Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K5/00—Casings, cabinets or drawers for electric apparatus
  • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
  • H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/50—Fixed connections
  • H01R12/51—Fixed connections for rigid printed circuits or like structures
  • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
  • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/50—Fixed connections
  • H01R12/51—Fixed connections for rigid printed circuits or like structures
  • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
  • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
  • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board

Definitions

• the present invention relates to an electronic device.
• the invention also relates to a control device and a method for assembling an electronic arrangement.
• circuit boards are mounted on a large number of pins.
• the circuit board and pins are usually connected by means of soldering or a press connection.
• soldering or a press connection.
• it is necessary to support the pins or the component holding the pins.
• sufficient support during the pressing is often not possible or can only be implemented to a limited extent.
• the electronic arrangement according to the invention with the features of claim 1 offers the advantage of a very simple and inexpensive construction which enables reliable and effective mechanical support when a printed circuit board is pressed on.
• this is achieved with an electronic arrangement comprising a base plate, an electronic component, a printed circuit board, a cooling area, and a sealing arrangement.
• the base plate is preferably provided to hold the other components.
• the base plate can be designed to allow the components to be fastened in or on a housing.
• the base plate can accommodate a mechanical load.
• the electronic component has a large number of pins, each of which extends parallel to a press-in axis.
• the electronic component can be designed in many ways.
• the electronic component can have one or more electronic components, such as, for example, inverters.
• the circuit board is pressed onto the pins along the press-in axis. In particular, there is thus a press connection between the circuit board and the pins.
• the sealing arrangement is arranged between the base plate and the electronic component, in particular along a direction of the press-in axis.
• the sealing arrangement has a seal carrier and at least one seal.
• the sealing arrangement is provided in order to seal off the cooling area which is located between the electronic component and the base plate.
• the seal can be an elastomeric seal such as an O-ring seal.
• the seal is preferably received at least partially in the seal carrier.
• the seal carrier can have an annular groove in which the seal is partially received.
• the seal carrier has a large number of press-in domes protruding parallel to the press-in axis.
• the electronic component is supported here by means of the press-in dome in order to absorb a pressing force when the circuit board is pressed onto the pins.
• Press-in domes are pin-like or nipple-like elevations of the seal carrier, which protrude from a base body of the seal carrier and thereby form a reduced contact surface for an adjacent component.
• the press-in domes preferably protrude slightly from a surface of the seal carrier surrounding the press-in domes, in particular by a maximum of 5 mm, preferably at least 0.5 mm.
• the cooling area is preferably set up to receive a coolant.
• the cooling area in particular with coolant, can be provided in order to enable the electronic component to be cooled.
• the cooling area can be viewed as a gap between the electronic component and the base plate. Since the electronic component cannot be supported directly when the circuit board is pressed on due to the cooling area, the indirect support by means of the press-in dome of the Seal carrier can be particularly advantageously made possible that the circuit board can be pressed on with little effort, precisely and without damaging parts of the electronic arrangement.
• the press-in domes of the seal carrier provide indirect support for the electronic component on the base plate. This means that when the printed circuit board is pressed onto the pins, it can be held against on or by means of the base plate, preferably by means of a counter-holding force opposing the pressing force.
• the press-on force can be conducted from the electronic component through the seal carrier into the base plate, with the press-in domes forming part of the force transmission path.
• the press-in domes are provided in order to avoid damage to the seal, for example due to excessive compression due to the press-on force.
• the special design of the press-in dome enables optimal and targeted distribution of the mechanical loads when the printed circuit board is pressed on, in order to avoid damage to the electronic arrangement.
• a specifically designed support means that when the circuit board is pressed on, a desired pressing force can be implemented in a particularly targeted and precise manner in order to produce a reliable, long-lasting and easy-to-produce press connection between the circuit board and pins, which can be easily reproduced with little or no deviations.
• the electronic arrangement preferably further comprises a holding plate which is connected to the base plate.
• the holding plate pretensions the electronic component in the direction of the base plate.
• the holding plate is preferably connected to the base plate by means of a screw connection.
• the holding plate thus allows the assembly of the electronic component, base plate and sealing arrangement to be pretensioned.
• the press-in domes are preferably elastically deformed by the connection between the holding plate and the base plate. That is, by bracing the holding plate with the base plate, the electronic component and the seal carrier are clamped between the holding plate and the base plate in such a way that the press-in domes are elastically deformed. In this case, there is preferably an elastic deformation exclusively on the press-fit domes.
• the seal is thereby preferably slightly compressed in order to provide direct support, that is to say without elastic flexibility of the seal.
• the circuit board can be pressed onto the pins particularly precisely and precisely with a desired pressing force.
• the holding plate is particularly preferably arranged on a side of a partial area of the electronic component opposite the base plate. Furthermore, the holding plate is connected to a contact element of the base plate that protrudes parallel to the press-in axis.
• the retaining plate and the contact element are connected to one another in a lying manner. This enables a particularly simple assembly of the electronic arrangement, in particular as a preparation for pressing the printed circuit board on, by simply bracing the holding plate against the base plate so that the holding plate rests against the contact element.
• the holding plate can be designed as an annular plate, with a radially inner region of the holding plate resting against a radially outer flange region of the electronic component.
• a radially outer region of the holding plate can bear against the contact element of the base plate, the contact element preferably protruding in the direction of the electronic component.
• the holding plate can be constructed in several parts, for example in the form of a plurality of individual plates, which can each be braced separately with the base plate and each come into contact with a separate sub-area of the electronic component.
• the holding plate can preferably be connected to the contact element by means of a screw connection, for a particularly simple, inexpensive design and manufacture.
• the press-in domes are preferably designed so that a sum of a first restoring force, which corresponds to a sum of restoring forces of all press-in domes, and a second restoring force of the seal is greater than or equal to the predetermined pressing force with which the circuit board is pressed onto the pins.
• the predetermined pressing force is preferably at least 70 N, and in particular a maximum of 150 N, per pin.
• the first elastic restoring force is preferably significantly greater than the second elastic restoring force.
• a value of the first elastic restoring force is preferably at least 80%, particularly preferably at least 95%, of the predetermined pressing force.
• the seal carrier and the seal preferably surround the cooling area in an annular manner in order to provide the sealing of the cooling area between the electronic component and the base plate.
• the sealing arrangement preferably has two seals in order to enable particularly reliable sealing of the cooling area.
• a first seal is arranged between the seal carrier and the electronic component and a second seal is arranged between the seal carrier and the base plate.
• the seal carrier of the seal carrier preferably has an annular groove in which the seals are arranged on opposite sides along a direction of the press-in axis.
• the seal carrier has an H-shaped cross section in a cross-sectional plane parallel to the press-in axis.
• a plurality of press-fit domes are further preferably grouped to form press-fit domes groups.
• press-fit dome groups are distributed around the circumference of the seal carrier.
• a press-fit dome group is considered to be a predefined number of press-fit domes which are arranged close to one another.
• a first distance between adjacent press-fit dome groups is preferably at least three times, preferably at least ten times, a distance between adjacent press-fit domes within a press-fit dome group.
• Each press-fit dome group particularly preferably has at least two, preferably a maximum of ten, in particular three, press-fit domes.
• the seal carrier preferably has at least four, particularly preferably a maximum of twelve, in particular eight, press-fit dome groups.
• Each press-fit dome preferably has a length-to-width ratio of at least one, preferably a maximum of five, in particular two.
• the length-width ratio is considered in a cross-sectional plane perpendicular to the press-in axis.
• the length preferably corresponds to one dimension of the press-in dome essentially along a circumferential direction of the seal carrier, the width corresponding to one dimension of the press-in dome, in particular perpendicular to the length, essentially in the radial direction of the seal carrier.
• Each press-in dome particularly preferably has a rectangular or oval cross-section in the cross-sectional plane.
• the seal carrier is preferably formed from plastic, in particular from a thermoplastic, particularly preferably polyphenylene sulfide.
• a thermoplastic particularly preferably polyphenylene sulfide.
• the press-in domes are particularly preferably arranged on the seal carrier facing the electronic component. This means that when the printed circuit board is pressed on, the electronic component rests against the press-in mandrels. As a result, there is only a small contact area between the electronic component and the seal carrier, namely on the press-fit domes, so that, for example, heat transfer from the electronic component to the seal carrier is kept low.
• the invention also leads to a control device which comprises the electronic arrangement described.
• the control device is preferably a control device of a vehicle, such as an engine control device, in particular a motor vehicle.
• the invention also relates to a method for assembling an electronic arrangement, in particular the electronic arrangement described. The method comprises the steps, which are preferably carried out one after the other in the sequence described below:
• seal carrier has a plurality of press-in domes protruding parallel to the press-in axis
• the press-in dome supports the electronic component when the printed circuit board is pressed on, in order to absorb a press-on force.
• the method is characterized by the fact that it can be carried out in a particularly simple and time-efficient manner.
• common operating equipment such as pressing devices, can be used without any special adaptation being required.
• the method preferably further comprises the steps:
• the electronic component is pretensioned against the base plate via the seal carrier with the press-in domes by means of the holding plate.
• the holding plate is preferably connected to the base plate by means of a screw connection. This enables particularly simple and precise handling of the electronic arrangement during assembly, since, for example, the relative arrangement of the individual components can be precisely aligned and fixed by pretensioning.
• the electronic component is particularly preferably preloaded against the base plate by means of the holding plate in such a way that the press-in dome of the Seal carrier are deformed.
• the press-in domes can be elastically and / or plastically deformed. In this case, there is preferably only a deformation at the press-fit domes. This makes it possible to ensure that the circuit board can be pressed onto the pins particularly precisely and precisely with a desired pressing force, in particular without undesirable resilience of other components having an influence on the press connection.
• Figure 1 is a sectional view of a control device with an electronic
• Figure 2 shows a detail of Figure 1
• Figure 3 is a perspective view of a detail of the electronic
• FIG. 4 shows a detail of FIG. 3.
• FIG. 1 shows a sectional view of a control device 100 which comprises an electronic arrangement 1 according to a preferred exemplary embodiment of the invention.
• FIGS. 2 to 4 detailed views of the electronic arrangement 1 of FIG. 1 are shown.
• the electronic arrangement 1 comprises a base plate 2 and an electronic component 3.
• a cooling area 6 is formed between the electronic component 3 and the base plate 2.
• the cooling area 6 is in Designed in the form of a gap in order to be able to accommodate a coolant for cooling the electronic component 3.
• the electronic component 3 preferably comprises a cooling element 31, for example in the form of cooling ribs, which protrude into the cooling area in order to enable effective heat dissipation from the electronic component 3.
• the electronic arrangement 1 further comprises a sealing arrangement 7 which is arranged between the base plate 2 and the electronic component 3 and which is provided for sealing the cooling area 6.
• the sealing arrangement 7 has a first seal 72, a second seal 73 and a seal carrier 71.
• the seal carrier 71 holds the two seals 72, 73 in position.
• the seal carrier 71 ensures a minimum distance between the electronic component 3 and the base plate 2 in order to form the cooling region 6.
• the first seal 72 is arranged between the electronic component 3 and the seal carrier 71.
• the second seal 73 is arranged between the base plate 2 and the seal carrier 71.
• FIG. 1 A perspective view of the seal carrier 71 with the first seal 72 is shown in FIG.
• Seal carrier 71 and seals 72, 73 are ring-shaped, essentially in the form of a rectangular ring, and surround the cooling area 6.
• the seal carrier 71 has an H-shaped cross section (see FIG. 1).
• the H-shaped cross section is formed by two opposing annular grooves 76 in which one of the two seals 72, 73 is received.
• the electronic component 3 has a multiplicity of pins 30 which are arranged on a side of the electronic component 3 opposite the base plate 2 and which each extend parallel to a press-in axis 4.
• the electronic component 3 preferably has a total of 30 pins 30 in total.
• the electronic arrangement 1 comprises a printed circuit board 5, which is pressed onto the pins 30 of the electronic component 3 along the press-in axis 4.
• the printed circuit board 5 is pressed onto the pins 30 along the press-in axis 4 with a predefined press-on force 40.
• the indirect support takes place by means of a large number of press-in domes 75 of the seal carrier 71.
• the press-in domes 75 protrude along a direction parallel to the press-in axis 4 and thus form predefined contact points of the electronic component 3 on the seal carrier 71.
• the press-in domes 75 project in such a way that the seal carrier 71 can be in contact with the electronic component 3 exclusively by means of the press-in dome 75.
• the electronic arrangement 1 further comprises a holding plate 8.
• the holding plate 8 is designed as an annular plate.
• the electronic component 3 protrudes through a central opening 80 in the annular holding plate 8.
• a flange area 35 of the electronic component 3 is pretensioned in the direction of the base plate 2 by means of the holding plate 8.
• the base plate 2 has a contact element 20 which extends along a direction of the press-in axis 4 and projects beyond the seal carrier 71 and the cooling region 6.
• the holding plate 8 is connected to the contact element 20 of the base plate 2 in an adjacent manner.
• the connection of the holding plate 8 and the base plate 2 takes place by means of a screw connection.
• a screw 21 is screwed into the contact element 20 of the base plate 2 for this purpose.
• the dimensions of the retaining plate 8, electronic component 3, seal carrier 71, press-in domes 75 and contact element 20 are coordinated with one another so that the press-in domes 75 are created by pretensioning by means of the retaining plate 8, i.e. when the retaining plate 8 is screwed to the contact element 20 as far as possible be elastically deformed.
• a plastic deformation of the press-in domes 75 can be present here, for example.
• the press-in domes 75 are designed in such a way that all press-in domes 75 together exert a predefined first restoring force in the opposite direction to the press-on force 40 on the electronic component 30.
• a second restoring force which results from the two elastically deformed seals 72, 73, there is a supporting force acting on the flange area 35 of the electronic component 3, which is opposite to the pressing force 40 and the amount of which is equal to or greater than the pressing force 40 .
• the printed circuit board 5 can thus be pressed onto the pins 30 with the desired pressing force 40 without adverse influences, such as deformations of the elements involved, impairing the pressing process.
• desired properties of the press connection between the pins 30 and the circuit board 5 can be set particularly precisely and reliably.
• each press-fit dome 75 has an oval shape.
• Each press-in dome 75 has a length-to-width ratio of two in a cross-sectional plane perpendicular to the press-in axis 4. That is to say, a length 75a of the press-in dome 75 corresponds to twice its width 75b.
• each press-in dome 75 along the direction of the press-in axis 4 essentially corresponds to the length 75a.
• the press-in domes 75 can preferably be arranged in a recess 71b of the seal carrier 71, so that the press-in domes 75 only partially protrude beyond an upper side 71a of the seal carrier 71 along the direction of the press-in axis 4.
• the press-in domes 75 preferably protrude only 20% of the length 75a beyond the top side 71a.
• a plurality of press-fit domes 75 are grouped to form a press-fit domes group 70 for a particularly targeted distribution of force and optimal use of the available installation space. This is shown in FIGS. 3 and 4, FIG. 4 showing a detail of FIG. 3, which shows exactly one press-in dome group 70.
• Each press-fit dome group 70 has exactly three press-fit domes 75 lying next to one another.
• the press-in dome 75 of a single press-in dome group 70 are arranged at a distance 75d from one another, which corresponds approximately to the length 75a of an individual press-in dome 75.
• a total of eight press-fit dome groups 70 are distributed around the circumference of the seal carrier 71.
• Four press-in dome groups 70 are arranged on each of the two long sides of the rectangular ring which the seal carrier 71 forms. The four
• Press-in dome groups 70 on each long side of the seal carrier 71 are arranged at a predefined distance 70a from one another, which corresponds to ten times the distance 75d between the individual press-in domes 75 of each press-in dome group 70.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
• Mounting Of Printed Circuit Boards And The Like (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=76502705

Family Applications (1)

Country Status (6)

Family Cites Families (22)

• 2020
  • 2020-06-25 DE DE102020207871.8A patent/DE102020207871A1/de active Pending
• 2021
  • 2021-06-09 WO PCT/EP2021/065465 patent/WO2021259639A2/de unknown
  • 2021-06-09 EP EP21733075.2A patent/EP4173452A2/de active Pending
  • 2021-06-09 CN CN202180044995.XA patent/CN115804250A/zh active Pending
  • 2021-06-09 JP JP2022580140A patent/JP7494330B2/ja active Active
  • 2021-06-09 US US18/013,084 patent/US20230255004A1/en active Pending

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