EP4211731A1 - Revêtement pour composant optoélectronique, procédé de fabrication d'un tel revêtement et composant optoélectronique comprenant un tel revêtement - Google Patents

Revêtement pour composant optoélectronique, procédé de fabrication d'un tel revêtement et composant optoélectronique comprenant un tel revêtement

Info

Publication number
EP4211731A1
EP4211731A1 EP20842178.4A EP20842178A EP4211731A1 EP 4211731 A1 EP4211731 A1 EP 4211731A1 EP 20842178 A EP20842178 A EP 20842178A EP 4211731 A1 EP4211731 A1 EP 4211731A1
Authority
EP
European Patent Office
Prior art keywords
coating
monomer
optoelectronic component
layer system
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20842178.4A
Other languages
German (de)
English (en)
Inventor
Ulrike Bewersdorff-Sarlette
Andre Weiss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heliatek GmbH
Original Assignee
Heliatek GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heliatek GmbH filed Critical Heliatek GmbH
Publication of EP4211731A1 publication Critical patent/EP4211731A1/fr
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D181/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Coating compositions based on polysulfones; Coating compositions based on derivatives of such polymers
    • C09D181/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00865—Applying coatings; tinting; colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/50—Photovoltaic [PV] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • Optoelectronic components in particular photovoltaic elements, consist of a layer system applied to a substrate, comprising two electrodes, one being applied as a base electrode on the substrate and the other as a cover electrode on the side facing away from the substrate. At least one photoactive layer, preferably an organic photoactive layer, is located between the two electrodes. In addition, further layers can be arranged between the electrodes, for example transport layers.
  • the optoelectronic components with an organic photoactive layer organic optoelectronic components, can be produced, for example, by evaporating the materials, by printing polymers or by processing from a liquid.
  • the basic structure of organic optoelectronic components is disclosed, for example, in WO2004083958A2, WO2006092134A1, WO2010139804A1 or WO2011138021A2.
  • the organic active layers can be made up of polymers or small molecules. Small molecules are understood to mean, in particular, non-polymeric organic molecules with monodisperse molar masses between 100 and 2000 g/mol, which under normal pressure ( air pressure of the atmosphere surrounding us ) and are in the solid phase at room temperature . In particular, the small molecules are photoactive, photoactive meaning that the molecules change their charge state and/or their polarization state when exposed to light.
  • a photoactive layer in a layer system can comprise only one acceptor or only one donor-absorber material or also comprise a combination of several absorber materials of different and/or the same type. Furthermore, materials can be added to the absorber layers in order to improve the absorption properties.
  • the layer system cannot only consist of photoactive (absorber) layers. Rather, further layers, for example transport layers, preferably doped transport layers, can also be introduced in the layer system between individual photoactive (absorber) layers and between a photoactive (absorber) layer and the electrodes.
  • Organic optoelectronic components in particular organic solar cells, consist of a series of thin layers with at least one photoactive layer, which are preferably vacuum-evaporated or processed from a solution.
  • the electrical connection can be made by metal layers, transparent conductive oxides and/or transparent conductive polymers.
  • the vacuum vapor deposition of the organic layers is particularly advantageous in the production of multi-layer solar cells, in particular tandem or triple cells.
  • Organic single or tandem cells are known from the prior art.
  • DE102004014046A1 discloses a photoactive component, in particular a solar cell, consisting of organic layers of one or more stacked pi, ni and/or pin diodes.
  • Organic optoelectronic components in particular organic solar cells or organic photodetectors, show a greatly reduced service life through direct contact with air, in particular oxygen, and/or moisture, in particular water, and must therefore be adequately protected by a barrier layer and/or a
  • Encapsulation are protected.
  • the encapsulation can Barrier films or be performed by a direct encapsulation.
  • Photovoltaic elements are structured using laser processes. This process is primarily used in the roll-to-roll process, both for the interconnection of individual solar cell strips on a module and for the electrical separation of individual cells.
  • a problem in the production of optoelectronic components with organic layers in the roll-to-roll process is that the substrates are only separated from one another by electrical insulation, usually introduced by laser processes or lithographic-chemical or mechanical processes. The substrates are on the roll and must be separated from one another for completion and adequately protected from external environmental influences. As a result, bulges, so-called laser scribes, arise primarily during the laser structuring of the electrodes, which can damage the module if the module is wound up without a covering layer.
  • a protective layer is therefore required to protect the optoelectronic component. This ensures a damage-free transfer to a subsequent machine and less sensitive further processing of the optoelectronic component, in which touches on both sides of the film are also possible.
  • a polymer film is applied as a protective layer.
  • DE 10 2004 024 461 A1 discloses the production of an organic component in a roll-to-roll process, with the active regions of the semiconductor layer not being exposed to unprotected solvents and/or solvent vapors at any time during the production process.
  • DE102015116418A1 discloses a protective layer and a method for applying the protective layer as part of a continuous roll-to-roll process for producing a semi-finished product of organic electronic components, comprising a layer stack on a substrate film, the protective layer protecting the layer stack from environmental influences before and during final production and protects against damage caused by handling.
  • a protective layer material that is at least temporarily fluid in the application phase can be crosslinked or cured and is compatible with the layer stack in the fluid and solid phase and with the conditions during the roll-to-roll process is applied in such a way that a functional protective layer forms.
  • a disadvantage of the prior art is that such coatings cannot be applied directly to a photoactive layer system, in particular electrodes or photoactive layers, since these are damaged.
  • the method is not suitable for a roll-to-roll method for producing optoelectronic components; in particular, simply covering the layer system is not sufficient in the roll-to-roll method for producing large-area solar cells because this can cause short circuits.
  • the invention is therefore based on the object of providing a coating for planarizing and stabilizing a laser-structured surface of an optoelectronic component, a method for coating a surface of a laser-structured optoelectronic component with such a coating, an optoelectronic component with such a coating, and the use of such a coating as winding protection for an optoelectronic component and/or for a semi-finished product for producing an optoelectronic component, with the disadvantages mentioned not occurring, and with in particular a protective layer being able to be applied to a layer system of an electronic component without negative interactions with the layer system, in particular Electrodes and / or a photoactive layer of the layer system occur.
  • a coating is provided in particular with direct contact of the coating or diffusion contact of the coating with an electrode or a photoactive layer, in particular an organic photoactive layer, with the function thereof in particular not being impaired and in particular not being damaged.
  • the technical problem on which the present invention is based is, on the one hand, to stabilize bulges, in particular caused by laser structuring of the individual layers of the layer system of the optoelectronic component, in order to achieve a sealing or to allow tight enclosure by means of a thin layer, which eliminates the disadvantages found in the prior art and on the other hand can be integrated into a roll-to-roll process.
  • the coating is intended in particular to enable protection and winding of the semi-finished product, which can then be further processed.
  • the object is achieved in particular by providing a coating for planarizing and stabilizing a laser-structured surface of an optoelectronic component, the optoelectronic component having a layer system, the layer system comprising a first electrode, a second electrode, and at least one photoactive layer, the at least one photoactive layer is arranged at least partially between the electrodes, and wherein the layer system is laser-structured.
  • the coating has a polythiolene matrix, preferably consists of a polythiolene matrix, the polythiolene matrix being formed by polymerisation of at least one first monomer and one second monomer, the first monomer being a polyfunctional thiol with at least three thiol groups preferably terminally arranged thiol groups, the second monomer being a polyfunctional alkene having at least two CC double bonds preferably terminally arranged CC double bonds, and wherein the coating is arranged on the optoelectronic component and at least partially has direct contact with the layer system and/or a diffusion contact with the layer system for at least the first monomer and/or the second monomer.
  • R 1 is an organic radical having at least two thiol groups, preferably an alkyl radical having at least two thiol groups.
  • R 2 is an organic radical having at least one CC double bond, preferably an alkyl radical having at least one CC double bond.
  • the layer system of the optoelectronic component in particular electrodes or a photoactive layer of the Layer system, protected for a transport and / or a phase of final production from environmental influences and damage during further processing.
  • the coating is electrically insulating, at least in the hardened state.
  • the laser-structured surface of the layer system is planarized and stabilized by the coating according to the invention.
  • the optoelectronic component can be a semi-finished product or a finished product.
  • the optoelectronic component has a substrate, with the layer system being arranged on the substrate.
  • the layer system has further functional layers, in particular transport and/or passivation layers.
  • a coating is understood to mean in particular a protective layer, preferably a barrier layer, to prevent the permeability of external influences, preferably air, in particular oxygen, and/or moisture, in particular water, to increase the mechanical resistance, in particular scratch resistance.
  • the coating is a barrier layer.
  • a barrier layer is understood to mean, in particular, a protective layer that forms a barrier against chemical compounds, contaminants, moisture and/or oxygen.
  • the barrier layer is in particular a protective layer to prevent the permeability of external influences, in particular atmospheric oxygen and/or moisture, a protective layer to increase the mechanical resistance, in particular scratch resistance, and/or a filter layer, preferably a layer with a UV filter.
  • Laser structuring of an optoelectronic component in particular of electrodes, layers of a layer system and/or of a layer system, is understood to mean in particular an interconnection of individual photovoltaic cells on an optoelectronic component or an electrical separation of photovoltaic cells.
  • the at least one photoactive layer is at least partially uncovered and not completely covered by an electrode, in particular an electrode layer.
  • Laser patterning creates a topology, morphology, particles, and/or bulges that result in an uneven, non-planar surface.
  • the laser structuring can cause bulges, so-called laser scribes, which exceed the height of the layers of the flat topology of a layer system of an organic photovoltaic element many times over.
  • further layers in particular a barrier layer, can only be applied with difficulty on the one hand, and on the other hand a layer that has already been applied can be damaged during subsequent encapsulation.
  • an optoelectronic component in particular the layer system
  • unevennesses of the surface are covered to such an extent that unevennesses, in particular bulges, for example due to the laser structuring of the layer system, are covered.
  • an optoelectronic component with a uniform layer thickness is obtained as a result of the planarization.
  • more material is applied to lower-lying areas on the surface of the optoelectronic component Coating applied than to higher lying areas. After applying the planarization layer or the coating, the optoelectronic component with the layer system is largely planar.
  • Stabilization means in particular stabilization of a specific surface structure of the layer system, in particular a topology and/or a morphology of the layer system. Ideally, the stabilization allows winding and unwinding during the later process steps for producing the end product in the roll-to-roll process and/or during the winding of the end product.
  • stabilization means fixing of the laser-structured surface of the optoelectronic component.
  • the planarization and stabilization of the bulges caused by laser structuring is ensured by the coating according to the invention.
  • the optoelectronic component is an LED, an OLED, a photovoltaic element, in particular a solar cell, an organic photovoltaic element, in particular an organic solar cell, or a photodetector, in particular an organic photodetector.
  • At least one photoactive layer is at least partially arranged on the surface of the layer system and/or is at least partially accessible from the surface of the layer system, in particular the layer system has grooves or channels for this purpose formed by laser structuring.
  • the layer system is preferably not completely covered by the electrodes.
  • Coating arranged on the optoelectronic component, wherein the coating at least partially direct contact with at least a photoactive layer of the layer system and/or a diffusion contact with at least one photoactive layer of the layer system for at least the first monomer and/or the second monomer.
  • the coating is arranged on a diffusion-permeable adjacent layer of the layer system.
  • the coating is arranged on a barrier layer already arranged on the layer system or is applied to a barrier layer already arranged on the layer system, the barrier layer not completely sealing the optoelectronic component, in particular the layer system, so that at least partially In other words, there is direct contact between the coating and the layer system at individual points, in particular as a result of fine cracks, imperfections and/or a barrier layer that is not formed cleanly, for example through an SiOCH layer arranged on the layer system.
  • a SiOCH layer is understood to mean, in particular, a layer which comprises silicon oxide (SiOx), which is given organic properties by means of a proportion of carbon, d. H . the carbon content influences the chemical structure and the polymer-like, partially cross-linked chain structure.
  • the material is more elastic and flexible than SiOx , it is a nanoporous material that has flexible and / or elastic properties .
  • Direct contact of the coating with the layer system is understood to mean in particular direct contact of at least one component, in particular at least the first monomer and/or the second monomer, with the layer system, in particular an electrode and/or a photoactive layer of the layer system.
  • the direct contact can arise, for example, due to an incomplete arrangement of an electrode on the at least one photoactive layer, due to the laser structuring of the layer system or due to cracks in an electrode and/or a protective layer arranged on the electrode.
  • Diffusion contact of the coating with the layer system means, in particular, indirect contact of at least one component of the coating, in particular the first monomer and/or the second monomer, via at least one intermediate material, in particular at least one intermediate layer, with the layer system, in particular an electrode and/or a photoactive layer of the layer system, wherein the at least one component of the coating can pass through the at least one intermediate material, in particular the at least one intermediate layer.
  • the coating does not contain any material that is incompatible with the layer system, in particular no incompatible solvent, and/or moisture that can impair and/or damage the layer system.
  • the coating is not formed from acrylates and/or methacrylates. In a preferred embodiment of the invention, the coating does not contain any polyacrylates.
  • the coating contains no siloxane (polysiloxane) and/or no silane.
  • the coating is water and solvent-free. This avoids or at least reduces the release of the organic materials from the layer system and/or disintegration of the layer system, for example through diffusion.
  • the coating is applied completely to the optoelectronic component. In a preferred embodiment of the invention, the coating is arranged over the entire surface of the optoelectronic component. In a further preferred embodiment of the invention, the coating is applied to the layer system in some areas. In a preferred embodiment of the invention, contact points of the optoelectronic component are of the Coating kept free, preferably without having to subsequently free them from a protective layer.
  • the photovoltaic element has a cell with at least one photoactive layer, in particular a CIS, CIGS, GaAs, or Si cell, a perovskite cell or an organic photovoltaic element (OPV), a so-called organic solar cell.
  • An organic photovoltaic element is understood to mean in particular a photovoltaic element with at least one organic photoactive layer, in particular a polymeric organic photovoltaic element or an organic photovoltaic element based on small molecules.
  • the organic photoactive layer is in particular a photoactive layer in which excitons (electron-hole pairs) are formed by radiation of visible light, UV radiation and/or IR radiation.
  • the organic materials are printed, glued, coated, steamed or otherwise applied to the foils in the form of thin films or small volumes.
  • the at least one photoactive layer is formed from organic materials, preferably from small organic molecules or polymeric organic molecules, particularly preferably from small organic molecules.
  • the photoactive layer of the layer system comprises small molecules which can be evaporated in a vacuum.
  • the layers of the layer system are applied by evaporating small organic molecules.
  • the coating according to the invention for planarizing and stabilizing a laser-structured surface of an optoelectronic component has advantages compared to the prior art.
  • the inventive Coating can be applied directly to the electrodes and / or the photoactive layer of a layer system without damaging them.
  • the coating protects the layer system from environmental influences and damage before and during the final production.
  • the coating can advantageously be applied in liquid form directly to the layer system, in particular the electrodes and/or the photoactive layer, without damaging them.
  • the coating according to the invention advantageously adheres particularly well to optoelectronic components.
  • the coating prevents short circuits caused by the bulges turning over or folding in after the laser structuring.
  • a closed planar topology is advantageously provided.
  • subsequent encapsulation can be applied more easily, for example thin-layer encapsulation.
  • the method can advantageously be carried out in a roll-to-roll process for producing an optoelectronic component.
  • the adhesion of a subsequently applied barrier layer or an encapsulation is advantageously improved.
  • the coating prevents the layer system from detaching from the substrate, in particular when unrolling in a roll-to-roll process, in particular in the case of longer storage times before further processing in the case of semi-finished products.
  • winding and unwinding is made possible during the roll-to-roll process.
  • the coating advantageously protects the organic photoactive layer system from undesired interaction, in particular with the adhesive.
  • several consecutive roll-to-roll systems can be used for the complete production of an end product of the optoelectronic component.
  • the layer system is protected from solvents and/or mechanical stress by the coating between the work steps.
  • the method for producing the coating is simple, flexible and inexpensive, and can be integrated into a roll-to-roll process.
  • a roll-to-roll process is understood to mean, in particular, the production of flexible electronic components that are printed on a web of flexible plastic or metal foil.
  • the substrate, which is on a roll is unrolled, processed and finally rolled up again.
  • a roll-to-roll process is understood to mean, in particular, a continuous process in which individual components are processed one after the other. In particular, this means that at least optoelectronic components or semi-finished products of optoelectronic components are produced in more than one process step using a continuous process.
  • the roll-to-roll method is characterized, for example, by a continuous substrate, in particular made of a plastic film, for example PET or PEN.
  • materials are applied to this substrate, in particular by vapor deposition, printing, coating, sputtering or plasma deposition.
  • the coating is at least largely permeable to light in the visible wavelength range, in particular at least largely transparent.
  • the coating is arranged in a form-fitting manner, in particular cohesively, on the optoelectronic component.
  • An optoelectronic component is understood to mean, in particular, a photovoltaic element.
  • a photovoltaic element is understood to mean in particular a photovoltaic cell, in particular a solar cell.
  • the photovoltaic element is preferably made up of a number of photovoltaic cells which can be connected in series or in parallel.
  • the multiple photovoltaic cells can be arranged and/or connected in different ways in the optoelectronic component.
  • an optoelectronic component is understood to mean a semifinished product of an optoelectronic component.
  • the first monomer has at least four thiol groups, with the thiol groups preferably being arranged in each case at a terminal end.
  • the second monomer has at least three C-C double bonds, preferably at least four C-C double bonds, with the C-C double bonds preferably being arranged in each case at a terminal end.
  • the polythiolene matrix is additionally formed from at least one third monomer and/or at least one further component, the at least one third monomer having at least two thiol groups, the thiol groups preferably each are arranged at a terminal end, and wherein the at least one further component is selected from the group consisting of an additive, a flame retardant, a filler, an inhibitor, an initiator, and a stabilizer.
  • the coating is additionally formed from at least one third monomer, the at least one third monomer having at least two thiol groups, preferably at least three thiol groups, with the thiol groups preferably each being arranged at a terminal end are .
  • the coating is additionally formed from at least one fourth monomer, the at least one fourth monomer having at least one CC double bond, the CC double bond preferably being located at a terminal end, particularly preferably having at least one fourth Monomer at least two CC double bonds, wherein the CC double bonds are preferably arranged in each case at a terminal end.
  • the coating has at least one compound with a functional urethane group, preferably with at least two functional urethane groups, preferably with three functional urethane groups, a urethane group, also referred to below as urethane, meaning an -NH-CO-O-group.
  • the coating contains at least one urethane in an amount of 5 to 30% by weight of the coating, based on the total weight of the coating, preferably 10 to 30% by weight, preferably 15 to 30% by weight. -%, preferably from 5 to 20% by weight, preferably from 5 to 10% by weight, preferably from 10 to 20% by weight, or preferably from 15 to 30% by weight, the urethane being a functional urethane group, or preferably has two urethane functional groups.
  • the first monomer and/or the third monomer has at least one urethane group.
  • the first monomer is a mercaptoester, preferably the first monomer is selected from the group consisting of:
  • the CC double bonds are allyl groups and/or vinyl groups, with the second monomer preferably being a triallyl isocyanurate or a triallyl cyanurate, particularly preferably selected from the group consisting of:
  • the molar ratio of the first monomer to the second monomer is 2:1 to 0.7:1, preferably 2:1 to 1:0.9, preferably 1.6:1 to 1:0 .9, preferably 1.5:1 to 1:1, or preferably 1.2:1 to 1:1.
  • the coating in particular the monomer mixture, has a proportion of the at least one first monomer of 30 to 60% by weight, preferably 35 to 60% by weight, preferably 30 to 55% by weight. -%, preferably from 30 to 50% by weight, or preferably from 35 to 50% by weight, based on the total weight of the coating, in particular based on the total weight of the monomer mixture.
  • the coating in particular the monomer mixture, has a proportion of the at least one second monomer of 10 to 60% by weight, preferably 20 to 60% by weight, preferably 30 to 55% by weight. %, preferably from 10 to 50% by weight, preferably from 10 to 40% by weight, or preferably from 10 to 30% by weight, based on the total weight of the coating, in particular based on the total weight of the monomer mixture .
  • the coating is formed from a proportion of the first monomer and the second monomer of at least 60% by weight, preferably at least 70% by weight, preferably at least 80% by weight, preferably at least 85% weight -%, preferably at least 90 wt. -%, preferably at least 95
  • weight -% preferably at least 98 wt. -%, preferably at least 99
  • weight -% preferably at least 99.5 wt. -% , or preferably at least
  • the coating has flexible properties, with an elasticity (modulus of elasticity) of the coating, preferably the polythiolene matrix, being 80,000 psi to 360,000 psi, preferably 100,000 psi to 300,000 psi, preferably 120,000 psi 260,000 psi, or preferably 100,000 psi to 200,000 psi.
  • the elasticity preferably relates to a cured coating, preferably a cured, in particular crosslinked, polythiolene matrix.
  • the layer thickness of the coating is 1 ⁇ m to 2000 ⁇ m, preferably 1 ⁇ m to 1000 ⁇ m, preferably 1 ⁇ m to 100 ⁇ m, preferably 1 ⁇ m to 10 ⁇ m, preferably 5 ⁇ m to 1000 ⁇ m, preferably 10 ⁇ m ⁇ m to 1000 ⁇ m, preferably 10 ⁇ m to 500 ⁇ m, preferably 10 ⁇ m to 200 ⁇ m, preferably 10 ⁇ m to 100 ⁇ m, preferably 20 ⁇ m to 200 ⁇ m, preferably 20 ⁇ m to 100 ⁇ m, preferably 20 ⁇ m to 100 ⁇ m, preferably 50 ⁇ m to 500 pm, preferably 50 pm to 200 pm, or preferably 50 pm to 100 pm.
  • the layer thickness of the coating is at least 100 ⁇ m, preferably at least 1000 ⁇ m, or preferably at least 2000 ⁇ m.
  • At least two layers of the coating are arranged on the optoelectronic component, preferably three layers of the coating.
  • the layer thickness of the coating is adapted in such a way that the coating completely covers particles and bulges formed by the laser structuring. In a preferred embodiment of the invention, the coating completely covers the layer system. In an alternative preferred embodiment of the invention, the coating does not cover the area of the busbar and/or the contacts. According to one development of the invention, it is provided that an SiOCH layer is at least partially arranged between the coating and the optoelectronic component, in particular between the coating and the layer system of the optoelectronic component.
  • the object of the present invention is also achieved by providing a method for coating a surface of a laser-structured optoelectronic component with a coating according to the invention, in particular according to one of the exemplary embodiments described above.
  • the method comprises the following steps: a) providing an optoelectronic component with a layer system having a first electrode, a second electrode and at least one photoactive layer which is arranged between the two electrodes, the optoelectronic component being laser-structured, b) providing at least a first monomer and a second monomer, wherein the first monomer is a polyfunctional thiol having at least three thiol groups, and the second monomer is a polyfunctional alkene having at least two CC double bonds, c) mixing the at least first monomer and second monomer , wherein a monomer mixture is obtained, d) application of the monomer mixture to the optoelectronic component, wherein the first monomer and/or the second monomer are at least partially in direct contact
  • At least the photoactive layer of the layer system with small molecules is vapor-deposited in a vacuum.
  • the coating is formed at least partially directly on the layer system, in particular at least partially directly on the at least one photoactive layer, in particular the monomer mixture for forming the coating is at least partially directly on the layer system, in particular at least partially applied directly to the at least one photoactive layer.
  • the at least one first monomer and the at least one second monomer in step b) are provided as a monomer mixture, so that there is no mixing in step c).
  • the process is carried out under an inert gas, preferably nitrogen.
  • the proportion of the first monomer and the second monomer in the monomer mixture is at least 60% by weight. -%, based on the total weight of the monomer mixture, preferably at least 70 wt. -%, preferably at least 80 wt. -%, preferably at least 85 wt. -%, preferably at least 90 wt. -%, preferably at least 95 wt. -%, preferably at least 98 wt. -%, or preferably at least 99 wt. -% .
  • the monomer mixture is applied in liquid form.
  • the monomer mixture does not contain any material that is incompatible with the layer system, in particular no incompatible solvent, and/or moisture that can impair and/or damage the layer system.
  • the monomer mixture contains no acrylate and/or methacrylate.
  • the monomer mixture has at least one initiator and/or at least one catalyst for accelerating and/or improving the polymerization of the at least first and second monomer.
  • the viscosity of the monomer mixture is 200 mPas to 9000 mPas, preferably 200 mPas to 3000 mPas, preferably 200 mPas to 2000 mPas, preferably 200 mPas to 1000 mPas, preferably 300 mPas to 3000 mPas, preferably 300 mPas to 2000 mPas, preferably 300 mPas to 1000 mPas, preferably 1000 mPas to 5000 mPas, preferably 1000 mPas to 4000 mPas, preferably 2000 mPas to 4000 mPas, preferably 1000 mPas to 3000 mPas, or preferably 1500 mPas to 250 mPas
  • the monomer is 200 mPas to 9000 mPas, preferably 200 mPas to 3000 mPas, preferably 200 mPas
  • the monomer mixture is cured by means of UV curing, dual curing, thermal curing and/or a reaction gas.
  • the monomer mixture is applied to the optoelectronic component at a temperature of from 20.degree. C. to 60.degree. C., preferably from 20.degree. C. to 50.degree. C., preferably from 20.degree. C. to 40.degree 20°C to 30°C, preferably from 25°C to 50°C, preferably from 25°C to 40°C, or preferably from 30°C to 50°C.
  • the applied monomer mixture is cured at a temperature of 30°C to 200°C, preferably 50°C to 150°C, preferably 80°C to 150°C, preferably 30°C to 100°C, preferably from 50°C to 100°C, preferably from 50°C to 80°C, or preferably from 30°C to 60°C.
  • the time required to dry the applied monomer mixture is chosen in particular depending on the type of monomer mixture and on the layer thickness of the applied monomer mixture.
  • the applied monomer mixture is dried over a period of 10 s to 300 s, preferably 10 s to 200 s, preferably 10 s to 100 s, preferably 10 s to 50 s, or preferably 10 s to 20 s.
  • the applied monomer mixture is dried at a temperature of 30°C to 70°C, preferably 30°C to 60°C, preferably 30°C, in particular after the monomer mixture has cured to 50°C, preferably from 30°C to 40°C, preferably from 40°C to 60°C, or preferably from 40°C to 50°C.
  • the method is carried out in a roll-to-roll process, preferably a continuous roll-to-roll process.
  • the substrate is in particular rolled onto a roll and thus runs continuously into a closed system. This is where the layer system is formed.
  • the layer system is preferably manufactured under vacuum. If the optoelectronic component is a semi-finished product, then the semi-finished product can be supplied for further processing. Due to the coating, in particular the coating as anti-winding protection, the semi-finished product is not damaged either by rolling up or by touching the surfaces.
  • the anti-wrap device prevents the layer system from detaching from the substrate, for example when it is being rolled up and down.
  • the monomer mixture is applied by means of a printing process, preferably a screen printing process, a plotting process, an inkjet printing process or a 3D printing process, a slot nozzle process, a commabar process or a Knife method, and wherein preferably the pressure for applying the monomer mixture is less than 200 kPa, preferably less than 50 kPa, preferably less than 10 kPa, or preferably less than 5 kPa.
  • the coating can be applied to the optoelectronic component either permanently or temporarily.
  • Temporary is understood in particular to mean that the coating can be removed without leaving any residue during further processing of the optoelectronic component as a semi-finished product, so that the removal of the additional layer does not cause any damage to the layer system.
  • the coating is applied as a temporary coating and can be removed again without residue at a later point in time before further processing of the optoelectronic component, the layer system not being damaged when the coating is removed.
  • the coating is structured on the surface so that a subsequent adhesive layer and/or barrier layer adheres better.
  • the object of the present invention is also achieved by providing an optoelectronic component, preferably a flexible optoelectronic component, with a coating according to the invention and/or produced according to a method according to the invention, in particular according to one of the exemplary embodiments described above.
  • an optoelectronic component preferably a flexible optoelectronic component
  • a coating according to the invention and/or produced according to a method according to the invention in particular according to one of the exemplary embodiments described above.
  • the optoelectronic component there are in particular the advantages which have already been described in connection with the coating for planarization and stabilization of a laser-structured surface of an optoelectronic component and with the method for coating a surface of a laser-structured optoelectronic component.
  • the optoelectronic component has a layer system with at least two electrodes and at least one photoactive layer, the at least one photoactive layer being arranged between the two electrodes, the coating at least partially having direct contact with the layer system and/or a diffusion contact with the layer system.
  • the optoelectronic component is a flexible optoelectronic component component .
  • the flexible optoelectronic component is a flexible photovoltaic element, in particular a flexible organic photovoltaic element.
  • a flexible optoelectronic component is understood to mean, in particular, an optoelectronic component that can be bent and/or stretched in a specific area.
  • the object of the present invention is also achieved by providing a use of a coating according to the invention as winding protection for an optoelectronic component and/or for a semi-finished product for producing an optoelectronic component, preferably in a roll-to-roll process, in particular after one of the exemplary embodiments described above.
  • This results in the use of the coating in particular the advantages that have already been mentioned in connection with the coating for planarization and stabilization of a laser-structured surface of an optoelectronic component, with the method for coating a surface of a laser-structured optoelectronic component, and the optoelectronic component with a coating according to the invention were described.
  • the coating protects the optoelectronic component and/or the semifinished product, in particular the layer system of the optoelectronic component and/or the semifinished product, at least temporarily from external influences, with the optoelectronic component and/or the semifinished product not being damaged.
  • Winding protection means in particular, a protective layer for protecting an optoelectronic component from environmental influences and/or damage. After the application of the coating as winding protection, a transfer of an optoelectronic component coated with the coating into a further system is made possible, in which further processing steps are carried out.
  • the optoelectronic component is a semi-finished product, correspondingly optoelectronic component to which the coating is applied, a semi-finished product for producing a finished optoelectronic component.
  • a semi-finished product is understood to mean, in particular, a preliminary stage of an optoelectronic component in which at least one further method step is necessary, ie further processing is necessary in order to obtain a finished optoelectronic component.
  • a semi-finished product is preferably understood to mean an optoelectronic component, in particular a photovoltaic cell, which does not yet have a barrier layer or not yet have all the barrier layers and/or is not yet encapsulated.
  • the optoelectronic component is preferably provided with all barrier layers and/or encapsulated after the final production, in particular equipped with the necessary connections for electrical contacting.
  • the coating can be removed from the semifinished product without leaving any residue before the optoelectronic component is finished, so that the optoelectronic component, in particular the layer system of the optoelectronic component, and/or the semifinished product are not damaged when the coating is removed.
  • Fig. 1 shows a schematic illustration of an exemplary embodiment of a layer system of an optoelectronic component in cross section
  • Fig. 2 shows a schematic representation of an exemplary embodiment of an optoelectronic component with a coating for planarization and stabilization of a laser-structured surface of the optoelectronic component in cross section;
  • Fig. 3 shows a schematic representation of an exemplary embodiment of an optoelectronic component with a SiOCH layer and with a coating for planarization and stabilization of a laser-structured surface of the optoelectronic component in cross section;
  • Fig. 4 shows a schematic representation of an embodiment of a method for coating a surface of a laser-structured optoelectronic component with a coating in a flow diagram
  • Fig. 6 in one embodiment an influence of the monomers of a coating according to the invention and a coating not according to the invention on the photoactive layer of a layer system.
  • the exemplary embodiments relate in particular to an optoelectronic component produced in a roll-to-roll process, preferably containing organic layers containing materials based on small molecules.
  • Fig. 1 shows a schematic illustration of an exemplary embodiment of a layer system 7 of an optoelectronic component 100 in cross section;
  • the optoelectronic component 100 in particular an organic photovoltaic element, consists of a sequence of thin layers, with the layer system 7, with at least one photoactive layer 4, which are preferably vacuum-deposited or processed from a solution.
  • the electrical connection can be made by metal layers, transparent conductive oxides and/or transparent conductive polymers.
  • the vacuum vapor deposition of the organic layers is particularly advantageous in the production of multi-layer photovoltaic elements, in particular tandem or triple cells.
  • a layer system 7 of such an optoelectronic component 100 is shown in one exemplary embodiment in FIG. 1 .
  • the Optoelectronic component 100 has a layer system 7 with at least two electrodes 2 , 6 and at least one photoactive layer 4 with at least one absorber material on a substrate 1 , the at least one photoactive layer 4 being arranged between the two electrodes 2 , 6 .
  • the layer system 7 with the electrodes 2 , 6 is laser structured.
  • the layer system 7 can also have a hole transport layer 5 and a charge carrier layer 3 .
  • Fig. 2 shows a schematic representation of an exemplary embodiment of an optoelectronic component 100 with a coating 10 for planarization and stabilization of a laser-structured surface 11 of the optoelectronic component 100 in cross section. Elements that are the same and have the same function are provided with the same reference symbols, so that reference is made to the previous description.
  • the coating 10 for planarizing and stabilizing a laser-structured surface 11 of an optoelectronic component 100 is at least partially arranged on the layer system 7 of the optoelectronic component 100, the optoelectronic component 100 having a layer system 7, the layer system 7 having a first electrode 2, a second electrode 6 , and at least one photoactive layer 4 , the at least one photoactive layer 4 being arranged at least partially between the electrodes 2 , 6 , and the layer system 7 being laser-structured.
  • the coating 10 has a polythiolene matrix, preferably consists of a polythiolene matrix, the polythiolene matrix being formed by means of polymerization from at least a first monomer and a second monomer, the first monomer being a polyfunctional thiol with at least three thiol groups is preferably terminally arranged thiol groups, the second monomer being a polyfunctional alkene having at least two CC double bonds preferably terminally arranged CC double bonds, and wherein the coating 10 is arranged on the optoelectronic component 100 and at least partially has direct contact with the layer system 7 and/or a diffusion contact with the layer system 7 for at least the first monomer and/or the second monomer.
  • the provided optoelectronic component 100 was produced in particular in a roll-to-roll process.
  • the coating 10 of the optoelectronic component 100 can be applied directly to the electrodes 2, 6 and/or the photoactive layer 4 of a layer system 7 without damaging them, with a planar topology being provided in particular.
  • the coating 10 can be applied directly to the layer system 7 in liquid form.
  • the method can advantageously be carried out in a roll-to-roll process for producing an optoelectronic component 100 or a semifinished product thereof.
  • the coating 10 can be wound up and unwound during the roll-to-roll process.
  • the coating 10 prevents the layer system 7 from becoming detached from the substrate 12 , in particular when unrolling in a roll-to-roll process, in particular during further processing of semi-finished products of the optoelectronic component 100 .
  • the coating 10 advantageously protects the layer system 7 from environmental influences and damage before and during the final production.
  • the first monomer has at least four thiol groups, with the thiol groups preferably being arranged in each case at a terminal end.
  • the second monomer has at least three CC double bonds, preferably at least four CC double bonds, the CC double bonds preferably each being located at a terminal end.
  • the polythiolene matrix is additionally formed from at least one third monomer and/or at least one further component, the at least one third monomer having at least two thiol groups, the thiol groups preferably each being at a terminal End are arranged, and wherein the at least one other component is selected from the group consisting of an additive, a flame retardant, a filler, an inhibitor, an initiator, and a stabilizer.
  • the first monomer is a mercaptoester, preferably the first monomer is selected from the group consisting of:
  • the CC double bonds are allyl groups and/or vinyl groups, the second monomer preferably being a triallyl isocyanurate or a triallyl cyanurate, particularly preferably selected from the group consisting of:
  • the molar ratio of the first monomer to the second monomer is 2:1 to 1:0.9, preferably 1.5:1 to 1:1, or preferably 1.2:1 to 1:1.
  • the first monomer is present in at least a slight excess.
  • the coating contains at least one urethane in an amount of 5 to 40% by weight of the coating, based on the total weight of the coating, preferably 5 to 30% by weight, preferably 10 to 30% by weight. -%, preferably from 15 to 30% by weight, preferably from 5 to 20% by weight, preferably from 5 to 10% by weight, preferably from 10 to 20% by weight, or preferably from 15 to 30% by weight %.
  • compositions are available from Nordland Products Inc., for example, under the designations NOA61, NOA63, NOA65 or NOA68.
  • NOA61 contains 55-57% by weight of a tetrathiol and 43-45% by weight of a triallyl isocyanurate.
  • NOA63 contains 70-75% by weight of NOA61 and 15-30% by weight of a urethane.
  • the coating 10 has flexible properties, with an elasticity (modulus of elasticity) of the coating 10, preferably the polythiolene matrix, being 80,000 psi to 360,000 psi, preferably 100,000 psi to 300,000 psi, particularly preferably 120,000 psi to 260,000 psi, and/or the layer thickness of the coating 10 is 1 pm to 2000 pm, preferably 1 pm to 1000 pm, or preferably 20 pm to 100 pm.
  • an elasticity (modulus of elasticity) of the coating 10 preferably the polythiolene matrix, being 80,000 psi to 360,000 psi, preferably 100,000 psi to 300,000 psi, particularly preferably 120,000 psi to 260,000 psi, and/or the layer thickness of the coating 10 is 1 pm to 2000 pm, preferably 1 pm to 1000 pm, or preferably 20 pm to 100 pm.
  • an SiOCH layer 14 is arranged at least partially.
  • the SiOCH layer 14 can be produced using plasma-enhanced chemical vapor deposition (PECVD) methods, such as hollow-cathode-supported PECVD (arcPECVD) methods, via an HMDSO precursor or bis-trimethylsilymethane (BTMSM) precursor or tetraethylorthosilicate (TEOS) precursor or tetramethylsilane (TMS) precursor or hexamethyldisilazane (HMDSN) precursor are deposited.
  • PECVD plasma-enhanced chemical vapor deposition
  • the optoelectronic component 100 is a flexible optoelectronic component 100, with a coating 10 according to the invention and/or produced according to a method according to the invention, having a layer system 7 with at least two electrodes 2, 6 and at least one photoactive layer 4, wherein the at least one photoactive layer 4 is arranged between the two electrodes 2 , 6 , the coating 10 at least partially having direct contact with the layer system 7 and/or a diffusion contact with the layer system 7 .
  • the optoelectronic component 100 is preferably a photovoltaic element, particularly preferably a flexible organic photovoltaic element.
  • the production of the organic optoelectronic component 100 in the roll-to-roll process takes place by providing a substrate 12 to which the layer system 7 is applied, with the first electrode 2 in particular first and then both the absorber also being (partially) doped and/or or undoped transport layers, in particular the photoactive layer 4, are applied.
  • the second electrode 6 is then applied.
  • individual applied layers are at least partially laser-structured, or the layer system 7 is at least partially laser-structured after all layers have been applied.
  • Barrier layer 13 are applied to protect against moisture and / or atmospheric oxygen.
  • the coating 10 can have a layer thickness of 10 ⁇ m to 2000 ⁇ m, preferably from 100 ⁇ m to 1000 ⁇ m.
  • the coating 10 is at least largely electrically insulating.
  • the optoelectronic component 100 is a semifinished product of an optoelectronic component 100, in particular a semifinished product in a roll-to-roll process.
  • a continuous substrate 12 or on an optoelectronic component 100 with a substrate 12 comprising an electrode 2 arranged on the substrate 12, an organic layer system 7 and an electrode 6 on the side of the layer system 7 facing away from the substrate 12, at least one photoactive organic layer 4 between the electrode 2 and of the electrode 6 , and a protective layer on that side of the at least one optoelectronic component 100 which is remote from the substrate 12 , the protective layer preferably completely covering the organic layer system 7 .
  • the optoelectronic component 100 is an organic optoelectronic component 100, preferably an organic solar cell, an OFET, an OLED or an organic photodetector.
  • the coating 10 according to the invention can be used in particular as winding protection for an optoelectronic component 100 and/or for a semi-finished product for producing an optoelectronic component 100, preferably in a roll-to-roll process.
  • the coating protects the optoelectronic component 100 and/or the semifinished product, in particular the layer system 7 of the optoelectronic component 100 and/or the semifinished product, at least temporarily from external influences, with the optoelectronic component 100 and/or the semifinished product not being damaged.
  • FIG. 3 shows a schematic representation of an exemplary embodiment of an optoelectronic component 100 with an SiOCH layer 14 and with a coating 10 for planarization and stabilization of a laser-structured surface 11 of the optoelectronic component 100 in cross section.
  • Elements that are the same and have the same function are provided with the same reference symbols, so that reference is made to the previous description.
  • the coating 10 of the optoelectronic component 100 has at least partially direct contact with the layer system 7 and/or a diffusion contact with the layer system 7 .
  • FIG. 4 shows a schematic representation of an exemplary embodiment of a method for coating a surface 11 of a laser-structured optoelectronic component 100 with a coating 10 in a flow chart. Elements that are the same and have the same function are provided with the same reference symbols, so that reference is made to the previous description.
  • the method for coating a surface 11 of a laser-structured optoelectronic component 100 with a coating 10 comprises the following steps: a) providing an optoelectronic component 100 with a layer system 7, having a first electrode 2, a second electrode 6, and at least one photoactive Layer 4, which is arranged between the two electrodes 2, 6, the optoelectronic component 100 being laser-structured, b) providing at least a first monomer and a second monomer, the first monomer being a polyfunctional thiol having at least three thiol groups, and the second monomer is a polyfunctional alkene having at least two CC double bonds, c) mixing the at least first monomer and second monomer, a monomer mixture being obtained, d) applying the monomer mixture to the optoelectronic component 100, the first monomer and/or the second ite monomer at least partially have direct contact with the layer system 7 and/or have a diffusion contact with the layer system 7, and e) curing of the monomer mixture by
  • the viscosity of the monomer mixture is 200 mPas to 9000 mPas, preferably 300 mPas to 3000 mPas, and the monomer mixture is cured by means of UV curing, dual curing, thermal curing and/or a reaction gas, in particular is networked.
  • the method is carried out in a roll-to-roll process, preferably a continuous roll-to-roll process.
  • the monomer mixture is applied by means of a printing process, preferably a screen printing process, a plotting process, an inkjet printing process or a 3D printing process, a slot nozzle process, a commabar process or a doctor blade process, wherein preferably the pressure for applying the monomer mixture is less than 200 kPa, preferably less than 50 kPa, preferably less than 10 kPa, or preferably less than 5 kPa.
  • the applied monomer mixture is cured thermally at a temperature of 80 and 150 °C.
  • the monomer mixture applied can alternatively be cured by means of UV radiation, for example with a UV radiation dose of 0.150 J/cm 2 to 1.20 J/cm 2 in a wavelength range of 100 nm to 280 nm and at least partially cured monomer mixture, in particular the coating 10, are dried in a further step, for example at 30° C. to 60° C.
  • the applied monomer mixture was processed in a Fusion UV System LC6B Benchtop at a speed of 1 . 83 m/min cured .
  • the coating 10 is in particular before the flexible optoelectronic component 100 is wound up, before it is transported into another facility or after transport under nitrogen to another facility.
  • Fig. 5 shows experimental results of laser-structured optoelectronic components 100 with a coating 10 according to the invention and a coating not according to the invention.
  • the optoelectronic component 100 is a photovoltaic element.
  • the coating 10 according to the invention was produced from a liquid monomer mixture with subsequent curing by UV radiation, with the winding protection being obtained.
  • BS1 was applied as an adhesive film to the photovoltaic element.
  • BS1 is a polyester carrier film coated with a polysiloxane PSA (pressure-sensitive adhesive).
  • PSA pressure-sensitive adhesive
  • FIG. 5A shows the course of the fill factor FF of the photovoltaic element over a period of 1000 h
  • FIG. 5B shows the course of the short-circuit current Isc of the photovoltaic element over a period of 1000 h
  • FIG. 5C shows the course of the normalized efficiency of the photovoltaic element PCE over a period of 1000 h
  • FIG. 5D shows the course of the no-load voltage Voc of the photovoltaic element over a period of 1000 h, in each case in a comparison of a coating 10 according to the invention made of NOA63 as winding protection with a coating not according to the invention with BS1 as winding protection.
  • the fill factor FF, the short-circuit current Isc , the normalized efficiency PCE , and the open-circuit voltage Voc of the photovoltaic element with a coating 10 according to the invention as winding protection over a period of 1000 h run much better compared to the photovoltaic Element with BS1 as anti-winding protection.
  • better protection of the photovoltaic element, in particular of the layer system 7 of the photovoltaic element is obtained with the coating 10 according to the invention as winding protection.
  • FIG. 6 shows an influence of the monomers of a coating 10 according to the invention and a coating not according to the invention on the photoactive layer 4 of a layer system 7 .
  • the optoelectronic component 100 is an organic photovoltaic element.
  • the organic photovoltaic element comprises a substrate 1, e.g. B. made of glass, on which an electrode 2 is located, which z. B. ITO includes .
  • Arranged thereon is a layer system 7 with an electron-transporting layer 3 and at least one photoactive layer 4, with at least one absorber, a p-conducting donor material, and an n-conducting acceptor material, e.g. B. C60 fullerene .
  • a p-doped hole transport layer 5 and an electrode 6 made of aluminum are arranged above it.
  • the monomer mixture was applied to the layer system 7 of an optoelectronic component 100 as drops and then distributed over a wide area.
  • the optoelectronic component 100 has a laser-structured layer system 7 .
  • the first monomer and the second monomer were mixed in a proportion of 55:45 to 57:43.
  • the first monomer and the second monomer are the main components of the monomer mixture and together account for at least 80% by weight. -% from, based on the total weight of the monomer mixture.
  • the monomer mixture according to the invention has NOA63, and the mixture not according to the invention VE672 has acrylates, in particular 25-75% exo-1,7,7-trimethylbicyclo[2.2.1] hept-2-yl acrylate, 25-75% methacrylic acid ester, and 2.5-10% urethane acrylate.
  • the coatings were each prepared from a liquid monomer mixture with subsequent curing by UV radiation.

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Abstract

L'invention concerne un revêtement (10) pour le lissage et la stabilisation d'une surface structurée au laser (11) d'un composant optoélectronique (100). Le composant optoélectronique (100) a un système de couches (7) qui comprend une première électrode (2), une seconde électrode (6), et au moins une couche photoactive (4), la couche ou les couches photoactives (4) étant au moins partiellement disposées entre les électrodes (2, 6), et le système de couches (7) étant structuré au laser. Le revêtement (10) a une matrice de polythiol, et la matrice de polythiol est constituée d'au moins un premier monomère et d'un second monomère au moyen de polymérisation. Le premier monomère est un thiol polyfonctionnel comportant au moins trois groupes thiol, et le second monomère est un alcène polyfonctionnel comportant au moins deux doubles liaisons C-C. Le revêtement (10) est disposé sur le composant optoélectronique (100) et est au moins partiellement en contact direct avec le système de couches (7) et/ou en contact par diffusion avec le système de couches (7) pour le premier monomère et/ou le second monomère.
EP20842178.4A 2019-12-12 2020-12-11 Revêtement pour composant optoélectronique, procédé de fabrication d'un tel revêtement et composant optoélectronique comprenant un tel revêtement Pending EP4211731A1 (fr)

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DE102019134145 2019-12-12
DE102020123252.7A DE102020123252A1 (de) 2019-12-12 2020-09-07 Beschichtung für ein optoelektronisches Bauelement, Verfahren zur Herstellung einer solchen Beschichtung, optoelektronisches Bauelement mit einer solchen Beschichtung
PCT/DE2020/101051 WO2022048699A1 (fr) 2019-12-12 2020-12-11 Revêtement pour composant optoélectronique, procédé de fabrication d'un tel revêtement et composant optoélectronique comprenant un tel revêtement

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AU2004221377B2 (en) 2003-03-19 2009-07-16 Heliatek Gmbh Photoactive component comprising organic layers
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DE102005010978A1 (de) 2005-03-04 2006-09-07 Technische Universität Dresden Photoaktives Bauelement mit organischen Schichten
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US20230081559A1 (en) 2023-03-16

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