ES2071443T3 - Procedimiento de realizacion de un laser semiconductor plano de cinta enterrada. - Google Patents

Procedimiento de realizacion de un laser semiconductor plano de cinta enterrada.

Info

Publication number
ES2071443T3
ES2071443T3 ES92400227T ES92400227T ES2071443T3 ES 2071443 T3 ES2071443 T3 ES 2071443T3 ES 92400227 T ES92400227 T ES 92400227T ES 92400227 T ES92400227 T ES 92400227T ES 2071443 T3 ES2071443 T3 ES 2071443T3
Authority
ES
Spain
Prior art keywords
tape
realization
procedure
flat semiconductor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92400227T
Other languages
English (en)
Inventor
Leon Goldstein
Dominique Bonnevie
Francois Brillouet
Francis Poingt
Jean-Louis Lievin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent NV
Original Assignee
Alcatel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9409518&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2071443(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Alcatel NV filed Critical Alcatel NV
Application granted granted Critical
Publication of ES2071443T3 publication Critical patent/ES2071443T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/227—Buried mesa structure ; Striped active layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2054—Methods of obtaining the confinement
    • H01S5/2081—Methods of obtaining the confinement using special etching techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/227—Buried mesa structure ; Striped active layer
    • H01S5/2275—Buried mesa structure ; Striped active layer mesa created by etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/09—Laser anneal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/10—Lift-off masking

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

TRAS UN GRABADO QUE DELIMITA UNA CINTA DE LASER (2A) EN RELIEVE SOBRE UN SUSTRATO (1), CAPAS LATERALES (6, 7) QUE DEBEN RODEAR ESTA CINTA ESTAN FORMADAS POR UN METODO DE CRECIMIENTO NO SELECTIVO QUE REALIZA UNA DEPOSICION NO SOLO AL LADO DE ESTA CINTA, SINO TAMBIEN POR ENCIMA DE ESTE CREANDO UN SALIENTE PARASITO (6A, 7A). ESTE SALIENTE SE RETIRA A CONTINUACION TRAS HABER SIDO SEPARADO DE ESTE SUSTRATO POR UN ATAQUE QUIMICO SELECTIVO DE UNA TIRA DE AYUDA AL RELEJE (4A) QUE HABIA SIDO DEPOSITADA PARA ESTE PROPOSITO POR ENCIMA DE ESTA CINTA ANTES DE ESTE GRABADO. SE HAN REALIZADO PASOS (28) PARA EL MEDIO DE ATAQUE UTILIZADO PARA ESTO. LA INVENCION SE APLICA EN PARTICULAR A LA REALIZACION DE SISTEMAS DE TRANSMISION DE FIBRAS OPTICAS.
ES92400227T 1991-02-08 1992-01-29 Procedimiento de realizacion de un laser semiconductor plano de cinta enterrada. Expired - Lifetime ES2071443T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9101470A FR2672740B1 (fr) 1991-02-08 1991-02-08 Procede de realisation d'un laser semiconducteur planaire a ruban enterre.

Publications (1)

Publication Number Publication Date
ES2071443T3 true ES2071443T3 (es) 1995-06-16

Family

ID=9409518

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92400227T Expired - Lifetime ES2071443T3 (es) 1991-02-08 1992-01-29 Procedimiento de realizacion de un laser semiconductor plano de cinta enterrada.

Country Status (6)

Country Link
US (1) US5215939A (es)
EP (1) EP0498695B1 (es)
JP (1) JP3067052B2 (es)
DE (1) DE69201891T2 (es)
ES (1) ES2071443T3 (es)
FR (1) FR2672740B1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7877014B2 (en) * 2001-07-05 2011-01-25 Enablence Technologies Inc. Method and system for providing a return path for signals generated by legacy video service terminals in an optical network

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766994B2 (ja) * 1985-02-19 1995-07-19 シャープ株式会社 半導体レーザ素子
JPH0710019B2 (ja) * 1987-01-17 1995-02-01 日本電信電話株式会社 埋込み構造半導体レ−ザの製造方法
JPH0279486A (ja) * 1988-09-14 1990-03-20 Sharp Corp 半導体レーザ素子
JPH0281441A (ja) * 1988-09-17 1990-03-22 Mitsubishi Electric Corp 半導体装置の製造方法
KR900013612A (ko) * 1989-02-17 1990-09-05 프레데릭 얀 스미트 두 물체의 연결 방법 및 장치
US5084409A (en) * 1990-06-26 1992-01-28 Texas Instruments Incorporated Method for patterned heteroepitaxial growth
JPH06200857A (ja) * 1993-01-08 1994-07-19 Fuji Heavy Ind Ltd 高圧噴射式エンジンの燃料圧力制御方法

Also Published As

Publication number Publication date
EP0498695B1 (fr) 1995-04-05
DE69201891D1 (de) 1995-05-11
EP0498695A1 (fr) 1992-08-12
FR2672740B1 (fr) 1995-03-31
DE69201891T2 (de) 1995-09-07
JP3067052B2 (ja) 2000-07-17
FR2672740A1 (fr) 1992-08-14
JPH04336485A (ja) 1992-11-24
US5215939A (en) 1993-06-01

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