ES2040439T3 - Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto. - Google Patents

Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto.

Info

Publication number
ES2040439T3
ES2040439T3 ES198989121279T ES89121279T ES2040439T3 ES 2040439 T3 ES2040439 T3 ES 2040439T3 ES 198989121279 T ES198989121279 T ES 198989121279T ES 89121279 T ES89121279 T ES 89121279T ES 2040439 T3 ES2040439 T3 ES 2040439T3
Authority
ES
Spain
Prior art keywords
printed circuits
procedure
manufacture
contact surfaces
circuits provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198989121279T
Other languages
English (en)
Inventor
Klaus Dr. Ritz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schoeller and Co Elektronik GmbH
Evonik Operations GmbH
Original Assignee
Schoeller and Co Elektronik GmbH
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller and Co Elektronik GmbH, Degussa GmbH filed Critical Schoeller and Co Elektronik GmbH
Application granted granted Critical
Publication of ES2040439T3 publication Critical patent/ES2040439T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

PARA LA FABRICACION DE CIRCUITOS IMPRESOS PROVISTOS DE SUPERFICIES DE CONTACTO SE PRESIONAN LAMINAS DE COBRE CONTRA UNA PLANTILLA PROVISTA DE SUPERFICIES EN RELIEVE CON UN DIBUJO PREFIJADO Y LA PARTE INTERIOR DE LAS HUELLAS PRODUCIDAS EN LAS LAMINAS DE COBRE SE RELLENAN CON UN MATERIAL CURABLE. DESPUES DEL PRENSADO PREVIO CON PREPEGS SE FABRICAN CIRCUITOS IMPRESOS A PARTIR DE ESTOS LAMINADOS PREVIOS. LAS LAMINAS DE COBRE DEBEN POSEER UN ALARGAMIENTO DE ROTURA SUPERIOR AL 10% Y UN ESPESOR DE 10 A 100 (MU)M.
ES198989121279T 1988-12-23 1989-11-17 Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto. Expired - Lifetime ES2040439T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3843528A DE3843528C1 (es) 1988-12-23 1988-12-23

Publications (1)

Publication Number Publication Date
ES2040439T3 true ES2040439T3 (es) 1993-10-16

Family

ID=6370040

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198989121279T Expired - Lifetime ES2040439T3 (es) 1988-12-23 1989-11-17 Procedimiento para la fabricacion de circuitos impresos provistos de superficies de contacto.

Country Status (5)

Country Link
EP (1) EP0374483B1 (es)
AT (1) ATE89976T1 (es)
AU (1) AU614455B2 (es)
DE (2) DE3843528C1 (es)
ES (1) ES2040439T3 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9407103U1 (de) * 1994-04-28 1994-09-08 Andus Electronic Gmbh Leiterpl Verbindungsanordnung für Multilayer-Schaltungen
DE4418679A1 (de) * 1994-05-28 1995-11-30 Telefunken Microelectron Vorrichtung zur Kontaktierung zweier Schaltungsteile

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1182319B (de) * 1954-07-12 1964-11-26 Beck S Inc Verfahren zur Herstellung eines Leitungsmusters auf einer Kunststofftraegerplatte
AU417989B2 (en) * 1968-07-12 1971-10-12 William Edwards George Improvements relating to the manufacture of circuit boards
US4125310A (en) * 1975-12-01 1978-11-14 Hughes Aircraft Co Electrical connector assembly utilizing wafers for connecting electrical cables
DE3235212A1 (de) * 1982-09-23 1984-03-29 Schoeller & Co Elektronik Gmbh, 3552 Wetter Kontaktierungselement fuer gedruckte schaltungen
DE3610036A1 (de) * 1986-03-21 1987-09-24 Schering Ag Kontaktieren von mikroelektronischen schaltungen
NL8601567A (nl) * 1986-06-17 1988-01-18 Du Pont Nederland Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat.

Also Published As

Publication number Publication date
AU614455B2 (en) 1991-08-29
EP0374483B1 (de) 1993-05-26
EP0374483A2 (de) 1990-06-27
ATE89976T1 (de) 1993-06-15
AU4700889A (en) 1990-06-28
DE3843528C1 (es) 1990-05-23
EP0374483A3 (de) 1991-01-02
DE58904499D1 (de) 1993-07-01

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