EP4088329A1 - Système d'encapsulation conçu pour un composant optoélectronique, comportant au moins une première encapsulation et une deuxième encapsulation, composant optoélectronique équipé d'un tel système d'encapsulation - Google Patents

Système d'encapsulation conçu pour un composant optoélectronique, comportant au moins une première encapsulation et une deuxième encapsulation, composant optoélectronique équipé d'un tel système d'encapsulation

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Publication number
EP4088329A1
EP4088329A1 EP21705421.2A EP21705421A EP4088329A1 EP 4088329 A1 EP4088329 A1 EP 4088329A1 EP 21705421 A EP21705421 A EP 21705421A EP 4088329 A1 EP4088329 A1 EP 4088329A1
Authority
EP
European Patent Office
Prior art keywords
encapsulation
optoelectronic component
layer
edge region
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21705421.2A
Other languages
German (de)
English (en)
Inventor
Merve Anderson
Michael Eritt
Judith Geoerg
Michael Meissner
Ralph Wichtendahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heliatek GmbH
Original Assignee
Heliatek GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heliatek GmbH filed Critical Heliatek GmbH
Publication of EP4088329A1 publication Critical patent/EP4088329A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to an encapsulation system for an optoelectronic component with at least a first encapsulation and a second encapsulation, as well as an optoelectronic component with such an encapsulation system.
  • Optoelectronics is made up of the fields of optics and semiconductor electronics. In particular, it includes systems and methods that enable the conversion of electronically generated energies into light emission or convert light emissions into energy.
  • Optoelectronic components in particular organic photovoltaic elements (OPVs) and organic light emitting diodes (OLED), generate electrical energy or convert electrical energy into light emissions.
  • OLEDs organic photovoltaic elements
  • OLEDs organic light emitting diodes
  • Organic optoelectronic components in particular organic solar cells, consist of a sequence of thin layers with at least one photoactive layer, which are preferably evaporated in a vacuum or processed from a solution.
  • the electrical connection can be made by metal layers, transparent conductive oxides and / or transparent conductive polymers.
  • the vacuum evaporation of the organic layers is particularly advantageous in the production of multilayer solar cells, in particular tandem or triple cells.
  • Organic single or tandem cells are known from the prior art.
  • DE102004014046A1 discloses a photoactive component, in particular a solar cell, consisting of organic layers of one or more pi, ni and / or pin diodes stacked on top of one another.
  • Organic optoelectronic components in particular organic photovoltaic elements or organic photodetectors, show a greatly reduced service life through direct contact with air, in particular oxygen and / or moisture, in particular water, and must therefore be adequately protected by a barrier layer and / or encapsulation.
  • Organic optoelectronic components, in particular organic photovoltaic elements therefore require a barrier, in particular encapsulation, to protect against moisture and / or oxygen in order to prevent moisture and / or oxygen from coming into contact with the layer system, in particular organic photoactive layers of the layer system, of the optoelectronic component prevent.
  • Organic optoelectronic components can be protected against the ingress of moisture and oxygen as well as against mechanical damage by applying protective layers or encapsulation.
  • protective layers or encapsulation For this purpose, special films and layers with different properties are known, which are, however, very expensive, the coating is also very complex, and films that meet the high requirements are only available in a few.
  • corners of the encapsulated optoelectronic component must be protected against detachment of the layer and the associated entry of moisture and / or oxygen. The corners and the edges are painstakingly sealed.
  • Flexible solar cells provided with a protective layer are known; these are mostly laminates or film composites that protect internal components from external influences and enable reliable electrical contact to be made with the outside. The demands on the materials are high, especially when a good moisture barrier is required.
  • EP 2927 985 A2 discloses multilayer films for optoelectronic components, comprising one or more barrier layers with low moisture and / or oxygen permeability, and one or more sealing layers.
  • DE 102016106 846 A1 discloses a multilayer encapsulation having a layer sequence which comprises at least one barrier layer and at least one planarization layer, the barrier layer and the planarization layer together being one have lower water permeability than the barrier layer, and an optoelectronic component having an encapsulation.
  • WO2008 / 014492A2 discloses methods and devices for improved protection of solar cells.
  • the device has an individual encapsulation for a solar cell, the encapsulated solar cell having at least one protective layer on at least one side of the solar cell, the at least one protective layer being formed from essentially inorganic material.
  • US2007 / 0216300A1 discloses an organic optoelectronic component, the organic optoelectronic component having a substrate with at least one layer system arranged thereon and a multi-layer barrier layer over the at least one layer system.
  • No. 6,765,351 B2 discloses an organic optoelectronic component with a protective layer applied in a vacuum to protect the organic optoelectronic component from moisture and oxygen.
  • the invention is therefore based on the object of providing an encapsulation system for an optoelectronic component with at least a first encapsulation and a second encapsulation, as well as an optoelectronic component with such a component Provide encapsulation system, wherein the disadvantages mentioned do not occur, and in particular an improved protection of the optoelectronic component against external influences is ensured.
  • the object is achieved in particular by providing an encapsulation system, in particular a double encapsulation, for an optoelectronic component with at least a first encapsulation and a second encapsulation, the first encapsulation comprising at least one front barrier layer on a front side of the optoelectronic component and at least one rear barrier layer is formed on a rear side of the optoelectronic component with at least one first connection material applied between them, the second encapsulation being formed from at least one front protective layer on the front side of the optoelectronic component and at least one rear protective layer on the rear side of the optoelectronic component with at least one second connection material applied between them is.
  • the first encapsulation encloses the optoelectronic component in such a way that the first encapsulation protrudes with a first edge area over the optoelectronic component
  • the second encapsulation encloses the first encapsulation with the optoelectronic component in such a way that the second encapsulation with a second edge area over the first Edge area of the first encapsulation protrudes.
  • the second encapsulation is arranged on the first encapsulation, in particular the at least one front protective layer is arranged on the at least one front barrier layer and the at least one rear protective layer is arranged on the at least one rear barrier layer.
  • the encapsulation system has different zones, in particular Has encapsulation zones, the encapsulation zones in particular fulfilling different functions, a multiplicity of material properties preferably being divided into two front layers and two rear layers in each case.
  • diffusion of water to the optoelectronic component is at least largely prevented by means of the first encapsulation with a certain width of the first edge region, and the second encapsulation with a certain width of the second edge region also provides mechanical protection of the first encapsulation and thus also of the optoelectronic component Component guaranteed.
  • the protruding first edge region and the protruding second edge region can reduce the penetration of moisture and / or oxygen through the second encapsulation and through the first encapsulation to the optoelectronic component.
  • a width of the first edge region of the first encapsulation and a width of the second edge region of the second encapsulation is designed in particular such that a diffusion length of the first edge region and / or the second edge region is sufficient for moisture and / or oxygen to enter the interior of the encapsulation , in particular in or on the optoelectronic component.
  • a connecting material is understood to mean, in particular, a material, preferably an adhesive, or a layer of a material, in particular an adhesive layer, by means of which an element is fixed, in particular glued, in particular two layers are glued on top of one another, so that these are firmly connected to each other.
  • a front side of an optoelectronic component in particular a photovoltaic element, correspondingly also a front barrier layer and a front protective layer, is understood to mean a side of the optoelectronic component that is intended to face sunlight. Accordingly, under a rear side of an optoelectronic component, in particular a photovoltaic element, is correspondingly also under a rear barrier layer and a rear protective layer, understood as intended a side of the optoelectronic component facing away from sunlight.
  • An edge area of an encapsulation is understood in particular to mean the area which protrudes in its extent beyond the area of a further element arranged below or therein, in particular an optoelectronic component or a further encapsulation, that is to say is larger in extent than the further element.
  • the first encapsulation preferably the front side and / or the rear side of the first encapsulation, is formed from at least two barrier layers, preferably two barrier layers, or preferably three barrier layers, and / or the second encapsulation, preferably the front side and / or the rear side of the second encapsulation, formed from at least two protective layers, preferably two protective layers, or preferably three protective layers.
  • at least one connecting material is applied between the successive barrier layers and / or the successive protective layers, it being possible for the type of the at least one connecting material to differ in each case.
  • a barrier layer is understood to mean, in particular, a layer which forms protection, in particular a barrier, against chemical compounds, contaminants, moisture and / or oxygen, in particular atmospheric oxygen.
  • the barrier layer is in particular a layer for preventing the permeability of external influences, in particular atmospheric oxygen and / or moisture.
  • a barrier layer is also a protective layer.
  • a protective layer in particular a layer to increase the mechanical resistance, in particular scratch resistance, and / or a filter layer, preferably a layer with a UV Filter, understood.
  • a protective layer is also a barrier layer.
  • An edge of an optoelectronic component or an encapsulation is understood to mean, in particular, an edge region of an optoelectronic component or an encapsulation, in particular an end of the optoelectronic component or the encapsulation that is arranged in the geometric plane of its greatest horizontal extent.
  • the optoelectronic component is an LED, an OLED, a photovoltaic element, in particular a solar cell, an organic photovoltaic element, in particular an organic solar cell, or a photodetector, in particular an organic photodetector.
  • the first encapsulation in particular the front side of the first encapsulation, and / or the second encapsulation, in particular the front side of the second encapsulation, is at least largely transparent to light in the visible wavelength range, in particular at least largely transparent.
  • Connection material at least largely permeable to light in the visible wavelength range.
  • the first encapsulation and / or the second encapsulation is at least partially transparent on a side that is intended to be facing the sunlight.
  • the at least one front barrier layer of the first encapsulation and the at least one front protective layer of the second encapsulation are at least partially transparent.
  • the edges of the encapsulation are advantageously protected against delamination.
  • the service life of an optoelectronic component is advantageously increased.
  • Different properties are advantageously divided between at least a first encapsulation and a second encapsulation, in particular by barrier layers and / or protective layers with different properties.
  • the dependency on suppliers of certain barrier layers and / or protective layers is advantageously lower.
  • the distribution of the requirements to different encapsulations and / or layers of the encapsulations enables the electrical contact to be made by means of a contact element running at least largely outside the first encapsulation and under the second encapsulation, so that the complexity of the barrier-relevant first encapsulation is reduced.
  • the encapsulation system can advantageously be produced in a simple, flexible and inexpensive manner, in particular in a roll-to-roll process.
  • a roll-to-roll process is understood to mean, in particular, the production of flexible electronic components that are applied to a web of flexible plastic or metal foil.
  • a substrate located on a roll in particular made of a plastic film, for example PET or PEN, is unrolled, processed and finally rolled up again.
  • materials are applied to this substrate, in particular by vapor deposition, printing, coating, sputtering or plasma deposition.
  • a roll-to-roll process is understood to mean, in particular, a continuous process management in which individual components are processed one after the other.
  • an element in particular a layer that is applied, arranged or formed on another element, in particular another layer, is understood to mean a direct contact of one element with the other element or an indirect contact, in particular by means of at least one further layer arranged in between.
  • the first encapsulation is formed over the full extent of the optoelectronic component
  • the second encapsulation is formed over the complete extent of the first encapsulation
  • / or the first edge region of the first encapsulation is formed around the optoelectronic component and / or the second edge region of the second encapsulation is formed all around the first encapsulation, with a width of the first edge region depending on an edge of the optoelectronic component and / or a width of the second edge region being formed differently depending on an edge of the first encapsulation .
  • corners of the first encapsulation and / or of the second encapsulation are rounded.
  • the at least one front barrier layer and the at least one rear barrier layer of the first encapsulation are made of different materials and / or a different number of layers, and / or the at least one front protective layer and the at least one rear layer Protective layer of the second encapsulation is formed from a different material and / or a different number of layers.
  • the first encapsulation is formed from at least two front and / or rear barrier layers, in particular barrier layers with different properties
  • / or the second encapsulation is formed from at least two front and / or rear protective layers is formed, in particular protective layers with different properties
  • the first encapsulation preferably forming a protection against moisture and / or oxygen, in particular atmospheric oxygen
  • the second encapsulation forming a mechanical protection
  • an adhesive layer is arranged between the optoelectronic component and the first encapsulation and / or an adhesive layer is arranged between the first encapsulation and the second encapsulation, and / or a planarization layer is arranged between the optoelectronic component and the first encapsulation is.
  • the adhesive layer between the optoelectronic component and the first encapsulation and / or the adhesive layer between the first encapsulation and the second encapsulation is formed from a material selected from the group consisting of
  • PMMA polymethyl methacrylate
  • styrenes / polystyrene urethanes / polyurethanes or derivatives thereof in the form of monomers, oligomers or polymers.
  • a layer thickness of the first encapsulation is 20 ⁇ m to 400 ⁇ m, preferably 50 ⁇ m to 200 ⁇ m, and / or a layer thickness of the second encapsulation is 50 ⁇ m to 1000 ⁇ m, preferably 50 ⁇ m to 500 ⁇ m, or preferably 100 ⁇ m to 500 ⁇ m, and / or a layer thickness of the first connecting material and / or the second connecting material is 10 ⁇ m to 300 ⁇ m, preferably 20 ⁇ m to 150 ⁇ m, or preferably 20 ⁇ m to 100 ⁇ m. If an encapsulation has a plurality of layers, the individual layers can have the same layer thickness or a different layer thickness among one another.
  • the layer thickness of the first encapsulation is 1 pm to 2000 pm, preferably 1 pm to 1000 pm, preferably 1 pm to 100 pm, preferably 1 pm to 10 pm, preferably 5 pm to 1000 pm, preferably 10 pm to 1000 pm, preferably 10 mih to 500 mih, preferably 10 mih to 200 mih, preferably 10 mih to 100 mih, preferably 20 mih to 200 mih, preferably 20 mih to 100 mih, preferably 20 mih to 100 mih, preferably 50 mih to 500 mih, preferably 50 mih to 200 mih, or preferably 50 mpib to 100 mih.
  • the layer thickness of the second encapsulation is 10 gm to 2000 gm, preferably 10 gm to 1000 gm, preferably 10 gm to 500 gm, preferably 10 gm to 100 gm, preferably 10 gm to 200 gm, preferably 10 gm to 100 gm, preferably 20 gm to 200 gm, preferably 20 gm to 100 gm, preferably 20 gm to 100 gm, preferably 50 gm to 500 gm, preferably 50 gm to 200 gm, or preferably 50 gm to 100 gm.
  • the layer thickness of the second encapsulation is at least 100 ⁇ m, preferably at least 1000 ⁇ m, or preferably at least 2000 ⁇ m.
  • the encapsulation system has flexible properties, an elasticity (modulus of elasticity) of the encapsulation system being 80,000 psi to 360,000 psi, preferably 100,000 psi to 300,000 psi, preferably 120,000 psi to 260,000 psi, or preferably 100,000 psi to 200,000 psi psi.
  • the width of the first edge area is 5 mm to 200 mm, preferably 5 mm to 100 mm, preferably 10 mm to 100 mm, preferably 10 mm to 80 mm, preferably 10 mm to 50 mm, preferably 10 mm to 30 mm, preferably 20 mm to 100 mm, or preferably 20 mm to 50 mm, and / or the width of the second edge area is 5 mm to 100 mm, preferably 5 mm to 50 mm, preferably 5 mm to 40 mm, preferably 5 mm to 30 mm, preferably 8 mm to 50 mm, preferably 8 mm to 40 mm, preferably 8 mm to 30 mm, preferably 10 mm to 80 mm, preferably 10 mm to 50 mm, preferably 10 mm to 40 mm, preferred 10 mm to 30 mm, or preferably 20 mm to 40 mm.
  • the layer thickness of the first encapsulation partially decreases towards the first edge region, preferably continuously or discontinuously, preferably up to a width of the first edge region of 5 mm to 60 mm, preferably from 20 mm to 30 mm, and / or the layer thickness of the second encapsulation partially decreases towards the second edge region, preferably continuously or discontinuously, preferably up to a width of the second Edge area from 5 mm to 50 mm, preferably from 8 mm to 20 mm.
  • the at least one barrier layer and / or the at least one protective layer is preferably a UV protective layer, an anti-reflective layer, a layer against moisture and / or oxygen, in particular atmospheric oxygen, and / or a mechanical protective layer to increase scratch resistance.
  • the at least one front barrier layer and / or the at least one rear barrier layer comprises a material selected from the group consisting of polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN) , Polyethylene terephthalate (PET), polypropylene (PP), polyvinyl chloride (PVC), and thermoplastic polyurethane (TPU), the material of the front and / or the rear barrier layer preferably being coated, and / or the at least one front protective layer and / or the at least one rear protective layer has a material selected from the group consisting of ethylene vinyl acetate (EVA), polyacrylate (PA),
  • EVA ethylene vinyl acetate
  • PA polyacrylate
  • PC Polycarbonate
  • PE polyethylene
  • PEN polyethylene naphthalate
  • PET polyethylene terephthalate
  • PMMA polymethyl methacrylate
  • PP polypropylene
  • PVC polyvinyl chloride
  • TPU thermoplastic polyurethane
  • At least one barrier layer and / or at least one protective layer has a coating, the coating imparting certain functional properties to the barrier layers and / or the protective layers.
  • EFE ethylene tetrafluoroethylene
  • PVDF polyvinylidene fluoride
  • PVF polyvinyl fluoride
  • PTFE polytetrafluoroethylene
  • the first encapsulation and / or the second encapsulation is at least largely electrically insulating.
  • the first connecting material and / or the second connecting material is selected from the group consisting of acrylates, epoxides and polyurethanes, preferably in a 1-component or 2-component composition.
  • the first connecting material and / or the second connecting material is a curable material, in particular a crosslinkable material, preferably by UV curing or thermal curing.
  • a connecting material of an encapsulation is understood to mean, in particular, a material for connecting, in particular for gluing, layers, in particular barrier layers and / or protective layers, to one another and / or to the optoelectronic component.
  • the first connecting material and / or the second connecting material is selected from the group consisting of siloxanes / polysiloxanes, epoxides, in particular an epoxy resin, acrylates / polyacrylates, in particular polymethyl methacrylate (PMMA), styrenes / polystyrene, urethanes / polyurethanes or Derivatives thereof in the form of monomers, oligomers or polymers.
  • the first connecting material and / or the second connecting material has an initiator and / or a catalyst to accelerate the curing and / or the crosslinking.
  • the layer thickness of the first encapsulation in the first edge area is 1 pm to 100 pm, preferably 10 pm to 50 pm, or preferably 10 pm to 30 pm, and / or the layer thickness of the second encapsulation in the second edge area is 1 pm to 100 pm, preferably 10 pm to 50 pm, or preferably 10 pm to 30 pm.
  • first edge region and / or the second edge region in particular the edges of the first edge region and / or the edges of the second edge region, are sealed.
  • At least two optoelectronic components are encapsulated together in the encapsulation system, preferably at least two optoelectronic components are each individually encapsulated with the first encapsulation and are encapsulated together with the second encapsulation.
  • a functional layer preferably a colored layer, a filter layer and / or an adhesive layer, can be arranged at least partially between the first encapsulation and the second encapsulation and / or between the optoelectronic component and the first encapsulation.
  • the encapsulation system has at least one further encapsulation, preferably a third encapsulation, the third encapsulation enclosing the second encapsulation, or preferably a third encapsulation and a fourth encapsulation, the third encapsulation enclosing the second encapsulation and the fourth encapsulation encloses the third encapsulation.
  • the third encapsulation is composed of at least one front protective layer on the front side of the optoelectronic component and at least one rear protective layer on the rear side of the optoelectronic component with at least one connecting material applied in between formed, the third encapsulation preferably enclosing the second encapsulation in such a way that the third encapsulation protrudes with an edge region over the second edge region of the second encapsulation.
  • the object of the present invention is also achieved by providing an optoelectronic component, preferably a flexible optoelectronic component, with an encapsulation system according to the invention, in particular double encapsulation, in particular according to one of the exemplary embodiments described above.
  • an optoelectronic component preferably a flexible optoelectronic component
  • an encapsulation system according to the invention, in particular double encapsulation, in particular according to one of the exemplary embodiments described above.
  • the optoelectronic component has a layer system with an electrode, a counter electrode, and at least one photoactive layer, the at least one photoactive layer being arranged between the two electrodes.
  • the photovoltaic element has a cell with at least one photoactive layer, in particular a CIS, CIGS, GaAs, or Si cell, a perovskite cell or an organic photovoltaic element (OPV), a so-called organic solar cell.
  • a photoactive layer in particular a CIS, CIGS, GaAs, or Si cell, a perovskite cell or an organic photovoltaic element (OPV), a so-called organic solar cell.
  • An organic photovoltaic element is understood to mean, in particular, a photovoltaic element with at least one organic photoactive layer, in particular a polymeric organic photovoltaic element or an organic photovoltaic element based on small molecules. While polymers are characterized by the fact that they cannot be evaporated and can therefore only be applied from solutions, small molecules can usually be evaporated and can either be applied as a solution like polymers or by means of evaporation technology, in particular by evaporation from a vacuum.
  • the organic photoactive layer is in particular a photoactive layer in which excitons (electron-hole pairs) are formed by radiation from visible light, UV radiation and / or IR radiation.
  • the Organic materials are printed, glued, coated, vapor-deposited or otherwise applied onto the foils in the form of thin films or small volumes.
  • the at least one photoactive layer is formed from organic materials, preferably from small organic molecules or polymeric organic molecules, particularly preferably from small organic molecules.
  • Small molecules are understood to mean, in particular, non-polymeric organic molecules with monodisperse molar masses between 100 and 2000 g / mol, which are present in the solid phase under normal pressure (air pressure of the surrounding atmosphere) and at room temperature.
  • the small molecules are photoactive, photoactive being understood to mean that the molecules change their charge state and / or their polarization state when light is introduced.
  • the optoelectronic component has a substrate, preferably a film, the layer system of the optoelectronic component being arranged on the substrate.
  • the optoelectronic component has at least one busbar, preferably at least two busbars, the at least one busbar being arranged under the first encapsulation and / or the second encapsulation and at least partially on the electrode and / or the counter electrode of the optoelectronic component is electrically conductively contacted, and wherein the at least one busbar is electrically conductively contacted by means of at least one contact element with a junction box lying outside the second encapsulation.
  • a busbar a so-called busbar, is understood to mean, in particular, an arrangement which is used for electrical contacting as a central distributor of electrical energy incoming and outgoing lines are electrically conductively connected, preferably with at least one electrode and / or at least one counter-electrode.
  • the busbar is designed in particular in a planar manner as a band, strip, plate or as a metal layer.
  • a junction box is understood to mean, in particular, an element for connecting the optoelectronic component to an electrical circuit.
  • the junction box is used in particular for the electrically conductive connection of at least one busbar arranged under the at least one protective layer of the optoelectronic component to an electrical circuit.
  • the contact element in particular an electrically conductive contact element, is arranged at least largely between the first encapsulation and the second encapsulation, the layer system of the optoelectronic component being electrically conductively contacted through the first encapsulation.
  • the optoelectronic component is a photovoltaic element, in particular a solar cell.
  • each cell preferably has its own electrode and counter electrode.
  • the series connection is made by electrically connecting the electrode of one cell to the counter electrode of the next cell.
  • An optoelectronic component is understood to mean, in particular, a photovoltaic element.
  • a photovoltaic element is understood to mean, in particular, a photovoltaic cell, in particular a solar cell.
  • the photovoltaic element is preferably composed of several photovoltaic cells which can be connected in series or in parallel. The several photovoltaic cells can be arranged and / or connected in different ways in the optoelectronic component.
  • the at least one busbar is applied directly to the electrode or the counter-electrode, that is to say connected in an electrically conductive manner.
  • an electrically conductive layer is arranged between the at least one busbar and the electrode or the counter electrode.
  • the optoelectronic component is a flexible optoelectronic component.
  • the flexible optoelectronic component is a flexible photovoltaic element, in particular a flexible organic photovoltaic element.
  • a flexible optoelectronic component is understood to mean, in particular, an optoelectronic component that can be bent and / or stretched in a specific area.
  • FIG. 1 shows a schematic illustration of an exemplary embodiment of a layer system of an optoelectronic component in cross section
  • FIG. 2 shows a schematic illustration of an exemplary embodiment of an optoelectronic component with an encapsulation system in a cross section
  • FIG. 3 shows a schematic illustration of an exemplary embodiment of an optoelectronic component with an encapsulation system in a cross section; and 4 shows a schematic illustration of an exemplary embodiment of a plurality of optoelectronic components encapsulated in an encapsulation system, in cross section.
  • the exemplary embodiments relate in particular to an optoelectronic component produced in a roll-to-roll process.
  • FIG. 1 shows a schematic illustration of an exemplary embodiment of a layer system 20 of an optoelectronic component 2 in cross section.
  • the optoelectronic component 2 in particular an organic photovoltaic element, consists of a sequence of thin layers, with the layer system 20, with at least one photoactive layer 26, which is preferably evaporated in a vacuum or processed from a solution.
  • the electrical connection can be made by metal layers, transparent conductive oxides and / or transparent conductive polymers.
  • the vacuum deposition of the organic layers is particularly advantageous in the production of multilayer photovoltaic elements, in particular tandem or triple cells.
  • a layer system 20 of such an optoelectronic component 2 is shown in one exemplary embodiment in FIG. 1.
  • the optoelectronic component 2 has a layer system 20 with at least two electrodes 18, for example ITO, and 19, for example aluminum, and at least one photoactive layer 26 with at least one absorber material on a substrate 23, for example a polymer film, the at least one photoactive layer 26 is arranged between the two electrodes 18, 19.
  • the layer system 20 can furthermore have a hole transport layer 24 and a charge carrier layer 25.
  • the layer system 20 with the electrodes 18, 19 can be laser-structured.
  • FIG. 2 shows a schematic illustration of an exemplary embodiment of an optoelectronic component 2 with an encapsulation system 1 in a cross section. Identical and functionally identical elements are provided with the same reference symbols, so that in this respect reference is made to the preceding description.
  • the optoelectronic component 2 is an organic photovoltaic element.
  • the encapsulation system in particular a double encapsulation, for an optoelectronic component 2, has at least a first encapsulation 3 and a second encapsulation 4, the first encapsulation 3 comprising at least one front barrier layer 5 on a front side of the optoelectronic component 2 and at least one rear barrier layer 6 is formed on a rear side of the optoelectronic component 2 with at least one first connecting material 7 applied in between, the second encapsulation 4 comprising at least one front protective layer 8 on the front side of the optoelectronic component 2 and at least one rear protective layer 9 on the rear side of the optoelectronic component 2 is formed with at least one second connecting material 10 attached therebetween.
  • the first encapsulation 3 encloses the optoelectronic component 2 in such a way that the first encapsulation 3 protrudes with a first edge region 11 over the optoelectronic component 2.
  • the second encapsulation 4 encloses the first encapsulation 3 with the optoelectronic component 2 in such a way that the second encapsulation 4 protrudes with a second edge region 12 over the first edge region 11 of the first encapsulation 3.
  • the optoelectronic component 2 is encapsulated with the encapsulation system 1 and completely enclosed on all sides.
  • the edge regions 11, 12 can be designed differently.
  • the encapsulation system protects the optoelectronic component 2 particularly well against external influences, in particular environmental influences and mechanical damage.
  • edges and / or corners of the first encapsulation 3 are covered with the second encapsulation 4 and against delamination protected.
  • Different properties of barrier layers 5, 6 and / or protective layers 8, 9 are advantageously divided between at least the first encapsulation 3 and the second encapsulation 4.
  • the barrier layers 5, 6 and / or the protective layers 8, 9 for forming the first encapsulation 3 and / or the second encapsulation 4 can be applied using the deposition methods known to those skilled in the art, e.g. by means of an atomic layer deposition method (ALD), a plasma-assisted atomic layer deposition method (PEALD) or a plasma-less atomic layer deposition process (PLALD), by means of a chemical vapor deposition process (CVD), a plasma-assisted gas phase deposition process (PECVD), a plasma-less gas phase deposition process (PLCVD), and / or alternatively by means of other suitable deposition processes.
  • ALD atomic layer deposition method
  • PEALD plasma-assisted atomic layer deposition method
  • PLAD plasma-less atomic layer deposition process
  • CVD chemical vapor deposition process
  • PECVD plasma-assisted gas phase deposition process
  • PLCVD plasma-less gas phase deposition process
  • the first encapsulation 3 is formed over the complete extent of the optoelectronic component 2
  • the second encapsulation 4 is formed over the complete extent of the first encapsulation 3
  • / or the first edge region 11 of the first encapsulation 3 is all around the optoelectronic component 2 is formed
  • / or the second edge region 12 of the second encapsulation 4 is formed all around the first encapsulation 3, with a width 13 of the first edge region 11 depending on an edge of the optoelectronic component 2 and / or a width 14 of the second edge region 12 is designed differently depending on an edge of the first encapsulation 3.
  • the at least one front barrier layer 5 and the at least one rear barrier layer 6 of the first encapsulation 3 are made of different materials and / or a different number of layers, and / or the at least one front protective layer 8 and the at least a rear protective layer 9 of the second encapsulation 4 is formed from a different material and / or a different number of layers.
  • the first encapsulation 3 is formed from at least two front and / or rear barrier layers 5, 6, in particular barrier layers 5, 6 with different properties, and / or the second encapsulation 4 is made up of at least two front and / or rear layers Protective layers 8, 9 are formed, in particular protective layers 8, 9 with different properties, the first encapsulation 3 preferably forming protection against moisture and / or oxygen, in particular atmospheric oxygen, and the second encapsulation 4 forming mechanical protection.
  • an adhesive layer is arranged between the optoelectronic component 2 and the first encapsulation 3 and / or an adhesive layer is arranged between the first encapsulation 3 and the second encapsulation 4, and / or is between the optoelectronic component 2 and the first Encapsulation 3 arranged a planarization layer.
  • a layer thickness of the first encapsulation is 320 pm to 400 pm, preferably 50 pm to 200 pm, and / or a layer thickness of the second encapsulation is 450 pm to 1000 pm, preferably 100 pm to 500 pm, and / or a layer thickness of the first connecting material 7 and / or of the second connecting material is 1010 ⁇ m to 300 ⁇ m, preferably 20 ⁇ m to 100 ⁇ m.
  • the width 13 of the first edge region is 115 mm to 200 mm, preferably 20 mm to 50 mm, and / or the width 14 of the second edge region is 125 mm to 100 mm, preferably 8 mm to 40 mm.
  • the layer thickness of the first encapsulation 3 partially decreases towards the first edge region 11, preferably up to a width 21 of the first edge region 11 of 5 mm to 60 mm, preferably from 20 mm to 30 mm, and / or increases the layer thickness of the second encapsulation 4 to the second edge region 12 down partially, preferably up to a width 22 of the second edge region 12 of 5 mm to 50 mm, preferably of 8 mm to 20 mm.
  • the at least one barrier layer 5, 6 and / or the at least one protective layer 8, 9 is a UV protective layer, an anti-reflective layer, a layer against moisture and / or oxygen, and / or a mechanical protective layer, preferred to increase scratch resistance.
  • the at least one front barrier layer 5 and / or the at least one rear barrier layer 6 comprises a material selected from the group consisting of polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN) , Polyethylene terephthalate (PET), polypropylene (PP), polyvinyl chloride (PVC), and thermoplastic polyurethane (TPU), the material of the front and / or the rear barrier layer 5, 6 preferably being coated and / or having the at least one front protective layer 8 and / or the at least one rear protective layer 9 a material selected from the group consisting of ethylene vinyl acetate (EVA), polyacrylate (PA),
  • EVA ethylene vinyl acetate
  • PA polyacrylate
  • PC Polycarbonate
  • PE polyethylene
  • PEN polyethylene naphthalate
  • PET polyethylene terephthalate
  • PMMA polymethyl methacrylate
  • PP polypropylene
  • PVC polyvinyl chloride
  • TPU thermoplastic polyurethane
  • the first connecting material 7 and / or the second connecting material 10 is selected from the group consisting of acrylates, epoxides and polyurethanes, preferably in a 1-component or 2-component composition.
  • the first edge region 11 and / or the second edge region 12, in particular the edges of the first edge region 11 and / or the edges of the second edge region 12, are sealed and / or at least two optoelectronic components 2 are jointly in the Encapsulation system 1 encapsulated, preferably at least two optoelectronic components 2 are each individually encapsulated with the first encapsulation 3 and encapsulated together with the second encapsulation 4.
  • the optoelectronic component 2 is encapsulated with the encapsulation system 1, in particular a double encapsulation.
  • the optoelectronic component 2 has a layer system 20 with an electrode 18, a counter electrode 19, and at least one photoactive layer 26, the at least one photoactive layer 26 being arranged between the two electrodes 18, 19.
  • the optoelectronic component 2 has at least one busbar 15, preferably at least two busbars 15, which are arranged under the first encapsulation 3 and / or the second encapsulation 4 and at least partially on the electrode 18 and / or the counter electrode 19 of the optoelectronic component 2 is electrically conductively contacted, and wherein the at least one busbar 15 is electrically conductively contacted by means of at least one contact element 16 with a junction box 17 located outside the second encapsulation 4.
  • the optoelectronic component 2 is a photovoltaic element, in particular a solar cell, preferably a flexible organic photovoltaic element.
  • the encapsulation system 1 can be produced in one embodiment as follows: To form the
  • encapsulation system 1 is initially a material for applying a barrier layer 5, 6, consisting of a 100 ⁇ m thick PET carrier material and several SiOx layers, unrolled from a roll and on the inside over the entire surface using a slot nozzle method with a 50 ⁇ m thick acrylate adhesive layer coated as connecting material 7. The process is repeated on a second roll of the same material. Both coated foils are fed to a laminating unit in such a way that the two with the sides coated with the acrylate adhesive layer are oriented towards one another and the edges of the rolls lie one above the other. An optoelectronic component 2 is separated from a third roll, fed to the lamination unit between the barrier layers 5, 6 and pressed.
  • the optoelectronic component 2 is, for example, 2 m long and 30 cm wide. After pressing in the laminating plant, the connecting material 7 is hardened by means of the action of heat under infrared lamps. This can be done, for example, at 100 ° C and a duration of 180s. The optoelectronic component 2 is thus encapsulated with a first encapsulation 3 with a first edge region 11.
  • the second encapsulation 4 largely follows the processes of the first encapsulation 3. This time, however, materials for forming protective layers 8, 9 are applied. In this exemplary embodiment, mechanical protective films are used, but direct coating is also conceivable as an alternative.
  • the front protective layer 8 is a 100 ⁇ m thick PET base film which, on the side facing away from the optoelectronic component 2, has a protective lacquer that is weather-resistant and UV-blocking.
  • the rear protective layer 9 is a PP coextrudate with a layer thickness of 200 ⁇ m.
  • the connection material 7,10 in both encapsulations is a 2-component polyurethane adhesive, the curing takes place with heat support at 100 ° C over a period of 180s, but there can also be a different first
  • Connection material 7 and second connection material 10 are used.
  • the first encapsulation 3 and / or the second encapsulation 4 can alternatively be cured by means of UV curing, dual curing, thermal curing, and / or by means of a reaction gas.
  • the barrier layers 5, 6 and / or the protective layers 8, 9 can alternatively be applied by means of a printing process, preferably a screen printing process, a plot process, an inkjet printing process or a 3D printing process, a slot nozzle process, a decimal point process, or one
  • the first encapsulation 3 and the second encapsulation 4 of the optoelectronic component 2 can in particular be carried out in a roll-to-roll method.
  • FIG. 3 shows a schematic illustration of an exemplary embodiment of an optoelectronic component 2 with an encapsulation system 1 in a cross section. Identical and functionally identical elements are provided with the same reference symbols, so that in this respect reference is made to the preceding description.
  • the optoelectronic component 2 is an organic photovoltaic element.
  • the electrical contact 16, wherein the at least one busbar 15 is at least partially electrically conductively contacted at the electrode 18 or the counter electrode 19, can be carried out as follows:
  • a step b) at least one opening is formed in the first encapsulation 3 by means of laser ablation with at least one laser beam, at least one busbar 15 arranged below the first encapsulation 3 being partially exposed.
  • a low-melting solder is introduced into the at least one opening, and an electrically conductive element is aligned on a side of the at least one opening opposite the at least one busbar 15.
  • an electrically conductive contact element 16 is formed in the at least one opening by means of inductive soldering.
  • at least one connection opening is formed in the second encapsulation 4 by means of laser ablation with at least one laser beam for the electrically conductive connection of the connection box 17 in a step e).
  • the junction box 17 is electrically conductively contacted with the electrically conductive contact element 16.
  • the parameters of the laser ablation in particular an energy density, a pulse duration, a pulse shape, a pulse frequency and / or a wavelength of the at least one laser beam are adapted depending on the material and the layer thickness of the first encapsulation 3 and / or the second encapsulation 4, and the parameters of the inductive soldering are adapted depending on the material and dimensions of the connecting element to be formed.
  • FIG. 4 shows a schematic illustration of an exemplary embodiment of a plurality of optoelectronic components 2 encapsulated in an encapsulation system 1, in cross section. Identical and functionally identical elements are provided with the same reference symbols, so that in this respect reference is made to the preceding description.
  • At least two optoelectronic components 2 are encapsulated together in the encapsulation system 1, preferably at least two optoelectronic components 2 are each individually encapsulated with the first encapsulation 3 and encapsulated together with the second encapsulation 4.
  • three optoelectronic components 2 are each individually encapsulated with a first encapsulation 3, and then the optoelectronic components 2 individually encapsulated with the first encapsulation 3 are encapsulated together with a second encapsulation 4, an individually encapsulated component 27 being obtained.
  • the individual optoelectronic components 2, in particular the individual photovoltaic elements, are connected to one another in an electrically conductive manner via line elements 28.
  • the optoelectronic components 2 can be connected in parallel or connected in series.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photovoltaic Devices (AREA)
  • Luminescent Compositions (AREA)

Abstract

L'invention concerne un système d'encapsulation (1), en particulier une encapsulation double, pour un composant optoélectronique (2), comprenant au moins une première encapsulation (3) et une deuxième encapsulation (4), la première encapsulation (3) étant constituée d'au moins une couche barrière antérieure (5) située sur une face avant du composant optoélectronique (2) et d'au moins une couche barrière postérieure (6) située sur une face arrière du composant optoélectronique (2), avec au moins un premier matériau de liaison (7) disposé entre elles, la deuxième encapsulation (4) étant constituée d'au moins une couche de protection antérieure (8) située sur la face avant du composant optoélectronique (2) et d'au moins une couche de protection postérieure (9) située la face arrière du composant optoélectronique (2), avec au moins un deuxième matériau de liaison (10) disposé entre elles. La première encapsulation (3) entoure le composant optoélectronique (2) de manière que cette première encapsulation (3) fasse saillie par rapport à ce composant optoélectronique (2) avec une première zone marginale (11), et la deuxième encapsulation (4) entoure la première encapsulation (3) renfermant le composant optoélectronique (2) de manière que la deuxième encapsulation (4) fasse saillie par rapport à la première zone marginale (11) de la première encapsulation (3) avec une deuxième zone marginale (12).
EP21705421.2A 2020-01-06 2021-01-05 Système d'encapsulation conçu pour un composant optoélectronique, comportant au moins une première encapsulation et une deuxième encapsulation, composant optoélectronique équipé d'un tel système d'encapsulation Pending EP4088329A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020200053.0A DE102020200053A1 (de) 2020-01-06 2020-01-06 Verkapselungssystem für ein optoelektronisches Bauelement mit mindestens einer ersten Verkapselung und einer zweiten Verkapselung, optoelektronisches Bauelement mit einem solchen Verkapselungssystem
PCT/DE2021/100001 WO2021139853A1 (fr) 2020-01-06 2021-01-05 Système d'encapsulation conçu pour un composant optoélectronique, comportant au moins une première encapsulation et une deuxième encapsulation, composant optoélectronique équipé d'un tel système d'encapsulation

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EP4088329A1 true EP4088329A1 (fr) 2022-11-16

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US (1) US20230036237A1 (fr)
EP (1) EP4088329A1 (fr)
JP (1) JP2023509492A (fr)
KR (1) KR20220124183A (fr)
CN (1) CN114868269A (fr)
DE (1) DE102020200053A1 (fr)
WO (1) WO2021139853A1 (fr)

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DE102020131743A1 (de) * 2020-11-30 2022-06-02 Heliatek Gmbh Photovoltaisches Element mit mindestens einer photovoltaischen Zelle und mit einer Rückseitenbarriere

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1524708A3 (fr) * 1998-12-16 2006-07-26 Battelle Memorial Institute Matière de barrière contre les conditions d'ambiance et son procédé de fabrication
US6765351B2 (en) 2001-12-20 2004-07-20 The Trustees Of Princeton University Organic optoelectronic device structures
US20070216300A1 (en) 2002-04-04 2007-09-20 International Display Systems, Inc. Organic opto-electronic device with environmentally protective barrier
WO2004083958A2 (fr) 2003-03-19 2004-09-30 Technische Universität Dresden Composant photo-actif presentant des couches organiques
US20070295385A1 (en) * 2006-05-05 2007-12-27 Nanosolar, Inc. Individually encapsulated solar cells and solar cell strings having a substantially inorganic protective layer
WO2008014492A2 (fr) 2006-07-27 2008-01-31 Nanosolar, Inc. Cellules solaires individuellement encapsulées et/ou chaînes de cellules solaires
US20090114262A1 (en) * 2006-08-18 2009-05-07 Adriani Paul M Methods and Devices for Large-Scale Solar Installations
US20080289681A1 (en) * 2007-02-27 2008-11-27 Adriani Paul M Structures for low cost, reliable solar modules
WO2008150558A1 (fr) * 2007-06-08 2008-12-11 Robert Stancel Ensemble de branchement électrique pour montage en bordure
US20110041890A1 (en) * 2007-11-19 2011-02-24 Sheats James R High-efficiency, high current solar cell and solar module
WO2009144899A1 (fr) * 2008-05-27 2009-12-03 株式会社フジクラ Élément de conversion photoélectrique
DE102011084276B4 (de) * 2011-10-11 2019-10-10 Osram Oled Gmbh Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung
KR101809659B1 (ko) * 2011-10-14 2017-12-18 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
US20150029681A1 (en) * 2013-07-29 2015-01-29 Evonik Industries Ag Flexible composite, production thereof and use thereof
DE102013013829A1 (de) * 2013-08-21 2015-02-26 Mühlbauer Ag Anschlussadapter für Photovoltaik-Halbzeuge zur Herstellung von Solarprodukten
WO2015107035A1 (fr) * 2014-01-16 2015-07-23 Koninklijke Philips N.V. Dispositif à semi-conducteur encapsulé et procédé d'encapsulation
US10193101B2 (en) * 2014-03-26 2019-01-29 Sharp Kabushiki Kaisha Electronic device
US10910590B2 (en) 2014-03-27 2021-02-02 Universal Display Corporation Hermetically sealed isolated OLED pixels
DE102016106846A1 (de) 2016-04-13 2017-10-19 Osram Oled Gmbh Mehrschichtige Verkapselung, Verfahren zur Verkapselung und optoelektronisches Bauelement
FR3066324B1 (fr) * 2017-05-11 2021-09-10 Isorg Dispositif electronique a tenue au vieillissement amelioree

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US20230036237A1 (en) 2023-02-02
CN114868269A (zh) 2022-08-05
JP2023509492A (ja) 2023-03-08
KR20220124183A (ko) 2022-09-13
DE102020200053A1 (de) 2021-07-08
WO2021139853A1 (fr) 2021-07-15

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