AU2462595A - Surface mount and flip chip technology - Google Patents
Surface mount and flip chip technologyInfo
- Publication number
- AU2462595A AU2462595A AU24625/95A AU2462595A AU2462595A AU 2462595 A AU2462595 A AU 2462595A AU 24625/95 A AU24625/95 A AU 24625/95A AU 2462595 A AU2462595 A AU 2462595A AU 2462595 A AU2462595 A AU 2462595A
- Authority
- AU
- Australia
- Prior art keywords
- surface mount
- flip chip
- chip technology
- technology
- flip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H01L2924/01006—Carbon [C]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US321937 | 1989-03-10 | ||
US23855294A | 1994-05-05 | 1994-05-05 | |
US238552 | 1994-05-05 | ||
US32193794A | 1994-10-12 | 1994-10-12 | |
PCT/US1995/005217 WO1995031006A1 (en) | 1994-05-05 | 1995-05-04 | Surface mount and flip chip technology |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2462595A true AU2462595A (en) | 1995-11-29 |
Family
ID=26931764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU24625/95A Abandoned AU2462595A (en) | 1994-05-05 | 1995-05-04 | Surface mount and flip chip technology |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0707741A4 (en) |
JP (1) | JP4308904B2 (en) |
KR (1) | KR100232410B1 (en) |
AU (1) | AU2462595A (en) |
DE (1) | DE707741T1 (en) |
WO (1) | WO1995031006A1 (en) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
DE19718618C2 (en) | 1997-05-02 | 1999-12-02 | Daimler Chrysler Ag | Composite structure with a growth substrate having several microelectronic components and a diamond layer, and method for producing the composite structure |
FR2793953B1 (en) | 1999-05-21 | 2002-08-09 | Thomson Csf | THERMAL CAPACITY FOR ELECTRONIC COMPONENT OPERATING IN LONG PULSES |
JP4761644B2 (en) * | 2001-04-18 | 2011-08-31 | 三菱電機株式会社 | Semiconductor device |
AU2002309459A1 (en) * | 2001-06-13 | 2002-12-23 | Advanpack Solutions Pte Ltd | Method for forming a wafer level chip scale package, and package formed thereby |
EP2560199B1 (en) | 2002-04-05 | 2016-08-03 | STMicroelectronics S.r.l. | Process for manufacturing a through insulated interconnection in a body of semiconductor material |
JP2004104074A (en) * | 2002-07-17 | 2004-04-02 | Sumitomo Electric Ind Ltd | Member for semiconductor device |
WO2005050257A2 (en) * | 2003-11-18 | 2005-06-02 | Halliburton Energy Services, Inc. | High temperature imaging device |
FR2874127B1 (en) * | 2004-08-03 | 2006-12-08 | United Monolithic Semiconduct | MINIATURE MICROFREQUENCY CASE FOR SURFACE MOUNTING AND METHOD FOR MANUFACTURING THE HOUSING |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
WO2007089206A1 (en) | 2006-02-01 | 2007-08-09 | Silex Microsystems Ab | Vias and method of making |
FR2923080A1 (en) * | 2007-10-26 | 2009-05-01 | St Microelectronics Rousset | Forming vias in semiconductor wafer, by making wafer having closed perimeter on its front side, filling wafer with dielectric material, thinning wafer by abrasion and/or etching, and removing semiconductor extending inside perimeter |
FR2955202B1 (en) * | 2009-12-10 | 2012-08-03 | St Microelectronics Crolles 2 | INTEGRATED MICROELECTRONIC DEVICE WITH THROUGH CONNECTIONS. |
TWI487019B (en) | 2011-05-23 | 2015-06-01 | Cmp pad dresser having leveled tips and associated methods | |
JP7232137B2 (en) * | 2019-06-25 | 2023-03-02 | ルネサスエレクトロニクス株式会社 | Semiconductor device and its manufacturing method |
DE102019122888A1 (en) * | 2019-08-27 | 2021-03-04 | Infineon Technologies Ag | Power semiconductor device and method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62154651A (en) * | 1985-12-26 | 1987-07-09 | Nippon Soken Inc | Integrated circuit substrate |
JPS62194652A (en) * | 1986-02-21 | 1987-08-27 | Hitachi Ltd | Semiconductor device |
US4972250A (en) * | 1987-03-02 | 1990-11-20 | Microwave Technology, Inc. | Protective coating useful as passivation layer for semiconductor devices |
JPH01120853A (en) * | 1987-11-04 | 1989-05-12 | Mitsubishi Electric Corp | Semiconductor device |
US5131963A (en) * | 1987-11-16 | 1992-07-21 | Crystallume | Silicon on insulator semiconductor composition containing thin synthetic diamone films |
US5091331A (en) * | 1990-04-16 | 1992-02-25 | Harris Corporation | Ultra-thin circuit fabrication by controlled wafer debonding |
JP3047986B2 (en) * | 1990-07-25 | 2000-06-05 | 株式会社日立製作所 | Semiconductor device |
US5170930A (en) * | 1991-11-14 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
US5426072A (en) * | 1993-01-21 | 1995-06-20 | Hughes Aircraft Company | Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate |
US5272104A (en) * | 1993-03-11 | 1993-12-21 | Harris Corporation | Bonded wafer process incorporating diamond insulator |
EP0637078A1 (en) * | 1993-07-29 | 1995-02-01 | Motorola, Inc. | A semiconductor device with improved heat dissipation |
-
1995
- 1995-05-04 KR KR1019960700077A patent/KR100232410B1/en not_active IP Right Cessation
- 1995-05-04 JP JP52901495A patent/JP4308904B2/en not_active Expired - Lifetime
- 1995-05-04 DE DE0707741T patent/DE707741T1/en active Pending
- 1995-05-04 AU AU24625/95A patent/AU2462595A/en not_active Abandoned
- 1995-05-04 WO PCT/US1995/005217 patent/WO1995031006A1/en not_active Application Discontinuation
- 1995-05-04 EP EP95918863A patent/EP0707741A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO1995031006A1 (en) | 1995-11-16 |
EP0707741A1 (en) | 1996-04-24 |
KR100232410B1 (en) | 1999-12-01 |
JPH09500240A (en) | 1997-01-07 |
JP4308904B2 (en) | 2009-08-05 |
EP0707741A4 (en) | 1997-07-02 |
DE707741T1 (en) | 1996-11-28 |
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