AU1847295A - Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same - Google Patents
Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming sameInfo
- Publication number
- AU1847295A AU1847295A AU18472/95A AU1847295A AU1847295A AU 1847295 A AU1847295 A AU 1847295A AU 18472/95 A AU18472/95 A AU 18472/95A AU 1847295 A AU1847295 A AU 1847295A AU 1847295 A AU1847295 A AU 1847295A
- Authority
- AU
- Australia
- Prior art keywords
- methods
- integrated circuit
- circuit device
- flip chip
- chip integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
Classifications
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/903—Catalyst aided deposition
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US195434 | 1994-02-14 | ||
US08/195,434 US5508228A (en) | 1994-02-14 | 1994-02-14 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same |
PCT/US1995/002109 WO1995022172A1 (en) | 1994-02-14 | 1995-02-13 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1847295A true AU1847295A (en) | 1995-08-29 |
Family
ID=22721410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU18472/95A Abandoned AU1847295A (en) | 1994-02-14 | 1995-02-13 | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same |
Country Status (6)
Country | Link |
---|---|
US (1) | US5508228A (en) |
EP (1) | EP0745270A4 (en) |
JP (1) | JPH09512386A (en) |
KR (1) | KR100323082B1 (en) |
AU (1) | AU1847295A (en) |
WO (1) | WO1995022172A1 (en) |
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-
1994
- 1994-02-14 US US08/195,434 patent/US5508228A/en not_active Expired - Lifetime
-
1995
- 1995-02-13 AU AU18472/95A patent/AU1847295A/en not_active Abandoned
- 1995-02-13 WO PCT/US1995/002109 patent/WO1995022172A1/en not_active Application Discontinuation
- 1995-02-13 EP EP95910308A patent/EP0745270A4/en not_active Withdrawn
- 1995-02-13 KR KR1019960704510A patent/KR100323082B1/en not_active IP Right Cessation
- 1995-02-13 JP JP7521440A patent/JPH09512386A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH09512386A (en) | 1997-12-09 |
US5508228A (en) | 1996-04-16 |
EP0745270A1 (en) | 1996-12-04 |
WO1995022172A1 (en) | 1995-08-17 |
KR100323082B1 (en) | 2002-06-24 |
EP0745270A4 (en) | 1999-08-11 |
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