EP4308337A1 - Alliage de brasage, pâte à braser et feuille de brasage comprenant un tel alliage de brasage - Google Patents

Alliage de brasage, pâte à braser et feuille de brasage comprenant un tel alliage de brasage

Info

Publication number
EP4308337A1
EP4308337A1 EP22715981.1A EP22715981A EP4308337A1 EP 4308337 A1 EP4308337 A1 EP 4308337A1 EP 22715981 A EP22715981 A EP 22715981A EP 4308337 A1 EP4308337 A1 EP 4308337A1
Authority
EP
European Patent Office
Prior art keywords
maximum
mass fraction
solder alloy
soldering
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22715981.1A
Other languages
German (de)
English (en)
Inventor
Martin KOMMER
Wolfgang Baumann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mapal Fabrik fuer Praezisionswerkzeuge Dr Kress KG
Original Assignee
Mapal Fabrik fuer Praezisionswerkzeuge Dr Kress KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapal Fabrik fuer Praezisionswerkzeuge Dr Kress KG filed Critical Mapal Fabrik fuer Praezisionswerkzeuge Dr Kress KG
Priority to EP24157070.4A priority Critical patent/EP4345182A3/fr
Publication of EP4308337A1 publication Critical patent/EP4308337A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent

Definitions

  • solder alloy solder paste and solder foil containing such a solder alloy
  • the invention relates to a solder alloy, a solder paste with such a solder alloy and a solder foil with such a solder alloy.
  • the invention is therefore based on the object of creating a soldering alloy, a soldering paste with such a soldering alloy and a soldering foil with such a soldering alloy, the disadvantages mentioned being reduced and preferably not occurring.
  • solder alloy comprising:
  • the solder alloy advantageously has a comparatively low melting temperature, in particular in the range from 545° C. to at most 620° C., and can therefore be used at comparatively low temperatures Soldering temperatures, in particular from 560 °C to a maximum of 650 °C, are used. This means that even temperature-sensitive materials such as PCD can be soldered with the solder alloy without the risk of damage. Nevertheless, high shear strengths are achieved, in particular of more than 1,500 Newtons or more than 110 MPa, preferably of up to 315 MPa.
  • the mass fractions of silver mentioned in the context of the present technical teaching are determined wet-chemically, in particular by precipitation titration, in particular in accordance with the ISO 11427:2014 standard in the version applicable on the date determining the seniority of the present property right.
  • the mass fractions of the other elements are determined in the context of the present technical teaching by means of optical emission spectrometry with inductively coupled plasma (ICP-OES), in particular in accordance with the standard SOP 2-EM-551 2018-03 in the rank of the present The version applicable on the day on which property rights are determined.
  • ICP-OES optical emission spectrometry with inductively coupled plasma
  • solder alloy proposed here is free of cadmium.
  • the solder alloy is therefore in particular a Cd-free solder alloy.
  • solder alloy proposed here is a silver-based solder alloy.
  • the solder alloy is therefore in particular an Ag-based solder alloy.
  • solder alloy proposed here is an Ag-based, Cd-free solder alloy.
  • solder alloy proposed here can be used in a variety of ways, in particular for connecting parts of a wide variety of material compositions.
  • the mass fraction of copper is preferably from at least 11% to at most 26%.
  • the mass fraction of silver is at least 40% to at most 60%, preferably at least 50% to at most 60%, and the mass fraction of copper is at least 13% to at most 22%, preferably at least 15 % up to a maximum of 21%.
  • the mass fraction of silver is from at least 42% to at most 58.5%, preferably from at least 54.5% to at most 58%, preferably up to at most 57.5%, preferably up to at most 57%.
  • the solder alloy has a mass fraction of at least 4% to at most 17%, preferably at least 5% to at most 16% of tin.
  • the mass fraction of tin is preferably from at least 6% to at most 14%, preferably up to at most 13.5%.
  • the solder alloy has a mass fraction of at least 0.1% to a maximum of 10%, preferably from at least 3% to a maximum of 7%, preferably from at least 4% to a maximum of 6%, preferably from at least 4.3% % to at most 5.5%, preferably up to at most 5%, of gallium.
  • the solder alloy has a mass fraction of at least 0.1% to at most 16%, preferably at least 2% to at most 15% of indium.
  • the mass fraction of indium is preferably from at least 2.3% to at most 14%, preferably from at least 3% to at most 12%, preferably up to at most 9%, preferably up to at most 5%, preferably from at least 3.3% to at most 4, 5%
  • the mass fraction of indium is preferably from at least 6% to at most 16%, preferably from at least 8% to at most 14%, preferably from at least 9% to at most 12%, preferably from at least 9.7% to at most 11%, preferably up to at most 10.5%.
  • the solder alloy has a mass fraction of at least 4% to a maximum of 17%, preferably from at least 5% to a maximum of 16%, preferably from at least 7% to a maximum of 15%, preferably from at least 8% to a maximum of 14% %, preferably from at least 9% to at most 13.7%, preferably from at least 9.5% to at most 13.5%, of tin, the mass fraction of tin preferably being at least 10% to at most 13%, preferably at least 10.5% to at most 12.7%, preferably from at least 11% to at most 12.5%, preferably from at least 11.5% to at most 12%, preferably 11.7%.
  • the advantages already mentioned are realized in a special way.
  • the solder alloy proves to be very easy to roll while at the same time being not very brittle and having a very high shear strength.
  • the mass fraction of silver is preferably from at least 51% to at most 62%, preferably from at least 54% to at most 60%.
  • the mass fraction of copper is preferably from at least 13.5% to at most 20%, preferably from at least 15% to at most 19%.
  • the mass fraction of zinc is preferably from at least 9% to at most 19%, preferably from at least 11.5% to at most 15.5%.
  • the solder alloy is preferably free of gallium. Alternatively or additionally, the solder alloy is preferably free of manganese. Alternatively or additionally, the solder alloy is preferably free of nickel. Alternatively or additionally, the solder alloy is preferably free of indium.
  • the wording “free of” means in particular that the element designated in this way occurs at most in traces, is preferably not detectable and/or is below the detection limit.
  • the total mass fraction of the elements and impurities occurring in traces is preferably at most 0.15%, preferably at most 0.1%.
  • the total mass fraction of trace elements and impurities is less than 0.15%, preferably less than 0.1%.
  • the mass fraction of a trace element or impurity is at most 0.04%, preferably at most 0.035%, preferably at most 0.01%, preferably at most 0.008%.
  • the mass fraction of a trace element or impurity is less than 0.01%, preferably less than 0.008%, preferably less than 0.005%, preferably less than 0.002%, preferably less than 0.001%.
  • the mass fraction of copper is at least 13% to at most 19%, preferably at least 14% to at most 18.7%, preferably at least 17% to at most 18.5%, the solder alloy a mass fraction of tin of at least 6% to at most 17%, preferably at least 7% to at most 15%, preferably from at least 9% to at most 13%.
  • the mass fraction of silver is preferably from at least 51% to at most 62%.
  • the mass fraction of zinc is preferably from at least 9% to at most 20%.
  • the solder alloy is preferably free of gallium. Alternatively or additionally, the solder alloy is preferably free of manganese. Alternatively or additionally, the solder alloy is preferably free of nickel.
  • the solder alloy is preferably free of indium.
  • the solder alloy has a mass fraction of at least 5% to a maximum of 12%, preferably from at least 5.5% to a maximum of 8%, preferably from at least 6% to a maximum of 7%, preferably at least 6.3% % to a maximum of 6.7% of tin, and a mass fraction of at least 2% to a maximum of 9%, preferably from at least 2.5% to a maximum of 6%, preferably from at least 3% to a maximum of 5%, preferably at least 3.5 % to at most 4.5%, preferably from at least 3.7% to at most 4.3% of indium.
  • the solder alloy proves to be easy to roll while at the same time having a very high shear strength.
  • the mass fraction of silver is preferably from at least 52% to at most 62%.
  • the mass fraction of copper is preferably from at least 13% to at most 23%.
  • the mass fraction of zinc is preferably from at least 9% to at most 19%.
  • the solder alloy is preferably free of gallium. Alternatively or additionally, the solder alloy is preferably free of manganese. Alternatively or additionally, the solder alloy is preferably free of nickel.
  • the mass fraction of zinc is less than 19%, preferably less than 15%, the alloys having a mass fraction of tin that is greater than 5%, preferably greater than 6%, and up to at most 7%, the alloy having a mass fraction of indium of at least 2.3% to at most 9%, preferably at least 3% to at most 4.5%.
  • the mass fraction of silver is preferably from at least 52% to at most 62%.
  • the mass fraction of copper is preferably from at least 13% to at most 23%.
  • the mass fraction of zinc is preferably from at least 9% to at most 19%.
  • the solder alloy is preferably free of gallium. Alternatively or additionally, the solder alloy is preferably free of manganese. Alternatively or additionally, the solder alloy is preferably free of nickel.
  • the solder alloy has a mass fraction of at least 6% to a maximum of 16%, preferably from at least 9% to a maximum of 11%, preferably from at least 9.7% to a maximum of 10.7%, preferably from at least 10 % to at most 10.5% of indium.
  • this solder alloy has a particularly high shear strength.
  • the mass fraction of silver is from at least 37% up to a maximum of 47%.
  • the mass fraction of copper is preferably from at least 11% to at most 21%.
  • the mass fraction of zinc is preferably from at least 18% to at most 28%.
  • the solder alloy is preferably free of gallium.
  • solder alloy has a
  • the mass fraction of silver is preferably from at least 37% to at most 47%.
  • the mass fraction of copper is preferably from at least 11% to at most 21%.
  • the mass fraction of zinc is preferably from at least 18% to at most 28%.
  • the mass fraction of indium is preferably from at least 6% to at most 16%.
  • the solder alloy is preferably free of gallium.
  • solder alloy has a
  • the mass fraction of silver is preferably from at least 37% to at most 47%.
  • the mass fraction of copper is preferably from at least 11% to at most 21%.
  • the mass fraction of zinc is preferably from at least 18% to at most 28%.
  • the mass fraction of indium is preferably from at least 6% to at most 16%.
  • the mass fraction of manganese is preferably from at least 0.1% to at most 10%.
  • the solder alloy is preferably free of gallium.
  • solder alloy has a
  • Solder alloy has a mass fraction of indium that is greater than 7% and no more than 13%, the solder alloy having a mass fraction of at least 3.5% to no more than 5.5% nickel.
  • the mass fraction of silver is preferably from at least 37% to at most 47%.
  • the mass fraction of copper is preferably from at least 11% to at most 21%.
  • the mass fraction of zinc is preferably from at least 18% to at most 28%.
  • the solder alloy is preferably free of gallium. Specific preferred embodiments of solder alloys are described below:
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • a seventh exemplary embodiment of the solder alloy is particularly preferred, in which the solder alloy has the following composition—in mass fractions: - from a minimum of 55.3% to a maximum of 57.3% silver,
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • solder alloy has the following composition—in mass fractions:
  • a melting range of 565° C. to 610° C. could be determined for this thirteenth exemplary embodiment of the solder alloy.
  • a soldering temperature range from 575 °C to 605 °C could be specified.
  • An average shear strength of 176 MPa was determined for a brazed joint with the brazing alloy.
  • solder alloy has the following composition—in mass fractions:
  • a melting range of 590° C. to 615° C. could be determined for this fourteenth exemplary embodiment of the solder alloy.
  • a soldering temperature range from 605 °C to 630 °C could be specified.
  • An average shear strength of 190 MPa was determined for a soldered joint with the solder alloy.
  • solder alloy has the following composition—in mass fractions:
  • a melting range of 590° C. to 615° C. could be determined for this fifteenth exemplary embodiment of the solder alloy.
  • a soldering temperature range from 615 °C to 640 °C could be specified.
  • An average shear strength of 251 MPa was determined for a brazed joint with the brazing alloy.
  • soldering paste which has a solder alloy according to the invention or a solder alloy according to one or more of the exemplary embodiments described above.
  • soldering paste there are in particular the advantages that have already been described in connection with the soldering alloy.
  • the soldering paste preferably has a flux, in particular a hard soldering flux, or a binder. These additives do not affect the melting temperature of the solder alloy and thus also of the solder paste, but rather evaporate during soldering. Suitable fluxes or binders are known per se, so that they will not be discussed in detail here.
  • suitable fluxes include, for example: A flux in accordance with DIN EN 1045:1997-08 in the version of August 8, 1997, flux FH 10 to 12, in particular 181 PF Atmosin from Castolin GmbH in the version that determines the seniority of the present property right date, 1802 PF Atmosin from Castolin GmbH in the composition available on the date determining the seniority of the present intellectual property right, or BrazeTec h 285 from SAXONIA Technical Materials GmbH in the composition available on the date determining the seniority of the present intellectual property right.
  • soldering foil that has a soldering alloy according to the invention or a soldering alloy according to one or more of the exemplary embodiments described above.
  • soldering foil preferably consists of the soldering alloy.
  • the brazing foil is preferably a thinly rolled foil made of the brazing alloy.
  • the soldering foil has a thickness of at least 0.1 mm and at most 0.3 mm, preferably 0.2 mm.
  • the soldering foil preferably has a width of at least 0.5 cm to a maximum of 15 cm, preferably from at least 1 cm to a maximum of 10 cm, preferably from at least 2 cm to a maximum of 8 cm, preferably from at least 4 cm to a maximum of 6 cm. preferably 5 cm.
  • Figure 1 is a schematic representation of a dosage form of an embodiment of a solder paste
  • FIG. 2 shows a schematic representation of a form of administration of an exemplary embodiment of a soldering foil.
  • soldering paste 1 shows a schematic representation of a form of administration of an exemplary embodiment of a soldering paste 1.
  • the soldering paste 1 is arranged in a tube 3 here by way of example.
  • the solder paste 1 has a solder alloy according to the invention or a solder alloy according to one or more of the exemplary embodiments described above.
  • the soldering paste preferably has a flux, in particular a hard soldering flux, or a binder.
  • the soldering foil 5 is preferably designed as a thin-rolled foil and is rolled up into a roll or spool 7 here, for example.
  • the soldering foil 5 has a soldering alloy according to the invention or a soldering alloy according to one or more of the exemplary embodiments described above.
  • the soldering foil 5 consists of such a soldering alloy.
  • the soldering foil 5 has a thickness D of at least 0.1 mm and at most 0.3 mm, preferably 0.2 mm.
  • the soldering foil 5 preferably has a width B of at least 0.5 cm to at most 15 cm, preferably from at least 1 cm to at most 10 cm, preferably from at least 2 cm to at most 8 cm, preferably from at least 4 cm to at most 6 cm, preferably 5 cm.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne un alliage de brasage comprenant - une fraction massique d'argent d'au moins 35 % à 62 % maximum, - une fraction massique de cuivre d'au moins 10 % à 30 % maximum, - une fraction massique de zinc d'au moins 10 % à 26 % maximum, les fractions massiques restantes comprenant au moins un élément choisi dans le groupe constitué par l'étain, le gallium, le manganèse, le nickel et l'indium pour arriver à 100 % à l'exception des impuretés inévitables.
EP22715981.1A 2021-03-18 2022-03-15 Alliage de brasage, pâte à braser et feuille de brasage comprenant un tel alliage de brasage Pending EP4308337A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP24157070.4A EP4345182A3 (fr) 2021-03-18 2022-03-15 Alliage de brasage, pâte à braser et feuille de brasage utilisant un tel alliage de brasage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021202673.7A DE102021202673A1 (de) 2021-03-18 2021-03-18 Lotlegierung, Lötpaste und Lötfolie mit einer solchen Lotlegierung
PCT/EP2022/056733 WO2022194882A1 (fr) 2021-03-18 2022-03-15 Alliage de brasage, pâte à braser et feuille de brasage comprenant un tel alliage de brasage

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP24157070.4A Division EP4345182A3 (fr) 2021-03-18 2022-03-15 Alliage de brasage, pâte à braser et feuille de brasage utilisant un tel alliage de brasage

Publications (1)

Publication Number Publication Date
EP4308337A1 true EP4308337A1 (fr) 2024-01-24

Family

ID=81307109

Family Applications (2)

Application Number Title Priority Date Filing Date
EP22715981.1A Pending EP4308337A1 (fr) 2021-03-18 2022-03-15 Alliage de brasage, pâte à braser et feuille de brasage comprenant un tel alliage de brasage
EP24157070.4A Pending EP4345182A3 (fr) 2021-03-18 2022-03-15 Alliage de brasage, pâte à braser et feuille de brasage utilisant un tel alliage de brasage

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP24157070.4A Pending EP4345182A3 (fr) 2021-03-18 2022-03-15 Alliage de brasage, pâte à braser et feuille de brasage utilisant un tel alliage de brasage

Country Status (9)

Country Link
US (1) US20240157485A1 (fr)
EP (2) EP4308337A1 (fr)
JP (1) JP2024511988A (fr)
KR (1) KR20230158492A (fr)
CN (1) CN117098629A (fr)
CA (1) CA3208010A1 (fr)
DE (1) DE102021202673A1 (fr)
MX (1) MX2023010855A (fr)
WO (1) WO2022194882A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1532840A (en) 1976-09-24 1978-11-22 Sheffield Smelting Co Ltd Brazing alloys
DE2745409C3 (de) 1977-10-08 1982-03-11 W.C. Heraeus Gmbh, 6450 Hanau Kupfer und Zink enthaltende Hartlot-Legierung
DE4323227C1 (de) 1993-07-12 1994-07-28 Degussa Verwendung einer kadmiumfreien Silberlegierung als niedrigschmelzendes Hartlot
DE19940115A1 (de) 1999-08-24 2001-03-01 Degussa Cadmiumfreie Hartlotlegierungen
US20050089440A1 (en) 2003-10-24 2005-04-28 Kembaiyan Kumar T. Braze alloy
JP4093322B1 (ja) * 2007-09-06 2008-06-04 株式会社新潟Ｔｌｏ 低融点銀ろう材
EP2832488A1 (fr) * 2013-07-31 2015-02-04 Umicore AG & Co. KG Alliages de brassage

Also Published As

Publication number Publication date
EP4345182A2 (fr) 2024-04-03
DE102021202673A1 (de) 2022-09-22
CA3208010A1 (fr) 2022-09-22
US20240157485A1 (en) 2024-05-16
CN117098629A (zh) 2023-11-21
MX2023010855A (es) 2023-09-28
EP4345182A3 (fr) 2024-06-19
JP2024511988A (ja) 2024-03-18
WO2022194882A1 (fr) 2022-09-22
KR20230158492A (ko) 2023-11-20

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