ES2056232T3 - Metodo para fabricar una oblea plana. - Google Patents
Metodo para fabricar una oblea plana.Info
- Publication number
- ES2056232T3 ES2056232T3 ES89313008T ES89313008T ES2056232T3 ES 2056232 T3 ES2056232 T3 ES 2056232T3 ES 89313008 T ES89313008 T ES 89313008T ES 89313008 T ES89313008 T ES 89313008T ES 2056232 T3 ES2056232 T3 ES 2056232T3
- Authority
- ES
- Spain
- Prior art keywords
- thin
- polished
- nitride
- slice
- slices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
- H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching
- H01L21/31056—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching the removal being a selective chemical etching step, e.g. selective dry etching through a mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
UN PERFECCIONAMIENTO EN LA LISURA DE RODAJAS DELGADAS Y PULIDAS DE SILICIO SE OBTIENE MEDIANTE LA DISMINUCION DEL TIEMPO CONSUMIDO EN ALISAR LA RODAJA DELGADA Y PULIDA. DESPUES DE UNA OPERACION CONVENCIONAL DE SOLAPAMIENTO, LA RODAJA DELGADA Y PULIDA SE REVISTE CON UN REVESTIMIENTO RESISTENTE A LA CORROSION, TIPICAMENTE NITRURO DE SILICIO. UNA FASE DE ALISAMIENTO ELIMINA EL REVESTIMIENTO DE NITRURO SOBRE LAS SUPERFICIES PLANAS DE LA RODAJA DELGADA Y PULIDA, PERO DEJA UN REVESTIMIENTO DE NITRURO SOBRE LOS LATERALES DE HOYOS QUE SE FORMAN EN LA OPERACION DE SOLAPAMIENTO. LA RODAJA DELGADA Y PULIDA SE TRATA DESPUES AL AGUA FUERTE, TIPICAMENTE EN KOH, PARA ELIMINAR LA SUPERFICIE DE SILICIO HASTA DEBAJO DE LA PROFUNDIDAD DE LOS HOYOS. EL CORTE POCO PROFUNDO O REBAJO DEL REVESTIMIENTO DE NITRURO ELIMINA LOS HOYOS, O DEJA PROTUSIONES RELATIVAMENTE PEQUEÑAS EN SU LUGAR. LAS PROTUSIONES PUEDEN ELIMINARSE MEDIANTE UNA OPERACION BREVE DE ALISAMIENTO. TAMBIEN SON POSIBLES OTROS TIPOS DE RODAJAS DELGADAS Y PULIDAS Y MATERIALES RESISTENTES A LA CORROSION. CIRCUITOS INTEGRADOS SE FORMAN TIPICAMENTE SOBRE LAS RODAJAS DELGADAS Y PULIDAS MEDIANTE TECNICAS LITOGRAFICAS QUE, VENTAJOSAMENTE, UTILIZAN LA LISURA PERFECCIONADA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/290,653 US4874463A (en) | 1988-12-23 | 1988-12-23 | Integrated circuits from wafers having improved flatness |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2056232T3 true ES2056232T3 (es) | 1994-10-01 |
Family
ID=23116985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES89313008T Expired - Lifetime ES2056232T3 (es) | 1988-12-23 | 1989-12-13 | Metodo para fabricar una oblea plana. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4874463A (es) |
EP (1) | EP0375258B1 (es) |
JP (1) | JPH069194B2 (es) |
DE (1) | DE68916393T2 (es) |
ES (1) | ES2056232T3 (es) |
HK (1) | HK135295A (es) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6391798B1 (en) | 1987-02-27 | 2002-05-21 | Agere Systems Guardian Corp. | Process for planarization a semiconductor substrate |
EP0368584B1 (en) * | 1988-11-09 | 1997-03-19 | Sony Corporation | Method of manufacturing a semiconductor wafer |
GB2227362B (en) * | 1989-01-18 | 1992-11-04 | Gen Electric Co Plc | Electronic devices |
US5142828A (en) * | 1990-06-25 | 1992-09-01 | Microelectronics And Computer Technology Corporation | Correcting a defective metallization layer on an electronic component by polishing |
US5137597A (en) * | 1991-04-11 | 1992-08-11 | Microelectronics And Computer Technology Corporation | Fabrication of metal pillars in an electronic component using polishing |
EP0529888A1 (en) * | 1991-08-22 | 1993-03-03 | AT&T Corp. | Removal of substrate perimeter material |
EP0619495B1 (de) * | 1993-04-05 | 1997-05-21 | Siemens Aktiengesellschaft | Verfahren zur Herstellung von Tunneleffekt-Sensoren |
US5356513A (en) * | 1993-04-22 | 1994-10-18 | International Business Machines Corporation | Polishstop planarization method and structure |
US5473433A (en) * | 1993-12-07 | 1995-12-05 | At&T Corp. | Method of high yield manufacture of VLSI type integrated circuit devices by determining critical surface characteristics of mounting films |
US5733175A (en) * | 1994-04-25 | 1998-03-31 | Leach; Michael A. | Polishing a workpiece using equal velocity at all points overlapping a polisher |
US5607341A (en) | 1994-08-08 | 1997-03-04 | Leach; Michael A. | Method and structure for polishing a wafer during manufacture of integrated circuits |
US5885900A (en) * | 1995-11-07 | 1999-03-23 | Lucent Technologies Inc. | Method of global planarization in fabricating integrated circuit devices |
US5766971A (en) * | 1996-12-13 | 1998-06-16 | International Business Machines Corporation | Oxide strip that improves planarity |
US6514875B1 (en) | 1997-04-28 | 2003-02-04 | The Regents Of The University Of California | Chemical method for producing smooth surfaces on silicon wafers |
US6019806A (en) * | 1998-01-08 | 2000-02-01 | Sees; Jennifer A. | High selectivity slurry for shallow trench isolation processing |
CN1347566A (zh) * | 1999-04-16 | 2002-05-01 | 东京电子株式会社 | 半导体器件的制造方法及其制造生产线 |
US6600557B1 (en) * | 1999-05-21 | 2003-07-29 | Memc Electronic Materials, Inc. | Method for the detection of processing-induced defects in a silicon wafer |
US6416391B1 (en) | 2000-02-28 | 2002-07-09 | Seh America, Inc. | Method of demounting silicon wafers after polishing |
US6446948B1 (en) | 2000-03-27 | 2002-09-10 | International Business Machines Corporation | Vacuum chuck for reducing distortion of semiconductor and GMR head wafers during processing |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4278987A (en) * | 1977-10-17 | 1981-07-14 | Hitachi, Ltd. | Junction isolated IC with thick EPI portion having sides at least 20 degrees from (110) orientations |
US4331546A (en) * | 1979-01-31 | 1982-05-25 | Mobil Oil Corporation | Lubricant composition containing phosphite-diarylamine-carbonyl compound reaction product |
US4251300A (en) * | 1979-05-14 | 1981-02-17 | Fairchild Camera And Instrument Corporation | Method for forming shaped buried layers in semiconductor devices utilizing etching, epitaxial deposition and oxide formation |
US4588421A (en) * | 1984-10-15 | 1986-05-13 | Nalco Chemical Company | Aqueous silica compositions for polishing silicon wafers |
US4671851A (en) * | 1985-10-28 | 1987-06-09 | International Business Machines Corporation | Method for removing protuberances at the surface of a semiconductor wafer using a chem-mech polishing technique |
US4735679A (en) * | 1987-03-30 | 1988-04-05 | International Business Machines Corporation | Method of improving silicon-on-insulator uniformity |
-
1988
- 1988-12-23 US US07/290,653 patent/US4874463A/en not_active Expired - Lifetime
-
1989
- 1989-12-13 EP EP89313008A patent/EP0375258B1/en not_active Expired - Lifetime
- 1989-12-13 DE DE68916393T patent/DE68916393T2/de not_active Expired - Lifetime
- 1989-12-13 ES ES89313008T patent/ES2056232T3/es not_active Expired - Lifetime
- 1989-12-22 JP JP1331425A patent/JPH069194B2/ja not_active Expired - Lifetime
-
1995
- 1995-08-24 HK HK135295A patent/HK135295A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE68916393D1 (de) | 1994-07-28 |
EP0375258B1 (en) | 1994-06-22 |
EP0375258A2 (en) | 1990-06-27 |
DE68916393T2 (de) | 1994-12-22 |
JPH02226723A (ja) | 1990-09-10 |
US4874463A (en) | 1989-10-17 |
HK135295A (en) | 1995-09-01 |
JPH069194B2 (ja) | 1994-02-02 |
EP0375258A3 (en) | 1991-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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