EP4295416A1 - Système de transport pour transporter au moins deux substrats, appareil d'impression pour impression sur deux substrats ou plus, et procédés pour les mettre en oeuvre - Google Patents

Système de transport pour transporter au moins deux substrats, appareil d'impression pour impression sur deux substrats ou plus, et procédés pour les mettre en oeuvre

Info

Publication number
EP4295416A1
EP4295416A1 EP21706916.0A EP21706916A EP4295416A1 EP 4295416 A1 EP4295416 A1 EP 4295416A1 EP 21706916 A EP21706916 A EP 21706916A EP 4295416 A1 EP4295416 A1 EP 4295416A1
Authority
EP
European Patent Office
Prior art keywords
platform
substrate
solar cell
support
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21706916.0A
Other languages
German (de)
English (en)
Inventor
Daniele Gislon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Italia SRL
Original Assignee
Applied Materials Italia SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Italia SRL filed Critical Applied Materials Italia SRL
Publication of EP4295416A1 publication Critical patent/EP4295416A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Definitions

  • TRANSPORTATION SYSTEM FOR TRANSPORTING TWO OR MORE SUBSTRATES, PRINTING APPARATUS FOR PRINTING ON TWO OR MORE SUBSTRATES, AND METHODS FOR PERFORMING SAME FIELD
  • Embodiments of the present disclosure relate to systems for transporting multiple substrates, such as solar cells or solar cell pieces.
  • Embodiments also relate to apparatuses for printing patterns on substrates, such as solar cells or solar cell pieces. More specifically, embodiments described herein relate to screen printing apparatuses for screen printing patterns on substrates.
  • a substrate such as a solar cell, which is processed by multiple processing stations of a processing line, is transported from one processing station to the next.
  • a gripper system can be used for transporting solar cells between consecutive processing stations.
  • a gripper can be a mechanical arm with suction cups to lift and move a solar cell or other type of substrate.
  • the present disclosure particularly aims at improving a manufacturing process of photovoltaic devices involving the transportation of solar cell substrates and the printing of a pattern thereon.
  • a transportation system for transporting two or more substrates used for the manufacture of photovoltaic devices includes a multiple substrate support including a first platform to support a first substrate and a second platform to support a second substrate.
  • the first substrate is a first solar cell or a first solar cell piece.
  • the second substrate is a second solar cell or a second solar cell piece.
  • the second platform is movable relative to the first platform.
  • the multiple substrate support is movable over a first distance from a first position to a second position to provide a joint transportation of the first platform and the second platform.
  • the transportation system includes a second actuator system connected to the second platform to move the second platform relative to the first platform during the movement of the movable body from the first position to the printing position.
  • a method for transporting two or more substrates used for the manufacture of photovoltaic devices includes supporting a first substrate by a first platform.
  • the first substrate is a first solar cell or a first solar cell piece.
  • the method includes supporting a second substrate by a second platform.
  • the second substrate is a second solar cell or a second solar cell piece.
  • the method includes jointly transporting the first platform supporting the first substrate and the second platform supporting the second substrate.
  • the method includes moving the second platform supporting the second substrate relative to the first platform supporting the first substrate.
  • a method for deposition on two or more substrates used for the manufacture of photovoltaic devices includes supporting a first substrate by a first platform.
  • the first substrate is a first solar cell or a first solar cell piece.
  • the method includes supporting a second substrate by a second platform.
  • the second substrate is a second solar cell or a second solar cell piece.
  • the method includes moving the second platform supporting the second substrate relative to the first platform supporting the first substrate.
  • the method includes depositing at least one first feature on the first substrate supported by the first platform and, in parallel, depositing at least one second feature on the second substrate supported by the second platform.
  • a method for processing two or more substrates used for the manufacture of photovoltaic devices includes supporting a first substrate by a first platform.
  • the first substrate is a first solar cell or a first solar cell piece.
  • the method includes supporting a second substrate by a second platform.
  • the second substrate is a second solar cell or a second solar cell piece.
  • the method includes moving the second platform supporting the second substrate relative to the first platform supporting the first substrate.
  • the method includes processing the first substrate supported by the first platform and, in parallel, processing the second substrate supported by the second platform.
  • FIGs. 1-3 show a transportation system for transporting two or more substrates according to embodiments described herein;
  • FIG. 4 shows a top view of a transportation system according to embodiments described herein;
  • FIG. 5 shows a side view of a transportation system according to embodiments described herein, the transportation system including a first actuator system and a second actuator system;
  • Embodiments described herein involve a multiple substrate support wherein substrates, such as for example solar cell pieces, are supported by respective platforms of the multiple substrate support.
  • a platform for supporting a substrate is distinguished from a gripper system for holding a substrate.
  • a platform is configured for supporting a substrate on top of the platform.
  • the substrate may be disposed on top of a substantially flat receiving surface of the platform.
  • a substrate supported by a platform can be processed by a processing device.
  • a substrate supported by a platform can be subject to a deposition process e.g. a printing process.
  • a gripper can be understood as a movable member which is configured for moving above a surface, e.g.
  • the first platform 110 and the second platform 120, and potential further platforms of the multiple substrate support 100 may be separate plate-like members that may have a gap in between.
  • the gap may be a gap of a few millimeters or a few centimeters.
  • the first platform 110 and the second platform 120 (and any further possible platforms) may be arranged next to each other such that the gap between adjacent platforms may have an elongated shape.
  • the gap may have a length extending in a direction which is substantially perpendicular to a transport direction of the multiple substrate support 100, as shown in Figs. 1-3.
  • the platforms may be oriented such that the length of the gap may be substantially parallel to the transport direction.
  • the first platform 110 and the second platform 120 may be substantially parallel to each other, i.e. the receiving surfaces for receiving the substrates on the respective platforms may be parallel to each other.
  • the term “substantially parallel” may include a deviation of, for example, up to 15 degrees, with respect to exactly parallel platforms.
  • the first platform 110 and the second platform 120 may be substantially co-planar platforms. A small vertical offset between the first platform 110 and the second platform may be present, e.g. an offset of a few millimeters.
  • the first substrate 115 is disposed on top of the first platform 110 so that the first substrate 115 rests upon the first platform 110.
  • the second substrate 125 is disposed on top of the second platform 120.
  • the first substrate 115 is supported by the first platform 110 while the second substrate 125 is supported by the second platform 120.
  • a substrate as described herein can be a flat piece of material, e.g. a thin plate-like wafer.
  • a substrate can be a photovoltaic substrate.
  • a substrate can be a solar cell or a solar cell piece.
  • a solar cell piece can be understood as a segment of a solar cell obtained by separating, or cleaving, the solar cell into two or more solar cell pieces.
  • a solar cell may be cleaved in N strip-like solar cell pieces of substantially equal width, where N is 2 or 3 or more.
  • a solar cell piece can be used in the manufacturing of shingled solar cell arrangements.
  • the first position 160 may be spaced apart from the second position 170 at least in a horizontal direction.
  • the first substrate 115 on the first platform 110 and the second substrate 125 on the second platform 120 are transported together by the multiple substrate support 100 from the first position 160 to the second position 170.
  • a first processing station may be located.
  • the first position 160 may be a loading position where a loading station is arranged for loading the first substrate 115 and the second substrate 125 (and possible further substrates) onto the multiple substrate support 100.
  • an incoming conveyor may be arranged adjacent to the first position (e.g. the incoming conveyor may be arranged to the left of the first position 160 in Figs. 1-3).
  • the substrates may be transferred from the incoming conveyor to the multiple substrate support in the first position 160.
  • a vacuum system of the multiple substrate support 100 may be activated for holding, i.e. suctioning, the substrates in a fixed position on the respective platforms of the multiple substrate support 100.
  • an alignment of the second substrate 125 e.g. a solar cell or solar cell piece
  • an alignment of the first substrate 115 can be performed during said movement.
  • Embodiments described herein allow for an “on- the-fly” alignment of the substrates supported by the multiple substrate support 100.
  • Fig. 1 shows the multiple substrate support 100 in the first position 160.
  • the multiple substrate support 100 will move to the second position 170 indicated in Fig. 1 by the dashed lines.
  • Fig. 2 shows the multiple substrate support 100 in an intermediate position during the movement from the first position 160 to the second position 170.
  • Fig. 3 shows the multiple substrate support 100 in the second position 170.
  • the first substrate 115 and the second substrate 125 may not be well- aligned.
  • the second substrate 125 is oriented at an angle with respect to the first substrate 115, which may constitute a misalignment.
  • the second platform 120 may be moved relative to the first platform to bring the orientation of the second substrate 125 in alignment with the orientation of the first substrate 115.
  • the second platform 120 is moved over an angle, i.e.
  • the second platform 120 may be translated with respect to the first platform 110 for aligning the second substrate 125 during the movement of the multiple substrate support 100 from the first position 160 to the second position 170, or a combined rotation and translation of the second platform 120 may be performed.
  • the second substrate 125 has been aligned, as illustrated in Fig. 3, and is ready for processing, e.g. by a second processing station.
  • the second substrate 125 is parallel to the first substrate 115 i.e. the longitudinal edges of both substrates are parallel to each other, which may constitute a target alignment.
  • a second processing station may be located.
  • the second position 170 may be a printing position where a printing head arrangement is located for printing respective patterns on the substrates supported by the multiple substrate support 100.
  • the printing head arrangement may be configured for printing a respective pattern of fingers and/or bus bars on the first substrate 115 and the second substrate 125.
  • the printing head arrangement may be configured for printing a respective adhesive on the first substrate 115 and the second substrate 125.
  • the printing head arrangement may be configured for printing the respective patterns in parallel on the first substrate and the second substrate which may have been aligned during the movement of the multiple substrate support from the first position 160 to the second position 170.
  • the substrates may have been aligned during the movement from the first position 160 to the second position 170.
  • the printing operation can start right away when the multiple substrate support 100 arrives at the second position 170. Further, the printing on the respective substrates can be carried out in parallel.
  • the respective patterns can be printed on the aligned substrates simultaneously while the substrates are supported jointly by the multiple substrate support 100.
  • the exemplary transportation system shown in Figs. 1-3 involves an on-the-fly alignment of the substrates, i.e. an alignment which is performed during the movement of the multiple substrate support from the first position to the second position.
  • an on-the-fly alignment has the advantage that the substrates are well aligned when the multiple substrate support arrives in the second position, so that the substrates can be processed immediately after arrival of the multiple substrate support in the second position. An improved cycle time can be obtained since the system does not have to wait for the alignment to be performed.
  • the alignment of the substrates may not be an on- the-fly alignment.
  • the alignment may be an alignment which is performed after the multiple substrate support has arrived in the second position.
  • the alignment may be a stationary alignment performed while the multiple substrate support is stationary in the second position. In some implementations, a stationary alignment can be performed without increasing the cycle time, or at least keeping an increase of the cycle time at a minimum.
  • the transportation system can include a rotary table which may be configured to rotate in a horizontal plane.
  • the rotary table can have a receiving surface including several areas which are spaced apart from each other. Each respective area may be configured to receive a multiple substrate support as described herein.
  • the rotary table can include a first area for receiving a first multiple substrate support, a second area for receiving a second multiple substrate support, and possibly further areas for receiving further multiple substrate supports.
  • the multiple substrate supports can be supported simultaneously by the rotary table.
  • a processing head e.g. a printing head, may be arranged at a fixed position over the rotary table.
  • a second multiple substrate support may be supported by the rotary table in an area below the processing head and may be being processed by the processing head.
  • the alignment of the substrates supported by the first multiple substrate support and the processing of the substrates supported by the second multiple substrate support may both be performed in parallel while the rotary table is stationary.
  • the alignment operation for the first multiple substrate support therefore does not lead to an increased cycle time (or at best a minimal increase) since the period during which the second multiple substrate support is processed by the processing head is being used for performing the alignment operation.
  • a transportation system for transporting two or more substrates used for the manufacture of photovoltaic devices includes a multiple substrate support including a first platform to support a first substrate and a second platform to support a second substrate.
  • the first substrate is a first solar cell or a first solar cell piece.
  • the second substrate is a second solar cell or a second solar cell piece.
  • the multiple substrate support is movable over a first distance from a first position to a second position to provide a joint transportation of the first platform and the second platform.
  • the second platform is movable relative to the first platform.
  • a platform of the multiple substrate support such as the first platform or the second platform, may be a horizontal platform.
  • a platform of the multiple substrate support may remain in a horizontal orientation while the multiple substrate support moves from the first position to the second position.
  • a platform may have a receiving surface for receiving a substrate on the receiving surface.
  • a substrate supported by a platform may be disposed on top of the platform.
  • a platform such as the first platform 110 or the second platform 120, may include one or more holding elements for holding a substrate supported by the platform in a fixed position on the platform.
  • a holding element may, e.g., be a suction element for suctioning the substrate to the platform.
  • the first platform and the second platform may be separate platforms of the multiple substrate support.
  • a gap may be provided between the first platform and the second platform, particularly a gap in a substantially horizontal direction.
  • the second platform may be movable relative to the first platform to perform an alignment of the second substrate. The alignment may be performed during the movement of the multiple substrate support from the first position to the second position.
  • the notion of performing an alignment of the second substrate 125 may include, for example, performing an alignment of the second substrate 125 with respect to the first substrate 115 (or with respect to another substrate supported by the multiple substrate support 100), e.g. aligning the second substrate 125 to bring an edge of the second substrate 125 in an orientation parallel to an edge of the first substrate 115, as shown in Figs. 1-3.
  • the second substrate 125 may be aligned with respect to a reference direction, a reference location or a reference orientation, e.g. a reference orientation determined by an orientation of a processing device (e.g. a printing head) which will process the substrates once the multiple substrate support 100 has arrived at the second position 170.
  • the second substrate 125 can be aligned with respect to one or more alignment marks, e.g. one or more alignment marks disposed on the second platform 120 or one or more alignment marks on the first substrate 115 (e.g. a portion of a pattern previously printed on the first substrate 115).
  • one or more alignment marks e.g. one or more alignment marks disposed on the second platform 120 or one or more alignment marks on the first substrate 115 (e.g. a portion of a pattern previously printed on the first substrate 115).
  • the second platform 120 can be movable in a plane, e.g. a plane substantially parallel to a substrate receiving surface of the second platform 120.
  • the second platform 120 can be movable in a first direction (indicated by arrow 401) which may be substantially parallel to the second platform 120 and/or in a second direction (indicated by arrow 402) which may be substantially parallel to the second platform 120.
  • first direction indicated by arrow 401
  • second direction indicated by arrow 402
  • Substantially parallel directions, orientations, planes and the like can include a deviation of up to 15 degrees from an exactly parallel configuration.
  • the first platform 110 can be mounted or movably mounted to the movable body 420.
  • the movement of the multiple substrate support from the first position to the second position can include a movement over an angle, i.e. a rotation, such as a movement over an angle in a horizontal plane.
  • the movable body can be mounted to a rotatable support, e.g. a rotatable table, or the movable body can include or be a rotatable body.
  • the rotatable support or the rotatable body can be configured to move, i.e. in this example rotate, the multiple substrate from the first position to the second position, e.g. by rotating the multiple substrate support in a horizontal plane.
  • the second actuator system 520 can be configured for translating the second platform 120 in the first direction, for translating the second platform 120 in the second direction, and/or for rotating the second platform.
  • the second actuator system 520 can include, for example, three actuators (e.g. three linear motors) for moving the second platform 120, including an actuator for performing a translation of the second platform 120 in the first direction (e.g. an X- direction), another actuator for performing a translation of the second platform 120 in the second direction (e.g. a Y-direction perpendicular to the X-direction) and another actuator for performing a rotation of the second platform 120 (e.g. a rotation in a plane formed by the X-direction and the Y-direction) .
  • three actuators e.g. three linear motors
  • a transportation system may include a first actuator system connected to the multiple substrate support to move the multiple substrate support from the first position to the second position.
  • the transportation system may include a second actuator system connected to the second platform to move the second platform relative to the first platform.
  • the second actuator system may be configured to move the second platform relative to the first platform during the movement of the multiple substrate support from the first position to the second position.
  • the second actuator system can be an alignment actuator system for aligning the second platform.
  • the second platform 120 and the third platform 610 can each be translatable relative to the movable body 420 in a first direction and/or a second direction for aligning the second substrate and the third substrate, respectively, as indicated by the arrows.
  • the second platform 120 and the third platform 610 can each be rotatable relative to the movable body 420 about respective rotation axes 410 and 615 for aligning the second substrate and the third substrate, respectively.
  • the multiple substrate support 100 may include respective actuators for translating and/or rotating the second platform 120 and respective actuators for translating and/or rotating the third platform 610 relative to the movable body 420.
  • a multiple substrate support as described herein may include a third platform to support a third substrate.
  • the third platform may be mounted to the movable body.
  • the first platform 110 may be a fixed platform.
  • the first substrate 115 on the first platform 110 may remain in a same position relative to the movable body during the movement of the movable body from the first position 160 to the second position 170.
  • the second substrate 125 and the third substrate can be aligned relative to the first substrate 115 by adjusting the positions of the second platform 120 and the third platform 610 relative to the movable body 420.
  • a common orientation of the three substrates may be provided by suitably moving the second platform 120 and the third platform relative to the first platform 110 while the position of the first platform 110 relative to the movable body 420 stays fixed.
  • the deposition apparatus 800 may be a printing apparatus.
  • the deposition apparatus 800 includes a deposition head arrangement including a first deposition head 810, e.g. a first printing head. Further deposition heads may be included in the deposition head arrangement.
  • the second platform 120 can be moved relative to the first platform 110 for aligning the second substrate 125.
  • the second platform 120 can be moved relative to the first platform 110 for aligning the second substrate 125 during a movement of the multiple substrate support 100 from the first position 160 to the deposition position e.g. the second position 170.
  • the substrates may be well-aligned by the time the multiple substrate support 100 arrives at the deposition position, so that the first pattern and the second pattern can be deposited directly after the arrival of the multiple substrate support 100 in the deposition position. In light thereof, a faster process is provided, since the deposition apparatus 800 does not have to wait for an alignment operation to be performed after arrival of the multiple substrate support 100 in the deposition position.
  • a deposition apparatus e.g. a printing apparatus for deposition on two or more substrates used for the manufacture of photovoltaic devices.
  • the deposition apparatus includes a deposition head arrangement including a first deposition head, e.g. a first printing head.
  • the deposition apparatus includes a multiple substrate support comprising a first platform to support a first substrate and a second platform to support a second substrate.
  • the first substrate may be a first solar cell or a first solar cell piece.
  • the second substrate may be a second solar cell or a second solar cell piece.
  • the multiple substrate support is arranged in or movable to a deposition position. In the deposition position, the deposition head arrangement, particularly a first deposition head of the deposition head arrangement, faces both the first platform and the second platform.
  • the second platform is movable relative to the first platform.
  • a printing apparatus for printing on two or more substrates used for the manufacture of photovoltaic devices.
  • the printing apparatus includes a printing head arrangement including a first printing head.
  • the first printing head may include a screen device for screen printing.
  • the printing apparatus includes a transportation system.
  • the transportation system includes a movable body.
  • the transportation system includes a first platform mounted to or included in the movable body.
  • the transportation system includes a second platform mounted to or included in the movable body.
  • the transportation system includes a first actuator system connected to the movable body to transport the movable body over a first distance from a first position to a printing position. In the printing position, the first printing head faces both the first platform and the second platform.
  • the transportation system includes a second actuator system connected to the second platform to move the second platform relative to the first platform during the movement of the movable body from the first position to the printing position.
  • the printing position, or deposition position may be the second position as described herein.
  • the method may include inspecting, e.g. by an inspection system as described herein, at least one of the first substrate supported by the first platform and the second substrate supported by the second platform.
  • the second platform supporting the second substrate may be moved relative to the first platform supporting the first substrate to perform an alignment of the second substrate in response to inspecting at least the second substrate supported by the second platform.
  • Depositing the at least one first feature or the at least one second feature may include printing, such as screen printing, the at least one first feature or the at least one second feature.
  • the processing position may be a position below the laser device such that the platforms of the multiple substrate support are in a position adapted for receiving a laser beam of the laser device.
  • the multiple substrates on the platforms may be processed in parallel by respective laser beams emitted by the laser device.
  • a method for processing two or more substrates used for the manufacture of photovoltaic devices includes supporting a first substrate by a first platform, as described herein.
  • the first substrate may be a first solar cell or a first solar cell piece.
  • the method includes supporting a second substrate by a second platform, as described herein.
  • the second substrate may be a second solar cell or a second solar cell piece.
  • the method includes moving the second platform supporting the second substrate relative to the first platform supporting the first substrate, as described herein.
  • the method includes processing the first substrate supported by the first platform and, in parallel, processing the second substrate supported by the second platform.
  • the substrates may be processed by a processing device as described herein.
  • the method may be performed by a processing apparatus as described herein.

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  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un système de transport (10) pour transporter au moins deux substrats utilisés pour la fabrication de dispositifs photovoltaïques. Le système de transport comprend un support de substrat multiple (100) comprenant une première plateforme (110) pour supporter un premier substrat (115) et une seconde plateforme (120) pour supporter un second substrat (125). Le premier substrat est une première cellule solaire ou une première pièce de cellule solaire. Le second substrat est une seconde cellule solaire ou une seconde pièce de cellule solaire. La seconde plateforme est mobile par rapport à la première plateforme. Le support de substrat multiple (100) est mobile sur une première distance d'une première position (160) à une seconde position (170) pour fournir un transport commun de la première plateforme (110) et de la seconde plateforme (120).
EP21706916.0A 2021-02-18 2021-02-18 Système de transport pour transporter au moins deux substrats, appareil d'impression pour impression sur deux substrats ou plus, et procédés pour les mettre en oeuvre Pending EP4295416A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2021/054020 WO2022174904A1 (fr) 2021-02-18 2021-02-18 Système de transport pour transporter au moins deux substrats, appareil d'impression pour impression sur deux substrats ou plus, et procédés pour les mettre en oeuvre

Publications (1)

Publication Number Publication Date
EP4295416A1 true EP4295416A1 (fr) 2023-12-27

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Application Number Title Priority Date Filing Date
EP21706916.0A Pending EP4295416A1 (fr) 2021-02-18 2021-02-18 Système de transport pour transporter au moins deux substrats, appareil d'impression pour impression sur deux substrats ou plus, et procédés pour les mettre en oeuvre

Country Status (2)

Country Link
EP (1) EP4295416A1 (fr)
WO (1) WO2022174904A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001062995A (ja) * 1999-08-30 2001-03-13 Minami Kk スクリーン印刷機
JP4324805B2 (ja) * 2006-01-26 2009-09-02 智雄 松下 パターン形成装置
ITUD20080141A1 (it) * 2008-06-19 2009-12-20 Baccini S P A Sistema di trasporto di precisione per stampa serigrafica
DE102012019573A1 (de) * 2012-09-25 2014-03-27 Ekra Automatisierungssysteme Gmbh Druckvorrichtung, Drucksystem, Verfahren

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WO2022174904A1 (fr) 2022-08-25

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