EP4334841A1 - Carte porteuse de données, produit semi-fini, agencement de câblage associé et procédé de production associé - Google Patents

Carte porteuse de données, produit semi-fini, agencement de câblage associé et procédé de production associé

Info

Publication number
EP4334841A1
EP4334841A1 EP22726424.9A EP22726424A EP4334841A1 EP 4334841 A1 EP4334841 A1 EP 4334841A1 EP 22726424 A EP22726424 A EP 22726424A EP 4334841 A1 EP4334841 A1 EP 4334841A1
Authority
EP
European Patent Office
Prior art keywords
contact
contact pads
electrically conductive
continuous wire
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22726424.9A
Other languages
German (de)
English (en)
Inventor
Stefan Kluge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient ePayments GmbH
Original Assignee
Giesecke and Devrient ePayments GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102022109547.9A external-priority patent/DE102022109547A1/de
Application filed by Giesecke and Devrient ePayments GmbH filed Critical Giesecke and Devrient ePayments GmbH
Priority to EP24180889.8A priority Critical patent/EP4404101A3/fr
Publication of EP4334841A1 publication Critical patent/EP4334841A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors

Definitions

  • the invention relates generally to the field of electronic data carriers in the form of cards, in particular chip cards such as credit and debit cards, and in particular data carriers which have two electronic components which are arranged separately in the data carrier but are electrically connected to one another.
  • the invention relates to the data carriers as such, as well as semi-finished products and contact layouts for them, and methods for their production.
  • the antenna device is laid, for example, as a coil on a layer inside the card, in the so-called card inlay, and has two contact pads that are electrically conductively connected to two corresponding contact surfaces on the underside of a chip module containing the chip.
  • the card inlay is laminated with one or more additional layers, so that the surface of the card inlay that carries the antenna device is inside the card.
  • a cavity is then milled into the card body, into which the chip module is inserted.
  • the chip can communicate both contactlessly via the antenna device and with contact via further exposed contact surfaces of the chip module.
  • the connection pads of the antenna coil are also exposed.
  • a silicon compound with metallic particles can serve as a connection between the contact pads of the antenna coil and the contact surfaces of the chip module above it Flex Bump Technology).
  • an electrically conductive soldering paste is applied to the respective contact pad of the antenna device instead of the silicon mass and liquefied in a local melting process so that it creates a reliable electrically conductive connection to the contact surfaces of the chip module, which becomes permanent when the solder cools down (for example in the so-called TeConnect process from Mühlbauer).
  • the contact pads of the antenna device are provided with an anisotropically conductive foil (ACF).
  • an electronic card-shaped data carrier can have other electronic components, in particular sensors such as a fingerprint sensor.
  • sensors can be used to identify an authorized user and to activate the cards. Just like the antenna coil, they must be electrically connected to the chip on the chip card in order to be able to communicate with the chip. This can be done in the same way as previously explained in relation to the antenna device.
  • first contact pads of the card inlay for contacting a first electronic component must therefore be connected in an electrically conductive manner to one or more second contact pads for contacting a second electronic component.
  • the contact pads and the electrically conductive connections between the contact pads are made by one and the same wire to reduce the manufacturing effort, by meandering or zigzagging the relevant wire in the area of the contact pads - is laid in a jagged pattern on the card inlay in such a way that the contact pad is sufficiently densely covered with the wire so that contact can be reliably made from above.
  • the wire is laid with the support of ultrasound so that it digs into the surface of the card inlay and does not damage the thickness of the card body. influences
  • the wire itself is usually plastic-coated, with the plastic coating in the area of the contact pads being removed during free milling.
  • the object of the present invention is therefore to provide a solution in this context as to how two contact surfaces of one of these two components and a contact pad of the other component can be reliably electrically conductively connected to one another in a card-shaped data carrier with several electronic components that are electrically conductively connected to one another .
  • a contact layout of a corresponding multilayer card-shaped data carrier has a first contact pad for connecting a first electronic component and preferably at least two second contact pads for connecting a second electronic component, as well as electrically conductive connections on the one hand between the first contact pad and a first of the second contact pads and on the other hand between the first of the second contact pads and a second of the second contact pads.
  • the contact pads mentioned are each formed by a meandering wire and are also referred to below as wire pads.
  • a continuous wire is used for this purpose, which forms both the mentioned contact pads and the electrically conductive connection.
  • This wire is laid in the first of the second contact surfaces as a double meander, namely preferably in such a way that a first part of the wire forms first meander loops lined up in a first direction and an adjoining second part of the continuous wire forms second meander loops lined up in an opposite direction of passage, wherein the first and second meander loops are nested within each other.
  • the interlocking feed and return of the double meandering wire forms an "interdigital structure".
  • the double meander allows the wire to run in the wire pad in such a way that the end of the wire entering the contact pad and the end of the wire leading out of the contact pad are at the same end of the contact pad.
  • the contact pad is then arranged in the card body in such a way that the opposite end of the contact pad faces the cavity to be milled out, it does not damage the electrical connection between the first and the second contact pad if the contact pad with a double meander shape falls out when the cavity is milled out is milled. Because the fact that when the contact pad laid in a double meandering pattern comes into contact with an associated contact surface of the (second) electronic component, an electrical connection is always established between the end of the wire leading into the contact pad and the end of the wire leading out of the contact pad is an interruption of the wire in the area of the contact pad is not critical.
  • a corresponding method for producing this contact layout accordingly comprises the following steps:
  • the "continuous wire” is also to be understood as a continuous wire if the wire is interrupted between the first part of the wire forming the first meander loops and the second part of the wire forming the second meander loops, because - as will be explained below - The wire is separated anyway in a later step at this point.
  • the contact pads for connecting the first and second electronic components and the electrically conductive connections between the contact pads are formed by two continuous wires.
  • the first continuous wire forms the (at least one) first contact pad for the first electronic component and the first of the (at least two) two contact pads for the second electronic component and a connecting line between these two contact pads.
  • the second wire forms the second of the second contact pads and a connection line led out therefrom.
  • an electrically conductive connecting element is provided, which “overlays” the connecting line formed by the first wire and the connection line formed by the second wire and connects them to one another in an electrically conductive manner.
  • the electrically conductive connecting element can cover the area of the connecting line of the first continuous wire and the area of the connecting line of the second continuous wire from above.
  • the electrically conductive connecting element can first be provided on the card inlay and both the laying of the first continuous wire in the area of the connecting line and the laying of the second continuous wire in the area of the connection line can be carried out, in each case over the electrically conductive connecting element. follow, so that the electrically conductive connection element lies under the continuous wire and the connection line.
  • the electrically conductive connecting element is preferably metallic, in particular copper, and the electrically conductive connection between the electrically conductive connecting element and the connecting line of the first continuous wire on the one hand and between the electrically conductive connecting element and the connecting line of the second continuous wire on the other hand is a welded connection.
  • the welded joint in turn is preferably a thermocompression welded joint, in which metal is welded to metal by welding the metallic, electrically conductive connecting element to the respective wire.
  • the thermocompression welding is in turn preferably carried out with the aid of ultrasound. In the process, both any plastic coating of the wires and any oxide layer of the metalli's electrically conductive connecting element are rubbed away before the elements ultimately weld together.
  • the area of the connecting line of the first continuous wire and the area of the connecting line of the second continuous wire, which are to be connected to one another by means of the electrically conductive connecting element are so close together that the electrically conductive connection between the connecting element and the connecting line on the one hand and between the connecting element and the connecting line on the other hand as a common connection point, in particular as a continuous welded connection, which can advantageously be produced in a single process step, e.g. by thermocompression welding.
  • a thin copper element or another electrically conductive element is preferably used as the connecting element, particularly preferably a metalized film, for example a PVC film or another suitable plastic film.
  • a corresponding method for producing the contact layout described above can include the following steps:
  • first continuous wire Laying a first continuous wire on the plastic substrate to create at least one first contact pad for connecting a first electronic component and a first of at least two second contact pads for connecting a second electronic component and for creating a connecting line between these two contact pads, the first continuous wire is laid in a meandering pattern in the contact pads mentioned,
  • an electrically conductive connecting element in such a way that it either covers both an area of the connecting line of the first continuous wire and an area of the connecting line of the second continuous wire or that both the laying of the first continuous wire in the area of the connecting line and the laying of the second continuous wire wire in the area of the connection line only after the application of the electrically conductive connection element and in each case via the electrically conductive connection element, and electrically conductive connection of the electrically conductive connection element both to the first continuous wire in the area of the connection line and to the second continuous wire in the area of the connecting cable.
  • a third aspect of the present disclosure also provides that the contact pads and the electrically conductive connections between them are produced by means of two continuous wires.
  • the first continuous wire forms the (at least one) first contact pad for the first electronic component and the first of the (at least two) second contact pads for the second electronic component and a connecting line between these two contact pads.
  • the electrically conductive connection is not established by means of an additional electrically conductive connection element, but instead the first continuous wire forms an additional meandering contact pad in a region of its connecting line, and this additional meandering contact pad overlaps with the contact pad formed by the second wire formed connection line.
  • the electrically conductive connection between the second wire and the first wire in the area of the additional meandering contact pad is again preferably a thermocompression welded connection, in which the wires are welded directly to one another, optionally again with the aid of ultrasound.
  • the additional contact pad is preferably shifted towards the adjacent contact pad for the second electronic component or towards the adjacent contact pad for the first electronic component, so that these two contact pads together form large contact pad, which is preferably at least 50% larger than a normal contact pad, in particular than the other contact pad for the second electronic component or as another or all other contact pads for the first electronic component.
  • a corresponding method for producing the contact layout described above can include the following steps:
  • first continuous wire Laying a first continuous wire on the plastic substrate to produce at least one first contact pad for connecting a first electronic component and a first of at least two second contact pads for connecting a second electronic component and for create a connecting line between these two contact pads, with the first continuous wire being laid in a meandering pattern in the contact pads mentioned and forming an additional meandering contact pad in one area of the connecting line,
  • Second continuous wire Laying a second continuous wire on the plastic substrate to produce a second of the second contact pads and a connecting line leading out therefrom, the second continuous wire being laid in a meandering manner in the second of the second contact pads, and the first and the second continuous wire being laid in this way that the connecting line formed by the second continuous wire and the additional meandering contact pad formed by the first continuous wire overlap one another, and electrically conductively connecting the connecting line formed by the second continuous wire and the additional meandering contact pad formed by the first continuous wire overlap area.
  • the additional wire pad can also be dispensed with and the connection line can be directly superimposed on the first of the second contact pads or on the at least one first contact pad, and the electrically conductive connection can be made in the superimposed area.
  • the electrically conductive connection between the two contact pads for the second electronic component is formed by an electrically conductive soldering material, which preferably connects them to one another in a direct line at the contact pads.
  • a corresponding method for producing the contact layout described above can include the following steps:
  • first continuous wire Laying a first continuous wire on the plastic substrate to create at least one first contact pad for connecting a first electronic component and a first of at least two second contact pads for connecting a second electronic component and for creating a connecting line between these two contact pads, the first continuous wire is laid in a meandering pattern in the contact pads mentioned,
  • two contact pads for the second electronic component are not electrically conductively connected to one another, but rather two contact surfaces of the electronic component itself are electrically conductively connected.
  • the contact layout on the card inlay in turn comprises a first contact pad for connecting a first electronic component and at least one second contact pad for connecting a second electronic component and an electrically conductive connection between the first contact pad and the second contact pad. Said contact pads are preferably again each formed by a meandering wire.
  • the second electronic component has at least two contact surfaces that are to be short-circuited. This requires an electrically conductive border connection between the two contact surfaces of the second electronic Component provided by means of an electrically conductive material, which is applied to the two contact surfaces and connects them directly to each other. The electrically conductive connection is thus pre-assembled on the relevant electronic component before it is inserted into the card body, and is not produced on the card inlay.
  • This fifth aspect of the present disclosure is particularly suitable for the production of cards in which the contact between the contact pads on the card inlay and the associated contact surfaces of the electronic components takes place by means of an anisotropically conductive film (ACF connection technology).
  • the electrically conductive material directly connecting the two contact surfaces of the second electronic component is preferably a preferably uninsulated wire or alternatively a line of isotropic conductive paste that may have to harden, or a line of isotropically conductive plastic .
  • the latter alternatives have the advantage that they have less impact on the thickness of the card body to be manufactured.
  • the result is a semi-finished product that includes the contact layout and at least the second electronic component, which are preferably electrically conductively connected to one another by means of an ACF film.
  • a method for producing the above-described semi-finished product according to the fifth aspect of the present disclosure can include the following steps:
  • the contact layout or the surface of the plastic layer on which the contact layout is prepared ultimately lies as a card inlay inside the final multilayer card-shaped data carrier.
  • the card inlay layer is laminated with further layers, namely at least one artwork layer covering the contact layout, which is printed or otherwise provided with a design and information, and if the back of the card inlay layer is provided with a similar design or information, preferably one corresponding artwork layer on the back of the card inlay layer.
  • a transparent protective layer can be provided either as a transparent film or as a transparent protective lacquer, in order to form the multi-layer card body for the card-shaped data carrier, in which the contact layout and the electronic components that are electrically connected to one another are integrated.
  • a corresponding multiplicity of areas of a multi-use sheet for example a PVC film
  • a suitable metal in particular copper
  • a corresponding multi-use sheet namely at least one such metallic coated area per card of the Mehmutzenbogen.
  • Fig. 2A shows a sectional view of the chip card shown in Fig. 1 (for e.g. TeConnect or Flex-Bump),
  • Fig. 2B shows a sectional view of the chip card shown in Fig. 1 (for e.g. ACF),
  • FIG. 3 shows a contact layout according to a first aspect of the disclosure
  • FIGS. 4 and 5 show two variants of a contact layout according to a second aspect of the present disclosure
  • FIGS. 6A and 6B show two contact layouts according to a third aspect of the present disclosure
  • FIG. 7 shows a contact layout according to a fourth aspect of the present disclosure
  • FIGS 8a, 8b two alternatives of an electronic component
  • FIG. 9 shows a chip card produced using the component shown in FIG. 8a or 8b.
  • FIG. 1 shows such a data carrier in a schematic top view.
  • the card body 1 of this chip card contains a coil element 3, which serves as a transmission and Receiving antenna for a figuratively not shown, integrated circuit egg Nes chip module 2 is used.
  • the coil element 3 is completely embedded in the card body. To illustrate the position of the coil element 3 in the card body, the coil element 3 is shown schematically in FIG.
  • the chip module 2 is inserted in a recess in the card body and is electrically connected to the coil element 3 via contact areas 8 provided on the underside of the chip module 2 .
  • a capacitive coupling surface or another transmission element can also be provided as an antenna.
  • FIG. 2A shows the chip card shown in FIG. 1 in a sectional representation when the chip module 2 is inserted into a two-stage cavity 5 of the card body 1.
  • the section was made along the line AB drawn in FIG. To better illustrate the details, the entire chip card is not shown, but only an enlarged section of the chip card.
  • the card body 1 has a multi-layered structure and comprises at least one card inlay 11 with the coil element 3 arranged thereon, including contact pads 4, a cover layer 12, which can be designed as an artwork layer and is accordingly printed on its upper side, for example, and optionally transparent protective layers 13A, 13B , which here form the outer layers of the card body.
  • the protective layers 13A, 13B can be provided as a lacquer layer or as a film.
  • the inlay layer 11 can be performed as an artwork layer on the back, just like the cover layer 12, or there can be an additional artwork layer between the inlay layer
  • the film layers 11 and 12A may be provided.
  • the film layers 11 and 12A may be provided.
  • a two-stage recess 5 with a shoulder area 5a is milled into the card body 1, into which the chip module 2 is inserted from above.
  • the chip module 2 is typically fitted into the recess 5 within the applicable technical tolerances in such a way that the surface of the chip module 2 is flush with the surface of the card body 1 and the contact surfaces 8 on the underside of the chip module 2 are opposite those exposed by milling and thereby partially Abtra own contact pads 4 of the coil element 3 come to rest.
  • the recess 5 is dimensioned so that they can accommodate the chip module 2 together with a potting compound 9 that surrounds an integrated circuit 10 .
  • the mechanical connection between the chip module 2 and the card body 1 can be made, for example, with the help of a thermoactivated fourtable adhesive 6, the z. B. on the underside of the chip module 2 next to the contact surfaces 8 is applied.
  • the electrical connection between the chip module 2 and the coil element 3 contained in the card body 1 can be made by means of a conductive elastomer 7 (e.g. Flex-Bump from Mühlbauer), which is applied to the contact pads 4 of the coil element 3.
  • a conductive elastomer 7 e.g. Flex-Bump from Mühlbauer
  • the conductive elastomer is preferably a silicone mass with metallic particles, which remains elastic after curing and thus forms a reliable electrically conductive connection with the contact surfaces 8 of the chip module 2 resting on the silicone mass from above (so-called flex bump technology). .
  • an electrically conductive soldering paste can be applied to the respective contact pad 4 of the coil element 3 and liquefied in a local melting process, so that the soldering paste creates a reliable electrically conductive connection to the contact surfaces 8 of the chip module 2, which is permanent by cooling the solder (TeConnect procedure).
  • the contact pads 4 of the coil element 3 are provided with an anisotropically conductive film 7' (ACF film).
  • ACF film anisotropically conductive film 7'
  • the corresponding map structure is shown in Figure 2B.
  • the ACF film 7' is a hot-melt plastic material with conductive particles distributed in it, which means that the film only conducts electricity perpendicularly to the contact pad 4, so that the film can also be applied over a large area over several contact pads 4, without these contact pads 4 electrically short circuit.
  • the ACF film 7' is typically applied flat to the underside of the chip module.
  • FIG. 1 shows two contact surfaces 17A, 17B of the second electronic component 15, which is connected to one of the contact surfaces 8 via electrically conductive connections 16 in each case.
  • FIG. 1 shows a further contact area 17C on the underside of the second electronic component 15, corresponding to the contact areas 8 of the chip module 2 in FIG. 2A.
  • the various aspects described below are concerned with producing an electrically conductive connection between the contact surfaces 17B and 17C of the second electronic component 15 .
  • All exemplary embodiments described below have in common that the contact layout on the inlay layer 11 is formed by wires that are embedded in the surface of the inlay layer 11 . To do this, the wire is laid on the inlay layer and subjected to ultrasound so that it digs into the surface due to the vibrations generated.
  • Contact pads of the contact layout are produced by laying the wire in a meandering or zigzag manner, and the electrically conductive connections 16 between the contact pads are also formed by the wire from which the pads were also made.
  • This part of the contact layout 20 includes, on the one hand, two contact pads 4 and 14B, which are electrically connected by means of the connecting line 16 and are formed by a continuous wire, the wire running in a meandering manner in the area of the contact pads 4 and 14B.
  • a third contact pad 14C which is used to make contact with the contact surface 17C of the second electronic component 15 shown in FIG.
  • the same wire used to connect the contact pads 4, 14B and the electrically conductive connection Rankg 16 is formed, leads out of the contact pad 14B to the contact pad 14C and is also laid there in a meandering manner in order to form the contact pad 14C.
  • all contact pads 4, 14B, 14C and the connecting lines 16 are formed by a continuous wire.
  • the wire is laid as a double meander in the area of contact pad 14B and, on the other hand, preferably leads out on that side of contact pad 14B where connecting line 16 leads into contact pad 14B.
  • the contact pads 14B and 14C are located in the shoulder area 5a of the two-stage recess 5 shown in Figure 2B 3 is indicated by a frame shown in dashed lines, a part of the contact pad 14B is milled away. The wire is severed in the area of the contact pad 14B and initially no longer leads to the other contact pad 14C.
  • this contact pad 14B is then connected to an assigned contact surface 17B of the electronic component 15 when the electronic component 15 is inserted, for example by means of an electrically conductive adhesive or solder or via an electrically conductive ACF film, then the nested meander loops of the short-circuited by the wire laid as a double meander, so that an electrically conductive connection to the contact pad 14C is also established again.
  • the double meander is preferably laid in such a way that a first part of the continuous wire forms first meander loops lined up in a first direction and a subsequent second part of the continuous wire forms second meander loops lined up in an opposite direction of passage, so that the first and second meander loops are nested in each other.
  • the connections 16 to the contact pads 4 and 14C preferably enter the contact pad 14B at locations which are as far away from the recess 5 as possible, preferably on the side of the contact pad 14B pointing away from the recess 5.
  • FIGS. 4 and 5 each again show part of a contact layout 20 applied to the inlay layer 11 in a schematic top view.
  • the contact layout includes a first contact pad 4 for connecting a first electronic component, for example the chip module 2, and at least two contact pads 14B, 14C for connecting the second electronic component 15 and an electrically conductive connection 16 between the first contact pad 4 and the first of the second contact pads 14B and a further electrically conductive border connection 18, 19 between the contact pad 14B and the further contact pad 14C, the contact pads each being formed by a meandering wire.
  • the second contact pad 14C is formed by its own continuous wire, which forms a connection line 18 leading out from the contact pad 14C, which, however, does not lead directly to the first contact pad 14B.
  • an electrically conductive connecting element 19 is provided in such a way that it overlies and connects a portion of the connecting line 16 between the contact pads 4 and 14B and a portion of the connecting line 18 .
  • the connecting element 19 can be a metallic element or a metallised element, for example a piece of copper or a thin copper foil or a metallised plastic foil, for example a PVC foil, particularly preferably a copper-coated plastic foil. It is possible first to apply the connecting element 19 to the inlay layer 11 and then to lay the respective continuous wires in the area of the connecting line 16 and connecting line 18 over it, or first to lay the wires and then to lay the connecting element 19 over the connecting line 16 and Connecting line 18 to pla decorate.
  • the electrical connections between the electrically conductive connec tion element 19 and the connecting line 16 and connecting line 18 are indicated in Fig. 4 by two ellipses and are preferably made by thermocompression welding.
  • thermocompression welding is preferably carried out with the aid of ultrasound, with both a plastic coating of the wires and any oxide layer of the metallic electrically conductive connecting element 19 being rubbed away before the elements ultimately welded together.
  • the exemplary embodiments according to Figures 4 and 5 differ only insofar as the connecting line 16 and the connecting line 18 in the exemplary embodiment according to Figure 5 are so close together that a single welded connection (indicated by only an ellipse in Fig. 5) is sufficient to weld both To connect lines 16, 18 with the connecting element 19 electrically lei tend.
  • a separate welded connection is produced for the connection of the connecting element 19 to the connecting line 16 on the one hand and to the connecting line 18 on the other hand.
  • the electrically conductive connecting elements 19 for a plurality of chip cards on a correspondingly large-format plastic film which forms the inlay layer 11, the electrically conductive connecting elements being provided as a metallic coating in some areas at the appropriate points are where an electrically conductive connection between adjacent lines 16,
  • FIGS. 6A and 6B which in turn each show a part of a contact layout 20 applied to the inlay layer 11 in a schematic plan view.
  • the solution according to the third aspect is similar to that of the second aspect.
  • a fourth wire pad 21 is provided in addition to the connection pads 4, 14B and 14C designed as wire pads, namely as part of the connecting line 16.
  • the connecting lines 16 and the associated wire pads are corresponding 4, 21 and 14B formed by a continuous wire.
  • the connection line 18 leading out of the connection pad 14C is laid above or below the fourth wire pad 21, depending on which of the two wires is laid first.
  • connection line 18 and the fourth wire pad 21 preferably again by thermocompression welding. This is indicated by an ellipse in FIG. 6A.
  • the advantage of this solution compared to the solution according to the second aspect described above is that no additional material in the sense of another separate element is required to establish the connection between the two wires, so that the thickness of the inlay layer 11 with the contact layout 20 located thereon is not increased compared to the initially explained double meander solution.
  • FIG. 6B shows an alternative to the exemplary embodiment from FIG. 6A in such a way that the additional fourth wire pad 21 is shifted towards the contact pad 14B and preferably forms an enlargement of the contact pad 14B.
  • This enlargement is preferably at least 50% and can be approximately 100%, as shown in the exemplary embodiment according to FIG. 6B.
  • the additional fourth wire pad 21 can be shifted towards the contact pad 4 and preferably form an enlargement of the contact pad 4, so that the contact pad 4 is preferably at least 50% and in particular, for example, 100% larger than a or all other contact pads 4 for contacting the first electronic component or for contacting the chip module 2.
  • Relocating the fourth wire pad 21 to the wire pad 14B or the wire pad 4 offers the advantage that its visibility on the surface of the finished chip card is reduced.
  • FIG. 7 which schematically shows the data carrier 1 in plan with a set therein a first electronic component, here the chip module 2, and a second electronic component 15, which is in the two-stage recess 5 of the card body 1 is still to be used.
  • the boxes 4 and 17A to 17C shown on the electronic components 2 and 15 represent connection surfaces of the electrical components concerned, including the connection surface 17C already mentioned with reference to FIG a connecting line 16 with an associated pad 4 of the other electronic components te 2 is to be electrically conductively connected.
  • connecting lines 16 run inside the card body 1 on an inner surface of an inlay layer.
  • the two-stage recess 5 including the shoulder area 5a is milled out of the card body 1, and local depressions are milled in the shoulder area 5a for the case of the connection technology described in Figure 2A using solder (TeConnect) or conductive elastomer (Flex-Bump) in order to associated contact pads 14A, 14B to expose. If the connection technique using ACF foil is used, the design of the depressions is analogous to FIG. 2B. In addition, another contact pad 14C is exposed. All of the contact pads are wire pads, as previously described, and the connection lines 16 are formed as a continuous wire with the respective contact pad 14A and 14B.
  • the con tacting between the contact pads 14A, 14B, 14C on the one hand and the associated contact surfaces 17A, 17B, 17C of the second electronic component 15 on the other hand can be done for example in the flex bump technology by means of a solder paste (e.g. TeConnect) or by means of ACF Foil, also as previously explained.
  • a solder paste e.g. TeConnect
  • ACF Foil also as previously explained.
  • the contact pads 14B and 14C are electrically connected to one another in such a way that the solder paste, or in the case of flex bump technology, the electrically conductive plastic mass, not only in the area of the contact pads 14B and 14C is applied, but also that an electrically conductive connection 22 is produced directly between the two contact pads 14B and 14C.
  • the shoulder 5a of the second-stage depression 5 is not only milled away in the area of the contact pads 14B and 14C, but a connecting channel is also milled in between, in which the solder paste or the electrically conductive plastic is then laid along a continuous line, in order to connect the two contact pads 14B and 14B 14C to be electrically conductively connected.
  • the solder paste or the electrically conductive plastic is isotropic in terms of electrical conductivity.
  • FIG. 8A and 8B each show a schematic top view of two exemplary embodiments of the second electronic component 15. This can be inserted into the card body 1 in the same way as explained with reference to FIG. 7 and shown in FIG .
  • the difference from the fourth aspect described above is that the additional contact pad 14C of the contact layout or the inlay layer can be dispensed with.
  • the material for producing the conductive connection between the two contact surfaces 17B and 17C of the electronic component 15 in FIG. 8A is a simple, preferably uninsulated wire 23.
  • Conductive paste 24 provided. Conductive paste means all materials that can be applied in any way to enable an electrical connection between two contact pads. This can be solder, for example, or a paste filled with metallic particles of any shape, as well as carbon or other electrically conductive materials.
  • the conductive paste hardens or dries before the electronic component 15 is inserted into the card body 1 . Then only a one-to-one wire connection needs to be made on the card inlay between the respective contact pads 4 and 14A, 14B of the electronic components 2 and 15 to be connected to one another which are preferably formed again by means of a continuous wire, which meanders in the area of the contact pads.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention propose plusieurs variantes de connexion électrique de deux composants électroniques (2, 15) d'une carte à puce l'un à l'autre. Selon l'invention, deux bornes de contact d'un des deux composants électroniques (15) sont connectées électriquement l'une à l'autre directement ou par l'intermédiaire de plages de contact (14B, 14C) associées à l'intérieur du corps de carte (1).
EP22726424.9A 2021-05-04 2022-04-28 Carte porteuse de données, produit semi-fini, agencement de câblage associé et procédé de production associé Pending EP4334841A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP24180889.8A EP4404101A3 (fr) 2021-05-04 2022-04-28 Support de données sous forme de carte, produit semi-fini et disposition de contacts pour celui-ci, et procédé pour sa fabrication

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102021111570 2021-05-04
DE102022109547.9A DE102022109547A1 (de) 2021-05-04 2022-04-20 Kartenförmiger Datenträger sowie Halbzeug und Kontaktlayout dafür, und Verfahren zur Herstellung derselben
PCT/EP2022/061403 WO2022233716A1 (fr) 2021-05-04 2022-04-28 Carte porteuse de données, produit semi-fini, agencement de câblage associé et procédé de production associé

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP24180889.8A Division EP4404101A3 (fr) 2021-05-04 2022-04-28 Support de données sous forme de carte, produit semi-fini et disposition de contacts pour celui-ci, et procédé pour sa fabrication

Publications (1)

Publication Number Publication Date
EP4334841A1 true EP4334841A1 (fr) 2024-03-13

Family

ID=82404488

Family Applications (2)

Application Number Title Priority Date Filing Date
EP24180889.8A Pending EP4404101A3 (fr) 2021-05-04 2022-04-28 Support de données sous forme de carte, produit semi-fini et disposition de contacts pour celui-ci, et procédé pour sa fabrication
EP22726424.9A Pending EP4334841A1 (fr) 2021-05-04 2022-04-28 Carte porteuse de données, produit semi-fini, agencement de câblage associé et procédé de production associé

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP24180889.8A Pending EP4404101A3 (fr) 2021-05-04 2022-04-28 Support de données sous forme de carte, produit semi-fini et disposition de contacts pour celui-ci, et procédé pour sa fabrication

Country Status (3)

Country Link
US (1) US20240242054A1 (fr)
EP (2) EP4404101A3 (fr)
WO (1) WO2022233716A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10258801A1 (de) * 2002-12-16 2004-07-22 Siemens Ag Verfahren und Vorrichtung zum Aufbringen eines pastenartigen Materials auf elektronische Bauelemente, Bestückvorrichtung
CN102629337A (zh) * 2012-04-12 2012-08-08 上海祯显电子科技有限公司 一种微型智能标签
DE102012211546B4 (de) * 2012-07-03 2017-02-16 Morpho Cards Gmbh Chipkarte mit bei Raumtemperatur pastenförmiger oder flüssiger Kontaktierung
US10318852B2 (en) * 2014-11-10 2019-06-11 Golden Spring Internet Of Things Inc. Smart card simultaneously having two read/write modes and method for producing same
EP3159832B1 (fr) * 2015-10-23 2020-08-05 Nxp B.V. Jeton d'authentification

Also Published As

Publication number Publication date
WO2022233716A1 (fr) 2022-11-10
EP4404101A3 (fr) 2024-10-16
US20240242054A1 (en) 2024-07-18
EP4404101A2 (fr) 2024-07-24

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