WO1997023843A1 - Procede de production d'une carte a puces pour utilisations sans contact - Google Patents

Procede de production d'une carte a puces pour utilisations sans contact Download PDF

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Publication number
WO1997023843A1
WO1997023843A1 PCT/CH1996/000448 CH9600448W WO9723843A1 WO 1997023843 A1 WO1997023843 A1 WO 1997023843A1 CH 9600448 W CH9600448 W CH 9600448W WO 9723843 A1 WO9723843 A1 WO 9723843A1
Authority
WO
WIPO (PCT)
Prior art keywords
label
coupling means
integrated circuit
card
chip
Prior art date
Application number
PCT/CH1996/000448
Other languages
German (de)
English (en)
Inventor
Werner Hottinger
Original Assignee
Sempac Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sempac Sa filed Critical Sempac Sa
Priority to KR1019980704791A priority Critical patent/KR19990076679A/ko
Priority to JP52318197A priority patent/JP2001521649A/ja
Priority to AU10288/97A priority patent/AU1028897A/en
Priority to PL96327234A priority patent/PL327234A1/xx
Priority to EP96940980A priority patent/EP0868706A1/fr
Priority to BR9612185-8A priority patent/BR9612185A/pt
Publication of WO1997023843A1 publication Critical patent/WO1997023843A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07788—Antenna details the antenna being of the capacitive type

Definitions

  • contactless chip cards In addition to the known chip cards, which have a contact field on the outside and communicate via this with a (writing and) reading device, so-called contactless chip cards have also been proposed in various ways. With these, at least for data exchange, no galvanic contact connection between the card and the reader is required, but instead a wireless transmission takes place with the aid of coupling means built into the card and the reader. Depending on the application, a distinction is made between close transmission, in which the card has to be inserted into a reading device, and transmission over medium or large distances (remote coupling), which "go by" communication, ie without the introduction of the Card allowed in a reader.
  • a first proposal provides for a laminate structure of the card from several welded layers (including printed cover foils or labels), an inner substrate foil with conductor tracks including two small transmission coils (for short-range transmission) and equipped with chips; a ring surrounding a chip apparently serves as mechanical protection (see publication mentioned above, pp. 75, 76, fig. 8 right and fig. 10).
  • the large-area welding appears problematic with regard to the embedded chips as well as the printed outer films.
  • Another proposal provides for a single 4x4 mm chip with a hybrid circuit and a high frequency antenna coil attached to the back of the chip.
  • the card consists of a multilayer film stack, the chip having to be inserted into a recess in a film lying inside (Jurisch, R.: m ⁇ c3 - the new contactless chip card technology. Card-Forum 1995, No. 3, pages 82- 84).
  • the above reservations apply; but above all, the chip only offers a very limited area for the antenna coil, which in any case could exclude applications with remote transmission.
  • the present invention relates to a method for producing a chip card, in which inductive and / or capacitive Coupling means for contactless power and / or data ⁇ transmission and connected to the coupling means integrated circuit means (in the form of at least one chip and / or an electronic module) are provided, and wherein at least one outer face of the card is formed by a label.
  • the method according to the invention is intended to enable the rational, cost-effective and reliable series production of contactless chip cards, taking into account the special requirements of the coupling means for contactless operation and avoiding the expensive special chips caused by the manufacturing process as far as possible.
  • electrically conductive connections between the coupling means and the integrated circuit means in the injection mold are produced by mechanical contact pressure, electrically conductive adhesive and / or by low-melting solder.
  • the labels used are preferably already printed on the outer side, but blank labels can also be used and the finished cards can be subsequently printed if necessary. Both coils and capacitor covering, means for inductive and capacitive coupling can also be included in the same card.
  • an electronic module is understood to mean a manufactured unit which is to be inserted into the card and which has at least one chip with a protective sheath and connecting contacts. If a label is provided on each outside of the card, both labels or only one of the two can be prepared for insertion into the mold in the manner specified.
  • the label which is generally required anyway, advantageously has a double function.
  • the coupling means can be designed in numerous variations and arranged on the label, so that handling - such as stacking and unstacking and insertion into the mold - is not hindered. Practically the entire label or card area is available for the coupling means, so that coil areas and number of turns, which are required for remote transmission, or capacitor coverings for capacitive coupling can also be realized. Devices (manipulators) are available for precisely inserting the modules or chips into the mold, which are already preserved during the production of conventional chip cards. Injection molding, in turn, is a rational process technology for the production of chip cards and ensures gentle and at the same time solid embedding of chips and modules in the card body.
  • 1 to 4 show various examples of labels with coupling means arranged on the inside thereof, which - after being introduced into the injection mold - are equipped or integrated with integrated circuit means in different ways
  • 5 shows in section a part of an injection mold with labels inserted therein and integrated circuit means, prepared for the injection molding process.
  • FIGS. 1-4 each show the inside of a label 1 as used for the production of chip cards in order to form an outer surface of the card.
  • a label 1 is a plastic film from e.g. 0.1mm thickness in card format, which usually serves as a font and / or image carrier. Both of the outer surfaces of the chip card are often formed by such a label.
  • the outside of the label which is not visible in the figures, is preferably already printed, but subsequent printing of the finished card is also possible.
  • coupling means 3, 6, 8 for contactless card operation are applied to the side of the label facing away from the outside.
  • the label 1 prepared in this way is inserted into the lower part 20 of an injection mold (see also FIG. 5).
  • Integrated circuit means in the form of semiconductor chips 2, 2 'or electronic modules 12, 12' are also shown.
  • these have been provided separately and introduced into the injection mold above the label 1.
  • the contact points (4 'in FIG. 1) have been positioned with the aid of a manipulator, not shown, over connections of the coupling means and have been contacted with them.
  • the aforementioned procedure also applies to the embodiment variants according to FIGS. 2 to 4 described further below.
  • a coil for inductive coupling is wound as a flat wire coil 3.
  • the spool has a rectangular shape adapted to the card format and is glued to the edge of the label 1.
  • the chip 2 shown separately on the right with its “underside” is provided with contact points 4 1 (bond pads) for the coil 3.
  • the coil ends can be connected to the chip 2 via connections 4 and optionally a wire bridge 5, the connections 4 being located on the label 1 and being in contact with the mentioned contact points 4 'of the chip 2.
  • the chip 2 can also be glued to the label 1.
  • a coupling coil 6 with the required number of turns in the form of a printed circuit on the label 1 has been produced.
  • the coil ends 7 can at the same time be appropriately shaped for direct contacting of a chip 2.
  • the chip can advantageously be positioned lying across the windings of the coil 6, so that a special transfer of the one coil end is omitted. If the side of the chip 2 facing the coil turns is provided with an insulating passivation layer, no further measures are necessary; if necessary, the coil 6 can also be provided with an insulating coating before the chip 2 is applied.
  • a coupling coil 6, which more or less fills the card format, is applied to the label 1 as a printed circuit.
  • two conductive surfaces 8 have been produced with the same technology within the coil surface as capacitor coverings for capacitive coupling.
  • An integrated circuit (chip 2) is contained in a flat electronics module 12 here. This has contact points in the form of module connections 13 for contacting both the two coil ends and the capacitor coating 8 and is expediently arranged such that it bridges the turns of the coil 6.
  • the integrated circuit means of the card need not be concentrated in a single chip or module, but can, in a manner known per se, be divided into two or more Components are distributed. It is then expedient to apply printed conductor tracks on the label for connecting the components mentioned to one another and / or for connecting the coupling means.
  • a corresponding example is shown in FIG. 4, specifically for a chip card which, in addition to contactless operation, is also intended for connection via galvanic contacts. 4, a module 12 'with contacts 15 and a separate chip 2' are accordingly arranged on the label 1 within a printed coil 6.
  • the chip 2 ' is e.g. a so-called communication chip on which the functions of the wireless data transmission and, if applicable, the feeding of the card circuit are combined. As shown, it can be connected directly to one coil end and to the other coil end via a wire bridge 5.
  • the electronics module 12 ' is of a particularly flat design, the contact field 15 of which lies in the one outer surface of the card for connection to a reading device (similar to the module as described, for example, in EP-A-0 599 194 is).
  • the external contacts 15 have angled "feet" 16, which come to rest on the label 1.
  • the coupling means on the label can be designed according to the requirements of the card system, in particular two coupling coils can also be arranged side by side.
  • both labels can also be provided with coupling means on cards whose two outer surfaces are each formed by a label.
  • Example one or more coils can be applied to one label of the card and capacitor coatings can be applied to the other label, or each of the two labels can be provided with a capacitor coating, etc.
  • the integrated switching means are then available for contacting the coupling means two labels, on both sides with the corresponding Bontakt ⁇ points or module connections.
  • FIG. 5 schematically shows such a shape with the mold halves 20 and 21 and the sprue 22 arranged in the parting plane.
  • the example shown was based on a prepared label according to FIG. 4. This forms the lower label la in the form 20, 21, and a second label lb m the upper mold half 21 has been inserted.
  • This upper label 1b (as is known per se) has a rectangular cutout 18 in which the contact field 15 of the module 12 'comes to lie.
  • the other contacts 17 of the module are not free on the outer surface of the card, but are covered by the lower label la.
  • the card body is finally produced by filling the mold cavity 23 with plastic in the injection molding process.
  • the injected material connects to the inside of the label (s), and at the same time the integrated circuit means are enveloped by the material, i.e. poured into the card body.
  • the finished chip card provided with all the components required for contactless operation, can then be removed from the mold.
  • the high temperatures that occur during injection molding can also be used advantageously for contacting, for example by using a heat-reacting adhesive that is already curing in the mold, or by simultaneously applying pressure and elevated temperature (thermocompression) in the case of metallic contacting.
  • contacting by means of preformed soft solder portions (preforms) is also conceivable, which melt in the injection mold.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne des cartes à puces devant comporter, outre des éléments de commutation intégrés (puce 2 et/ou module électronique 12) et des éléments de couplage (bobine 6, lamelles pour condensateur 8) pour la transmission sans contact d'énergie et/ou de données, au moins une étiquette (1) qui constitue une surface extérieure de la carte. Les éléments de couplage (6, 8) sont appliqués sur la face intérieure de cette étiquette. L'étiquette (1) ainsi obtenue est ensuite introduite dans un moule pour moulage par injection. Les éléments de commutation (12) intégrés préparés séparément sont ensuite positionnés en ajustement précis dans le moule par l'intermédiaire de connexions des éléments de couplage (6, 8) et sont mis en contact avec eux. Pour finir, le corps de la carte est moulé sur l'étiquette (1) par moulage par injection et les éléments de commutation (2, 12) sont simultanément moulés dans le corps de la carte. Des connexions électriques entre les éléments de couplage (6, 8) et les éléments de commutation (12) intégrés sont produites dans le moule même par différents moyens.
PCT/CH1996/000448 1995-12-22 1996-12-19 Procede de production d'une carte a puces pour utilisations sans contact WO1997023843A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1019980704791A KR19990076679A (ko) 1995-12-22 1996-12-19 비접촉식 기술에서 사용하기 위한 칩카드의 제조방법
JP52318197A JP2001521649A (ja) 1995-12-22 1996-12-19 非接触技術を用いたチップカードの製造方法
AU10288/97A AU1028897A (en) 1995-12-22 1996-12-19 Process for producing a chip card for contactless operation
PL96327234A PL327234A1 (en) 1995-12-22 1996-12-19 Method of making a chip card for contactless operation
EP96940980A EP0868706A1 (fr) 1995-12-22 1996-12-19 Procede de production d'une carte a puces pour utilisations sans contact
BR9612185-8A BR9612185A (pt) 1995-12-22 1996-12-19 Processo de fabricação de cartões inteligentes para uso em tecnologia de não-contato.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH365795 1995-12-22
CH3657/95 1995-12-22

Publications (1)

Publication Number Publication Date
WO1997023843A1 true WO1997023843A1 (fr) 1997-07-03

Family

ID=4260727

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1996/000448 WO1997023843A1 (fr) 1995-12-22 1996-12-19 Procede de production d'une carte a puces pour utilisations sans contact

Country Status (12)

Country Link
EP (1) EP0868706A1 (fr)
JP (1) JP2001521649A (fr)
KR (1) KR19990076679A (fr)
CN (1) CN1209210A (fr)
AU (1) AU1028897A (fr)
BR (1) BR9612185A (fr)
CA (1) CA2240503A1 (fr)
CZ (1) CZ197098A3 (fr)
PL (1) PL327234A1 (fr)
TW (1) TW355777B (fr)
WO (1) WO1997023843A1 (fr)
ZA (1) ZA9610816B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002075647A1 (fr) * 2001-03-16 2002-09-26 Koninklijke Philips Electronics N.V. Dispositif electronique portable
US7240847B2 (en) 2004-03-10 2007-07-10 Infineon Technologies Ag Chip card
HRP20010642B1 (en) * 1999-02-04 2010-07-31 Aventis Cropscience S.A. New process for preparing pesticidal intermediates

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6252777B1 (en) 1998-02-13 2001-06-26 Shinko Electric Industries Co., Ltd. IC card and its frame
JP2001043336A (ja) * 1999-07-29 2001-02-16 Sony Chem Corp Ｉｃカード
WO2003077195A1 (fr) 2002-03-11 2003-09-18 Aruze Corporation Carte a circuit integre
US7646305B2 (en) * 2005-10-25 2010-01-12 Checkpoint Systems, Inc. Capacitor strap
US8081078B2 (en) 2007-01-24 2011-12-20 United Security Applications Id, Inc. Universal tracking assembly
RU2009131342A (ru) * 2007-01-24 2011-02-27 Юнайтед Сикьюрити Эпликейшнс Айди, Инк. (Us) Универсальный блок отслеживания

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2548857A1 (fr) * 1983-07-04 1985-01-11 Cortaillod Cables Sa Procede de fabrication en continu d'une carte imprimee
EP0340100A1 (fr) * 1988-04-28 1989-11-02 Schlumberger Industries Procédé de réalisation de cartes à mémoire et cartes obtenues par ledit procédé
EP0647943A1 (fr) * 1993-10-08 1995-04-12 Gay Frères Vente et Exportation S.A. Dispositif à mémoire
EP0649719A1 (fr) * 1993-10-26 1995-04-26 Siemens Aktiengesellschaft Procédé de fabrication de cartes à puce par moulage par injection
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2548857A1 (fr) * 1983-07-04 1985-01-11 Cortaillod Cables Sa Procede de fabrication en continu d'une carte imprimee
EP0340100A1 (fr) * 1988-04-28 1989-11-02 Schlumberger Industries Procédé de réalisation de cartes à mémoire et cartes obtenues par ledit procédé
EP0647943A1 (fr) * 1993-10-08 1995-04-12 Gay Frères Vente et Exportation S.A. Dispositif à mémoire
EP0649719A1 (fr) * 1993-10-26 1995-04-26 Siemens Aktiengesellschaft Procédé de fabrication de cartes à puce par moulage par injection
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HRP20010642B1 (en) * 1999-02-04 2010-07-31 Aventis Cropscience S.A. New process for preparing pesticidal intermediates
WO2002075647A1 (fr) * 2001-03-16 2002-09-26 Koninklijke Philips Electronics N.V. Dispositif electronique portable
US7240847B2 (en) 2004-03-10 2007-07-10 Infineon Technologies Ag Chip card

Also Published As

Publication number Publication date
EP0868706A1 (fr) 1998-10-07
CN1209210A (zh) 1999-02-24
KR19990076679A (ko) 1999-10-15
ZA9610816B (en) 1997-06-24
JP2001521649A (ja) 2001-11-06
CZ197098A3 (cs) 1999-01-13
TW355777B (en) 1999-04-11
CA2240503A1 (fr) 1997-07-03
BR9612185A (pt) 1999-12-28
PL327234A1 (en) 1998-12-07
AU1028897A (en) 1997-07-17

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