ES2044461T3 - Procedimiento de elaboracion de elementos de conexion electrica, en particular de substratos de interconexion de circuitos hibridos. - Google Patents

Procedimiento de elaboracion de elementos de conexion electrica, en particular de substratos de interconexion de circuitos hibridos.

Info

Publication number
ES2044461T3
ES2044461T3 ES90400445T ES90400445T ES2044461T3 ES 2044461 T3 ES2044461 T3 ES 2044461T3 ES 90400445 T ES90400445 T ES 90400445T ES 90400445 T ES90400445 T ES 90400445T ES 2044461 T3 ES2044461 T3 ES 2044461T3
Authority
ES
Spain
Prior art keywords
ppm
temperature
substrates
atmosphere
hybrid circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90400445T
Other languages
English (en)
Inventor
Frederic Teisan K K Rotman
Dominique Navarro
Sylvie Mellul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Original Assignee
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide SA, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude filed Critical Air Liquide SA
Application granted granted Critical
Publication of ES2044461T3 publication Critical patent/ES2044461T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/4505—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application
    • C04B41/4519—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application application under an other specific atmosphere
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Combinations Of Printed Boards (AREA)
  • Communication Control (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

EL INVENTO SE REFIERE A UN PROCEDIMIENTO DE ELABORACION DE SUBSTRATOS DE INTERCONEXION DE CIRCUITOS HIBRIDOS, DEL TIPO EN EL QUE SE EFECTUA LA DEPOSICION EN UN SOPORTE DE UNA CAPA ESPESA DE TINTA O PASTA A BASE DE METAL NO NOBLE, COMO COBRE U OTRO MATERIAL DE FORMULACION "COMPATIBLE COBRE", APLICANDO SUCESIVAMENTE UN SECADO PRELIMINAR DE ELIMINACION DE LOS DISOLVENTES A UNA TEMPERATURA DEL ORDEN DE 100 (GRADOS) C A 150 (GRADOS) C, UNA COCCION QUE CONSISTE EN: A) UNA SUBIDA DE TEMPERATURA INCORPORANDO UNA FASE DE ELIMINACION DE RESINAS POLIMERICAS, B) UN SOPORTE DE SINTERIZACION A UNA TEMPERATURA DEL ORDEN DE 600 (GRADOS) C A 100 (GRADOS) C, Y C) UN ENFRIAMIENTO TEMPORIZADO, EFECTUANDOSE DICHA COCCION EN ATMOSFERA DE GAS INERTE (AZOTE Y/O ARGON Y/O HELIO), PRESENTANDO LA ATMOSFERA DE LA FASE DE ELIMINACION DE LOS POLIMEROS UN CONTENIDO EN VAPOR DE AGUA INFERIOR A 15000 PPM, PREFERENTEMENTE COMPRENDIDO ENTRE 1000 Y 10000 PPM, MIENTRAS QUE LA ATMOSFERA DE SINTERIZACION A ALTA TEMPERATURA PRESENTA UN CONTENIDO EN VAPOR DE AGUA EN CUALQUIER CASO INFERIOR A 1000 PPM.
ES90400445T 1989-02-20 1990-02-19 Procedimiento de elaboracion de elementos de conexion electrica, en particular de substratos de interconexion de circuitos hibridos. Expired - Lifetime ES2044461T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8902172A FR2643535B1 (fr) 1989-02-20 1989-02-20 Procede d'elaboration de moyens de connexion electrique, en particulier de substrats d'interconnexion de circuits hybrides

Publications (1)

Publication Number Publication Date
ES2044461T3 true ES2044461T3 (es) 1994-01-01

Family

ID=9378937

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90400445T Expired - Lifetime ES2044461T3 (es) 1989-02-20 1990-02-19 Procedimiento de elaboracion de elementos de conexion electrica, en particular de substratos de interconexion de circuitos hibridos.

Country Status (8)

Country Link
EP (1) EP0385829B1 (es)
JP (1) JPH07112105B2 (es)
KR (1) KR0168843B1 (es)
AT (1) ATE94329T1 (es)
CA (1) CA2010368A1 (es)
DE (1) DE69003130T2 (es)
ES (1) ES2044461T3 (es)
FR (1) FR2643535B1 (es)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法
JPS62108787A (ja) * 1985-11-06 1987-05-20 株式会社日立製作所 銅導体セラミツク配線基板の製法
JPS63233090A (ja) * 1987-03-23 1988-09-28 日本電産コパル株式会社 銅回路低温焼成基板の製造方法

Also Published As

Publication number Publication date
EP0385829B1 (fr) 1993-09-08
DE69003130T2 (de) 1994-01-05
KR900013682A (ko) 1990-09-06
ATE94329T1 (de) 1993-09-15
FR2643535B1 (fr) 1991-04-26
DE69003130D1 (de) 1993-10-14
JPH07112105B2 (ja) 1995-11-29
FR2643535A1 (fr) 1990-08-24
KR0168843B1 (ko) 1999-01-15
JPH02248098A (ja) 1990-10-03
CA2010368A1 (fr) 1990-08-20
EP0385829A1 (fr) 1990-09-05

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