DE1182319B - Process for the production of a line pattern on a plastic carrier plate - Google Patents

Description

FEDERAL REPUBLIC OF GERMANY

GERMAN

PATENT OFFICE

EDITORIAL

Boarding school Kl .: HOIb

German class: 21c-2/34

Number: 1182319

File number: B 31802 VIII d / 21 c

Filing date: July 12, 1954

Opening day: November 26, 1964

The invention relates to a method for producing a line pattern on a plastic carrier plate.

It is known from a metal foil located on the surface of an insulating base plate Etch out line patterns.

It is also known to produce a line pattern first of all corresponding to the line pattern to press flat hollows into an insulating base plate. After that, the base plate is over their entire surface sprayed with metal and finally the sprayed metal from the flat parts the surface of the base plate is removed again, so that it only remains in the indentations that were originally were pressed into the base plate.

It is also known, initially by means of a sandblasting process Generate recesses or notches in an insulating base plate and then to be sprayed with metal.

It is also known to initially use insulating material base plates made of Bakelite or similar insulating materials to cover a metal foil and then cut out this metal foil in accordance with a desired line pattern with a die and at the same time to press the edges of the cut-out pieces of film down into the grand plate. the Edges then protrude down into the insulating base plate. Incidentally, the line pieces of the line pattern are plastic Glue stuck to the base plate.

It is also known to apply finely divided, electrically conductive material to insulating base plates layers and then according to a line pattern with a pressure plate on the base plate to be pressed open so that the finely divided conductive material is compact there. Those conductive particles which are not touched by the pressure plate remain unaffected and can be blown away will.

It is also known to melt several connections in an insulating base plate. A wiring takes place between the connections.

It is also known, by means of a Porägewerkzeuges, which carries the line pattern in a raised form, a metal foil on an insulating base plate to press and cut there according to the desired line pattern. Through the pressing process the cut-out foil parts are attached to the base plate at the same time.

It is also known to electrolytically etch gravure cylinders and plates.

It is also known to use a line pattern in a method for producing a line pattern on a plastic carrier plate

Applicant:

Beck's Inc., St. Paul, Minn. (V. St. A.)
Representative:

Dipl.-Ing. F. Weickmann

and Dr.-Ing. A. Weickmann, patent attorneys,
Munich 27, Möhlstr. 22nd

Named as inventor:
John T. Beck, White Bear, St. Paul, Minn.
(V. St. A.)

To press plastic plate with a heated molding. The molded body has a on the pressing side . Relief that presses the metal into the plastic plate according to the desired pattern.

It is also known to have a line pattern produced by etching with a protective lacquer layer to cover.

In contrast, the method according to the invention is characterized in that a metal foil by means of a thermosetting, not yet hardened adhesive layer on a thermosetting, still not hardened base plate is glued, that then the metal foil up to the remaining line pattern and, if necessary, remaining islands are etched away and then the resulting Composite body at a temperature which causes the adhesive and the large plate material to cure is compressed.

The invention achieves practically insoluble adhesion of the line pattern to the base plate and at the same time an at least partial embedding of the line pattern in the grand disk.

One embodiment (hereinafter referred to as embodiment A) of the process according to the invention consists in the fact that the line pattern is pressed so deeply into the not yet hardened grand plate is that its free surface comes into alignment with the surface of the grand plate.

Another embodiment (hereinafter referred to as embodiment B) of the invention The method consists in that, in a first etching step, the metal foil is removed except for islands that remain is weakened that then the weakened metal foil up to the remaining line pattern

409 729/356

is etched away and that then the line pattern is covered with a layer of insulating material up to the level of the islands will.

Another embodiment (hereinafter referred to as embodiment C) of the invention Method consists in that the base plate is provided with holes, that then on the base plate the metal foil is placed on the metal foil with a flexible pressure pad.

Embodiment C

F i g. Fig. 20 is a plan view showing a wiring pattern of Embodiment C;

F i g. 21 to 28 show, on an enlarged scale, the successive process steps for producing a line pattern according to FIG. 20, namely that piece which is defined by the corner lines C4 to C 6 and C 6 to C 8 in FIG. 20 is included. The F i g. 21

Gen an abutment plate pressed into the holes io to 28 show with the exception of FIG. 24 cuts, that then the metal foil is etched away up to the standing- through the line pattern during successive line pattern and that gender production stages, namely that of the line pattern with an insulating material layer part that is covered in the direction of arrows Cl and C 9 . in Fig. 20 can be seen. Fig. 28 shows the finished line

Further details of the invention result from 15 patterns. Fig. 24 shows the wiring pattern from below from the description of exemplary embodiments in the direction of arrows 24-24 in FIG. 26. FIG. 26 with reference to the drawings. FIG. 26 shows a section along line 26-26 through FIG

Line pattern according to FIG. 24.

Embodiment A

In the production of a wiring pattern of Embodiment A, it is assumed that an i Carrier plate 10 made of an electrically insulating, flowing under pressure to a certain extent

Embodiment A

F i g. Fig. 1 is a plan view showing an example of a line pattern of Embodiment A;

Fig. 2 shows in section along line 2-4 in F i g. 1 the line pattern during the first stage of its manufacture;

F i g. 3 shows corresponding to FIG. 2 the line 35 and with the action of heat hardening work pattern during the next stage of manufacture; material. This material can be a hard or soft, Fig. 4 shows corresponding to Fi g. 2 the finished line-insulating, synthetic resin or some other suitable sample; neter plastic material that can be rolled

F i g. 5 shows in section along the line 5-5 in or kneading with additives the same or different. 1 another part of the finished line 30 of different character is suitable. He can with one pattern; Filler such as fabric, mica, glass fabric

F i g. 6 shows in section along the line 6-6 in od. The like. Be offset. Examples of suitable

Resins are: phenol-formaldehyde, phenol-furfural, furan, urea-formaldehyde, melamine, vinyl, 35 Polystyrene, polyethylene, methyl methacrylate and nylon resins. Suitable fillers are, for example Glass fibers, mica, earth, wood flour and the like can also be made of reinforcing inserts, for example Fabric or fiber material may be provided. Particularly suitable is a woven glass fiber and with material impregnated with thermosetting resin. Where climatic conditions require resins, which are very resistant to moisture, sponge, etc., will resist these influences 45 resistant resin is used. Correspondingly one uses oneself when resilience against extremely high temperatures is demanded, fiberglass panels, which are made with heat-resistant thermoplastic Resins such as silicone-polyethylene-copoly-fi g. 10 after applying a protective coating before 50 mers, phenol-formaldehyde and the like impregnated or after etching; are. Most synthetic resins are sufficiently resistant

F i g. Figure 13 shows a top view of the line withstand temperatures of molten pattern according to FIG. 10 after applying a solder, so that they are additional in the short period of time of the ore Protective cover; heating during the soldering process does not have a detrimental effect F i g. 14 and 15 show in section along the 55, may damage even after prolonged heating Lines 14 and 15 the line pattern according to FIG. 10 enter.

A plate 10 made of such a material is initially hardened in an uncured or only partially hardened state State used so that it has the ability during a later stage of the procedure still to flow. The line pattern is formed on or in the plate 10.

In Fig. 1, the line pattern is shown by heavy black lines; to the line

F i g. 19 shows a wiring pattern according to FIG. 18 65 patterns include junctions U, mechanical connection with a resistor, 12, 13, 14, 15, cable runs 16, 17, 18, an Aneinem Capacitor or some other component of contact points 19 arranged in a circle ment. for a switch, gaps 20 made by resistors

Fig. 1 shows the connection of a resistor, a Capacitor or other component with the line pattern.

Embodiment B

F i g. Fig. 7 is a plan view showing an example of a line pattern of Embodiment B; some parts of the line pattern are shown broken;

FIG. 8 shows the individual layers of the line pattern according to FIG. 7 during the first stage of his Manufacture;

FIG. 9 shows in section along the line 9-9 in FIG. 8 shows the layer structure of the line pattern;

Fig. 10 shows a part of the line pattern according to F i g. 7 during the second stage of its manufacture;

F i g. 11 and 12 respectively show the line pattern in section along lines 11-11 and 12-12

before a second etching process or after a second etching process;

Fig. 16 shows a further stage in the manufacture of the wiring pattern of Fig. 15;

FIG. 17 shows a plan view of the line pattern according to FIG. 13 after completion;

F i g. 18 shows in section along the line 18-18 in FIG. 17 the completed wiring pattern;

Inductors, capacitors or other units are to be bridged and at a mutual distance mutually standing connection points 21, to the electron tubes or other components Soldered or connected in some other way.

The F i g. 2 to 5 show the production of an isolated Connection point in a line pattern according to FIG. 1 during the various stages of its manufacture until its completion.

The line pattern is first indicated in its external dimensions by lines 24, 25, 26 and 27 set on the base plate 10. The base plate can be any shape it needs not to be rectangular, but can also be circular, elongated, or of irregular shape be.

The base plate 10 is cut to the appropriate size for the desired line pattern; but you can also use a large number of line patterns at the same time Create a plate and then cut this plate. An adhesive layer is applied to the base plate 30, which, if desired, can consist of the same resin as the base plate 10. The adhesive can be partially cured by the application of moderate heat and pressure to achieve its bond to the base plate; a final hardening at maximum Degree of hardness takes place in a later stage of the process. Excellent adhesives are polymerizable Resins such as vinyl, phenol, resorcinol, furan, urea, melamine, polystyrene, silicone and polyacrylic ester resins. However, other curable resins can also be used for this purpose Find.

A plate 31 made of conductive material, for example made of copper, aluminum, brass, silver, an alloy or other conductive material placed. In most cases copper, preferably electrolytic copper, is the appropriate one Material for the cable runs and connection points of the cable pattern; but in special cases Metals with greater resistance may also be useful. Precious metals such as silver, gold, platinum come also considered, since they are used in relatively thin layers and therefore not are costly. In some cases, high resistivity metal can be used. This is where the metal should be particularly decorative, such as in the manufacture of dials and the like Appearance of the metal is of great importance.

It should be emphasized that the metal from which the layer 31 is made, with the exception of those, is proportionate small amount that forms the conductive pattern.

The base plate 10 and the metal plate 31 are expediently first lightly sanded so that they get smooth, clean surfaces to which the adhesive layer 30 adheres well. The metal plate 31 is then firmly pressed onto the adhesive layer 30 located on the base plate 10. The whole is then or expediently heated somewhat and exposed to moderate pressure, so that the adhesive layer 30 gets hard at times. A complete hardening of the adhesive layer 30 and the base plate 10 is not done yet because it is desirable at a later stage in the process that the base plate 10 and the adhesive layer 30 still flow somewhat. The one during the process stage just described The adhesive force generated is sufficient to hold the plates 31 and 10 together for the duration of the process to stick together.

A drawing of a drawing to be produced on the base plate 10 is then made on the surface 32 of the plate 31 Line pattern laid. The in Fig. 1 by thick black lines and black dots

ίο shown line pattern is first in the form a cover pattern 34 made of an etch-resistant material, such as lacquer or paint, on the surface applied to the base plate 31, preferably by means of a template 'or by printing. the Template can consist of thin, paramagnetic material, which is held by magnets on the conductor side the plate 10 is held. Incidentally, this can also be used as the material for the cover pattern 34 the same adhesive resin as used for the adhesive layer 30 can be used.

In some cases, especially if very small line patterns, for example the size of postage stamps, are to be produced, the entire metal plate 31 is first coated with a light-sensitive layer and this is then exposed through a negative, so that the light-sensitive layer is only applied to the dark areas 1 hits light. The exposed areas of the layer are then hardened and made insoluble by development; the other unexposed areas are washed out during development. The hardened layer areas protect the metal underneath them during the subsequent etching process. '.

The lacquer or paint from which the cover pattern 34 is made is resistant to etching chemicals or electrolytic etching baths, which are used to remove the surface parts of the plate 31 that are not covered with the cover pattern 34. After the masking pattern 34 has been applied, it is allowed to dry or it is baked, depending on the nature of the paint or varnish used.
The structure constructed according to FIG. 2, consisting of the base plate 10, the adhesive layer 30, the metal plate 31 and the covering pattern 34, is then immersed in an etching bath. If the plate 31 is made of copper, a solution of ferric chloride and copper sulfate or a solution of acids and chlorides suitable for removing the copper serves as the etching bath. The structure of the F i g. 2 remains in the etching liquid until the metal not covered by the cover pattern 34 has been removed, that is to say the one in FIG. 3 is reached. The remaining areas 15 of the metal layer 31 form the line pattern and should have slightly outwardly inclined, inclined, lateral boundary surfaces 35 and 36. These boundary surfaces serve to anchor the line pattern in the final structure. When etching, they are obtained by appropriately controlling the time sequence of the etching process, by controlling the strength or concentration of the etching liquid, the etching current or the etching voltage, if applicable, by using protective agents that are applied from time to time during the etching process, or by other measures known in photographic. The cover pattern 34, which the surface 32 of the metal

Plate 31 covers and protects against the action of the etching liquid, remains on the emerging raised line pattern 15.

Now, according to embodiment A of the invention, the process shown in FIG. 3 is placed between two heated plates, which are then pressed together with such a force that the line pattern 15 penetrates into the base plate 10 until its surface is flat with the surface of the base plate

Art can drill holes for all connection points, as shown in FIG. 1 represented by dots are provided will. Connection wires from outside electrical components, 5 about resistors, capacitors, vacuum tubes, etc. are inserted, such. B. the connecting wires 51 and 52 in FIG. 6, preferably from the rear of the base plate 10. The whole is then with the exposed connection points

10 lies. The pressure required for this process is immersed in liquid solder pointing downwards and can be relatively weak because the egg has been removed from the solder again. The solder of the line pattern is relatively narrow
are and because the base plate 10 when heated

becomes soft. At the same time the glue is applied

then hardens and all connections are soldered in one operation. The connecting wires of external electrical components, such as resistors, layer 30 softens and flows around the elements of the capacitors, tubes and the like ; 30 b indicated. The application of heat and
Pressure on the opposing plates
continues until the base plate 10, the line pattern 15 and the adhesive layer 30, 30 a, 20
30 b to a flat structure with a surface
37 have become, in which the conduction pattern
is embedded (Fig. 4), and the resin base plate 10 and the resin adhesive layer 30 are fully cured. The boundary surfaces 35 and 25 curved and in bores 55 and 56 of the line and 36 of the line pattern are inserted according to the pattern. The wires stand rough a bit controlling the etching process. This roughness is
desirable because they have a particularly strong bond

thus, the mechanical holder, in addition to the electrical contact, is quickly integrated into a single one To complete dip soldering. F i g. 6 shows the way a capacitor, a resistor or a other component mechanically and electrically connected to the line pattern according to the invention will. The component 50 shown in Fig. 6 has two lead wires 51 and 52 which are parallel

formation of the line pattern with the synthetic resin results.

over the connection points 20 a and 20 b before. The component 50 and all other, in the same way in bores of connection points of the line pattern After the hardening of the synthetic resin, the structure 30 used components are removed with the surface from the heated printing plates and immersed in a 10 a down in liquid solder and then oven dried, keeping it flat. The surface 37 is then treated with sand

delt so that it becomes shiny.

taken out of the solder again. The solder remains only at the connection points 20 α and 20 b and on the parts of the wires adjacent to these points

The in Fig. 5 reproduced element 22 of 35 56 and 55 adhere and connect these parts mecha-line pattern has a bore 38 for insertion and electrical connection with one another. A complete

In this way, the conductor pattern can be made into contact with electrical components by simply immersion soldering.

tion of a line from the underside of the base plate 10 on.

Similarly, two elements of this

and mechanically connected. The plumb bob

If desired, the line pattern can be covered with a paint protective layer or insulation will. The line pattern is then completely enveloped and protected against the effects of the weather,

Kind of opposite each other on the two 4 ° that only for a short time with the base plate 10 in touch-sides the base plate 10 to connect two comes on tion, worsens the plastic the base plate applied to both sides of the base plate 10 and does not loosen the lei line pattern by means of a pattern through the bore 38. The solder bridges the connection points Led and soldered rivets or the like. Not provided over the surface of the insulating material layer, there be. 45 Excess solder when removing from the

Dip solder bath drips thanks to the surface tension of the molten solder. Dozens or even hundreds of connection connections can be soldered with the dip soldering process in a single working humidity or other destructive influences. As can be seen from FIGS. 4 and 5, the surface of the conductor pattern element 15 can be immersed in and removed from the solder bath, and it should be noted that each element is individual ab-22 external connections can be soldered directly.
Resistors 40 can be made by sputtering 55 can. Resistance material between spaces 20
be created. After the various electrical components have been attached and external connections have been made, the whole thing is preferably dipped in insulating varnish or it is provided with a plate 110 that forms the base plate 10 of the protective layer made of insulating material. form A corresponds in terms of structure and material. If the line pattern is to have holes, then there is a second one above the base plate 110. For this purpose, the plates 31 and 10 after their insulating plate 111 made of synthetic resin. The line pattern is located between this union and prior to the application of layer 34 and both plates. Pierce it before etching. Of course, 65 has connecting lines 112 to 116, 118 to 121, the through-hole can only be made when and 124 to 131, some of which in connection with the line pattern is already finished (FIG. 4); special points 132 to 147 end. To the left of line 151-151, however, the first-mentioned route is more moderate. The surface of the overhead plate 111 is towards this

soldered and removed for repair or replacement

Embodiment B
Fig. 7 shows a line system on a basic

9 10

see; the round connection points are shown with rounded points 141 B, 1365 and 1475, which are drawn lines, the connecting lines, finally, exposed contact points 141, 136, 147 themselves lie under the plate 111 and are therefore produced.

dashed lines. On the right of line 151-151, after the applied paint has dried

the connection lines and the connection points 5 or color covers is the structure of FIG. 10 Drawn fully drawn because there the cover and 11 exposed to a first etching. Suitable Plate 111 has broken away. At all connection etching processes are in the explanation of the execution points or on some of them, expression form A can be described.

lying resistors, capacitors, switches, Va- The first etching stage is continued until a

Kuumröhrensockel and the like be connected. io essential teal of metal 160 is etched away,

In the surface area, which by the lines approximately to a depth as it is outlined in cross section in 151-151 and 152-152, there are figs. 12 is shown. There the metal plate 160, the termination points 141, 136 and 147, a connection originally had a thickness H , except for the thickness L line 127 and part of the line 125. This has been etched away. The delimiting edges of the standing surface area are shown again in the following figures in remaining metal elevations 161, shown on a larger scale; as in embodiment A, it does not refer to it vertically, but to the following description. obliquely or curved outwards (see the limiting

In Fig. 8 you can see the base plate 110. On tongue edges 141D of the surface 141). Although it is applied a layer of adhesive 158, even if they themselves do not adhere D 141 outwardly extending bevels of metal. The layer 158 is desired, but in this case there is also good reform A from the same material as in the embodiment with curved undercut bevels, that is to say from a material that partially results. The etch is continued until the metal is allowed to harden and its final hardening in plate 160 is about 50 to 90%, preferably at a later stage in the process, about 85% of its original strength. That can. Overlying the layer 158 is a plate 160 of a whole which is then removed from the etch bath, a conductive material. Wash and dry the type and thickness of this. The etched surface of the material can be different, depending on the metal is now also in the places where the lei size of the elements of the line pattern that lie between the plates 110 and 111 see the two synthetic resin plates are to be embedded in the above-described way with cover target. Examples of this material are provided in the Er- 30 substance.

Purification of embodiment A indicated. According to FIG. 13 will be roughly the original

Thickness of the plate can range between a fraction and remaining covers 1415 and 1365 a thousandth of a centimeter and almost a centimeter together through a cover strip 1275 vermeter lie. The metal plate 160 and the baseboards, under which finally a connecting lead plate 110, between which the adhesive layer 158 35 device 127 is to remain. On the edge of the united is under slight pressure and with moderate coverage 1415, 1275, 1365 are advantageous Heat compressed until the layer 158 hardens on-protrusions 1655, 1665, 1675 of cover is. This provides the plate 160 with the sub-substance. These protrusions from Abihr lying base plate 110 for the further cover substance form anchors around the on-work steps firmly united in the process. At 40 connection points 141, 127, 136. Preferably Places where holes must be made later, at least two anchors for each connection such as for 1415, 1365 and 1475 in the connection point. You don't need to places 141, 136, 147 (Fig. 19), or where numeral- must have regular spacing from one another. the Leaf holes in a control panel are desired, protrusions 1665 on opposite sides of the they can through the metal plate 160 and the 45 cover elements 1275 can be opposite to each other-base plate 110 to be drilled at this point; appropriately, however, they are interwoven you can attach them later. sets, as can be seen from FIGS.

The next step in the process is the Mar- In a similar way, the cover element 1475

marking of the surface of the plate 160 in certain by a cover strip 1255 as well as by selected ones Areas where finally 50 additional projections 1685 expanded. That united Termination points or other parts of the line pattern covering pattern from elements 1415, 1275, through the upper insulating layer 111 free 1365, 1655, 1665 and 1675 and the elements should lie. This tunnel is 1255, 1475 and 1685 is dried and cleared around connection points for the production of standing - in F i g. 14 shown in section - Connections by solder or by rivets, hollow structures are then riveted a second time, Eyes or the like. Throwed in the embodiment. The etching continues until that of the etcher 7, circular points 132 to 147 are intended to be areas of the metal plate exposed to liquid exposed for connections. Therefore, there are on the 160, so among other things the surface parts 157 and Surface of the metal plate 160 circular ab- 159 of Fig. 14, are completely removed and Coverings made of a resistance to etching only that metal remains that is already primordial Substance, such as varnish or paint, sprinkled through the cover elements 1415, 1365 upset. This substance (which for example for and 1475 and now by the new cover elements digits 1415, 1365 and 1475 are used) 1255, 1275, 1655, 1665, 1675 and 1685 of the can consist of the same material as that of FIG. 13 has been covered. Etching away the Intermediate layer 158. As in the explanation 65, it can contain residual metal exposed to the etching liquid tion of the embodiment A described on the thus lays the partially cured synthetic resin layer Plate to be applied. 158 free in all the areas that are not through

Fig. 10 shows three circular covers to be covered in this way were protected.

The resulting structure (Fig. 15) is from taken the etching bath and removed the cover elements by a suitable solvent, so that the underlying conductor pattern 125, 127, 136, 141, 147, 165, 166, 167 and 168 is exposed (Figs. 16 and 17).

The structure of the F i g. 16 consists of the base plate 110 and the adhesive layer 58 on it attached, from the second etching process

pack. In this way, for example, a thermosetting resin in the uncured state can be applied to the im lower part of Fig. 16 shown structure applied and then between heated plates for 5 Purpose of hardening to be pressed so that the hardened surface is in line with the surfaces of the Connection points 141, 136 and 147 is brought. A structure should always be created, as it is in the 17 and 18 is shown, no matter what,

resulting, aforementioned elements of the Lei- io which original shape the layer 111 had, pattern. For example, in the area of the egg, the structure obtained shows - for example according to

mentes 141 the metal maximum thickness, thus treating its surface with sand - a smooth one same thickness as the original metal plate 160; Layer 111 of insulating hardened plastic, from the element 141 from projections in which only the connection points 141, 136 and 165, which are later visibly exposed as anchoring between the plates 15 147, while the line pattern 110 and 111 serve. Elements 141 and 136 elements 125, 127 and projections 165, 166, 167 are interconnected by element 127; and 168 between the two plates 110 and 111 separated therefrom by a gap 164 is embedded. By flowing the glue the Connection point 147 from which the element layer 158 during the last hardness and pressure 125 extends. The elements 125, 127 and also the 20 stage are all empty spaces between the two Protrusions 165, 166, 167 and 168 (of which are filled in panels 110 and 111. The finished structure is F i g. 16 only appears 165) are consistently of a flat, underside through the insulating layer 110, thinner than the original metal plate. Ver-AHe formed on the top by the insulating layer 111 Fasteners, projections, etc. of the to bund plate. Only those are through the top The line patterns created are visible in the terminal connection points 141, 136 and 147. To this etching generated. Connection points can, as indicated at 170,

On the lines produced in the manner described are soldered. When the connection structure A layer 111 is now made of uncured and the plate 110 underneath is not tetem, hardenable plastic, preferably made of perforated before the etching, so happens Heat solidifying plastic of 30 this now. The same can be used in the holes Type, as it is in the plate 110, side or rear side introduced and lines hung up. This layer or plate 111 is expediently dimensioned with the aid of rivets, rings or by soldering, but not necessary, to be tensile strengthened and contacted in the die. The finished structure 17 and 18 can be so thin that it has openings line pattern elements 141, 136, 147 of maximum 35 is flexible; it can be hardened in the bent state Thickness correspond (Fig. 16). So there will be in the.

Layer or plate 111, openings or recessed holes in connection points are shown in FIG

openings 141A, 136A, 147A , which are shown 141C, 136C and 147C. Electrical components fit over the raised line pattern elements 141,136 elements such as resistors, capacitances, electrons and 147. On the lower surface of the 40 tubes, impedances or the like, in the example case of the plate or layer 111, recesses need to be shown in FIG. 165, 166, 167 and 168 of the conductor pattern set, which are stiff enough that the component 154 is not provided because of the layer or plate to support. These wires are formed in templates or 111 in the uncured state and punched 45 tubes and then bent into the. Holes of the Anwird and therefore plugged in during the last stage of the terminals and soldered there. Is deformable in heat and pressure treatment. The case of FIG. 19 are the wires 155, 156 and 171 layer or plate 111 can, if the total thickness of one side is inserted into the holes 136C, 147C, ₁ 141C so the metal plate 160 is not excessively large, insofar as that they just lay down a little over the special and with the application of 50 other side survive, and the component 154 heat and pressure are deformed so that it hangs on the wires 155 and 156. It now follows the itself on the elements of the Line pattern adapts. Dip soldering described above. The plastic plate 111 is expediently based on the elements 125 and 127

If the base plate provided with the line pattern or any other parts of the line pattern 110 are placed (FIG. 16) and then the entire area 55 is exposed, it is then only necessary to bring such forms between two heated plates and to close them in front of the first Etch pressed together by an etch-resistant layer so that the plates 110 and 111 cover. The elements covered in this way are united with one another and around the conductor pattern then retain their strength during the etching and are shaped around them. The adhesive layer-158, which is thus free at the end of the last process stage. At the beginning it was only partially hardened. This way, according to the invention, other elements can also be heated and flows around, under and between the various elements of the line pattern, such as in name plates and dials
for mutual bonding between the layers
and contributing plates 110 and 111.

Instead of applying a layer 111 of uncured plastic that is not fully polymerized, non-plastic, one can also harden it, and therefore still plastic or semi-liquid, paste-like or powdered, by means of heat
Dust, sprinkle or apply hardening resins

getting produced.

Embodiment C

plastic insulating base plate 210 assumed,
their thickness between fractions of a millimeter

(if a flexible end product is desirable) and can be a few millimeters and more. Suitable Materials for this plate are explained under embodiment A. This plate 210 initially receives Holes 214 (Fig. 22) used to form junctions. In Fig. 20 is a such connection point 215 shown, which via a connecting line 216 to another connection point 217 is connected. This connection point 217 is connected to the connection point via a connecting line 218 219 connected, this in the same way with a connection point 220, the latter via a connecting line 221 with a connection point 222 and this in turn via a connecting line 223 with the connection point 224. The other connection points and connecting lines of the line pattern of FIG. 20 are not explained in detail, since, apart from a few details which will be discussed later, they are similar are executed. A hole 214 is enlarged in FIG. 22 shown.

A plate is placed on the plate prepared in this way

213 made of conductive material (metal), from which the line pattern is generated (suitable Materials are explained under embodiment A). When the insulating plate 210 is in the uncured state the conductive plate 213 cannot temporarily hold it by itself, first becomes a Adhesive layer 226 (Fig. 21) applied to them (suitable adhesives are under Embodiment A. described). The adhesive layer 226 is expediently already applied to the plate 210 and cured, before the plate 210 is cut to size and pierced.

In the next process step, the structure consisting of the plates 210 and 213 is converted into a Brought press or punch, which acts on the metal plate 213 male part 228 made of elastic Material (rubber) and a die 229 acting on the insulating material plate 210, e.g. made of steel or other hard metal. Under strong pressure and simultaneous exposure to heat, the Plate 210 and intermediate adhesive layer 226 softened. The rubber male part 228 presses strongly against it the part 215 of the metal plate 213 and forces it there into the FIG. 23 apparent shape, so that the Part 215 rests flat against the die 229. The pressures exerted cause a slight deformation of the bore 214, as shown at 232-232, so that it fits closely against the deformed portion 230 of the Metal plate applies. During the application of the pressure and the application of the heat, the Adhesive layer 226 so as to fill the space between corners 232-232 of the original recess

214 and part 230-230 of the metal plate at 234-234. The strength of sections 232 of the Adhesive layer 226 can be larger or smaller than in FIG. 23 drawn; the sections are missing at all, if an adhesive layer 226 was not used.

After completion of this pressing and hardening process, the one composed of the plates 210 and 213 has and united structures in the area of the connection points 215 impressions or depressions.

The metal plate 213 is preferably, but not necessarily, deformed to an extent that is sufficient to push the connection points completely through the thickness of the plate 210. if the plate 210 is exceptionally thick, the metal plate 213 needs in the area of the connection points 215 being pushed by part of the thickness of the plate 210; the surface of the junction 215 something is then needed that is not a disadvantage. Bulged connection points. 215 are special useful for obtaining good switch contacts. To get these bulges, the ma-

iö trize229 can even be shaped accordingly. For the purpose of the invention it is only necessary that the connection points 215 are pressed in the direction of the surface of the plate 210 which is exposed in the end product. ^r

After completing the one shown in FIG During the operation, a coating of etch-resistant material is applied to the free surface of the metal plate 213 according to the line pattern to be generated - as described in embodiment A -

■ brought 20. '' ■ '- ■' ■■

The cover layer is also applied to the depressed connection points 215 (at 215BJ, including their wall parts 230-230 (at 230 B) and preferably their edge all around (at 231). A cover layer applied in this way can be seen in FIG The edge portion 231 serves as an anchorage and can be provided with projections 233-233 (FIG. 24). These projections can, however, also be combined to form an annular flange, as indicated in FIG. 20 at 238 for the connection point 239 in dashed lines 24 shows three such anchoring projections; however, any number may be provided, for example two projections each for junctions 217, 219 and 220 of FIG .

F i g. 24 shows, on an enlarged scale, a section of a connecting line 216 between the connection points 215 and 217 of Figure 20. A strip 216B of masking substance is used to create this Connecting line 216. The connecting lines can have projections that reinforce their anchoring 242, as shown in FIG. 24 are shown; in general, however, it is ■ unnecessary to provide such anchoring projections, since the connecting lines ultimately between the plate 210 and a second plate.

The structure provided with the cover layer pattern is now etched, as in embodiment A. described. The etching is carried out until all parts of the metal plate 213 exposed to the etching liquid are removed, for example the part 245 in FIG. 25, and only the metal remains that passes through the cover layer was protected. A section through the etched piece is shown in FIG. 26 shown; a bit rough, The edge produced by etching is denoted by 243. The roughness of the etched edge supports that Adhesion of the second plastic plate to be applied in a later process stage. The peripheral edges the flanges, the connection points, the projections and the connecting lines are all etched and slightly roughened and therefore also contribute to the adhesion of the second plastic plate.

From the structure of FIG. 26 is now in the next process step, as under embodiment A, the masking layer pattern removed.

A layer 246 of adhesive is then applied to the underside of the structure treated in this way. The adhesive is conveniently the same as that used for layer 226; but it can also be a other, thermosetting synthetic resin can be used. The adhesive layer 246 is used for Create a flat surface along line 247 and fill in the recesses or Indentations under the connection points, for example

the same are present) and the plate 250 connected to one another, hardened and formed into a solid resilient composite bodies are formed. In this way, the connection points are advertised. The cylinder is roughly in a cylindrical shape under uniform pressure on its Hardened outside.

Larger slip rings and switch constructions can be designed in a flat form. In the Embodiment C can use the exposed connection points 215 can be bulged outward by making recesses in the plate 229. But you can also increase their

be indented inwards to fill the space under the anio contact effectiveness, terminating point 215. On this layer 246 a

another layer of plastic 250 applied (FIG. 27); emitting or radiating surfaces, the whole thing is then inserted between two heated plates. For this purpose, one pulls over those surfaces and pressed while heating until the elements of the line pattern and its component plate 210 and layers 226 and 246 (provided that 15 ments, which are likely to heat up the most, a bandage of surface elements exposed to the heat, for example from at a distance lamellae lying opposite one another (squares). This association of being spaced apart Their surfaces, through the holes in the metal lamellas exposed to heat, become like this of the plate 210 are exposed, completely embedded. applied that the slats at the corners electrically

The structure created in this way can and are thermally connected to each other and so on In this state components are now soldered onto the total area up to other parts of the conduit. The connection wires of the components are patterned where the heat is more easily radiated for this purpose, it is simply extended to the exposed surfaces 215 of the as can.

Terminals soldered on. To make it easier for you to

Soldering process and to simplify the circuit pattern emerging electrical connection, see above However, it is more expedient to form the connecting element than initially Terminals and the artificial planes lying below them, continuation of that part of the conductor element pierce fabric, d. H. completely or partially through the line pattern with which the connecting party To provide holes. This is shown in FIG. 28 and is intended to be established. After etching it will shows where the junction 215 is an art or drilling that is then bored under the conduction pattern Has punching generated opening 251, fabric plate around the edge of the extension through the cut through the plates 246 below, with the exception of the places where he met the and 250 continues. To generate the opening 35 line pattern is connected; then the art becomes z. B. the plate 250 placed on a die, so the fabric layer on the back of the extension wegdaß, as indicated in Fig. 28, a punch 255 in scraped; the metallic extension is then free and the exposed surface elements of the metal can through the in the underlying art plate 215 can penetrate. When the punching operation butt plate opening created by the scraping away Running in this way causes the 40 to be bent. If desired, a stamp is then added 255 a slight curvature of the edge of the additional plastic layer applied, which under punched hole flows inwards, as in Fig. 28 under the action of heat and pressure and that in 215 C indicated before the stamp made the connection hole made of the original plastic plate place and pierce the underlying plate. fills out and which at the same time as the line-this Beading the edge of the hole 215 C causes 45 wire serving extension covered and protects. These an additional anchoring of the connection point in an embodiment of the invention proves to be useful Plate 246, which is on the back of the connection point.

After the plate 210 has been combined with the plate 250 (FIG. 27), but before the final hardening, the structure can be curved into any shape and cured in the curved state.

The planar structures described so far can be made so thin that you can after final hardening can bend in order to adapt it to the respective installation conditions. the However, structures can also be used as cylindrical bodies, for example in the form of sliding rings, sleeves or be designed as a switch of cylindrical shape. To do this, it is merely necessary from a brass, copper or

especially useful in the manufacture of cylindrical and plane slip rings and contact points for multiple connections.

to assume another metal cylinder, which is on the inside by a sufficient layer of plastic (for the embodiments A and B) reinforced or on its outside with a plastic layer is covered with corresponding punched openings (embodiment C). That The procedure then continues as above

Claims (6)

Patent claims: 1. A method for producing a line pattern on a plastic carrier plate, thereby characterized in that a metal foil (31, 160, 213) by means of a thermosetting, not yet cured adhesive layer (30, 158, 226) on a heat-curable, not yet cured Base plate (10, 110, 210) is glued, that then the metal foil up to the remaining Line pattern (15, 125, 127, 216) and possibly remaining islands (136, 141, 147) is etched away and that the resulting composite body then undergoes hardening of the adhesive and the base plate material causing temperature is pressed together. 2. The method according to claim 1, characterized in that the line pattern (15) in cBe Not yet hardened base plate (10) so deep is pressed in that its free surface comes into alignment with the surface of the base plate. 3. The method according to claim 1, characterized in that in a first etching step the metal foil (160) is weakened except for islands (136, 141, 147) that remain, that the weakened metal foil is then etched away except for the conductive pattern (125, 127) that remains and that the line pattern is then covered with a layer of insulating material ίο (111) up to the level of the islands. 4. The method according to claim 1, characterized in that the base plate (210) is provided with holes (214) , that the metal foil (213) is then placed on the base plate, that then the metal foil with a resilient pressure pad (228) against a Abutment plate (229) is pressed into the holes, that the metal foil is then etched away down to the remaining line pattern (216) and that the ao line pattern is then covered with a layer of insulating material (246). 5. The method according to claim 2, characterized in that the line elements of the line pattern (15) obtained by etching in a manner known per se such a cross-sectional shape, that they anchor themselves when they are pressed into the base plate (10) by engaging behind them. 6. The method according to any one of the preceding claims, characterized in that the adhesive layer (30, 158, 226) is formed by a surface layer of the not yet cured base plate (10, 110, 210) . Considered publications: German Patent Nos. 505 9Ϊ6, 808 052, 331, 970 339; British Patent No. 672 255; "Modem Plastics", August 1951, pp. 99 to 111; April 1954, p. 92; "Radio mentor", 1948, p. 393; "Funk-Technik", 1947, issue 24, p. 12/13; "Umschau", 1953, no. 1, p. 14. For this purpose 2 sheets of drawings 409 729/356 11.64 Bundesdruckerei Berlin