ES2006054A6 - Metodo para conectar paquetes de pastilla sin terminales y articulo correspondiente. - Google Patents

Metodo para conectar paquetes de pastilla sin terminales y articulo correspondiente.

Info

Publication number
ES2006054A6
ES2006054A6 ES8800109A ES8800109A ES2006054A6 ES 2006054 A6 ES2006054 A6 ES 2006054A6 ES 8800109 A ES8800109 A ES 8800109A ES 8800109 A ES8800109 A ES 8800109A ES 2006054 A6 ES2006054 A6 ES 2006054A6
Authority
ES
Spain
Prior art keywords
articles
leadless chip
chip packages
pads
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8800109A
Other languages
English (en)
Spanish (es)
Inventor
Philip V Pesavento
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of ES2006054A6 publication Critical patent/ES2006054A6/es
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Die Bonding (AREA)
ES8800109A 1987-01-21 1988-01-19 Metodo para conectar paquetes de pastilla sin terminales y articulo correspondiente. Expired ES2006054A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US571587A 1987-01-21 1987-01-21

Publications (1)

Publication Number Publication Date
ES2006054A6 true ES2006054A6 (es) 1989-04-01

Family

ID=21717338

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8800109A Expired ES2006054A6 (es) 1987-01-21 1988-01-19 Metodo para conectar paquetes de pastilla sin terminales y articulo correspondiente.

Country Status (6)

Country Link
JP (1) JPH0719952B2 (ja)
AU (1) AU611127B2 (ja)
ES (1) ES2006054A6 (ja)
GB (1) GB2208569B (ja)
IL (1) IL85008A0 (ja)
WO (1) WO1988005428A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2634616B1 (fr) * 1988-07-20 1995-08-25 Matra Procede de montage de micro-composants electroniques sur un support et produit realisable par le procede
US4996629A (en) * 1988-11-14 1991-02-26 International Business Machines Corporation Circuit board with self-supporting connection between sides
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
GB2344550A (en) * 1998-12-09 2000-06-14 Ibm Pad design for electronic package
DE10018415C1 (de) * 2000-04-03 2001-09-27 Schott Glas Verbindung einer Anschlussstelle mit einer elektrischen Leiterbahn einer Platte
GB2362515B (en) * 2000-04-13 2003-09-24 Zeiss Stiftung Connection of a junction to an electrical conductor track on a plate
US7090098B2 (en) 2004-05-06 2006-08-15 Johnsondiversey, Inc. Metering and dispensing closure
CN102528266B (zh) * 2010-12-24 2014-03-05 中国科学院深圳先进技术研究院 超声阵列声头阵元的电路引线焊接方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1252883A (ja) * 1967-11-10 1971-11-10
JPS53134116A (en) * 1977-04-27 1978-11-22 Toyota Motor Corp Fuel feeder for internal combustion engine
JPS5521148A (en) * 1978-07-31 1980-02-15 Nichicon Capacitor Ltd Method of impregnating electrolytic capacitor
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4423468A (en) * 1980-10-01 1983-12-27 Motorola, Inc. Dual electronic component assembly
ZA826825B (en) * 1981-10-02 1983-07-27 Int Computers Ltd Devices for mounting integrated circuit packages on a printed circuit board
DE8322946U1 (de) * 1982-09-17 1987-05-07 Control Data Corp., Minneapolis, Minn. Schaltungsplatte
JPS603141A (ja) * 1983-06-20 1985-01-09 Toshiba Corp 回路基板

Also Published As

Publication number Publication date
IL85008A0 (en) 1988-06-30
AU1184388A (en) 1988-08-10
WO1988005428A1 (en) 1988-07-28
JPH0719952B2 (ja) 1995-03-06
JPH01501990A (ja) 1989-07-06
GB2208569A (en) 1989-04-05
GB2208569B (en) 1991-01-30
GB8821709D0 (en) 1988-11-16
AU611127B2 (en) 1991-06-06

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