ES2057445T5 - Procedimiento para depositar cobre por via quimica. - Google Patents
Procedimiento para depositar cobre por via quimica.Info
- Publication number
- ES2057445T5 ES2057445T5 ES90313187T ES90313187T ES2057445T5 ES 2057445 T5 ES2057445 T5 ES 2057445T5 ES 90313187 T ES90313187 T ES 90313187T ES 90313187 T ES90313187 T ES 90313187T ES 2057445 T5 ES2057445 T5 ES 2057445T5
- Authority
- ES
- Spain
- Prior art keywords
- procedure
- electricity
- metal
- deposit
- deposit copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1669—Agitation, e.g. air introduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0292—Using vibration, e.g. during soldering or screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
SE PRESENTA UN PROCESO PARA EL REVESTIMIENTO MECANICO QUE NO USA ELECTRICIDAD, PARTICULARMENTE PARA SER USADO EN SUBSTRATOS DE CIRCUITO IMPRESO PARA REVESTIR DE METAL A TRAVES DE AGUJEROS (14), Y MAS PARTICULARMENTE PARA DEPOSITAR ADITIVAMENTE METAL DE COBRE EN SUPERFICIES AGUJEREADAS, EN EL CUAL EL SUBSTRATO SE EXPONE AL MENOS INTERMITENTEMENTE A UN MOVIMIENTO DE VIBRACION EN CONTACTO CON UN BAÑO DE DEPOSITACION SIN ELECTRICIDAD, ASI MISMO (12) SE PRESENTA UN APARATO DEPOSITADOR DE METAL QUE FUNCIONA SIN ELECTRICIDAD PARA LLEVAR A CABO DICHO PROCESO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07493296 US5077099B1 (en) | 1990-03-14 | 1990-03-14 | Electroless copper plating process and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2057445T3 ES2057445T3 (es) | 1994-10-16 |
ES2057445T5 true ES2057445T5 (es) | 1998-02-16 |
Family
ID=23959652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES90313187T Expired - Lifetime ES2057445T5 (es) | 1990-03-14 | 1990-12-05 | Procedimiento para depositar cobre por via quimica. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5077099B1 (es) |
EP (1) | EP0446522B2 (es) |
JP (1) | JPH04228578A (es) |
CA (1) | CA2029090C (es) |
DE (1) | DE69009978T3 (es) |
ES (1) | ES2057445T5 (es) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05211384A (ja) * | 1991-11-20 | 1993-08-20 | Nec Corp | 印刷配線板のめっき方法 |
FI98667C (fi) * | 1993-07-08 | 1997-07-25 | Picopak Oy | Menetelmä ja laite kontaktinystyjen muodostamiseksi kemiallisesti puolijohdekiekoille |
US5865894A (en) * | 1997-06-11 | 1999-02-02 | Reynolds Tech Fabricators, Inc. | Megasonic plating system |
KR100586481B1 (ko) | 1997-09-02 | 2006-11-30 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판을도금하는방법 |
US6071385A (en) * | 1997-11-04 | 2000-06-06 | The Boeing Company | Racking fixture for electrochemical processing |
DE10015349A1 (de) * | 2000-03-23 | 2001-10-25 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung |
JP2006093651A (ja) * | 2004-08-26 | 2006-04-06 | Ngk Spark Plug Co Ltd | 配線基板の製造方法および配線基板製造用無電解メッキ装置 |
TWI314957B (en) * | 2005-12-29 | 2009-09-21 | Ind Tech Res Inst | Apparatus for metal plating on a substrate |
US20090238979A1 (en) * | 2008-03-21 | 2009-09-24 | William Decesare | Method of Applying Catalytic Solution for Use in Electroless Deposition |
JP5762137B2 (ja) * | 2011-05-27 | 2015-08-12 | 上村工業株式会社 | めっき方法 |
RU2573596C1 (ru) * | 2014-09-19 | 2016-01-20 | Акционерное общество "Концерн радиостроения "Вега" | Устройство для очистки и химической металлизации отверстий заготовок печатных плат |
US20220056589A1 (en) * | 2020-08-21 | 2022-02-24 | Advanced Semiconductor Engineering, Inc. | Electroless semiconductor bonding structure, electroless plating system and electroless plating method of the same |
CN113179593B (zh) * | 2021-03-26 | 2022-09-06 | 赣州金顺科技有限公司 | 一种电路板沉铜浸酸的预浸支撑桥架及其实施工艺 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
FR1412339A (fr) * | 1964-10-23 | 1965-09-24 | Produktionsgenossenschaft Des | Dispositif pour argenter intérieurement des objets en verre, en particulier des articles pour arbre de noël |
US3577324A (en) * | 1968-01-24 | 1971-05-04 | Sondell Research Dev Co | Process of coating particles with metals |
US3615735A (en) * | 1968-08-13 | 1971-10-26 | Shipley Co | Electroless copper plating |
US3934054A (en) * | 1969-08-25 | 1976-01-20 | Electro Chemical Engineering Gmbh | Electroless metal plating |
US3667590A (en) * | 1970-01-02 | 1972-06-06 | Dennis E Mead | Vibratory pile feeder |
JPS525873A (en) * | 1975-07-02 | 1977-01-17 | Toyoda Automatic Loom Works | Plating of synthetic resin goods |
US4209331A (en) * | 1978-05-25 | 1980-06-24 | Macdermid Incorporated | Electroless copper composition solution using a hypophosphite reducing agent |
US4279948A (en) * | 1978-05-25 | 1981-07-21 | Macdermid Incorporated | Electroless copper deposition solution using a hypophosphite reducing agent |
US4228213A (en) * | 1979-08-13 | 1980-10-14 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
CA1219179A (en) * | 1982-09-27 | 1987-03-17 | Etd Technology, Inc. | Apparatus and method for electroless plating |
US4734296A (en) * | 1982-09-27 | 1988-03-29 | Etd Technology, Inc. | Electroless plating of through-holes using pressure differential |
US4597988A (en) * | 1983-06-06 | 1986-07-01 | Macdermid, Incorporated | Process for preparing printed circuit board thru-holes |
US4756930A (en) * | 1983-06-06 | 1988-07-12 | Macdermid, Incorporated | Process for preparing printed circuit board thru-holes |
US4608275A (en) * | 1983-07-01 | 1986-08-26 | Macdermid, Incorporated | Oxidizing accelerator |
JPS6067674A (ja) * | 1983-09-21 | 1985-04-18 | Komatsu Ltd | 無電解めつき法 |
JPS6162655A (ja) * | 1984-09-04 | 1986-03-31 | Koji Yoshimura | 摩擦減速機 |
US4695505A (en) * | 1985-10-25 | 1987-09-22 | Shipley Company Inc. | Ductile electroless copper |
JPS62154797A (ja) * | 1985-12-27 | 1987-07-09 | 株式会社 プランテツクス | プリント基板製造装置 |
JPH0666550B2 (ja) * | 1988-07-12 | 1994-08-24 | 株式会社プランテックス | プリント基板製造装置 |
-
1990
- 1990-03-14 US US07493296 patent/US5077099B1/en not_active Expired - Lifetime
- 1990-10-31 CA CA002029090A patent/CA2029090C/en not_active Expired - Lifetime
- 1990-12-05 DE DE69009978T patent/DE69009978T3/de not_active Expired - Lifetime
- 1990-12-05 EP EP90313187A patent/EP0446522B2/en not_active Expired - Lifetime
- 1990-12-05 ES ES90313187T patent/ES2057445T5/es not_active Expired - Lifetime
-
1991
- 1991-02-25 JP JP3196182A patent/JPH04228578A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0446522A1 (en) | 1991-09-18 |
JPH04228578A (ja) | 1992-08-18 |
US5077099A (en) | 1991-12-31 |
DE69009978T3 (de) | 1998-01-29 |
EP0446522B1 (en) | 1994-06-15 |
CA2029090C (en) | 1998-04-14 |
CA2029090A1 (en) | 1991-09-15 |
EP0446522B2 (en) | 1997-08-27 |
ES2057445T3 (es) | 1994-10-16 |
US5077099B1 (en) | 1997-12-02 |
DE69009978T2 (de) | 1994-10-27 |
DE69009978D1 (de) | 1994-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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