AU5410400A - Electronic device comprising a chip fixed on a support and method for making same - Google Patents

Electronic device comprising a chip fixed on a support and method for making same

Info

Publication number
AU5410400A
AU5410400A AU54104/00A AU5410400A AU5410400A AU 5410400 A AU5410400 A AU 5410400A AU 54104/00 A AU54104/00 A AU 54104/00A AU 5410400 A AU5410400 A AU 5410400A AU 5410400 A AU5410400 A AU 5410400A
Authority
AU
Australia
Prior art keywords
support
electronic device
making same
chip fixed
adhesive layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU54104/00A
Inventor
Bernard Calvas
Jean-Christophe Fidalgo
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SA filed Critical Gemplus SA
Publication of AU5410400A publication Critical patent/AU5410400A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L2224/241—Disposition
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    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The thin electronic chips (2) and adhesive layers (10) are initially attached to a support structure which is then divided. Individual electronic chips with their adhesive layers are then located on to a support surface (16a) and a communications interface (18) is applied to the chip bump terminals (8). The assembly is completed by a protective film (20) which may be applied directly or by pulverization of an agent in liquid phase
AU54104/00A 1999-06-15 2000-05-30 Electronic device comprising a chip fixed on a support and method for making same Abandoned AU5410400A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9907550A FR2795200B1 (en) 1999-06-15 1999-06-15 ELECTRONIC DEVICE COMPRISING AT LEAST ONE CHIP FIXED ON A SUPPORT AND METHOD FOR MANUFACTURING SUCH A DEVICE
FR9907550 1999-06-15
PCT/FR2000/001493 WO2000077730A1 (en) 1999-06-15 2000-05-30 Electronic device comprising a chip fixed on a support and method for making same

Publications (1)

Publication Number Publication Date
AU5410400A true AU5410400A (en) 2001-01-02

Family

ID=9546803

Family Applications (1)

Application Number Title Priority Date Filing Date
AU54104/00A Abandoned AU5410400A (en) 1999-06-15 2000-05-30 Electronic device comprising a chip fixed on a support and method for making same

Country Status (7)

Country Link
EP (2) EP1210690B1 (en)
CN (2) CN1370305A (en)
AT (1) ATE237848T1 (en)
AU (1) AU5410400A (en)
DE (1) DE60002222D1 (en)
FR (1) FR2795200B1 (en)
WO (1) WO2000077730A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY148205A (en) * 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
CN103943939B (en) * 2013-01-21 2016-08-10 太盟光电科技股份有限公司 There is the plate aerial module of RFID formula

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2760113B1 (en) * 1997-02-24 1999-06-04 Gemplus Card Int METHOD FOR MANUFACTURING A CONTACTLESS CARD WITH A COILED ANTENNA
DE19735170A1 (en) * 1997-08-13 1998-09-10 Siemens Ag Chip module esp. for chip card with contacts with adjacent chips

Also Published As

Publication number Publication date
EP1210690B1 (en) 2003-04-16
CN1370305A (en) 2002-09-18
EP1225539A1 (en) 2002-07-24
FR2795200A1 (en) 2000-12-22
CN1393829A (en) 2003-01-29
WO2000077730A1 (en) 2000-12-21
ATE237848T1 (en) 2003-05-15
EP1210690A1 (en) 2002-06-05
DE60002222D1 (en) 2003-05-22
FR2795200B1 (en) 2001-08-31

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