DE69213691D1 - Verfahren zur Herstellung einer lichtemittierenden Halbleitervorrichtung, die AlGaInP enthält - Google Patents

Verfahren zur Herstellung einer lichtemittierenden Halbleitervorrichtung, die AlGaInP enthält

Info

Publication number
DE69213691D1
DE69213691D1 DE69213691T DE69213691T DE69213691D1 DE 69213691 D1 DE69213691 D1 DE 69213691D1 DE 69213691 T DE69213691 T DE 69213691T DE 69213691 T DE69213691 T DE 69213691T DE 69213691 D1 DE69213691 D1 DE 69213691D1
Authority
DE
Germany
Prior art keywords
manufacturing
light emitting
emitting device
semiconductor light
device containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69213691T
Other languages
English (en)
Other versions
DE69213691T2 (de
Inventor
Yasuo Kan
Kosei Takahashi
Masahiro Hosoda
Atsuo Tsunoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE69213691D1 publication Critical patent/DE69213691D1/de
Application granted granted Critical
Publication of DE69213691T2 publication Critical patent/DE69213691T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32325—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm red laser based on InGaP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223—Buried stripe structure
    • H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/017—Clean surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/974—Substrate surface preparation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Drying Of Semiconductors (AREA)
DE69213691T 1991-12-20 1992-12-18 Verfahren zur Herstellung einer lichtemittierenden Halbleitervorrichtung, die AlGaInP enthält Expired - Fee Related DE69213691T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3338804A JP2708992B2 (ja) 1991-12-20 1991-12-20 ＡｌＧａＩｎＰ系半導体発光装置の製造方法

Publications (2)

Publication Number Publication Date
DE69213691D1 true DE69213691D1 (de) 1996-10-17
DE69213691T2 DE69213691T2 (de) 1997-02-20

Family

ID=18321631

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69213691T Expired - Fee Related DE69213691T2 (de) 1991-12-20 1992-12-18 Verfahren zur Herstellung einer lichtemittierenden Halbleitervorrichtung, die AlGaInP enthält

Country Status (4)

Country Link
US (1) US5310697A (de)
EP (1) EP0549278B1 (de)
JP (1) JP2708992B2 (de)
DE (1) DE69213691T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5510277A (en) * 1994-06-29 1996-04-23 At&T Corp. Surface treatment for silicon substrates
KR100303279B1 (ko) * 1994-08-27 2001-12-01 윤종용 반도체레이저다이오드와그제조방법
US5821548A (en) * 1996-12-20 1998-10-13 Technical Visions, Inc. Beam source for production of radicals and metastables
US6316793B1 (en) * 1998-06-12 2001-11-13 Cree, Inc. Nitride based transistors on semi-insulating silicon carbide substrates
JP4040192B2 (ja) * 1998-11-26 2008-01-30 ソニー株式会社 半導体発光素子の製造方法
JP2001094212A (ja) * 1999-09-24 2001-04-06 Sanyo Electric Co Ltd 半導体素子およびその製造方法
JP3982985B2 (ja) * 1999-10-28 2007-09-26 シャープ株式会社 半導体レーザ素子の製造方法
US20030104171A1 (en) * 2001-11-29 2003-06-05 Maclachlan Julia Method of using short wavelength UV light to selectively remove a coating from a substrate and article produced thereby
JP2004055975A (ja) 2002-07-23 2004-02-19 Sharp Corp 半導体発光装置およびその製造方法
US7112830B2 (en) 2002-11-25 2006-09-26 Apa Enterprises, Inc. Super lattice modification of overlying transistor
US11677042B2 (en) 2019-03-29 2023-06-13 Meta Platforms Technologies, Llc Regrowth of epitaxial layer for surface recombination velocity reduction in light emitting diodes
US11424289B2 (en) 2019-11-14 2022-08-23 Meta Platforms Technologies, Llc In situ selective etching and selective regrowth of epitaxial layer for surface recombination velocity reduction in light emitting diodes
WO2023152023A1 (en) * 2022-02-10 2023-08-17 Ams-Osram International Gmbh Optoelectronic semiconductor device and manufacturing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969164A (en) * 1974-09-16 1976-07-13 Bell Telephone Laboratories, Incorporated Native oxide technique for preparing clean substrate surfaces
JPS56156760A (en) * 1980-05-06 1981-12-03 Shunpei Yamazaki Method and apparatus for forming coat
US4361461A (en) * 1981-03-13 1982-11-30 Bell Telephone Laboratories, Incorporated Hydrogen etching of semiconductors and oxides
US4371968A (en) * 1981-07-01 1983-02-01 The United States Of America As Represented By The Secretary Of The Army Monolithic injection laser arrays formed by crystal regrowth techniques
JPS59123226A (ja) * 1982-12-28 1984-07-17 Fujitsu Ltd 半導体装置の製造装置
US4833100A (en) * 1985-12-12 1989-05-23 Kozo Iizuka, Director-General Of Agency Of Industrial Science And Technology Method for producing a silicon thin film by MBE using silicon beam precleaning
DE69129047T2 (de) * 1990-05-09 1998-09-03 Sharp K.K., Osaka Herstellungsverfahren für eine aus Halbleiterverbindungen bestehende Laservorrichtung
JP2616139B2 (ja) * 1990-05-22 1997-06-04 日本電気株式会社 半導体結晶表面クリーニング方法
US5212701A (en) * 1992-03-25 1993-05-18 At&T Bell Laboratories Semiconductor surface emitting laser having enhanced optical confinement

Also Published As

Publication number Publication date
US5310697A (en) 1994-05-10
JPH05175609A (ja) 1993-07-13
JP2708992B2 (ja) 1998-02-04
EP0549278A1 (de) 1993-06-30
EP0549278B1 (de) 1996-09-11
DE69213691T2 (de) 1997-02-20

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee