ES2011466B3 - Placa compuesta conductora, asi como el procedimiento para su fabricacion. - Google Patents

Placa compuesta conductora, asi como el procedimiento para su fabricacion.

Info

Publication number
ES2011466B3
ES2011466B3 ES87106792T ES87106792T ES2011466B3 ES 2011466 B3 ES2011466 B3 ES 2011466B3 ES 87106792 T ES87106792 T ES 87106792T ES 87106792 T ES87106792 T ES 87106792T ES 2011466 B3 ES2011466 B3 ES 2011466B3
Authority
ES
Spain
Prior art keywords
carbon black
conductive
procedure
manufacture
well
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES87106792T
Other languages
English (en)
Inventor
Dirk Huthwelker
Eugen Rath
Eugen Konrad
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermopal Dekorplatten & Co KG GmbH
Original Assignee
Thermopal Dekorplatten & Co KG GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermopal Dekorplatten & Co KG GmbH filed Critical Thermopal Dekorplatten & Co KG GmbH
Application granted granted Critical
Publication of ES2011466B3 publication Critical patent/ES2011466B3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B21/08—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
  • Hybrid Cells (AREA)
  • Secondary Cells (AREA)
ES87106792T 1986-06-04 1987-05-11 Placa compuesta conductora, asi como el procedimiento para su fabricacion. Expired - Lifetime ES2011466B3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3618834A DE3618834C1 (es) 1986-06-04 1986-06-04

Publications (1)

Publication Number Publication Date
ES2011466B3 true ES2011466B3 (es) 1990-01-16

Family

ID=6302293

Family Applications (1)

Application Number Title Priority Date Filing Date
ES87106792T Expired - Lifetime ES2011466B3 (es) 1986-06-04 1987-05-11 Placa compuesta conductora, asi como el procedimiento para su fabricacion.

Country Status (5)

Country Link
EP (1) EP0248237B1 (es)
AT (1) ATE46482T1 (es)
DE (2) DE3618834C1 (es)
ES (1) ES2011466B3 (es)
GR (1) GR3000217T3 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10102790C1 (de) * 2001-01-22 2002-08-29 Witex Ag Fussbodenplatte und Verfahren zu deren Herstellung
KR100431545B1 (ko) * 2001-05-08 2004-05-14 주식회사 서한안타민 전도성 인테리어 시트 및 그 제조방법
KR100367885B1 (ko) * 2002-05-27 2003-01-14 이문수 정전기 방지 타일
DE102005057950B4 (de) * 2005-12-05 2020-02-06 Robert Bosch Gmbh Piezoaktor mit Ableitwiderstand

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1233248B (de) * 1964-09-07 1967-01-26 Feldmuehle Ag Verfahren zum Herstellen metallfolienartiger Oberflaechen
DE2834185C2 (de) * 1978-08-04 1986-03-06 Homapal Plattenwerk GmbH & Co KG, 3420 Herzberg Verbundplatte
DE8305544U1 (de) * 1983-02-26 1983-10-20 Thermopal-Dekorplatten GmbH & Co KG, 7970 Leutkirch Spanplatte
DE3338268A1 (de) * 1983-10-21 1985-05-02 Basf Ag, 6700 Ludwigshafen Verfahren zur herstellung von spanplatten mit verbesserter elektrischer leitfaehigkeit sowie spanplatte mit verbesserter elektrischer leitfaehigkeit
US4472474A (en) * 1983-10-26 1984-09-18 Formica Corp. Electrically conductive laminate
GB8432137D0 (en) * 1983-12-22 1985-01-30 Mead Corp Conductive papers

Also Published As

Publication number Publication date
DE3618834C1 (es) 1987-07-23
EP0248237B1 (de) 1989-09-20
GR3000217T3 (en) 1990-12-31
EP0248237A1 (de) 1987-12-09
ATE46482T1 (de) 1989-10-15
DE3760574D1 (en) 1989-10-26

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