ES2045622T3 - Dispositivo de sujecion y transporte para un disco. - Google Patents

Dispositivo de sujecion y transporte para un disco.

Info

Publication number
ES2045622T3
ES2045622T3 ES90107650T ES90107650T ES2045622T3 ES 2045622 T3 ES2045622 T3 ES 2045622T3 ES 90107650 T ES90107650 T ES 90107650T ES 90107650 T ES90107650 T ES 90107650T ES 2045622 T3 ES2045622 T3 ES 2045622T3
Authority
ES
Spain
Prior art keywords
cylinder
piston
support arms
wafer
vacuum system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90107650T
Other languages
English (en)
Spanish (es)
Inventor
Rudolf Wagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Balzers AG filed Critical Balzers AG
Application granted granted Critical
Publication of ES2045622T3 publication Critical patent/ES2045622T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Chain Conveyers (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Manufacturing Optical Record Carriers (AREA)
ES90107650T 1989-05-08 1990-04-23 Dispositivo de sujecion y transporte para un disco. Expired - Lifetime ES2045622T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3915038A DE3915038A1 (de) 1989-05-08 1989-05-08 Halte- und transportvorrichtung fuer eine scheibe

Publications (1)

Publication Number Publication Date
ES2045622T3 true ES2045622T3 (es) 1994-01-16

Family

ID=6380263

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90107650T Expired - Lifetime ES2045622T3 (es) 1989-05-08 1990-04-23 Dispositivo de sujecion y transporte para un disco.

Country Status (6)

Country Link
US (1) US5100285A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0396951B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH0366580A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE96577T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (2) DE3915038A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ES (1) ES2045622T3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156681A (en) * 1991-05-28 1992-10-20 Eaton Corporation Process module dispense arm
US5372612A (en) * 1993-06-28 1994-12-13 Motorola, Inc. Semiconductor material contacting member
AT640U1 (de) * 1993-10-22 1996-02-26 Sez Semiconduct Equip Zubehoer Greifer für halbleiterwafer und andere scheibenförmige gegenstände
DE4408537A1 (de) * 1994-03-14 1995-09-21 Leybold Ag Vorrichtung für den Transport von Substraten
JP2989557B2 (ja) * 1996-12-06 1999-12-13 株式会社椿本チエイン 物品把持装置
US6109677A (en) * 1998-05-28 2000-08-29 Sez North America, Inc. Apparatus for handling and transporting plate like substrates
US5945798A (en) * 1998-08-27 1999-08-31 Eastman Kodak Company System for determining part presence and grip pressure for a robotic gripping device
US6454332B1 (en) * 1998-12-04 2002-09-24 Applied Materials, Inc. Apparatus and methods for handling a substrate
DE19905882C1 (de) * 1999-02-11 2000-12-21 Krantz Tkt Gmbh Vorrichtung zum Transport von Gegenständen, insbesondere von Wafern und/oder Waferbehältern
US6190103B1 (en) * 1999-03-31 2001-02-20 Gasonics International Corporation Wafer transfer device and method
EP1325459A4 (en) * 2000-10-13 2010-09-01 Irm Llc HIGH EFFICIENCY PROCESSING SYSTEM AND METHOD OF USE
FI110506B (fi) * 2000-12-20 2003-02-14 Outokumpu Oy Laitteisto levymäisen tuotteen siirtämiseksi asemalta toiselle
US6592324B2 (en) * 2001-02-26 2003-07-15 Irm, Llc Gripper mechanism
US20030035711A1 (en) * 2001-07-14 2003-02-20 Ulysses Gilchrist Centering double side edge grip end effector with integrated mapping sensor
KR100860522B1 (ko) * 2002-03-23 2008-09-26 엘지디스플레이 주식회사 액정 패널의 이송장치
JP2003303876A (ja) * 2002-04-10 2003-10-24 Seiko Instruments Inc 試料ステージにおける半導体ウエハ保持機構
DE102007022122B4 (de) * 2007-05-11 2019-07-11 Deutsches Zentrum für Luft- und Raumfahrt e.V. Greifvorrichtung für eine Chirurgie-Roboter-Anordnung
US20090092470A1 (en) * 2007-10-03 2009-04-09 Bonora Anthony C End effector with sensing capabilities
DE102008045255A1 (de) * 2008-09-01 2010-03-04 Rena Gmbh Vorrichtung und Verfahren zum Transportieren von Substraten
KR20130137043A (ko) * 2011-04-15 2013-12-13 다즈모 가부시키가이샤 웨이퍼 교환 장치 및 웨이퍼 지지용 핸드
US8783747B2 (en) * 2011-07-08 2014-07-22 Ajou University Industry-Academic Cooperation Foundation Laminate structure generator, and stacking method and apparatus for secondary cell including the same
US10702994B1 (en) 2017-10-31 2020-07-07 Amazon Technologies, Inc. Finger assembly having a talon and spin paddle actuation
US10800045B1 (en) * 2017-10-31 2020-10-13 Amazon Technologies, Inc. Finger assembly having a spring-biased talon
US10654176B2 (en) 2017-10-31 2020-05-19 Amazon Technologies, Inc. Finger assembly having a talon and barrel cam actuation
EP4015711B1 (en) * 2020-12-09 2023-05-03 Kobelco Construction Machinery Co., Ltd. Holding apparatus and work machine including the same
CN115991381B (zh) * 2023-03-24 2023-06-09 湖南健坤精密科技有限公司 一种镜头模组组装机

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2789716A (en) * 1954-10-15 1957-04-23 Lloyd J Wolf Mobile pipe handling mechanism
SE300288B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1966-12-20 1968-04-22 Hydrauliska Ind Ab
DE1804005A1 (de) * 1968-10-19 1969-11-06 Demag Zug Gmbh Greifer mit Druckmittelleitungen
US3754667A (en) * 1972-01-07 1973-08-28 R Storch Transfer mechanism
JPS5537348U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1978-09-02 1980-03-10
JPS594272B2 (ja) * 1979-06-30 1984-01-28 ファナック株式会社 ワ−ク把持装置
US4252358A (en) * 1979-08-08 1981-02-24 Klebs James P Horizontal grapple
JPS5978538A (ja) * 1982-10-27 1984-05-07 Toshiba Corp ダイボンダ装置
GB2137160A (en) * 1983-03-18 1984-10-03 Nat Res Dev Concentric Gripper
EP0228973B1 (fr) * 1986-01-06 1991-04-17 CENTRE STEPHANOIS DE RECHERCHES MECANIQUES HYDROMECANIQUE ET FROTTEMENT Société anonyme Procédé et moyens de préhension et de transport des plaquettes de silicium
DD248694A3 (de) * 1985-03-08 1987-08-19 Schwermasch Kirow Veb K Greifvorrichtung, insbesondere fuer werkstuecke
DD235219B1 (de) * 1985-03-19 1989-06-21 Werkzeugmaschinenbau Fz Greifwerkzeug fuer einen montageroboter
JPS6274544A (ja) * 1985-09-24 1987-04-06 Rohm Co Ltd チヤツク及び移動装置
DE3874248D1 (de) * 1987-07-10 1992-10-08 Gregory C Hirschmann Lineareinheit fuer eine montage-einrichtung der handhabungstechnik.
ES2163388T3 (es) * 1988-05-24 2002-02-01 Unaxis Balzers Ag Instalacion de vacio.
US4865375A (en) * 1988-05-31 1989-09-12 Amp Incorporated Gripper head

Also Published As

Publication number Publication date
DE59003193D1 (de) 1993-12-02
DE3915038A1 (de) 1990-11-22
JPH0366580A (ja) 1991-03-22
DE3915038C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-09-19
EP0396951B1 (de) 1993-10-27
EP0396951A1 (de) 1990-11-14
ATE96577T1 (de) 1993-11-15
US5100285A (en) 1992-03-31

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