EP4112691A4 - THERMALLY CURED RESIN COMPOSITION, RESIN FILM AND METAL-BASED SUBSTRATE - Google Patents

THERMALLY CURED RESIN COMPOSITION, RESIN FILM AND METAL-BASED SUBSTRATE Download PDF

Info

Publication number
EP4112691A4
EP4112691A4 EP21761340.5A EP21761340A EP4112691A4 EP 4112691 A4 EP4112691 A4 EP 4112691A4 EP 21761340 A EP21761340 A EP 21761340A EP 4112691 A4 EP4112691 A4 EP 4112691A4
Authority
EP
European Patent Office
Prior art keywords
metal
based substrate
thermally curable
resin composition
curable resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21761340.5A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP4112691A1 (en
Inventor
Tadasuke Endo
Tomomasa Kashino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of EP4112691A1 publication Critical patent/EP4112691A1/en
Publication of EP4112691A4 publication Critical patent/EP4112691A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14—Modified phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2330/00—Thermal insulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
EP21761340.5A 2020-02-27 2021-02-24 THERMALLY CURED RESIN COMPOSITION, RESIN FILM AND METAL-BASED SUBSTRATE Pending EP4112691A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020031440 2020-02-27
PCT/JP2021/006950 WO2021172387A1 (ja) 2020-02-27 2021-02-24 熱硬化性樹脂組成物、樹脂シートおよび金属ベース基板

Publications (2)

Publication Number Publication Date
EP4112691A1 EP4112691A1 (en) 2023-01-04
EP4112691A4 true EP4112691A4 (en) 2024-03-27

Family

ID=77490495

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21761340.5A Pending EP4112691A4 (en) 2020-02-27 2021-02-24 THERMALLY CURED RESIN COMPOSITION, RESIN FILM AND METAL-BASED SUBSTRATE

Country Status (5)

Country Link
US (1) US20230095959A1 (https=)
EP (1) EP4112691A4 (https=)
JP (2) JP7231068B2 (https=)
CN (1) CN115190899A (https=)
WO (1) WO2021172387A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025063576A (ja) * 2023-10-04 2025-04-16 デンカ株式会社 樹脂組成物、絶縁性樹脂硬化体、積層体、及び回路基板
JP2025063575A (ja) * 2023-10-04 2025-04-16 デンカ株式会社 樹脂組成物、絶縁性樹脂硬化体、積層体、及び回路基板
CN117467333A (zh) * 2023-11-28 2024-01-30 济南市雋瀚电子材料有限公司 高导热耐击穿电压线路板材料、线路板及其制备方法
WO2026074903A1 (ja) * 2024-10-02 2026-04-09 日本発條株式会社 絶縁材料とその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160002520A1 (en) * 2014-07-02 2016-01-07 Sumitomo Bakelite Co., Ltd. Thermally conductive sheet, cured product thereof, and semiconductor device
JP2019108516A (ja) * 2017-12-15 2019-07-04 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、プリプレグ、積層板、金属ベース基板およびパワーモジュール
JP2019189840A (ja) * 2018-04-18 2019-10-31 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、積層板、金属ベース基板およびパワーモジュール

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486372B (zh) * 2008-11-28 2015-06-01 Ajinomoto Kk Resin composition
JP2013006972A (ja) * 2011-06-24 2013-01-10 Mitsubishi Chemicals Corp エポキシ樹脂組成物及び該エポキシ樹脂組成物を硬化させてなる硬化物
JP6023474B2 (ja) * 2012-06-08 2016-11-09 デンカ株式会社 熱伝導性絶縁シート、金属ベース基板及び回路基板、及びその製造方法
JP6123177B2 (ja) * 2012-07-04 2017-05-10 味の素株式会社 樹脂組成物
JP2014156531A (ja) * 2013-02-15 2014-08-28 Hitachi Chemical Co Ltd エポキシ樹脂組成物、接着シート及び半導体素子
JP2014214213A (ja) * 2013-04-25 2014-11-17 東レ株式会社 絶縁接着剤組成物ならびにそれを用いたペースト、未硬化絶縁接着剤シートおよび絶縁シート
JP6217165B2 (ja) * 2013-06-20 2017-10-25 住友ベークライト株式会社 プライマー層付きプリプレグ、プライマー層付き金属箔、金属張積層板、プリント配線基板、半導体パッケージおよび半導体装置
EP3121210A4 (en) * 2014-03-20 2017-12-06 Hitachi Chemical Co., Ltd. Resin composition, resin sheet, resin sheet cured product, resin sheet laminate, resin sheet laminate cured product and method for producing same, semiconductor device, and led device.
JP2015193504A (ja) 2014-03-31 2015-11-05 ナガセケムテックス株式会社 窒化ホウ素粒子、樹脂組成物および熱伝導性シート
CN105566852A (zh) * 2014-11-05 2016-05-11 住友电木株式会社 热传导性片用树脂组合物、带有基材的树脂层、热传导性片和半导体装置
JP2017028128A (ja) * 2015-07-23 2017-02-02 住友ベークライト株式会社 パワーモジュール用基板、パワーモジュール用回路基板およびパワーモジュール
JP2019006895A (ja) * 2017-06-23 2019-01-17 味の素株式会社 樹脂組成物
US20220372208A1 (en) * 2019-06-21 2022-11-24 Sumitomo Bakelite Co., Ltd. Thermosetting resin composition, resin sheet, and metal base substrate
CN114555518B (zh) * 2019-10-28 2024-03-29 株式会社德山 六方氮化硼粉末的制造方法、六方氮化硼粉末以及树脂组合物
JP6819765B2 (ja) 2019-11-13 2021-01-27 ソニー株式会社 送信装置及び送信方法、並びに受信装置及び受信方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160002520A1 (en) * 2014-07-02 2016-01-07 Sumitomo Bakelite Co., Ltd. Thermally conductive sheet, cured product thereof, and semiconductor device
JP2019108516A (ja) * 2017-12-15 2019-07-04 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、プリプレグ、積層板、金属ベース基板およびパワーモジュール
JP2019189840A (ja) * 2018-04-18 2019-10-31 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、積層板、金属ベース基板およびパワーモジュール

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021172387A1 *

Also Published As

Publication number Publication date
EP4112691A1 (en) 2023-01-04
CN115190899A (zh) 2022-10-14
JPWO2021172387A1 (https=) 2021-09-02
JP7231068B2 (ja) 2023-03-01
JP7468596B2 (ja) 2024-04-16
US20230095959A1 (en) 2023-03-30
WO2021172387A1 (ja) 2021-09-02
JP2023011681A (ja) 2023-01-24

Similar Documents

Publication Publication Date Title
EP4112691A4 (en) THERMALLY CURED RESIN COMPOSITION, RESIN FILM AND METAL-BASED SUBSTRATE
EP4083140A4 (en) CURTAINABLE HOT-MEL SILICONE COMPOSITION, HARDENED MATERIAL THEREOF AND LAMINATE HAVING CURED HOT-MEL SILICONE COMPOSITION OR HARDENED MATERIAL THEREOF
EP4024134A4 (en) RESIN COMPOSITION AND USES THEREOF
EP4269503A4 (en) CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF AND LAMINATE
EP4174103A4 (en) CURABLE COMPOSITION, URETHANE RESIN AND HEAT DISSIPATION ELEMENT
WO2009077865A3 (en) Uv curable coating composition
WO2009120547A3 (en) Paint film composites and methods of making and using the same
WO2012024070A3 (en) Radiation curable temporary laminating adhesive for use in high temperature applications
WO2008118567A3 (en) Polythioether amine resins and compositions comprising same
EP4174137A4 (en) CURABLE SILICONE COMPOSITION AND CURRED PRODUCT THEREOF
EP4317234A4 (en) Curable resin composition
EP4317207A4 (en) Curable composition and cured product thereof
EP4245785A4 (en) CURABLE COMPOSITION, CURRED PRODUCT AND ADHESIVE
WO2009060708A1 (ja) 新規樹脂組成物およびこれを含有する複合材料、並びにその利用
WO2009008278A1 (ja) インサート成型用フィルムを用いた樹脂成型品
EP3786204A4 (en) HARDENABLE COMPOSITION, HARDENED PRODUCT AND LAMINATE
EP4166322A4 (en) RESIN AND FILM COMPOSITION
EP4092065A4 (en) RESIN COMPOSITION
EP4306570A4 (en) HARDENABLE COMPOSITION AND HARDENED PRODUCT
EP4353755A4 (en) Curable composition and cured product
EP4368650A4 (en) CURABLE COMPOSITION
EP4328252A4 (en) CURABLE COMPOSITION
EP4180483A4 (en) RESIN COMPOSITION, FILM AND CURED PRODUCT
EP4209539A4 (en) RESIN COMPOSITION FOR SLIDING ELEMENT AND SLIDING ELEMENT
EP4328281A4 (en) Curable composition, cured product and adhesive

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20220823

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20240226

RIC1 Information provided on ipc code assigned before grant

Ipc: C09D 163/00 20060101ALI20240220BHEP

Ipc: C08L 61/06 20060101ALI20240220BHEP

Ipc: C08G 59/62 20060101ALI20240220BHEP

Ipc: C08K 3/14 20060101ALI20240220BHEP

Ipc: C08K 3/38 20060101ALI20240220BHEP

Ipc: C08K 3/28 20060101ALI20240220BHEP

Ipc: C08K 3/22 20060101ALI20240220BHEP

Ipc: H05K 1/05 20060101ALI20240220BHEP

Ipc: C08K 3/01 20180101ALI20240220BHEP

Ipc: C08L 63/00 20060101ALI20240220BHEP

Ipc: C08L 61/14 20060101AFI20240220BHEP