EP4688317A1 - Module de chauffage de système de brasage sélectif ayant une cloison de réflecteur, système de brasage sélectif et procédé associé - Google Patents

Module de chauffage de système de brasage sélectif ayant une cloison de réflecteur, système de brasage sélectif et procédé associé

Info

Publication number
EP4688317A1
EP4688317A1 EP24707520.3A EP24707520A EP4688317A1 EP 4688317 A1 EP4688317 A1 EP 4688317A1 EP 24707520 A EP24707520 A EP 24707520A EP 4688317 A1 EP4688317 A1 EP 4688317A1
Authority
EP
European Patent Office
Prior art keywords
module
reflector
bulkhead
heating
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP24707520.3A
Other languages
German (de)
English (en)
Inventor
Andreas STEINDAMM
Andreas Stemmler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ersa GmbH
Original Assignee
Ersa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ersa GmbH filed Critical Ersa GmbH
Publication of EP4688317A1 publication Critical patent/EP4688317A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Definitions

  • the invention relates to a selective soldering system heating module, i.e. a heating module for a selective soldering system, a selective soldering system and an associated method.
  • circuit boards equipped with electrical or electronic components are processed in different or mixed processing modules.
  • the modules form different zones of the selective soldering system, whereby the modules can be implemented as separate assemblies.
  • the circuit boards can also be designed as printed circuit cards, which contain several circuit boards that are separated into individual circuit boards after soldering.
  • the first step is fluxing, during which the areas of the circuit board that will be exposed to liquid solder during the soldering process are wetted.
  • This is followed by preheating in heating modules.
  • the aim of preheating is to heat the circuit board homogeneously before it is transported to the soldering module, where the actual soldering process takes place.
  • preheating it is advantageous to introduce up to 50 percent of the heat energy into the circuit board using infrared heat lamps, so that the circuit board and components in the soldering module are not heated up suddenly when they come into contact with the liquid solder.
  • the soldering modules contain soldering pots that can be moved independently of one another and each generate a soldering wave.
  • the soldering pot or soldering wave is moved to the point on the circuit board where the component is ultimately to be soldered.
  • the soldered circuit board is fed to an output, whereby the output can also be the input.
  • Known heating modules of selective soldering systems which are arranged between flux modules and soldering modules, have a base, a module inlet and a module outlet, whereby during operation the respective circuit board is transported along a transport direction (x-direction) from the module inlet to a heating position and from the heating position to the module outlet.
  • the heating modules also generally have side walls running parallel to the transport direction, whereby heat radiators, in particular Infrared heat lamps are provided.
  • the side walls can form a heating cassette.
  • Newer selective soldering systems in particular are required to have a throughput height of 60 mm to 100 mm, or more, above and below the transport level, as the size and height of the components to be soldered or already on the circuit board is increasing - also with regard to the power electronics of electric vehicles.
  • the throughput height is the height at which the circuit boards with the components arranged on them can be transported through the soldering system or heating module without collision. The throughput height is therefore specific to the soldering system or heating module.
  • JP H04-274 867 A discloses a ref low soldering system in which adjustable partition walls are provided along a conveyor to form several chambers arranged one behind the other in order to reduce the consumption of protective gas, to lower operating costs and to easily set a temperature profile inside a ref low passage. Heating elements can be provided in the chambers. From DE 37 24 005 C2, among other things, a ref low soldering system is known which has heating elements and in which adjustable, elliptical reflectors are provided around the heating elements.
  • a reflow soldering system for flexible circuit boards is known in which openings are provided on the top. On or above the opening there are several adjustable IR shutters to shade the near infrared radiation emerging upwards from the opening. The shutters define a soldering field from which the near infrared radiation emerges to heat the flexible circuit board.
  • a selective soldering system heating module having the features of claim 1.
  • the module entrance and/or module exit can be closed at least in sections.
  • the reflector bulkhead is adjustable in particular independently of any movement or transport of the circuit board.
  • the module entrance can in particular be provided at a different location to the module exit; however, it is also conceivable for the module entrance to also take on the function of the module exit, i.e. for the circuit board to be transported out of the module through the module entrance, which then functions as the module exit.
  • the passage height is at least temporarily reduced, which can occur in particular depending on the components to be soldered or already present on the circuit board.
  • a soldering system or a heating module has a throughput height of 100 mm, for example, this can be reduced to 50 mm or less by means of the at least one adjustable reflector bulkhead - if the components on the circuit board or their installation height allow it - which leads to more even heating of the circuit board and to noticeable energy savings. If there are components whose installation height is lower than the maximum permissible throughput height of the soldering system, a Better soldering results can be achieved, even if this reduces the throughput height of the soldering system.
  • a control system which controls the drive and is set up in such a way that the at least one reflector bulkhead is adjusted to the operating position depending on the installation height of the respective circuit board including the components arranged on it. This reduces the passage height depending on the installation height of the circuit board, to a value such that the circuit board including the components can still pass through the Heating module or the soldering system can be transported. If relatively high components are arranged on the circuit board, a larger throughput height can be used; if only relatively flat components are planned, the throughput height can be reduced to achieve better heating of the circuit boards.
  • control is further configured such that the adjustment is such that in a first operating position the distance between at least the reflector bulkhead and the transport plane is equal to or slightly greater than the installation height of the respective circuit board. This ensures that as little heat radiation as possible escapes from the heating module.
  • the control is further set up in such a way that the adjustment is such that after the respective circuit board reaches the heating position, the at least one reflector bulkhead is adjusted to a second operating position in which the module entrance and/or the module exit is at least largely closed. Consequently, after each entry of a circuit board into the heating module, the latter can preferably be closed as largely as possible so that as little radiation as possible escapes from the heating module during the heating phase.
  • the at least one reflector bulkhead is adjusted to an open position so that the heated circuit board can exit the heating module and/or a circuit board to be heated can enter the heating module.
  • the object mentioned at the outset is also achieved by a soldering system for soldering components present on a printed circuit board, comprising a heating module according to the invention.
  • the object mentioned at the outset is also achieved by a method for operating a selective soldering system, wherein the selective soldering system comprises a heating module, wherein when a circuit board is in a heating position in the heating module, the heating module is closed with an adjustable reflector bulkhead. The closing takes place at least slightly and preferably as far as possible.
  • the heating module is preferably a heating module according to the invention.
  • Figure 2 is an isometric view of a first heating module according to the invention
  • the soldering system 10 comprises various modules, whereby mixed modules with mixed processing functions are also possible. Downstream of the input 12 there is a flux module 22 in which the areas of the circuit board 16 that are exposed to liquid solder during the soldering process are wetted with flux. Downstream of the flux module 22 there is a heating module 24 in which the circuit boards 16 are preheated. Downstream of the heating module 24 there are two soldering modules 26 and 28 in which circuit boards can be soldered independently of one another. For this purpose, soldering pots (not shown) that can be moved independently of one another are arranged in the soldering modules 26 and 28, each of which generates a soldering wave.
  • the soldering pot or the soldering wave is moved to the location on the circuit board 16 where the component is ultimately to be soldered. After the soldering process, the completely soldered circuit board is fed to the output 14, whereby the output can also form the input.
  • the heating module 24, or its key components is shown in simplified form.
  • the transport system 18 extending through the soldering system 10 can be seen, with which the circuit boards 16 can be transported along the transport direction 20 in a transport plane E into the heating module 24 and out of the heating module.
  • electrical or electronic components 25 are provided on the top side of the circuit board 16 and are to be soldered in the soldering system 10.
  • the components 25 have feet which extend through the circuit board 16 and which are soldered to the circuit board 16 from below in the soldering module 28 (through-hole technology).
  • Electrical or electronic components 27 can also be provided on the underside of the circuit board which are not soldered in the soldering system 10 but are already attached or pre-assembled on the circuit board 16 in some other way before the circuit board 16 is transported to the soldering system 10, for example by means of pressing or by means of another soldering process.
  • the heating module 24 comprises a module input 30 and a module output 32, whereby the module input and the module output can also be identical or at the same location.
  • the printed circuit board 16 can be moved via the module input 30 into the heating module 24 and there into a heating position as shown in Figure 2, in which the actual heating process takes place. Once the preheating of the printed circuit board 16 is completed, the printed circuit board 16 can be transported from the heating position shown in Figures 2 and 3 through the module output 32 along the transport direction 20 from the heating module 24 into the adjoining soldering module 26, 28. A reversal of the transport direction or a different transport direction is also conceivable.
  • the heating module 34 has a base 34 in which or on which heat radiators 36 are provided, which can be tubular.
  • the heat radiators run transversely to the transport direction 20, in the direction of a y-axis. It is also conceivable that the radiators are positioned parallel to or differently from the transport direction.
  • the heat radiators 36 radiate infrared radiation in particular towards the circuit board 16, so that the latter is heated by means of the radiation. In order to heat the circuit board not only on the surface, it is advantageous to introduce heat energy into the circuit board using infrared radiators.
  • the heat radiators 36 are located below the circuit board 16 in order to preheat it from below. This is useful because the components 25 are soldered using a soldering wave from below the circuit board 16. However, it is also conceivable to install further heat radiators 36 on a cover element 38 opposite the base 34.
  • Heat radiator 36 to protect the circuit board 16 from to heat from above. In this case, it makes sense to provide additional reflector bulkheads 56, 58 above the circuit board 16, as shown in Figure 4 and described below, or bulkheads which cover the entire inlet and outlet area in height as far as possible.
  • a reflector bulkhead 40 and 52 is provided at the module inlet 30 and at the module outlet 32, respectively, which can be adjusted along a z-axis running transversely to the x-axis and y-axis into an operating position shown in Figure 3, in which the circuit board 16 is in the heating position.
  • Di there is a distance Di in the operating position between the transport plane E and the reflector bulkhead 40 or its upper edge 42.
  • the distance between the transport plane E and the reflector bulkhead 40 or a wall 44 delimiting the module inlet 30 at the bottom is the value D2, where D2 is greater than Di.
  • the value D2 corresponds to the maximum throughput height specified by the machine, with D2 preferably being in the range of 60 mm to 100 mm, or greater. This ensures that circuit boards 16 with components 27 that have a comparatively large installation height can be soldered.
  • the distance Di can be adjusted so that a reduced throughput height is obtained which is only slightly greater than the maximum (here downward-directed) installation height H of the circuit board 16 or of the components 27 present thereon. This ensures that the circuit board 16 can be transported through the module entrance 30 into the heating module 24 without collision when the reflector bulkhead 40 is in the operating position. If several identically equipped circuit boards 16 are transported one after the other into the heating module 24, the reflector bulkhead 40 remains in its operating position. Only when a circuit board 16 with components whose installation height H exceeds the distance Di is to be introduced into the heating module is the reflector bulkhead 40 lowered so far that the circuit board 16 together with components can be transported into the heating module 24 without collision.
  • drives 48 in the form of electric motors or pneumatic motors/cylinders are provided, which can be controlled via a controller 50.
  • the controller 50 can be set up in such a way that it adjusts the reflector bulkhead 40 into the operating position depending on the installation height of the circuit board 16, so that the circuit board with the components 27 arranged on it can be transported into the heating module 24 without collision, but preferably with a small distance to the reflector bulkhead 40 or to its upper edge 42. If comparatively flat components 27 are provided on the circuit board 16, a low throughput height Di can be set; if comparatively tall components 27 are provided on the circuit board 16, the adjustment of the reflector bulkhead can be such that a larger required throughput height Di results.
  • the drives 48 can also be manually operated drives, which are operated manually using a crank, for example. It is also conceivable that the reflector bulkheads 40, 52 can also be adjusted without drives. It is conceivable, for example, that the reflector bulkheads are provided with elongated holes extending in the z-direction, through which fastening screws extend, which are fastened to suitable components on the heating module 24. The respective reflector bulkhead 40, 52 can be adjusted by loosening the screws. Once it has reached the required or specified height, the screws can be tightened.
  • FIG 3 shows how the heat radiators 36 also radiate heat in the direction of the module inlet 30 or module outlet 32.
  • the heat radiation is indicated by the arrows 54. Because the reflector bulkhead 40 or 52 is in its operating position, the radiation 54 directed towards the module inlet 30 or module outlet 32 is reflected by the reflector bulkhead 40, 52 towards the circuit board 16 or the inner area of the heating module. Heat radiation which, without the presence of the reflector bulkhead 40, 52, emerges from the heating module 24 through the opening with the passage height D2 is held in the heating module 24 due to the reflection 40, 52 on the respective reflector bulkhead 40, 52 and thus contributes to the uniform heating of the circuit board 16.
  • the circuit board 16 can be heated sufficiently well, in particular in its edge regions 53, due to the reflection of the heat radiation 54 on the reflector bulkhead 40, 52. Furthermore, by providing the reflector bulkheads 40, 52, less heat radiation leaves the heating module 24. This prevents undesired heating of components that are provided outside the heating module 24. In addition, the soldering system 10 or the heating module 24 can be operated in a more energy-efficient manner.
  • Figure 4 shows a heating element 124 with top and bottom heating, in which components corresponding to the heating element 24 according to Figures 2 and 3 are provided with corresponding reference numerals. While in the embodiment according to Figures 2 and 3 the reflector bulkheads 40, 52 are each only provided below the transport plane E or the respective circuit board 16, in the heating module 124 upper reflector bulkheads 56 and 58 are also provided.
  • a reflector bulkhead 56, 58 provided above the transport plane E is particularly advantageous when heat radiators are not only provided on the base 34, but also in or on the cover element 38 above the circuit board 16.
  • the reflector bulkheads 56, 58 provided above the transport plane can ensure that heat radiation from the heat radiators provided above the transport plane remains in the respective heating module.
  • the arrangement is such that the reflector bulkheads 40, 56 can be moved towards and away from each other in the z-direction.
  • the reflector bulkheads 42, 58 can also be moved towards and away from each other in the z-direction.
  • the shotts are set to the smallest distance so that the products can still get into the heater.
  • the two reflector bulkheads 40, 56 are adjusted to an open position. After the circuit board 16 has reached its heating position, the two reflector bulkheads 40, 56 are moved towards each other so that the module entrance 30 is at least largely closed.
  • the two reflector bulkheads 40, 56 have open-edge recesses 60 which are arranged such that when the module entrance is closed, i.e. when the two reflector bulkheads 40, 56 reach their operating position, the transport means 18 are located within the recesses 60.
  • the reflector bulkheads 52, 58 at the module output 32 can also have such recesses 60.
  • the heating module 124 can, corresponding to the heating module 24, have drives 48 and a controller 50 (not shown in Figure 4) which is designed to move the reflector bulkheads 40, 56 into an open position during the transport of the respective circuit board 16 into the heating module 24 and, after the respective circuit board 16 has reached its heating position, to move the reflector bulkheads 40, 56 into the operating position closing the module entrance 30.
  • drives can drive the reflector bulkheads 52, 58 at the module exit so that they move from their closed operating position into an open position when the respective circuit board 16 is moved from the heating module 24 into the adjoining soldering module 26.
  • FIG. 5 shows a further embodiment of a heating module 224, wherein corresponding components in the heating module 124 are provided with corresponding reference numerals.
  • the heating module 224 differs from the heating module 124 in that reflector bulkheads 62, 64 are provided which are not arranged to be adjustable towards and away from each other in the vertical z-direction, but in the y-direction.
  • the circuit board 16 can be transported along the transport direction 20 into the heating module 224. After it has reached the heating position, the reflector bulkheads 62 and 64 are moved towards each other, whereby the module entrance 30 is at least largely completely closed. While the circuit board 16 is being heated, no noticeable heat radiation emerges from the heating module 224.
  • reflector bulkheads 62, 64 are only shown at the module entrance, it is conceivable within the scope of the invention, corresponding reflector bulkheads must also be provided at the module output 32 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention se rapporte à un module de chauffage pour un système de brasage sélectif comprenant une cloison de réflecteur, à un système de brasage sélectif et à un procédé associé.
EP24707520.3A 2023-04-05 2024-02-26 Module de chauffage de système de brasage sélectif ayant une cloison de réflecteur, système de brasage sélectif et procédé associé Pending EP4688317A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102023108790.8A DE102023108790A1 (de) 2023-04-05 2023-04-05 Heizmodul für eine Lötanlage mit einem Reflektorschott, Lötanlage und zugehöriges Verfahren
PCT/EP2024/054748 WO2024208486A1 (fr) 2023-04-05 2024-02-26 Module de chauffage de système de brasage sélectif ayant une cloison de réflecteur, système de brasage sélectif et procédé associé

Publications (1)

Publication Number Publication Date
EP4688317A1 true EP4688317A1 (fr) 2026-02-11

Family

ID=90057452

Family Applications (1)

Application Number Title Priority Date Filing Date
EP24707520.3A Pending EP4688317A1 (fr) 2023-04-05 2024-02-26 Module de chauffage de système de brasage sélectif ayant une cloison de réflecteur, système de brasage sélectif et procédé associé

Country Status (4)

Country Link
EP (1) EP4688317A1 (fr)
CN (1) CN120752107A (fr)
DE (1) DE102023108790A1 (fr)
WO (1) WO2024208486A1 (fr)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3715940A1 (de) * 1987-05-13 1988-12-01 Lothar Dipl Ing Himmelreich Infrarot-loetofen zum aufschmelzloeten von elektronischen bauelementen auf leiterplatten
DE3724005A1 (de) * 1987-07-21 1989-02-02 Friedrich Dieter Prozessgesteuerte erwaermungseinrichtung
DE3814870C1 (fr) * 1988-05-02 1989-11-16 Helmut Walter 8900 Augsburg De Leicht
JPH0775774B2 (ja) * 1991-03-01 1995-08-16 松下電器産業株式会社 雰囲気炉
JPH04274867A (ja) * 1991-03-01 1992-09-30 Matsushita Electric Ind Co Ltd 雰囲気炉
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
DE69316840T2 (de) * 1992-11-17 1998-05-20 Matsushita Electric Ind Co Ltd Verfahren und Vorrichtung zum Aufschmelzlöten
US7380699B2 (en) * 2002-06-14 2008-06-03 Vapour Phase Technology Aps Method and apparatus for vapour phase soldering
DE202009015051U1 (de) * 2009-11-05 2010-01-21 Asscon Systemtechnik-Elektronik Gmbh Dampfphasen-Lötanlage
JP5459294B2 (ja) * 2011-11-15 2014-04-02 株式会社デンソー リフロー装置
DE102011087704A1 (de) * 2011-12-05 2013-06-06 Osram Gmbh Reflowofen für flexible Leiterplatten in einer Reel-to-Reel-SMT-Fertigungslinie
DE102014106631B4 (de) * 2013-05-10 2021-12-02 Seho Systemtechnik Gmbh Vorrichtung und Verfahren zum Herstellen von Lötverbindungen

Also Published As

Publication number Publication date
WO2024208486A1 (fr) 2024-10-10
DE102023108790A1 (de) 2024-10-10
CN120752107A (zh) 2025-10-03

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