EP4244409A1 - Verfahren zur herstellung eines elektroplattierten produktes durch abscheidung einer unterschicht, diffusionsbarriereschicht und deckschicht auf der oberfläche - Google Patents

Verfahren zur herstellung eines elektroplattierten produktes durch abscheidung einer unterschicht, diffusionsbarriereschicht und deckschicht auf der oberfläche

Info

Publication number
EP4244409A1
EP4244409A1 EP21810021.2A EP21810021A EP4244409A1 EP 4244409 A1 EP4244409 A1 EP 4244409A1 EP 21810021 A EP21810021 A EP 21810021A EP 4244409 A1 EP4244409 A1 EP 4244409A1
Authority
EP
European Patent Office
Prior art keywords
indium
underlayer
electroplated product
top layer
precious metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21810021.2A
Other languages
English (en)
French (fr)
Inventor
Coline Nelias
Stefano BEGLIOMINI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coventya Srl
Original Assignee
Coventya SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coventya SpA filed Critical Coventya SpA
Publication of EP4244409A1 publication Critical patent/EP4244409A1/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50

Definitions

  • the present invention refers to a method for preparing an electroplated product by depositing an underlayer, a barrier diffusion layer and a top layer on a surface of a substrate comprising or consisting of copper or a copper or copper alloy layer wherein the underlayer comprises or consists of a precious metal selected from the group consisting of Au, Ag, Pd, Rh, Ru, Pt and alloys thereof and the top layer comprises or consists of a precious metal selected from the group consisting of Au, Ag, Pd, Rh, Ru, Pt and alloys thereof.
  • the underlayer and the top layer are separated by a barrier diffusion layer comprising or consisting of Indium or an alloy of Indium.
  • This barrier layer prevents the interdiffusion between the underlayer and the top layer.
  • the present invention also refers to an electroplated product obtainable by such a method.
  • the common electroplating sequence comprises a deposition of an underlayer of acid copper on the surface of the substrate to ensure a proper levelling of the substrate roughness followed subsequently by a white bronze layer of 2 to 5 pm and a thin palladium based layer of a thickness from 0.2 to 0.5 pm to stop the diffusion of the top precious metal layer, mainly gold or a gold alloy, into the copper or copper alloy underlayer, and most importantly to prevent the diffusion of copper into the precious metal layer.
  • the present bronze technology mainly uses cyanide as a complexing agent to enable the co-deposition of a ternary alloy of copper, tin and zinc, which is also efficient as a copper diffusion barrier.
  • indium on copper can lead to two different problems based on the thickness of the deposit. If the deposit has a low thickness, it could raise doubts for the operator about the presence of the deposit on the surface because of his 'translucid' aspect. A higher thickness could lead to many defects on the deposit, up to obtaining a dull deposit which is unacceptable for aesthetic reasons.
  • EP°3°540°097°Al discloses electroplated products having a combination of layers used to provide a diffusion barrier layer under a precious metal top layer on a substrate comprising a copper-based material and/or a copperbased underlayer, such that the layer or combination of layers prevents or retards the migration of copper into the precious metal layer or the opposite.
  • the diffusion barrier layer comprises indium or an indium alloy.
  • EP°2°139°012°Al discloses a silver-coated material for a movable contact component includes an electrically conductive base member that is comprised of copper or a copper alloy; an underlayer that is comprised of nickel or a nickel alloy to coat on the electrically conductive base member; an intermediate layer that is comprised of palladium, or a palladium alloy, or a silver tin alloy, to coat on the underlayer; and an outermost surface layer that is comprised of silver or a silver alloy, and that is formed on the intermediate layer.
  • US°2013/0224515°Al discloses a thin indium metal layer that is electroplated onto silver to prevent silver tarnishing.
  • the indium and silver composite has high electrical conductivity.
  • EP°3°359°710°Al discloses a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process comprises the steps: i. providing a substrate having at least one metal or metal alloy surface; ii. depositing a first indium or indium alloy layer on at least one portion of said surface whereby a composed phase layer is formed of a part of the metal or metal alloy surface and a part of the first indium or indium alloy layer; iii. removing partially or wholly the part of the first indium or indium alloy layer which has not been formed into the composed phase layer; iv. depositing a second indium or indium alloy layer on the at least one portion of the surface obtained in step iii.
  • the plating of indium on a precious metal lead to a bright lucid and white deposit. It was further found that this underlayer permits to increase the thickness of the indium barrier while maintaining the brightness. Furthermore, the bath can be operated more easily due to the fact that the electroplating bath is less sensible to parameter variations. It was found out that by using a precious metal underlayer under an indium diffusion barrier layer the barrier properties of the indium diffusion layer can be improved significantly.
  • the aqueous electroplating bath of step b) has a pH in the range of 1 to 14, preferably from 2 to 11, and more preferably from 4 to 10.
  • the at least one source of indium ions is selected from the group consisting of indium sulfate, indium chloride, indium acetate, indium sulfamate and combinations or mixtures thereof.
  • the concentration of the at least one source of indium ions of the aqueous electroplating bath of step b) is from 0,1 to 20 g/L, preferably from 0,2 to 15 g/L, more preferably from 0,3 to 10 g/L, and even more preferably from 0,5 to 10 g/L.
  • the aqueous electroplating bath of step b) contains conductive salts in order to spread the indium distribution throughout the required current density range.
  • the conductive salts are selected and balanced to not only act as a conductive salt but also as a buffering agent.
  • the conductive salts/buffering agents are preferably selected from the group consisting of citrates (e.g.
  • sodium or potassium citrate or their corresponding acidic version sodium or potassium citrate or their corresponding acidic version
  • formates e.g. sodium formate or the corresponding acidic version
  • pyrophosphates e.g. tetrapotassium pyrophosphate
  • gluconates e.g. sodium or potassium gluconate
  • nitrate carbonate, borate and combinations or mixtures thereof.
  • the aqueous electroplating bath of step b) comprises 30 to 600 g/L, more preferably 40 to 500 g/L, and most preferably 100 to 400 g/L of the at least one conductive salt.
  • a concentration in this range is suitable for keeping the pH of the inventive electroplating solution constant for many turnovers (TOs) of the electroplating solution.
  • the brightness of the indium deposit is preferably controlled by adding a surfactant to the aqueous electroplating bath of step b).
  • the surfactant acts as a wetting agent and reduces the surface tension to allow indium deposition.
  • the surfactants may belong to the amphoteric family and are selected from the group consisting of propionic amino acids, propionic imino acids, quaternary alkyl betaines or sulfo-betains.
  • the surfactant is preferably selected from the group consisting of betain, aminobetain, imidazoline, cocoamidopropyl betaine, N,N-dimethyl-N-(3-cocoamidopropyl)-N-(2-hydroxy-3-sulfopropyl) ammonium betain, N,N-dimethyl-N-octadecyl-N-(3-sulfopropyl)ammonium betaine, N,N-dimethyl-N-dodecyl-N-(3-sulfopropyl)ammonium betaine and combinations or mixtures thereof.
  • the aqueous electroplating bath in step b) comprises preferably from 0.01 to 5 g/L, more preferably from 0.01 to 1.5 g/L of the surfactant.
  • the indium ions may be complexed in solution by a complexing agent.
  • the complexing agent is preferably selected from the group consisting of carbohydrates, amino acids, imino acids, sulfur compounds, sugar alcohols, and combinations or mixtures thereof. More preferably, the complexing agent is selected from the group consisting of sorbitol, mannitol, gluconate, erithrytol, xylitol, nitrilotriacetic acid, cysteine, iminodiacetic acid, triethanolamine and combinations or mixtures thereof. Said complexing agents were found to be perfectly suited for complexing indium ions.
  • the aqueous electroplating bath of step b) comprises preferably from 0.5 to 100 g/L, preferably from 1 to 75 g/L, most preferably from 2.5 to 50 g/L, and in particular from 5 to 35 g/L of the complexing agent.
  • a concentration in these ranges is sufficient for complexing the indium ions which are comprised in the inventive electroplating solution.
  • a concentration of complexing agent under 0.5 g/L was found to be detrimental and not able to stabilize the bath at the required pH.
  • aqueous electroplating baths with non-complexed indium show a lack of stability at pH above 2 and that the stability is considerably improved with the use of appropriated complexing agents.
  • the sequence of steps a) to c) is not interrupted by any further deposition steps with the consequence that the layers electroplated in step a) to c) abut to each other.
  • the layers electroplated in step a) to c) directly abut to each other.
  • the at least one source of the precious metal ion in the electroplating bath of step a) is at least one source of Au and/or Ag ion.
  • the at least one source of the precious metal ion in the electroplating bath of step c) is selected from the group consisting of at least one source of Au, Ag, Pd, Pt ions or combinations thereof, preferably of Au and/or Ag ions.
  • a passivation or a lacquer or a finishing agent layer is deposited on the top layer.
  • the step d) comprises dipping the product obtained in step c) in a chemical solution.
  • an electroplated product comprising a substrate comprising copper or having a copper coating on which with an underlayer comprising or consisting of a precious metal selected from the group consisting of Au, Ag, Pd, Rh, Ru, Pt and alloys thereof and a top layer comprising or consisting of a precious metal selected from the group consisting of Au, Ag, Pd, Rh, Ru, Pt and alloys thereof is deposited.
  • the underlayer and the top layer are separated by a diffusion barrier layer comprising or consisting of Indium or an alloy of Indium with the material of the top layer which prevents the interdiffusion between the underlayer and the top layer.
  • the underlayer has a thickness of 10 to 500 nm, preferably 25 to 400 nm and more preferably 40 to 300 nm.
  • the diffusion barrier layer has a thickness of 1 to 500 nm, preferably 25 to 300 nm and more preferably 50 to 250 nm.
  • the top layer has a thickness of 1 to 500 nm, preferably 3 to 400 nm and more preferably 5 to 300 nm.
  • the top layer consists of a precious metal selected from the group consisting of Au, Ag, Pd, Pt and its alloys, preferably of Au, Ag and its alloys.
  • the first layer consists of gold or gold alloy.
  • a passivation or a lacquer or a finishing agent layer on the top layer.
  • Fig.l shows the GDOES spectra of example 1 without (on the left) and with thermal treatment (on the right).
  • Fig.2 shows the GDOES spectra of example 2 without (on the left) and with thermal treatment (on the right).
  • Fig.3 shows the GDOES spectra of example 3 without (on the left) and with thermal treatment (on the right).
  • Fig.4 shows the GDOES spectra of example 4 without (on the left) and with thermal treatment (on the right).
  • Fig.5 shows the GDOES spectra of example 5 without (on the left) and with thermal treatment (on the right).
  • Fig.6 shows the GDOES spectra of example 6 without (on the left) and with thermal treatment (on the right).
  • Fig.7 shows the GDOES spectra of example 7 without (on the left) and with thermal treatment (on the right).
  • Fig.8 shows the GDOES spectra of example 8 without (on the left) and with thermal treatment (on the right).
  • Fig.9 shows the GDOES spectra of example 9 without (on the left) and with thermal treatment (on the right).
  • Fig.10 shows the GDOES spectra of example 10 without (on the left) and with thermal treatment (on the right).
  • Fig.11 shows the GDOES spectra of example 11 without (on the left) and with thermal treatment (on the right).
  • Fig.12 shows the GDOES spectra of example 12 without (on the left) and with thermal treatment (on the right).
  • the GDOES values were measured on a GD-Profiler 2 from Horiba using the software QUANTUM V2.08.
  • the Pressure was set at 650 Pa, Power at 35 W, without Pulse, the Module Voltage 6V and the Phase Voltage 5V.
  • Examples 5 and 6 are made according to the invention, examples 1, 2, 3 and 4 are made as reference or for comparative reasons.
  • Examples 9, 10 and 12 are made according to the invention, examples 7, 8and 11 are made as reference or for comparative reasons.
  • Fig.10 evidences that by choosing a gold top layer the barrier effect can be improved.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP21810021.2A 2020-11-16 2021-11-15 Verfahren zur herstellung eines elektroplattierten produktes durch abscheidung einer unterschicht, diffusionsbarriereschicht und deckschicht auf der oberfläche Pending EP4244409A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20207754.1A EP4001472A1 (de) 2020-11-16 2020-11-16 Verfahren zur herstellung eines elektroplattierten produktes durch abscheiden einer unterschicht, einer diffusionssperrschicht und einer deckschicht auf der oberfläche eines substrats und so hergestelltes elektroplattiertes produkt
PCT/EP2021/081685 WO2022101474A1 (en) 2020-11-16 2021-11-15 Method for preparing an electroplated product by depositing an underlayer, diffusion barrier layer and top layer on the surface of a substrate and such prepared electroplated product

Publications (1)

Publication Number Publication Date
EP4244409A1 true EP4244409A1 (de) 2023-09-20

Family

ID=73452047

Family Applications (2)

Application Number Title Priority Date Filing Date
EP20207754.1A Withdrawn EP4001472A1 (de) 2020-11-16 2020-11-16 Verfahren zur herstellung eines elektroplattierten produktes durch abscheiden einer unterschicht, einer diffusionssperrschicht und einer deckschicht auf der oberfläche eines substrats und so hergestelltes elektroplattiertes produkt
EP21810021.2A Pending EP4244409A1 (de) 2020-11-16 2021-11-15 Verfahren zur herstellung eines elektroplattierten produktes durch abscheidung einer unterschicht, diffusionsbarriereschicht und deckschicht auf der oberfläche

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP20207754.1A Withdrawn EP4001472A1 (de) 2020-11-16 2020-11-16 Verfahren zur herstellung eines elektroplattierten produktes durch abscheiden einer unterschicht, einer diffusionssperrschicht und einer deckschicht auf der oberfläche eines substrats und so hergestelltes elektroplattiertes produkt

Country Status (3)

Country Link
EP (2) EP4001472A1 (de)
CN (1) CN116368267A (de)
WO (1) WO2022101474A1 (de)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3367754A (en) * 1965-02-03 1968-02-06 Gen Dynamics Corp Electronic transmission material and method of fabrication
JP4834022B2 (ja) 2007-03-27 2011-12-07 古河電気工業株式会社 可動接点部品用銀被覆材およびその製造方法
US9145616B2 (en) 2012-02-29 2015-09-29 Rohm and Haas Elcetronic Materials LLC Method of preventing silver tarnishing
AT514427B1 (de) * 2013-07-05 2015-01-15 W Garhöfer Ges M B H Ing Elektrolytbad sowie damit erhältliche Objekte bzw. Artikel
JP6813574B2 (ja) 2015-10-06 2021-01-13 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ インジウムまたはインジウム合金の堆積方法および物品
EP3540097A1 (de) 2018-03-13 2019-09-18 COVENTYA S.p.A. Elektroplattierte produkte und elektroplattierungsbad zur bereitstellung solcher produkte

Also Published As

Publication number Publication date
EP4001472A1 (de) 2022-05-25
WO2022101474A1 (en) 2022-05-19
CN116368267A (zh) 2023-06-30

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