EP4173051A1 - Module solaire et procédé de fabrication d'un module solaire - Google Patents

Module solaire et procédé de fabrication d'un module solaire

Info

Publication number
EP4173051A1
EP4173051A1 EP17854243.7A EP17854243A EP4173051A1 EP 4173051 A1 EP4173051 A1 EP 4173051A1 EP 17854243 A EP17854243 A EP 17854243A EP 4173051 A1 EP4173051 A1 EP 4173051A1
Authority
EP
European Patent Office
Prior art keywords
substrate
aperture
solar module
providing
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17854243.7A
Other languages
German (de)
English (en)
Other versions
EP4173051A4 (fr
Inventor
James Farnell
Christopher Smith
Paul Murray
Damion Milliken
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Greatcell Energy Ltd
Original Assignee
Greatcell Energy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AU2016903974A external-priority patent/AU2016903974A0/en
Application filed by Greatcell Energy Ltd filed Critical Greatcell Energy Ltd
Publication of EP4173051A1 publication Critical patent/EP4173051A1/fr
Publication of EP4173051A4 publication Critical patent/EP4173051A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • This invention relates to solar modules and to methods of fabricating solar modules.
  • the invention particularly relates to improved sealing arrangements for use in solar modules.
  • the present invention provides a method of preparing a substrate of a solar module including the steps of: providing a generally planar substrate; providing at least one aperture in the substrate; providing a conductive pathway which extends through the at least one aperture; and providing a hermetic seal associated with the at least one aperture.
  • the step of providing the hermetic seal may be carried out using a frit paste.
  • the frit paste may be electrically conductive and the step of providing the conductive pathway may be carried out by introducing the frit paste to the at least one aperture.
  • the method may further include the step of providing a cap member; and the step of providing the hermetic seal may be carried out by hermetically sealing the cap member to the substrate to overlie the at least one aperture.
  • the step of providing the conductive pathway may include the step of depositing conductive material through the at least one aperture.
  • the cap member may be at least partially recessed within the substrate.
  • the conductive pathway may be at least partially recessed within the substrate.
  • the invention provides a method of fabricating a solar module including the steps of: preparing a substrate in accordance with the first aspect of the invention; and incorporating the substrate as the back substrate in a solar module.
  • the method may further include the steps of providing a front substrate; and hermetically sealing the edges of the back substrate with the edges of the front substrate.
  • the invention provides a solar module including: a generally planar back substrate; the back substrate includes at least one aperture; a conductive pathway extending through the at least one aperture; and a hermetic seal associated with the at least one aperture.
  • the solar module may further include a cap member which overlies the at least one aperture.
  • the solar module may further include at least one junction box mounted to the back substrate in the vicinity of at least one aperture.
  • the solar module may further include a front substrate which is hermetically sealed about its edges with the back substrate.
  • Figure 1 is a cross sectional side view of a solar module
  • Figure 2 is a plan view of the module of figure 1 ;
  • Figure 3 is a cross sectional side view of another embodiment of a solar module
  • Figure 4 is a cross sectional side view of yet another embodiment of a solar module
  • Figure 5 is a plan view of the module of figure 4.
  • Figure 6 is a cross sectional side view of another embodiment of a solar module
  • Figure 7 is a plan view of the module of figure 6;
  • Figure 8 is a cross sectional side view of yet another embodiment of a solar module
  • Figure 9 is a plan view of the module of figure 8.
  • Figure 10 is a cross sectional view of another embodiment of a solar module
  • Figure 11 is a plan view of the module of figure 10;
  • Figure 12 is a cross sectional view of yet another embodiment of a solar module
  • Figure 13 is a plan view of the module of figure 12.
  • Figure 14 is a cross sectional view of another embodiment of a solar module.
  • a solar module 10a including a planar glass back substrate 20.
  • the back substrate 20 includes two apertures 26 and a conductive pathway which is also hermetic 50 extends through each aperture.
  • Apertures 26 are hermetically sealed by a sealing arrangement which includes a cap member in the form of capping substrate, for example glass or metal sheets or films, 60 and two regions of hermetic sealing material 40, 42.
  • the hermetic conductive pathways 50 extends between the regions of sealing material 40, 42.
  • the module of figures 1 and 2 is fabricated by a method which commences with preparation of the back substrate 20.
  • a panel of glass is cut to size and the apertures 26 are formed in the substrate by drilling, for example by mechanical drill bit, sand blasting, laser perforation, or other such suitable technique, the substrate 20.
  • Patterned regions of conductive coating are applied to form the inner 51 and outer 53 regions of the conductive pathways.
  • the regions 51, 53 are electrically joined by depositing a region of conductive material 52 through the apertures 26.
  • hermetic seal material 40, 42 in the form of commercially available glass loaded frit paste are then applied to the back substrate 20 and the capping substrate respectively, by suitable coating and deposition methods such as (silk-)screen printing, stencil printing, aerosol jet printing, inkjet printing, dispensing, gravure printing, rotogravure printing, flexographic printing, lithographic printing, or slot die coating, or other such suitable process.
  • suitable coating and deposition methods such as (silk-)screen printing, stencil printing, aerosol jet printing, inkjet printing, dispensing, gravure printing, rotogravure printing, flexographic printing, lithographic printing, or slot die coating, or other such suitable process.
  • Conductive region 50 is applied to overlie the region 40 of glass frit material by a suitable coating and deposition method such as (silk-)screen printing, stencil printing, aerosol jet printing, inkjet printing, dispensing, gravure printing, rotogravure printing, flexographic printing, lithographic printing, or slot die coating, or other such suitable process, so as not to disrupt the integrity of hermetic seal material 40, 42.
  • a suitable coating and deposition method such as (silk-)screen printing, stencil printing, aerosol jet printing, inkjet printing, dispensing, gravure printing, rotogravure printing, flexographic printing, lithographic printing, or slot die coating, or other such suitable process, so as not to disrupt the integrity of hermetic seal material 40, 42.
  • the capping substrate 60 is then brought together with the back substrate and heat is applied by placing the assembly in an oven for a period of time to cure the glass frit material 40, 42. After curing and cooling, the capping substrate 60 is hermetically sealed to the back substrate 20.
  • the process sequence may optionally involve first thermally curing the hermetic frit sealing material 40 or 42 on its relevant substrate 20 or 60 prior to deposition of hermetically sealing conductive material 50 and subsequent curing of hermetic sealing conductive material 50 with or without additional adjacent non-conductive hermetic sealing material.
  • conductive materials 51, 52, 53, 50 and the conductive material within aperture 26 may be the same material, or different material, and may be applied at the same time, or in sequential steps with or without thermal processing between one or more or all of the deposition steps.
  • the front substrate of the solar module 30 is prepared in a known fashion to provide one or more photovoltaic regions 70 on the inside surface of the front substrate 30.
  • the front substrate is then joined to the back substrate in a known fashion.
  • An edge seal 22 is provided about the periphery of the module.
  • Z-connects 24, 25 provide an electrical connection between the photovoltaic region 70 to the conductive pathways 51.
  • edge seal 22 is hermetic, for example a glass frit based seal, but can be any other suitably long-term stable edge sealing configuration such as desiccant filled butyl rubber or related chemistries or other such systems known to those skilled in the art.
  • the resulting assembly 10a therefore provides for electrical connections to the photovoltaic regions of the solar module without the need for conductive pathways to extend through the edge seal of the module, and while maintaining hermeticity in this rear junction box connection region, thereby improving the long-life prospects for the module over existing configurations.
  • FIG 3 another embodiment of a solar module 10b is shown. This embodiment differs from module 10a in that only one region of insulating hermetic sealant 42 is provided.
  • the embodiment in figure 3 provides the advantages of simpler manufacturing/processing and accommodation of different underlying conductivity requirements, spatial layouts and electrical and/or mechanical loading.
  • FIG. 4 yet another embodiment of a solar module 10c is shown.
  • This embodiment differs from those previously described in that no separate insulating hermetic sealant is used. Instead, two regions of conductive hermetic sealant 44 in the form of a commercially available metal loaded glass frit paste are utilised.
  • the metal may be silver, copper, aluminium or any other metal which is suitably electrically conductive for the cross sections, widths and distances required at the current loadings produced by the module, and which is compatible with the thermal processes used for hermetic sealing and the mechanical strength needs of the module assembly during service. This enables the sealing and conductivity to be provided by a single material, which has advantages in simpler manufacturing/processing, less material interactions/compatibility considerations and a larger conductive cross section.
  • FIG. 6 another embodiment of a solar module lOd is shown.
  • This embodiment differs from module 10c in that regions of conductive hermetic sealing material 46 are used to hermetically seal the apertures 26 in the back substrate as well as provide the conductive pathway. This removes the need for a capping substrate, which provides the advantages of an almost flush surface on the back substrate, simpler manufacturing/processing and a lower weight.
  • FIG. 8 yet another embodiment of a solar module lOe is shown.
  • the embodiment in Figure 8 demonstrates the use of a back substrate that has in-built or pre-deposited conductive regions 48 that do not form a hermetic seal.
  • a number of methods of fabricating the in-built or pre-deposited regions are possible, including deposition of a non-hermetic conductive material via processes such as (silk- )screen printing, stencil printing, aerosol jet printing, inkjet printing, dispensing, gravure printing, rotogravure printing, flexographic printing, lithographic printing, or slot die coating, along with appropriate curing regimes (thermal, UV, etc.) as required for the material and process combination.
  • the use of in-built or pre-deposited conductive regions in this embodiment can also be employed in variations of the embodiments of figures 3 and 4.
  • FIG. 10 yet another embodiment of a solar module lOf is shown.
  • This embodiment differs from module 10b in that the conductive hermetic pathway, insulating hermetic sealant and capping substrate are located in a recess 61 within the back substrate, which provides the advantages of a flush surface on the back substrate, simpler manufacturing/processing and a lower weight.
  • FIG. 12 yet another embodiment of a solar module lOg is shown.
  • This embodiment differs from module lOd in that the conductive hermetic sealing pathway is located in a recess 62 within the back substrate, which provides the advantages of a flush surface on the back substrate, simpler manufacturing/processing and a lower weight. This requires a recess of less depth in the back substrate than in module lOf.
  • FIG 14 another embodiment of a solar module lOh is shown. This embodiment differs from module lOd in that the thru holes are in an alternative configuration. A similar alternation of the thru hole configuration is also possible for modules 10a, 10b, 10c, lOe, lOf and lOg.
  • the sealing of the back substrate to the capping substrate can occur after or at the same time as the back substrate is sealed to the solar module. This is especially synergistic if the edge sealing is achieved in the same manner as the hermetic seal. Specifically, low temperature laser sintering of a hermetic glass frit, conductive or non-conductive, provides a method of sealing the edge seal and capping substrate in a single process.
  • the back substrate and capping substrate may be formed from rigid materials (glass, ceramic, aluminium, steel or other metals, etc), flexible (polymer, flexible glass, metal foil, etc), conductive (transparent conductive oxide coated glass, metals, metal foils, coated polymers, etc) or nonconductive (glass, polymer, coated metal foils, etc) materials.
  • rigid materials glass, ceramic, aluminium, steel or other metals, etc
  • flexible polymer, flexible glass, metal foil, etc
  • conductive transparent conductive oxide coated glass, metals, metal foils, coated polymers, etc
  • nonconductive glass, polymer, coated metal foils, etc
  • the conductive coating When embodied on a substrate with a conductive coating, the conductive coating can be either removed in a pattern to isolate and distinguish multiple conductive pathways within the hermetically sealed region, across the hermetic seals and/or outside the hermetically sealed region; or the conductive coating can be likewise pattered during deposition.
  • the invention When embodied on a conductive substrate, the invention also encompasses an insulating layer or coating which can also be patterned to isolate and distinguish multiple conductive pathways.
  • Embodiments of the invention can be integrated into the industry standard backsheet/s with or without integrated external contacts (Tedlar, Nylon, etc). Junction boxes may be affixed to the back faces of solar modules to connect with the conductive pathways which are accessible at the rear of the module.
  • This invention can apply to any solar module in which high quality environmental sealing is required to ensure long product life in service.
  • Kesterite solar cells such as copper-zinc -tin-sulfide
  • the invention is most suitable for those solar cell technologies which have a sensitivity to atmospheric moisture and/or oxygen, such as copper-indium- selenide and variants, copper-indium-gallium-selenide and variants, dye sensitised solar cells (both liquid and solid), organic photovoltaics and perovskite photovoltaics.
  • a back mounted junction box to be connected to an edge encapsulated solar module without compromising the edge sealing or back cover glass integrity.
  • the back substrate can be fully processed and sealed prior to the incorporation with the solar module encapsulation.
  • This allows for processing steps for the back substrate without the limitation of compatibility with the solar modules, such as high temperature sintering, UV curing or solvent exposure.
  • Any reference to prior art contained herein is not to be taken as an admission that the information is common general knowledge, unless otherwise indicated.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un procédé de préparation d'un substrat d'un module solaire, comprenant les étapes consistant à : fournir un substrat généralement plan; fournir au moins une ouverture dans le substrat; la fourniture d'un trajet conducteur qui s'étend à travers l'au moins une ouverture; et la fourniture d'un joint hermétique associé à l'au moins une ouverture.
EP17854243.7A 2016-09-30 2017-09-27 Module solaire et procédé de fabrication d'un module solaire Pending EP4173051A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AU2016903974A AU2016903974A0 (en) 2016-09-30 A solar module and a method of fabricating a solar module
PCT/AU2017/051052 WO2018058181A1 (fr) 2016-09-30 2017-09-27 Module solaire et procédé de fabrication d'un module solaire

Publications (2)

Publication Number Publication Date
EP4173051A1 true EP4173051A1 (fr) 2023-05-03
EP4173051A4 EP4173051A4 (fr) 2023-12-27

Family

ID=61762353

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17854243.7A Pending EP4173051A4 (fr) 2016-09-30 2017-09-27 Module solaire et procédé de fabrication d'un module solaire

Country Status (3)

Country Link
EP (1) EP4173051A4 (fr)
AU (2) AU2017337293A1 (fr)
WO (1) WO2018058181A1 (fr)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4432247B2 (ja) * 2000-10-04 2010-03-17 富士電機システムズ株式会社 太陽電池モジュール
FR2831714B1 (fr) 2001-10-30 2004-06-18 Dgtec Assemblage de cellules photovoltaiques
JP2007129014A (ja) * 2005-11-02 2007-05-24 Dainippon Printing Co Ltd 太陽電池モジュール用裏面保護シート、および、太陽電池モジュール
JP2013519243A (ja) * 2010-02-08 2013-05-23 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Ｍｗｔシリコン太陽電池の製造方法
DE102010003765A1 (de) * 2010-04-08 2011-10-13 Robert Bosch Gmbh Verfahren zur Herstellung eines Photovoltaik-Moduls mit rückseitenkontaktierten Halbleiterzellen
WO2011148930A1 (fr) 2010-05-24 2011-12-01 株式会社アルバック Module de cellule solaire et son procédé de fabrication
EP2612331A4 (fr) * 2010-09-01 2014-12-17 Ferro Corp Matériau de remplissage de trous d'interconnexion pour applications solaires
DE102011077469A1 (de) 2011-06-14 2012-12-20 Robert Bosch Gmbh Solarzellenmodul und Verfahren zu dessen Herstellung
US20140196779A1 (en) * 2012-04-06 2014-07-17 Solar Junction Corporation Multi-junction solar cells with through-substrate vias
US20140060622A1 (en) * 2012-08-31 2014-03-06 Primestar Solar, Inc. Direct connection of lead bar to conductive ribbon in a thin film photovoltaic device

Also Published As

Publication number Publication date
WO2018058181A1 (fr) 2018-04-05
AU2017337293A1 (en) 2019-05-16
EP4173051A4 (fr) 2023-12-27
AU2022246391A1 (en) 2022-11-17

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