littelfuse Inc
Application granted granted Critical
Publication of ES2124634T3 publication Critical patent/ES2124634T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
  • Lock And Its Accessories (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

UN FUSIBLE DE PELICULA DELGADA A MONTAR SOBRE UNA SUPERFICIE (58) QUE TIENE DOS SUBCONJUNTOS DE MATERIALES. EL PRIMER SUBCONJUNTO COMPRENDE UN ENLACE FUSIBLE (42), SU SUSTRATO DE SOPORTE (12) Y ATENUADORES TERMINALES (34, 36). EL SEGUNDO SUBCONJUNTO COMPRENDE UNA CAPA PROTECTORA (56) SUPERPUESTA AL ENLACE FUSIBLE (42) PARA PROPORCIONAR UNA PROTECCION CONTRA LOS IMPACTOS Y CONTRA LA OXIDACION. LA CAPA PROTECTORA (56) ESTA HECHA PREFERENTEMENTE DE UN MATERIAL POLIMERICO. EL MATERIAL POLIMERICO PREFERENTE ES UN GEL O PASTA DE POLIURETANO. ADEMAS, EL SUSTRATO DE SOPORTE PREFERENTE ES UNA EPOXI FR DA.
ES96919129T 1995-06-07 1996-06-06 Procedimiento mejorado y aparato para fabricar un dispositivo fusible de montaje en superficie. Expired - Lifetime ES2124634T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47256395A 1995-06-07 1995-06-07
US08/482,829 US5943764A (en) 1994-05-27 1995-06-07 Method of manufacturing a surface-mounted fuse device

Publications (1)

Publication Number Publication Date
ES2124634T3 true ES2124634T3 (es) 1999-02-01

Family

ID=27043825

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96919129T Expired - Lifetime ES2124634T3 (es) 1995-06-07 1996-06-06 Procedimiento mejorado y aparato para fabricar un dispositivo fusible de montaje en superficie.

Country Status (10)

Country Link
EP (1) EP0830704B1 (es)
JP (1) JPH10512094A (es)
CN (1) CN1191624A (es)
AT (1) ATE173355T1 (es)
AU (1) AU6154796A (es)
CA (1) CA2224070A1 (es)
DE (1) DE69600974T2 (es)
DK (1) DK0830704T3 (es)
ES (1) ES2124634T3 (es)
WO (1) WO1996041359A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923239A (en) * 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
EP1074034B1 (en) 1998-04-24 2002-03-06 Wickmann-Werke GmbH Electrical fuse element
US6002322A (en) * 1998-05-05 1999-12-14 Littelfuse, Inc. Chip protector surface-mounted fuse device
GB0001573D0 (en) * 2000-01-24 2000-03-15 Welwyn Components Ltd Printed circuit board with fuse
WO2002103735A1 (de) * 2001-06-11 2002-12-27 Wickmann-Werke Gmbh Sicherungsbauelement
US7551048B2 (en) 2002-08-08 2009-06-23 Fujitsu Component Limited Micro-relay and method of fabricating the same
CN101197351B (zh) * 2006-12-05 2010-09-01 邱鸿智 芯片慢熔型保险丝结构与制造方法
CN101894717B (zh) * 2009-05-21 2012-10-24 邱鸿智 具钻孔电极与压模包覆保险丝结构及制造方法
US9117615B2 (en) 2010-05-17 2015-08-25 Littlefuse, Inc. Double wound fusible element and associated fuse
JP5505142B2 (ja) * 2010-07-06 2014-05-28 富士通株式会社 ヒューズおよびその製造方法
CN101964287B (zh) * 2010-10-22 2013-01-23 广东风华高新科技股份有限公司 薄膜片式保险丝及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164725A (en) * 1977-08-01 1979-08-14 Wiebe Gerald L Three-piece solderless plug-in electrically conducting component
GB1604820A (en) * 1978-05-30 1981-12-16 Laur Knudson Nordisk Elektrici Electrical safety fuses
DE3044711A1 (de) * 1980-11-27 1982-07-01 Wickmann-Werke GmbH, 5810 Witten Schmelzsicherung
DE3530354A1 (de) * 1985-08-24 1987-03-05 Opel Adam Ag Elektrische sicherungsanordnung
JPH0831303B2 (ja) * 1986-12-01 1996-03-27 オムロン株式会社 チツプ型ヒユ−ズ
EP0513246B1 (en) * 1990-03-13 1994-11-02 Morrill Glasstek, Inc. Electrical component (fuse) and method of making it
JPH0433230A (ja) * 1990-05-29 1992-02-04 Mitsubishi Materials Corp チップ型ヒューズ
JPH04248221A (ja) * 1991-01-23 1992-09-03 Hitachi Chem Co Ltd チップ型ヒューズの製造法
JPH04245129A (ja) * 1991-01-30 1992-09-01 Hitachi Chem Co Ltd チップ型ヒューズ
JPH04245132A (ja) * 1991-01-30 1992-09-01 Hitachi Chem Co Ltd チップヒューズ用基板及びそれを用いたチップヒューズ
JPH04255627A (ja) * 1991-02-08 1992-09-10 Hitachi Chem Co Ltd チップ型ヒューズの製造法
JPH05166454A (ja) * 1991-12-11 1993-07-02 Hitachi Chem Co Ltd チップ型ヒューズ
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
JPH0636672A (ja) * 1992-07-16 1994-02-10 Sumitomo Wiring Syst Ltd カード型ヒューズおよびその製造方法
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device

Also Published As

Publication number Publication date
DE69600974T2 (de) 1999-06-10
CA2224070A1 (en) 1996-12-19
EP0830704B1 (en) 1998-11-11
EP0830704A1 (en) 1998-03-25
DE69600974D1 (de) 1998-12-17
WO1996041359A1 (en) 1996-12-19
AU6154796A (en) 1996-12-30
MX9709974A (es) 1998-06-28
CN1191624A (zh) 1998-08-26
DK0830704T3 (da) 1999-07-26
JPH10512094A (ja) 1998-11-17
ATE173355T1 (de) 1998-11-15

Similar Documents

Publication Publication Date Title
ES2124634T3 (es) Procedimiento mejorado y aparato para fabricar un dispositivo fusible de montaje en superficie.
DE69323984T2 (de) Verwendung eines isolierenden Klebebandes, Leiterplatte und Halbleiteranordnung mit diesem Band
DE3363992D1 (en) Display device having organic polymer film as substrate
AU4648497A (en) Array of solder pads on an integrated circuit
KR900015276A (ko) 회로 연결방법 및 그에 사용되는 접착 필름
IL132432A0 (en) An exposure apparatus exposure method using the same and method of manufacture of circuit device
MY107097A (en) Moisture indicating ink and package having same.
AU4471397A (en) Film carrier tape and semiconductor device, method for manufacturing them, and circuit board
EP0385418A3 (en) Hologram scale having moisture resistance
ATE118028T1 (de) Antistatisches klebeband.
DK0755178T3 (da) Kommunikationsapparat med elektrostatisk beskyttelse
SG65735A1 (en) Carrier film and integrated circuit device using the same and method of making the same
MY122247A (en) Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame.
DE3176292D1 (en) Substrate and integrated circuit module with this substrate
SG72904A1 (en) Semiconductor device method of fabricating the same film carrier tape circuit board and electronic apparatus
DK490186D0 (da) Fremgangsmaade til fremstilling af prepregs og metalkacheret grundmateriale for trykte kredslaebskort og indretning til udaevelse af fremgangsmaaden
KR900702757A (ko) 회로기판용 용제도포장치
AU6597296A (en) Method and apparatus for a surface-mountable device for prot ection against electrostatic damage to electronic components
AU7726591A (en) The bonding of polyimide films, and printed circuit boards
SG71092A1 (en) Semiconductor device method of making the same and mounting the same circuit board and flexible substrate with the same mounted thereon and method of making the same
EP0396768A4 (en) Pattern correction method
AU5410400A (en) Electronic device comprising a chip fixed on a support and method for making same
KR980006047U (ko) 인쇄회로기판의 실리콘 도포장치
WO1997008737A3 (de) Schaltungsanordnung mit einer hybridschaltung
FR2711693B1 (fr) Dispositif amovible de maintien de matériau isolant.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 830704

Country of ref document: ES