AU4700889A - A process for the production of printed circuits provided with contact surfaces - Google Patents

A process for the production of printed circuits provided with contact surfaces

Info

Publication number
AU4700889A
AU4700889A AU47008/89A AU4700889A AU4700889A AU 4700889 A AU4700889 A AU 4700889A AU 47008/89 A AU47008/89 A AU 47008/89A AU 4700889 A AU4700889 A AU 4700889A AU 4700889 A AU4700889 A AU 4700889A
Authority
AU
Australia
Prior art keywords
printed circuits
production
circuits provided
contact surfaces
copper films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU47008/89A
Other versions
AU614455B2 (en
Inventor
Klaus Ritz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schoeller and Co Elektronik GmbH
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH filed Critical Degussa GmbH
Publication of AU4700889A publication Critical patent/AU4700889A/en
Application granted granted Critical
Publication of AU614455B2 publication Critical patent/AU614455B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

For producing printed circuits provided with contact areas, copper films are pressed against a template provided with raised areas in a predetermined pattern, and the interior of the impressed imprints produced in the copper films is filled with a setting material. After the pre-pressing with prepregs, printed circuits are produced from these pre-laminates. The copper films must have here a breaking tension > 10% and a thickness of 10 to 100 mu m.
AU47008/89A 1988-12-23 1989-12-19 A process for the production of printed circuits provided with contact surfaces Ceased AU614455B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3843528A DE3843528C1 (en) 1988-12-23 1988-12-23
DE3843528 1988-12-23

Publications (2)

Publication Number Publication Date
AU4700889A true AU4700889A (en) 1990-06-28
AU614455B2 AU614455B2 (en) 1991-08-29

Family

ID=6370040

Family Applications (1)

Application Number Title Priority Date Filing Date
AU47008/89A Ceased AU614455B2 (en) 1988-12-23 1989-12-19 A process for the production of printed circuits provided with contact surfaces

Country Status (5)

Country Link
EP (1) EP0374483B1 (en)
AT (1) ATE89976T1 (en)
AU (1) AU614455B2 (en)
DE (2) DE3843528C1 (en)
ES (1) ES2040439T3 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9407103U1 (en) * 1994-04-28 1994-09-08 Andus Electronic GmbH Leiterplattentechnik, 10997 Berlin Connection arrangement for multilayer circuits
DE4418679A1 (en) * 1994-05-28 1995-11-30 Telefunken Microelectron Integrated circuit interconnect system for wafer test

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1182319B (en) * 1954-07-12 1964-11-26 Beck S Inc Process for the production of a line pattern on a plastic carrier plate
AU417989B2 (en) * 1968-07-12 1971-10-12 William Edwards George Improvements relating to the manufacture of circuit boards
US4125310A (en) * 1975-12-01 1978-11-14 Hughes Aircraft Co Electrical connector assembly utilizing wafers for connecting electrical cables
DE3235212A1 (en) * 1982-09-23 1984-03-29 Schoeller & Co Elektronik Gmbh, 3552 Wetter CONTACT ELEMENT FOR PRINTED CIRCUITS
DE3610036A1 (en) * 1986-03-21 1987-09-24 Schering Ag CONTACTING MICROELECTRONIC CIRCUITS
NL8601567A (en) * 1986-06-17 1988-01-18 Du Pont Nederland METHOD FOR APPLYING REFERRED CONTACT SURFACES TO A SUBSTRATE AND SO SUBSTRATE WITH CONTACT PLATES.

Also Published As

Publication number Publication date
ATE89976T1 (en) 1993-06-15
AU614455B2 (en) 1991-08-29
EP0374483A2 (en) 1990-06-27
EP0374483A3 (en) 1991-01-02
EP0374483B1 (en) 1993-05-26
DE58904499D1 (en) 1993-07-01
DE3843528C1 (en) 1990-05-23
ES2040439T3 (en) 1993-10-16

Similar Documents

Publication Publication Date Title
EP0338378A3 (en) Combined process of printing and forming a hologram
SG43840A1 (en) Photocurable resin laminate and method for producing printed circuit board by use thereof
AU632396B2 (en) Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
MY100774A (en) Process for producing metal-laminated base material for printed circuit boards.
EP0122619A3 (en) Composite product having patterned metal layer and process
DE3561771D1 (en) Dry resist film and process for producing resist patterns
EP0546402A3 (en) Method and apparatus for continuous production of surface refined boards and chip board so obtained
ES8501647A1 (en) Method and apparatus for the production of a polychromously patterned plastics web in particular.
GB2168923B (en) A process and apparatus for producing a plastics laminate material
AU614455B2 (en) A process for the production of printed circuits provided with contact surfaces
EP0347824A3 (en) A thick film forming process
GB8901243D0 (en) Method of producing a plastics platen for typewriters or other imprinting machines
EP0324238A3 (en) Hot foil printing
AU636668B2 (en) Process for preparing a sheet of polymer-based foam
CA2243114A1 (en) Method of producing lens sheet and projection screen
DE69414331T2 (en) METHOD FOR PRODUCING A CARD CONTAINING AT LEAST ONE ELECTRONIC BLOCK
DK0528774T3 (en) Process and apparatus for offset coating
JPS6484694A (en) Manufacture of insulating substrate provided with conductive layer
JPS5462A (en) Production of resin sheet
Reid Punch Pressing Speed Control and Density Stabilization in the Compaction of Multi-Level PM Parts
JPS54125266A (en) Production laminated sheets
EP0327157A3 (en) Contact material and process of manufacturing it
TW226349B (en) Method of transfer-printing colorful painting on solid polyall resin article
IL74564A (en) Process for producing copper-laminated base material for printed circuit boards
JPS545899A (en) Process for producing calcium carbide