ES2084945T3 - Material compuesto de fieltro de fibra de metal/polimero. - Google Patents

Material compuesto de fieltro de fibra de metal/polimero.

Info

Publication number
ES2084945T3
ES2084945T3 ES92306708T ES92306708T ES2084945T3 ES 2084945 T3 ES2084945 T3 ES 2084945T3 ES 92306708 T ES92306708 T ES 92306708T ES 92306708 T ES92306708 T ES 92306708T ES 2084945 T3 ES2084945 T3 ES 2084945T3
Authority
ES
Spain
Prior art keywords
fiber
metal
material composed
polymer
thermosformable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92306708T
Other languages
English (en)
Inventor
Yenni Donald Mackelvie Jr
Clyde David Calhoun
David Clarence Koskenmaki
Robert Lincoln Lambert Jr
David John Lundin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of ES2084945T3 publication Critical patent/ES2084945T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/12Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/02Layer formed of wires, e.g. mesh
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/903Microfiber, less than 100 micron diameter
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/654Including a free metal or alloy constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Textile Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)

Abstract

UNA LAMINA TERMOFORMABLE DE RECUBRIMIENTO EMI AÑADIDO QUE COMPRENDE UN MATERIAL PORTADOR SELECCIONADO DE PELICULAS POLIMERICAS E HILOS FIBROSOS QUE TIENEN LA CAPACIDAD DE CONVERTIRSE EN POROSOS CUANDO SON TERMOFORMADOS, TENIENDO UNA MATRIZ DE METAL AL MENOS PARCIALMENTE INCRUSTADA EN LOS MISMOS, QUE COMPRENDE UNA PLURALIDAD DE FIBRAS DE METAL ALEATORIAMENTE ORIENTADAS, FINAS, TENIENDO EL MATERIAL PORTADOR UNA TEMPERATURA DE ABLANDAMIENTO INFERIOR A LA TEMPERATURA MAS ALTA ALCANZADA DURANTE EL PROCESO DE TERMOFORMACION.
ES92306708T 1991-08-22 1992-07-22 Material compuesto de fieltro de fibra de metal/polimero. Expired - Lifetime ES2084945T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/748,708 US5869412A (en) 1991-08-22 1991-08-22 Metal fibermat/polymer composite

Publications (1)

Publication Number Publication Date
ES2084945T3 true ES2084945T3 (es) 1996-05-16

Family

ID=25010592

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92306708T Expired - Lifetime ES2084945T3 (es) 1991-08-22 1992-07-22 Material compuesto de fieltro de fibra de metal/polimero.

Country Status (8)

Country Link
US (1) US5869412A (es)
EP (1) EP0529801B1 (es)
JP (1) JPH05269912A (es)
KR (1) KR100220534B1 (es)
CA (1) CA2074198A1 (es)
DE (1) DE69209407T2 (es)
ES (1) ES2084945T3 (es)
SG (1) SG85581A1 (es)

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US6086979A (en) 1997-11-11 2000-07-11 Hitachi Chemical Company, Ltd. Electromagnetically shielding bonding film, and shielding assembly and display device using such film
US6013376A (en) * 1997-12-09 2000-01-11 3M Innovative Properties Company Metal fibermat/polymer composite
US6090728A (en) 1998-05-01 2000-07-18 3M Innovative Properties Company EMI shielding enclosures
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US6711440B2 (en) 2002-04-11 2004-03-23 Biophan Technologies, Inc. MRI-compatible medical device with passive generation of optical sensing signals
US7296690B2 (en) * 2002-04-18 2007-11-20 The Cupron Corporation Method and device for inactivating viruses
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US20040119201A1 (en) * 2002-07-12 2004-06-24 Siegel-Robert, Inc. Apparatus and method for manufacturing plastic products with EMI/RFI/ESD shield
US6925322B2 (en) * 2002-07-25 2005-08-02 Biophan Technologies, Inc. Optical MRI catheter system
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US20040167483A1 (en) * 2003-02-21 2004-08-26 The Cupron Corporation C/O Law Offices Of Mr. Sylavin Jakabovics Disposable diaper for combating diaper rash
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US7364756B2 (en) * 2003-08-28 2008-04-29 The Cuprin Corporation Anti-virus hydrophilic polymeric material
US7480393B2 (en) * 2003-11-19 2009-01-20 Digimarc Corporation Optimized digital watermarking functions for streaming data
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KR100963673B1 (ko) * 2007-10-23 2010-06-15 제일모직주식회사 열전도성 수지 복합재 및 이를 이용한 성형품
JP4968481B2 (ja) * 2008-04-28 2012-07-04 ソニーケミカル&インフォメーションデバイス株式会社 積層型軟磁性シートの製造方法
KR20110004907A (ko) * 2008-06-10 2011-01-14 다이셀 가가꾸 고교 가부시끼가이샤 다공질층을 갖는 적층체 및 그것을 사용한 기능성 적층체
KR101257693B1 (ko) * 2008-11-05 2013-04-24 제일모직주식회사 전기절연성 고열전도성 수지 조성물
KR101212671B1 (ko) * 2008-12-10 2012-12-14 제일모직주식회사 Emi/rfi 차폐용 수지 복합재
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Also Published As

Publication number Publication date
KR930004065A (ko) 1993-03-22
DE69209407T2 (de) 1996-11-28
EP0529801B1 (en) 1996-03-27
SG85581A1 (en) 2002-01-15
DE69209407D1 (de) 1996-05-02
EP0529801A1 (en) 1993-03-03
US5869412A (en) 1999-02-09
CA2074198A1 (en) 1993-02-23
KR100220534B1 (ko) 1999-09-15
JPH05269912A (ja) 1993-10-19

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