ES2124177B1 - Proceso de fabricacion de circuitos mixtos de 105 a 400 y de 17 a 105 micras. - Google Patents
Proceso de fabricacion de circuitos mixtos de 105 a 400 y de 17 a 105 micras.Info
- Publication number
- ES2124177B1 ES2124177B1 ES9602286A ES9602286A ES2124177B1 ES 2124177 B1 ES2124177 B1 ES 2124177B1 ES 9602286 A ES9602286 A ES 9602286A ES 9602286 A ES9602286 A ES 9602286A ES 2124177 B1 ES2124177 B1 ES 2124177B1
- Authority
- ES
- Spain
- Prior art keywords
- manufacturing process
- microns
- circuit
- follow
- mixed circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Abstract
PROCESO DE FABRICACION DE CIRCUITOS MIXTOS DE 105 A 400 Y DE 17 A 105 MICRAS. LAS OPERACIONES DE FABRICACION DE CIRCUITO MIXTO DE 400/35 MICRAS, EL PROCESO DE FABRICACION SE INICIA CON UN MECANIZADO PREVIO DEL SOPORTE DIELECTRICO MEDIANTE UNA CONVENCIONAL OPERACION DE TALADRADO (19), PROGRAMADA DE ACUERDO CON EL DISEÑO FINAL DEL CIRCUITO IMPRESO, A LA QUE SIGUE UNA DEPOSICION DE GRAFITO (21) EN LOS TALADROS PRODUCIDOS ANTERIORMENTE, PARA A CONTINUACION SEGUIR UNA IMPRESION (22) CON TINTA DEL NEGATIVO DEL CIRCUITO, Y SEGUIDAMENTE SE SOMETE A LA METALIZACION (23) MEDIANTE COBRE ELECTROLITICO Y POSTERIOR PROTECCION (29) DEL POSITIVO MEDIANTE UNA ALEACION DE SN/PB.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES9602286A ES2124177B1 (es) | 1996-10-29 | 1996-10-29 | Proceso de fabricacion de circuitos mixtos de 105 a 400 y de 17 a 105 micras. |
EP97500168A EP0843507A3 (fr) | 1996-10-29 | 1997-10-09 | Un procédé de fabrication de circuits imprimes mixtes de 105 à 400 et de 17 à 105 microns |
JP29080197A JPH10135604A (ja) | 1996-10-29 | 1997-10-23 | 105乃至400ミクロン膜厚並びに17乃至105ミクロン膜厚のハイブリットプリント回路の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES9602286A ES2124177B1 (es) | 1996-10-29 | 1996-10-29 | Proceso de fabricacion de circuitos mixtos de 105 a 400 y de 17 a 105 micras. |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2124177A1 ES2124177A1 (es) | 1999-01-16 |
ES2124177B1 true ES2124177B1 (es) | 1999-09-16 |
Family
ID=8296522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES9602286A Expired - Lifetime ES2124177B1 (es) | 1996-10-29 | 1996-10-29 | Proceso de fabricacion de circuitos mixtos de 105 a 400 y de 17 a 105 micras. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0843507A3 (es) |
JP (1) | JPH10135604A (es) |
ES (1) | ES2124177B1 (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2804573B1 (fr) * | 2000-02-02 | 2003-01-10 | Sagem | Carte multicouche pour assemblage de circuits de puissance et de donnees numeriques |
DE10221553A1 (de) * | 2002-05-14 | 2003-11-27 | Rotra Leiterplatten Produktion | Mehrlagen-Leiterplatten-Verbundkörper sowie Verfahren zu dessen Herstellung |
ES2239911B1 (es) * | 2004-03-31 | 2006-11-01 | Omicron Circuits, S.L. | Procedimiento para la fabricacion de circuitos de potencia con grabado inverso. |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4088545A (en) * | 1977-01-31 | 1978-05-09 | Supnet Fred L | Method of fabricating mask-over-copper printed circuit boards |
DE3121131C2 (de) * | 1981-05-27 | 1984-02-16 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten mit metallischen Durchkontaktierungen |
CH650373A5 (fr) * | 1982-07-16 | 1985-07-15 | Jean Paul Strobel | Circuit imprime et procede de fabrication du circuit. |
FR2653683A1 (fr) * | 1989-10-27 | 1991-05-03 | Osl Technologies | Machine de rincage modulaire. |
JPH0537124A (ja) * | 1991-07-26 | 1993-02-12 | Mitsubishi Electric Corp | プリント配線板の製造方法 |
JPH0582962A (ja) * | 1991-09-20 | 1993-04-02 | Fujitsu Ltd | プリント配線板の製造方法 |
JPH06224539A (ja) * | 1993-01-21 | 1994-08-12 | Yazaki Corp | 回路基板の製造方法 |
US5433819A (en) * | 1993-05-26 | 1995-07-18 | Pressac, Inc. | Method of making circuit boards |
-
1996
- 1996-10-29 ES ES9602286A patent/ES2124177B1/es not_active Expired - Lifetime
-
1997
- 1997-10-09 EP EP97500168A patent/EP0843507A3/fr not_active Withdrawn
- 1997-10-23 JP JP29080197A patent/JPH10135604A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0843507A2 (fr) | 1998-05-20 |
ES2124177A1 (es) | 1999-01-16 |
EP0843507A3 (fr) | 1999-03-10 |
JPH10135604A (ja) | 1998-05-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EC2A | Search report published |
Date of ref document: 19990116 Kind code of ref document: A1 Effective date: 19990116 |
|
PC2A | Transfer granted |