AU2022246391A1 - A solar module and a method of fabricating a solar module - Google Patents
A solar module and a method of fabricating a solar module Download PDFInfo
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- AU2022246391A1 AU2022246391A1 AU2022246391A AU2022246391A AU2022246391A1 AU 2022246391 A1 AU2022246391 A1 AU 2022246391A1 AU 2022246391 A AU2022246391 A AU 2022246391A AU 2022246391 A AU2022246391 A AU 2022246391A AU 2022246391 A1 AU2022246391 A1 AU 2022246391A1
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- substrate
- aperture
- solar module
- providing
- conductive
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- 239000000758 substrate Substances 0.000 claims abstract description 76
- 238000000034 method Methods 0.000 claims abstract description 24
- 230000037361 pathway Effects 0.000 claims abstract description 23
- 238000007789 sealing Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 description 15
- 239000011521 glass Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000003566 sealing material Substances 0.000 description 5
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 239000000443 aerosol Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000007646 gravure printing Methods 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000007764 slot die coating Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000013086 organic photovoltaic Methods 0.000 description 2
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- 239000007787 solid Substances 0.000 description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- WILFBXOGIULNAF-UHFFFAOYSA-N copper sulfanylidenetin zinc Chemical compound [Sn]=S.[Zn].[Cu] WILFBXOGIULNAF-UHFFFAOYSA-N 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
A method of preparing a substrate of a solar module is described including the steps of:
providing a generally planar substrate; providing at least one aperture in the substrate;
providing a conductive pathway which extends through the at least one aperture; and
providing a hermetic seal associated with the at least one aperture.
Description
Technical Field This invention relates to solar modules and to methods of fabricating solar modules. The invention particularly relates to improved sealing arrangements for use in solar modules.
Summary of the Invention In a first aspect the present invention provides a method of preparing a substrate of a solar module including the steps of: providing a generally planar substrate; providing at least one aperture in the substrate; providing a conductive pathway which extends through the at least one aperture; and providing a hermetic seal associated with the at least one aperture. The step of providing the hermetic seal may be carried out using a frit paste. The frit paste may be electrically conductive and the step of providing the conductive pathway may be carried out by introducing the frit paste to the at least one aperture. The method may further include the step of providing a cap member; and the step of providing the hermetic seal may be carried out by hermetically sealing the cap member to the substrate to overlie the at least one aperture. The step of providing the conductive pathway may include the step of depositing conductive material through the at least one aperture. The cap member may be at least partially recessed within the substrate. The conductive pathway may be at least partially recessed within the substrate. In a second aspect the invention provides a method of fabricating a solar module including the steps of: preparing a substrate in accordance with the first aspect of the invention; and incorporating the substrate as the back substrate in a solar module. The method may further include the steps of providing a front substrate; and hermetically sealing the edges of the back substrate with the edges of the front substrate. In a third aspect the invention provides a solar module including: a generally planar back substrate; the back substrate includes at least one aperture; a conductive pathway extending through the at least one aperture; and a hermetic seal associated with the at least one aperture. The solar module may further include a cap member which overlies the at least one aperture. The solar module may further include at least one junction box mounted to the back substrate in the vicinity of at least one aperture. The solar module may further include a front substrate which is hermetically sealed about its edges with the back substrate.
Brief Description of the Drawings An embodiment of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which: Figure 1 is a cross sectional side view of a solar module; Figure 2 is a plan view of the module of figure 1; Figure 3 is a cross sectional side view of another embodiment of a solar module; Figure 4 is a cross sectional side view of yet another embodiment of a solar module; Figure 5 is a plan view of the module of figure 4; Figure 6 is a cross sectional side view of another embodiment of a solar module; Figure 7 is a plan view of the module of figure 6; Figure 8 is a cross sectional side view of yet another embodiment of a solar module; Figure 9 is a plan view of the module of figure 8; Figure 10 is a cross sectional view of another embodiment of a solar module; Figure 11 is a plan view of the module of figure 10; Figure 12 is a cross sectional view of yet another embodiment of a solar module; Figure 13 is a plan view of the module of figure 12; and Figure 14 is a cross sectional view of another embodiment of a solar module.
Detailed Description of the Preferred Embodiment
Referring to figures 1 and 2, a solar module 10a is shown including a planar glass back substrate 20. The back substrate 20 includes two apertures 26 and a conductive pathway which is also hermetic 50 extends through each aperture. Apertures 26 are hermetically sealed by a sealing arrangement which includes a cap member in the form of capping substrate, for example glass or metal sheets or films, 60 and two regions of hermetic sealing material 40, 42. The hermetic conductive pathways 50 extends between the regions of sealing material 40, 42. The module of figures 1 and 2 is fabricated by a method which commences with preparation of the back substrate 20. A panel of glass is cut to size and the apertures 26 are formed in the substrate by drilling, for example by mechanical drill bit, sand blasting, laser perforation, or other such suitable technique, the substrate 20. Patterned regions of conductive coating are applied to form the inner 51 and outer 53 regions of the conductive pathways. The regions 51, 53 are electrically joined by depositing a region of conductive material 52 through the apertures 26. The rectangular regions of hermetic seal material 40, 42 in the form of commercially available glass loaded frit paste are then applied to the back substrate 20 and the capping substrate respectively, by suitable coating and deposition methods such as (silk-)screen printing, stencil printing, aerosol jet printing, inkjet printing, dispensing, gravure printing, rotogravure printing, flexographic printing, lithographic printing, or slot die coating, or other such suitable process. Conductive region 50 is applied to overlie the region 40 of glass frit material by a suitable coating and deposition method such as (silk-)screen printing, stencil printing, aerosol jet printing, inkjet printing, dispensing, gravure printing, rotogravure printing, flexographic printing, lithographic printing, or slot die coating, or other such suitable process, so as not to disrupt the integrity of hermetic seal material 40, 42. The capping substrate 60 is then brought together with the back substrate and heat is applied by placing the assembly in an oven for a period of time to cure the glass frit material 40, 42. After curing and cooling, the capping substrate 60 is hermetically sealed to the back substrate 20. The process sequence may optionally involve first thermally curing the hermetic frit sealing material 40 or 42 on its relevant substrate 20 or 60 prior to deposition of hermetically sealing conductive material 50 and subsequent curing of hermetic sealing conductive material 50 with or without additional adjacent non-conductive hermetic sealing material.
Further, conductive materials 51, 52, 53, 50 and the conductive material within aperture 26 may be the same material, or different material, and may be applied at the same time, or in sequential steps with or without thermal processing between one or more or all of the deposition steps. The front substrate of the solar module 30 is prepared in a known fashion to provide one or more photovoltaic regions 70 on the inside surface of the front substrate 30. The front substrate is thenjoined to the back substrate in a known fashion. An edge seal 22 is provided about the periphery of the module. Z-connects 24, 25 provide an electrical connection between the photovoltaic region 70 to the conductive pathways 51. Ideally, edge seal 22 is hermetic, for example a glass frit based seal, but can be any other suitably long-term stable edge sealing configuration such as desiccant filled butyl rubber or related chemistries or other such systems known to those skilled in the art. The resulting assembly 10a therefore provides for electrical connections to the photovoltaic regions of the solar module without the need for conductive pathways to extend through the edge seal of the module, and while maintaining hermeticity in this rear junction box connection region, thereby improving the long-life prospects for the module over existing configurations. An assembly according to figure 1 was fabricated in a laboratory and subsequently subjected to helium leak testing which verified the efficacy of the hermetic seal. Referring to figure 3, another embodiment of a solar module l0b is shown. This embodiment differs from module 10a in that only one region of insulating hermetic sealant 42 is provided. The embodiment in figure 3 provides the advantages of simpler manufacturing/processing and accommodation of different underlying conductivity requirements, spatial layouts and electrical and/or mechanical loading. Referring to figures 4 and 5, yet another embodiment of a solar module 10c is shown. This embodiment differs from those previously described in that no separate insulating hermetic sealant is used. Instead, two regions of conductive hermetic sealant 44 in the form of a commercially available metal loaded glass frit paste are utilised. The metal may be silver, copper, aluminium or any other metal which is suitably electrically conductive for the cross sections, widths and distances required at the current loadings produced by the module, and which is compatible with the thermal processes used for hermetic sealing and the mechanical strength needs of the module assembly during service. This enables the sealing and conductivity to be provided by a single material, which has advantages in simpler manufacturing/processing, less material interactions/compatibility considerations and a larger conductive cross section. Referring to figures 6 and 7, another embodiment of a solar module 10d is shown. This embodiment differs from module 1Oc in that regions of conductive hermetic sealing material 46 are used to hermetically seal the apertures 26 in the back substrate as well as provide the conductive pathway. This removes the need for a capping substrate, which provides the advantages of an almost flush surface on the back substrate, simpler manufacturing/processing and a lower weight. Referring to figures 8 and 9, yet another embodiment of a solar module 10e is shown. The embodiment in Figure 8 demonstrates the use of a back substrate that has in-built or pre-deposited conductive regions 48 that do not form a hermetic seal. A number of methods of fabricating the in-built or pre-deposited regions are possible, including deposition of a non-hermetic conductive material via processes such as (silk )screen printing, stencil printing, aerosol jet printing, inkjet printing, dispensing, gravure printing, rotogravure printing, flexographic printing, lithographic printing, or slot die coating, along with appropriate curing regimes (thermal, UV, etc.) as required for the material and process combination. The use of in-built or pre-deposited conductive regions in this embodiment can also be employed in variations of the embodiments of figures 3 and 4. Referring to figures 10 and 11, yet another embodiment of a solar module 1Of is shown. This embodiment differs from module 10b in that the conductive hermetic pathway, insulating hermetic sealant and capping substrate are located in a recess 61 within the back substrate, which provides the advantages of a flush surface on the back substrate, simpler manufacturing/processing and a lower weight. Referring to figures 12 and 13, yet another embodiment of a solar module 1Og is shown. This embodiment differs from module 10d in that the conductive hermetic sealing pathway is located in a recess 62 within the back substrate, which provides the advantages of a flush surface on the back substrate, simpler manufacturing/processing and a lower weight. This requires a recess of less depth in the back substrate than in module 10f. Referring to figure 14, another embodiment of a solar module 10h is shown. This embodiment differs from module 1d in that the thru holes are in an alternative configuration. A similar alternation of the thru hole configuration is also possible for modules 10a, 10b, 10c, l0e, 10f and 10g.
In some embodiments, for processing efficiency, the sealing of the back substrate to the capping substrate can occur after or at the same time as the back substrate is sealed to the solar module. This is especially synergistic if the edge sealing is achieved in the same manner as the hermetic seal. Specifically, low temperature laser sintering of a hermetic glass frit, conductive or non-conductive, provides a method of sealing the edge seal and capping substrate in a single process.
In various embodiments the back substrate and capping substrate may be formed from rigid materials (glass, ceramic, aluminium, steel or other metals, etc), flexible (polymer, flexible glass, metal foil, etc), conductive (transparent conductive oxide coated glass, metals, metal foils, coated polymers, etc) or nonconductive (glass, polymer, coated metal foils, etc) materials. In the case of a substrate formed from a conductive material such as metal it may be necessary to add an additional electrical isolation layer. If the conductive pathways are to be passed through non-glass interfaces or intermediate resistivity substrates (such as re concrete) then secondary insulation may be required.
When embodied on a substrate with a conductive coating, the conductive coating can be either removed in a pattern to isolate and distinguish multiple conductive pathways within the hermetically sealed region, across the hermetic seals and/or outside the hermetically sealed region; or the conductive coating can be likewise pattered during deposition.
When embodied on a conductive substrate, the invention also encompasses an insulating layer or coating which can also be patterned to isolate and distinguish multiple conductive pathways.
Embodiments of the invention can be integrated into the industry standard backsheet/s with or without integrated external contacts (Tedlar, Nylon, etc). Junction boxes may be affixed to the back faces of solar modules to connect with the conductive pathways which are accessible at the rear of the module.
This invention can apply to any solar module in which high quality environmental sealing is required to ensure long product life in service. This encompasses all types of solar modules, including: • Mono-crystalline silicon • Poly-crystalline silicon • Amorphous silicon • Gallium-arsenide and variants • Cadmium-telluride • Copper-indium-selenide and variants • Copper-indium-gallium-selenide and variants • Dye sensitised solar cells, both liquid and solid • Organic photovoltaics • Perovskite photovoltaics • Kesterite solar cells such as copper-zinc-tin-sulfide
However, the invention is most suitable for those solar cell technologies which have a sensitivity to atmospheric moisture and/or oxygen, such as copper-indium selenide and variants, copper-indium-gallium-selenide and variants, dye sensitised solar cells (both liquid and solid), organic photovoltaics and perovskite photovoltaics.
It can be seen that embodiments of the invention provide at least one of the following advantages: • A back mounted junction box to be connected to an edge encapsulated solar module without compromising the edge sealing or back cover glass integrity. • Embodiments of the present invention provide specific advantages in processing, as the back substrate can be fully processed and sealed prior to the incorporation with the solar module encapsulation. This allows for processing steps for the back substrate without the limitation of compatibility with the solar modules, such as high temperature sintering, UV curing or solvent exposure.
Any reference to prior art contained herein is not to be taken as an admission that the information is common general knowledge, unless otherwise indicated. Finally, it is to be appreciated that various alterations or additions may be made to the parts previously described without departing from the spirit or ambit of the present invention.
Claims (13)
1. A method of preparing a substrate of a solar module including the steps of: providing a generally planar substrate; providing at least one aperture in the substrate; providing a conductive pathway which extends through the at least one aperture; and providing a hermetic seal associated with the at least one aperture.
2. A method according to claim 1 wherein the step of providing the hermetic seal is carried out using a frit paste.
3. A method according to claim 2 wherein the frit paste is electrically conductive and the step of providing the conductive pathway is carried out by introducing the frit paste to the at least one aperture.
4. A method according to claim 1 further including the step of providing a cap member; and the step of providing the hermetic seal is carried out by hermetically sealing the cap member to the substrate to overlie the at least one aperture.
5. A method according to any preceding claim wherein the step of providing the conductive pathway includes the step of depositing conductive material through the at least one aperture.
6. A method according to any preceding claim wherein the cap member is at least partially recessed within the substrate.
7. A method according to any preceding claim wherein the conductive pathway is at least partially recessed within the substrate.
8. A method of fabricating a solar module including the steps of: preparing a substrate in accordance with any one of claims 1 to 7; and incorporating the substrate as the back substrate in a solar module.
9. A method according to claim 8 further including the steps of providing a front substrate; and hermetically sealing the edges of the back substrate with the edges of the front substrate.
10. A solar module including: a generally planar back substrate; the back substrate includes at least one aperture; a conductive pathway extending through the at least one aperture; and a hermetic seal associated with the at least one aperture.
11. A solar module according to claim 10 further including a cap member which overlies the at least one aperture.
12. A solar module according to either of claims 10 or 11 further including at least one junction box mounted to the back substrate in the vicinity of at least one aperture.
13. A solar module according to any one of claims 10 to 12 wherein the module further includes a front substrate which is hermetically sealed about its edges with the back substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2022246391A AU2022246391A1 (en) | 2016-09-30 | 2022-10-05 | A solar module and a method of fabricating a solar module |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2016903974 | 2016-09-30 | ||
| AU2016903974A AU2016903974A0 (en) | 2016-09-30 | A solar module and a method of fabricating a solar module | |
| PCT/AU2017/051052 WO2018058181A1 (en) | 2016-09-30 | 2017-09-27 | A solar module and a method of fabricating a solar module |
| AU2017337293A AU2017337293A1 (en) | 2016-09-30 | 2017-09-27 | A solar module and a method of fabricating a solar module |
| AU2022246391A AU2022246391A1 (en) | 2016-09-30 | 2022-10-05 | A solar module and a method of fabricating a solar module |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2017337293A Division AU2017337293A1 (en) | 2016-09-30 | 2017-09-27 | A solar module and a method of fabricating a solar module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2022246391A1 true AU2022246391A1 (en) | 2022-11-17 |
Family
ID=61762353
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2017337293A Abandoned AU2017337293A1 (en) | 2016-09-30 | 2017-09-27 | A solar module and a method of fabricating a solar module |
| AU2022246391A Pending AU2022246391A1 (en) | 2016-09-30 | 2022-10-05 | A solar module and a method of fabricating a solar module |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2017337293A Abandoned AU2017337293A1 (en) | 2016-09-30 | 2017-09-27 | A solar module and a method of fabricating a solar module |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4173051A4 (en) |
| AU (2) | AU2017337293A1 (en) |
| WO (1) | WO2018058181A1 (en) |
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|---|---|---|---|---|
| JP4432247B2 (en) * | 2000-10-04 | 2010-03-17 | 富士電機システムズ株式会社 | Solar cell module |
| FR2831714B1 (en) * | 2001-10-30 | 2004-06-18 | Dgtec | ASSEMBLY OF PHOTOVOLTAIC CELLS |
| JP2007129014A (en) * | 2005-11-02 | 2007-05-24 | Dainippon Printing Co Ltd | Reverse-surface protection sheet for solar cell module, and solar cell module |
| EP2534695A2 (en) * | 2010-02-08 | 2012-12-19 | E.I. Du Pont De Nemours And Company | Process for the production of a mwt silicon solar cell |
| DE102010003765A1 (en) * | 2010-04-08 | 2011-10-13 | Robert Bosch Gmbh | Method for producing a photovoltaic module with back-contacted semiconductor cells |
| WO2011148930A1 (en) * | 2010-05-24 | 2011-12-01 | 株式会社アルバック | Solar cell module and method of producing same |
| JP2013545215A (en) * | 2010-09-01 | 2013-12-19 | フェッロ コーポレーション | Via fill material for solar devices |
| DE102011077469A1 (en) * | 2011-06-14 | 2012-12-20 | Robert Bosch Gmbh | Solar cell module and method for its production |
| US20140196779A1 (en) * | 2012-04-06 | 2014-07-17 | Solar Junction Corporation | Multi-junction solar cells with through-substrate vias |
| US20140060622A1 (en) * | 2012-08-31 | 2014-03-06 | Primestar Solar, Inc. | Direct connection of lead bar to conductive ribbon in a thin film photovoltaic device |
-
2017
- 2017-09-27 WO PCT/AU2017/051052 patent/WO2018058181A1/en active Search and Examination
- 2017-09-27 AU AU2017337293A patent/AU2017337293A1/en not_active Abandoned
- 2017-09-27 EP EP17854243.7A patent/EP4173051A4/en active Pending
-
2022
- 2022-10-05 AU AU2022246391A patent/AU2022246391A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018058181A1 (en) | 2018-04-05 |
| AU2017337293A1 (en) | 2019-05-16 |
| EP4173051A1 (en) | 2023-05-03 |
| EP4173051A4 (en) | 2023-12-27 |
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