ES2040439T3 - Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto. - Google Patents

Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto.

Info

Publication number
ES2040439T3
ES2040439T3 ES198989121279T ES89121279T ES2040439T3 ES 2040439 T3 ES2040439 T3 ES 2040439T3 ES 198989121279 T ES198989121279 T ES 198989121279T ES 89121279 T ES89121279 T ES 89121279T ES 2040439 T3 ES2040439 T3 ES 2040439T3
Authority
ES
Spain
Prior art keywords
printed circuits
procedure
manufacture
contact surfaces
circuits provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198989121279T
Other languages
English (en)
Spanish (es)
Inventor
Klaus Dr. Ritz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schoeller and Co Elektronik GmbH
Evonik Operations GmbH
Original Assignee
Schoeller and Co Elektronik GmbH
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller and Co Elektronik GmbH, Degussa GmbH filed Critical Schoeller and Co Elektronik GmbH
Application granted granted Critical
Publication of ES2040439T3 publication Critical patent/ES2040439T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
ES198989121279T 1988-12-23 1989-11-17 Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto. Expired - Lifetime ES2040439T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3843528A DE3843528C1 (cg-RX-API-DMAC7.html) 1988-12-23 1988-12-23

Publications (1)

Publication Number Publication Date
ES2040439T3 true ES2040439T3 (es) 1993-10-16

Family

ID=6370040

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198989121279T Expired - Lifetime ES2040439T3 (es) 1988-12-23 1989-11-17 Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto.

Country Status (5)

Country Link
EP (1) EP0374483B1 (cg-RX-API-DMAC7.html)
AT (1) ATE89976T1 (cg-RX-API-DMAC7.html)
AU (1) AU614455B2 (cg-RX-API-DMAC7.html)
DE (2) DE3843528C1 (cg-RX-API-DMAC7.html)
ES (1) ES2040439T3 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9407103U1 (de) * 1994-04-28 1994-09-08 Andus Electronic GmbH Leiterplattentechnik, 10997 Berlin Verbindungsanordnung für Multilayer-Schaltungen
DE4418679A1 (de) * 1994-05-28 1995-11-30 Telefunken Microelectron Vorrichtung zur Kontaktierung zweier Schaltungsteile

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1182319B (de) * 1954-07-12 1964-11-26 Beck S Inc Verfahren zur Herstellung eines Leitungsmusters auf einer Kunststofftraegerplatte
AU417989B2 (en) * 1968-07-12 1971-10-12 William Edwards George Improvements relating to the manufacture of circuit boards
US4125310A (en) * 1975-12-01 1978-11-14 Hughes Aircraft Co Electrical connector assembly utilizing wafers for connecting electrical cables
DE3235212A1 (de) * 1982-09-23 1984-03-29 Schoeller & Co Elektronik Gmbh, 3552 Wetter Kontaktierungselement fuer gedruckte schaltungen
DE3610036A1 (de) * 1986-03-21 1987-09-24 Schering Ag Kontaktieren von mikroelektronischen schaltungen
NL8601567A (nl) * 1986-06-17 1988-01-18 Du Pont Nederland Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat.

Also Published As

Publication number Publication date
DE58904499D1 (de) 1993-07-01
AU614455B2 (en) 1991-08-29
EP0374483B1 (de) 1993-05-26
EP0374483A3 (de) 1991-01-02
ATE89976T1 (de) 1993-06-15
DE3843528C1 (cg-RX-API-DMAC7.html) 1990-05-23
EP0374483A2 (de) 1990-06-27
AU4700889A (en) 1990-06-28

Similar Documents

Publication Publication Date Title
DE3484570D1 (de) Zusammengesetzte leiterplatte mit metallmusterlagen und verfahren zur herstellung.
SG43840A1 (en) Photocurable resin laminate and method for producing printed circuit board by use thereof
EP0347456A4 (en) Ink roller for printing press and production thereof
ATE110640T1 (de) Kombiniertes druckverfahren und verfahren zur erzeugung von hologrammen.
ATE135848T1 (de) Verfahren zum herstellen einer halbleiteranordnung mit einer ausrichtungsmarke
EP0351413A4 (en) DEVICE AND METHOD FOR PRODUCING THREE-DIMENSIONAL OBJECTS BY PHOTO FASTENING.
EP0116415A3 (en) Improvements in or relating to the production of lines of separation in a sheet or other member
CA1258653A (en) PYRIDINIUM YLIDE POLYMERS AND PRODUCTS DERIVED THEREOF
DE59305371D1 (de) Schutzüberzug für elektronische Baugruppen, sowie Verfahren zu dessen Herstellung
ES2040439T3 (es) Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto.
FI893706A0 (fi) Muovattava kuitulevy, menetelmä puristamalla muovatun levyn valmistamiseksi sekä laite viiltojen leikkaamiseksi levyn pintaan
FR2343571A1 (fr) Procede et dispositif de decoupage et de mise en forme d'une feuille ou plaque d'une pate, notamment a base d'argiles pour la fabrication de pieces ceramiques
EP0350876A3 (en) Process for the production of dielectric layers in planar circuits on ceramic substrates
ATE37322T1 (de) Verfahren zur herstellung von praegungen/verformungen auf warenbahnen zwischen einer praegewalze und einer gegengeformtenwalze sowie vorrichtung zur durchfuehrung dieses verfahrens.
EP0404521A3 (en) Optical recording medium and method for manufacturing the same
ATE127313T1 (de) Verfahren und vorrichtung zur herstellung von gedruckten leiterplatten.
MX9204565A (es) Metodo y dispositivo para barnizar mediante procedimiento offset.
WO1990012482A3 (en) Printed circuit boards
DE3062012D1 (en) Method of manufacturing tiles
DE59600276D1 (de) Halbtonschablone sowie Verfahren und Vorrichtung zu ihrer Herstellung
JPS5394771A (en) Forming method for thin film pattern
JPS5462A (en) Production of resin sheet
EP0711102A4 (en) METHOD FOR PRODUCING A CONDUCTIVE CIRCUIT ON THE SURFACE OF A MOLDED BODY AND COMPONENT WITH A CONDUCTIVE CIRCUIT
SE8505725D0 (sv) Invarfolie
IT8783650A0 (it) Procedimento e mezzi di produzione di cilindri, metallici, inchiostratori, particolarmente per la stampa flessografica, retinati di precisione, con strato superficiale, inciso, fortemente indurito, atti a semplificarne l'allestimento e migliorarne le caratteristiche di funzione e durata e cilindri ottenuti con tali procedimenti e mezzi

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 374483

Country of ref document: ES