ES2078386T3 - Soporte para laminas de cobre de placas de circuitos impresos flexibles. - Google Patents
Soporte para laminas de cobre de placas de circuitos impresos flexibles.Info
- Publication number
- ES2078386T3 ES2078386T3 ES91109778T ES91109778T ES2078386T3 ES 2078386 T3 ES2078386 T3 ES 2078386T3 ES 91109778 T ES91109778 T ES 91109778T ES 91109778 T ES91109778 T ES 91109778T ES 2078386 T3 ES2078386 T3 ES 2078386T3
- Authority
- ES
- Spain
- Prior art keywords
- circuit boards
- support
- printed circuit
- flexible printed
- copper sheets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/308—Heat stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2631—Coating or impregnation provides heat or fire protection
- Y10T442/2672—Phosphorus containing
- Y10T442/268—Phosphorus and nitrogen containing compound
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
SE TRATA DE MATERIAL NO TEJIDO O PAPEL QUE PUEDEN SER UTILIZADOS COMO SOPORTES TERMOESTABLES PARA LAMINAS DE COBRE DE PLACAS CONDUCTORAS FLEXIBLES CON PRODUCTO DE RETICULACION QUIMICA COMPUESTO DE A) UNA DISPERSION ACUOSA CON 50% DE UN COPOLIMERIZADO RETICULABLE TERMICO CON UNA TEMPERATURA DE TRANSICION VITREA DE MAS 33 C DE ACRILNITRIL Y ESTIROL Y DE B) SOLUCION DE UN PRECONDENSADO AMINO O FENOPLASTICO QUE CONTIENE GRUPOS METILOL ACUOSOS CON UN 60% EN CONEXION CON UN SISTEMA INGNIFUGO LIBRE DE HALOGENO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4026354 | 1990-08-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2078386T3 true ES2078386T3 (es) | 1995-12-16 |
Family
ID=6412583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES91109778T Expired - Lifetime ES2078386T3 (es) | 1990-08-21 | 1991-06-14 | Soporte para laminas de cobre de placas de circuitos impresos flexibles. |
Country Status (8)
Country | Link |
---|---|
US (1) | US5498471A (es) |
EP (1) | EP0471937B1 (es) |
JP (1) | JPH07101770B2 (es) |
AT (1) | ATE127653T1 (es) |
DE (2) | DE4102473A1 (es) |
DK (1) | DK0471937T3 (es) |
ES (1) | ES2078386T3 (es) |
GR (1) | GR3018183T3 (es) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9119795D0 (en) * | 1991-09-17 | 1991-10-30 | Albright & Wilson | Flame retardant plastics material |
DE19508835C1 (de) * | 1995-03-11 | 1996-04-25 | Freudenberg Carl Fa | Verfahren zur Herstellung von Leiterplatten mit leitfähigen Sacklöchern |
JP3054866B1 (ja) * | 1998-12-14 | 2000-06-19 | キョーワ株式会社 | 建設工事現場に展張するメッシュシート用難燃剤とこれを用いた建設工事現場に展張する防炎メッシュシート |
US6224965B1 (en) | 1999-06-25 | 2001-05-01 | Honeywell International Inc. | Microfiber dielectrics which facilitate laser via drilling |
US6245696B1 (en) | 1999-06-25 | 2001-06-12 | Honeywell International Inc. | Lasable bond-ply materials for high density printed wiring boards |
US6327155B1 (en) | 1999-12-16 | 2001-12-04 | Nortel Networks Limited | Method and apparatus for preventing flamespread in an equipment assembly |
US6495244B1 (en) * | 2000-09-07 | 2002-12-17 | Oak-Mitsui, Inc. | Manufacturing fire retardant circuit boards without the use of fire retardant resin additives |
WO2002042981A1 (en) * | 2000-11-22 | 2002-05-30 | Ausubel Lawrence M | System and method for a dynamic auction with package bidding |
GB0029071D0 (en) * | 2000-11-29 | 2001-01-10 | Clariant Int Ltd | Coating |
US6519162B1 (en) * | 2001-08-30 | 2003-02-11 | Adc Telecommunications, Inc. | Protective panel for a splitter chassis or other device for holding electronic cards |
GB2400105B (en) * | 2001-12-20 | 2005-08-31 | World Properties Inc | Adhesive resin with high damping properties and method of manufacture thereof |
CN101589198B (zh) * | 2007-01-24 | 2012-10-03 | 巴斯夫欧洲公司 | 具有研磨表面的挠性片状基材 |
EA019582B1 (ru) * | 2008-07-24 | 2014-04-30 | Басф Се | Гибкие плоские субстраты с абразивной поверхностью |
KR20150036178A (ko) | 2012-06-28 | 2015-04-07 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 열전도성 기재 물품 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4075420A (en) * | 1975-08-28 | 1978-02-21 | Burroughs Corporation | Cover layer for flexible circuits |
JPS5439873A (en) * | 1977-09-06 | 1979-03-27 | Nippon Denso Co | Incombustible ypet flexible printed wiring board |
JPS5831753B2 (ja) * | 1979-02-02 | 1983-07-08 | 鐘淵化学工業株式会社 | 電気用絶縁積層板及び印刷回路用金属箔張り積層板 |
CA1200039A (en) * | 1981-12-26 | 1986-01-28 | Hiroaki Koyama | Resin composition containing granular or powdery phenol-aldehyde resin |
JPS6042256B2 (ja) * | 1982-08-02 | 1985-09-20 | カネボウ株式会社 | 熱可塑性樹脂の難燃化方法 |
CA1259439A (en) * | 1983-03-17 | 1989-09-12 | Masaharu Abe | Flame retarded epoxy resin composition for use in the manufacture of electrical laminates |
GB8413929D0 (en) * | 1984-05-31 | 1984-07-04 | Plascoat Uk Ltd | Flame retardant compositions |
DE3732907A1 (de) * | 1987-09-30 | 1989-04-13 | Basf Ag | Selbstverloeschende, thermoplastische polyphenylenether-polyamid-formmassen und ihre verwendung zur herstllung von formkoerpern |
JPH01163256A (ja) * | 1987-12-21 | 1989-06-27 | Nippon Oil Co Ltd | 積層板用樹脂組成物 |
-
1991
- 1991-01-29 DE DE4102473A patent/DE4102473A1/de active Granted
- 1991-06-14 EP EP91109778A patent/EP0471937B1/de not_active Expired - Lifetime
- 1991-06-14 AT AT91109778T patent/ATE127653T1/de not_active IP Right Cessation
- 1991-06-14 DE DE59106414T patent/DE59106414D1/de not_active Expired - Fee Related
- 1991-06-14 DK DK91109778.0T patent/DK0471937T3/da active
- 1991-06-14 ES ES91109778T patent/ES2078386T3/es not_active Expired - Lifetime
- 1991-08-21 JP JP3209201A patent/JPH07101770B2/ja not_active Expired - Fee Related
-
1995
- 1995-06-06 US US08/467,325 patent/US5498471A/en not_active Expired - Lifetime
- 1995-11-22 GR GR950403308T patent/GR3018183T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
DE59106414D1 (de) | 1995-10-12 |
EP0471937B1 (de) | 1995-09-06 |
US5498471A (en) | 1996-03-12 |
DE4102473C2 (es) | 1992-07-16 |
EP0471937A2 (de) | 1992-02-26 |
DK0471937T3 (da) | 1995-11-27 |
JPH07101770B2 (ja) | 1995-11-01 |
GR3018183T3 (en) | 1996-02-29 |
EP0471937A3 (en) | 1993-04-21 |
ATE127653T1 (de) | 1995-09-15 |
DE4102473A1 (de) | 1992-02-27 |
JPH04233784A (ja) | 1992-08-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2078386T3 (es) | Soporte para laminas de cobre de placas de circuitos impresos flexibles. | |
ES2190445T3 (es) | Puerta para un aparato de coccion. | |
CA2223552A1 (en) | Virus inactivating coatings | |
KR870010833A (ko) | 구울 수 있는 종이판제 음식접시 | |
GR3019621T3 (en) | Thin film electrical component with polymer substrate | |
FR2580433B1 (fr) | Connecteur thermique pour carte de circuit imprime revetue de composants electroniques | |
AU3747985A (en) | Article clamp | |
EP0285669A4 (en) | Functional film and process for its production | |
KR960038718A (ko) | 패턴 형성용 시트 및 이를 포함하는 라벨 | |
SE8701351L (sv) | Festdon | |
IL122956A0 (en) | Flat plate heat exchanger | |
BR8904847A (pt) | Substrato para placa de circuito impresso,composicao liquida,processo de polimerizacao com abertura de anel,e processo para a producao de uma composicao liquida | |
EP0201831A3 (de) | Thermotrope aromatische Polyester mit hoher Wärmeformbeständigkeit, Verfahren zu ihrer Herstellung und ihre Verwendung zur Herstellung von Formkörpern, Filamenten, Fasern und Folien | |
BR9807965A (pt) | Componente acessível ao usuário montável em um alojamento externo de um aparelho eletrônico, aparelho eletrônico, e, processo de fixar um conector em um aparelho eletrônico | |
DE59103098D1 (de) | Abdeckfolie für flexible Leiterplatten. | |
KR970001423A (ko) | 플루오르 함유 수지 성형체 | |
EP0707325A3 (en) | Fuse holder comprising clips supporting fuses for mounting on printed circuit boards | |
KR860006914A (ko) | 비-감광전이 절연도료 시이트 성형품 | |
FI874397A0 (fi) | Anordning med minst en med profilskenor i en konstruktionsgruppbaerare foerbindbar styrhaollare. | |
ES514819A0 (es) | "un dispositivo conectador electrico de borde, particularmente para efectuar conexiones electricas con el borde de un panel o substrato de circuito impreso". | |
KR900007625A (ko) | 열 전사용 리시버 | |
Hausdorf et al. | Carriers for Copper Sheets of Flexible Printed Circuit Boards | |
ATE247376T1 (de) | Bedruckte schaltträger | |
MY117567A (en) | Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating | |
EP0348345A3 (en) | Solution stable polyimide resin systems |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 471937 Country of ref document: ES |