EP4107817A1 - Elektrisches kontaktelement - Google Patents
Elektrisches kontaktelementInfo
- Publication number
- EP4107817A1 EP4107817A1 EP20853596.3A EP20853596A EP4107817A1 EP 4107817 A1 EP4107817 A1 EP 4107817A1 EP 20853596 A EP20853596 A EP 20853596A EP 4107817 A1 EP4107817 A1 EP 4107817A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact element
- sleeve
- solder
- soldering
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 52
- 238000005476 soldering Methods 0.000 claims description 66
- 230000000630 rising effect Effects 0.000 claims description 6
- 230000001174 ascending effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 108090000623 proteins and genes Proteins 0.000 claims 1
- 239000002184 metal Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 238000009428 plumbing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/111—Resilient sockets co-operating with pins having a circular transverse section
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a one-piece, stamped-rolled electrical contact element with a connection section and an adjoining soldering section for making electrical contact with a contact surface.
- Such contact elements are used to make electrical contact with a Maisflä surface on a printed circuit board, preferably by means of a soldered connection, and are usually inserted into a contact carrier in the longitudinal direction.
- the rear connection section serves to either connect an electrical line directly to the contact element, depending on the configuration, or to establish contact by means of a contact pin which can be inserted into the contact element in the longitudinal direction and which is connected to an electrical conductor.
- the L-shaped wall connection is only suitable to a limited extent, since unbundling the contacts to the circuit board requires a lot of space.
- this connection is slightly resilient due to the thin metal sheets usually used in the soldering area (generally the area in which soldering takes place), so that the area cannot be used at the same time for mounting the contact in the contact body.
- a level must also be provided on the contact on which the assembly force can be applied. This leads to inaccuracies in the manufacturing process, as the tolerances from the press-in plane to the solder surface must also be taken into account.
- J-connections are known in which the sheet metal is bent over in the soldering area in order to achieve more soldering surface in this way with thin sheet metal thicknesses.
- these connections require less space and are more rigid, provided that double the sheet metal thickness is used to stabilize the soldering area.
- such a connection is more expensive to manufacture, since the sheet metal strip for making the contact must have larger dimensions in accordance with the material bent by 180 °.
- a massive, rear area for soldering is provided here, which enables both sufficient soldering surface and stability for the assembly process.
- the front of particular area is sleeve-shaped for inserting a contact pin. Thanks to this coaxial structure, this connection takes up the least amount of space.
- a realization by means of a punched-rolled contact must be due to the necessary thin sheet metal strip with a pole pattern of 0.2 to 0.25 mm stepped sheet metal can be set.
- a thicker sheet is used in the basic state, which then has to be reduced to the required thin sheet thickness for the front area. This makes production more expensive and increases the weight of the contact.
- the present invention is therefore based on the object of proposing a one-piece, stamped-rolled contact part which, with a small footprint on the circuit board, enables good stability in assembly, is optimally solderable and can be implemented cost-effectively.
- the contact element has a soldering section which has the shape of a slotted sleeve and is designed as such.
- This ge rolled sleeve has a slot that results from the production and is as narrow as possible for stability reasons, in the extreme case goes to zero, because the Hül senr section abut.
- the interior of the soldering section is continuously hollow, interrupted or at least partially filled in the longitudinal direction, depending on the configuration. The configuration depends on the required stability of the soldering section and the amount of solder available on the soldering pad of the circuit board to which the soldering section is soldered.
- the solder rises through the capillary forces in the interior and thus serves in addition to a solder fillet forming on the outer circumference of the soldering section on the circuit board to increase stability. If there is insufficient amount of solder on the soldering pad, or if the additional stability is not required, a soldering stop is required.
- the soldering section can thus have an interior space to be filled by solder over the entire length, only over a certain distance, or it can have no interior space at all.
- a contact element designed in this way thus has a significantly lower weight than a rotated contact element, although on the one hand the stability is increased by further measures in the soldering area can or will also be increased by the flowing solder.
- the invention is suitable for both SMD and THR / THT. In this respect, with SMD the contact ends above a circuit board and with THR / THT not above a circuit board, but rather dips through holes in the circuit board or through the circuit board.
- the soldering section expediently has a surface that accepts solder, at least partially in the interior, on the inner surface at the free end. This is produced by electroplating and ensures that the inner surface can be easily wetted by flowing solder. Depending on the expediency, electroplating can also take place after rolling.
- a solder barrier is arranged in the interior space against solder rising from the free end in the interior space.
- the solder barrier is a flap that is punched out of the circumferential surface of the contact section, which is located in the interior, this closes against further rising solder.
- This is preferably omega-like, so that the circular diameter of the interior is also sealed as tightly as possible and rising solder cannot pass the solder lock.
- This solder barrier is punched out of the blank and bent after rolling. It can be arranged at any point along the length of the soldering section.
- the sleeve edges formed along the slot are bent inward and protrude into the interior of the sleeve or the sleeve-shaped soldering portion.
- the cross section of the contact element thus has a contour that is known from the crimping of contacts with wires.
- the cross-sectional contour can be designed so that the slot is completely closed in the longitudinal direction and thus no distance between the surrounding curved sleeve edges is present or provided with a sufficient stability quality ensuring distance and is therefore rather only slightly open.
- the cross-sectional contour can be completely or only partially closed, so that either no interior space or an interior space extending in the longitudinal direction of the soldering section is present.
- solder With a completely closed cross-sectional contour, solder is prevented from penetrating into the free end placed on a soldering surface from above in the case of SMD or a soldering section (THR / THT) penetrating a circuit board and thus only soldering on the outside of the soldering section.
- solder is not only in the outer area of the soldering section, where it forms a solder fillet, but also partially pulls up inside the soldering section.
- the resulting increased wetting surface for the solder ensures greater strength of the soldering zone between the contact element or soldering section and the soldering pad. Due to this higher specific stability in the soldering area, depending on the nature of the circuit board, a smaller area is required for the soldering pad in order to achieve a strength of the connection between the contact element and the circuit board that is comparable to the prior art. This enables simpler and more compact circuit board designs with smaller template openings or, when using larger template openings, a higher power transmission and thus greater robustness of the soldered connection.
- Such a contact element is advantageously produced in such a way that the sleeve edges are bent over into the interior space after the contact element has been electroplated.
- the length of the bent sleeve edges protruding into the interior space is 70 to 90% of the inner diameter of the sleeve-shaped Lötab section when the cross-sectional contour is open. Because the essentially parallel sleeve edges protrude far into the interior of the sleeve-shaped soldering section, the rigidity is increased. Depending on the degree of penetration, the cross-section for the amount of the rising perpendicular is influenced.
- the cross-sectional contour is completely closed sen. As stated above, this has the effect that no solder rises inside the Lötab section.
- the cross-sectional contour of the sleeve-shaped soldering section at the free end of the soldering section is not completely closed in a front area and completely closed in an adjoining rear area.
- a plumbing lock that can be adjusted as required in terms of height is provided.
- This configuration has the advantage that the solder fillet is formed on the outside in the front area of the soldering section and the solder pulls upwards along the sleeve edge of the front area, thereby creating additional stability to the outer soldering connection inside the soldering section. This can be set depending on the application.
- FIG. 1 shows a contact with a stamped-rolled contact on a sheet metal strip
- FIG. 2 shows an enlarged illustration of a sleeve-shaped contact element with a soldering section with sleeve edges bent into an interior
- FIG. 3 shows different solder sections of contact elements according to FIG. 2 in a perspective view and a sectional view in the case of SMD with a contact element completely closed in the cross-sectional contour (FIG. 3A), with a contact element closed in the cross-sectional contour from a certain height (FIG. 3B) and with a contact element that is completely open in the cross-sectional contour (FIG. 3C); and
- FIG. 4 solder sections of contact elements with a solder section in which the cross-sectional contour is circular in a perspective view and a sectional view in the case of SMD with a solder lock at the free end (FIG. 4A) and a solder lock (FIG. 4B) arranged away from the free end.
- a contact 1 in Figure 1 shows a sheet metal strip 2 to which a stamped-rolled contact element 3 is attached.
- the contact element 3 has a connection area 4 and a soldering section 5.
- the connection area 4 is used to insert a contact pin (not shown).
- the Lötab section 5 is sleeve-shaped and has a slot 6 that adjoins the connection area 4 to the free end or contact area 7 to a circuit board (not shown) in the case of SMD, at which the bent edges 10 of the sleeve-shaped soldering section 5 meet.
- the edges 10 of the sleeve-shaped soldering section 5 are bent inward and more or less strongly pressed together. In this illustration, the edges 10 of the sleeve-shaped soldering section 5 are only pressed together to such an extent that that solder 12 ′ can rise from the free end 7 into the entire soldering section 5, as shown in FIG. 3C.
- FIG. 3A shows the soldering section 5 in which the edges 10 are completely pressed together so that, as can be seen from the cross-sectional illustration, only one solder fillet with solder 12 can be formed from the soldering pad not shown on the circuit board.
- the soldering section 5 has a closed cross-sectional contour.
- FIG. B the soldering section 5 is divided into a front area 8 and a rear area 9. In the front area 8, the bent sleeve edges 10 are not completely closed (open cross-sectional contour), i.e. there is an interior space 11 in which the solder 12 'can rise to the rear area 9 with a closed cross-sectional contour in the soldering section 5.
- FIG. 3c shows a variant in which the entire soldering section 5 is not closed (open cross-sectional contour) so that the solder 12 can rise in the interior 11 until no further solder 12 'is available.
- additional solder 12 'in addition to the solder fillet with solder 12 increases the stability even further compared to the embodiment of FIG. 3B.
- FIG. 4 shows a solder lock 13 removed from the free end 7, the distance from the free end 7 being adjustable as desired.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE20205108A BE1028071B1 (de) | 2020-02-19 | 2020-02-19 | Elektrisches Kontaktelement |
| PCT/DE2020/101074 WO2021164800A1 (de) | 2020-02-19 | 2020-12-17 | Elektrisches kontaktelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP4107817A1 true EP4107817A1 (de) | 2022-12-28 |
Family
ID=69844322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP20853596.3A Pending EP4107817A1 (de) | 2020-02-19 | 2020-12-17 | Elektrisches kontaktelement |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US12334663B2 (de) |
| EP (1) | EP4107817A1 (de) |
| JP (1) | JP7485773B2 (de) |
| KR (1) | KR102876663B1 (de) |
| CN (1) | CN115136418B (de) |
| BE (1) | BE1028071B1 (de) |
| BR (1) | BR112022014871A2 (de) |
| CA (1) | CA3167412A1 (de) |
| TW (1) | TWI891697B (de) |
| WO (1) | WO2021164800A1 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7438454B2 (ja) * | 2021-03-29 | 2024-02-26 | 三菱電機株式会社 | 半導体装置 |
| BE1032011B1 (de) * | 2023-09-26 | 2025-04-29 | Phoenix Contact Gmbh & Co | Elektrisches Kontaktelement |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2689337A (en) * | 1952-04-04 | 1954-09-14 | Burtt | Shaped metal contact |
| US4735575A (en) * | 1986-10-06 | 1988-04-05 | Amp Incorporated | Electrical terminal for printed circuit board and methods of making and using same |
| US5366380A (en) * | 1989-06-13 | 1994-11-22 | General Datacomm, Inc. | Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
| US5295862A (en) * | 1991-12-16 | 1994-03-22 | Itt Corporation | Connector boardlock |
| US5209681A (en) * | 1992-03-26 | 1993-05-11 | Amp Incorporated | Electrical contact with the anti-solder wicking tab |
| GB2298530A (en) * | 1995-02-28 | 1996-09-04 | Zierick Mfg Corp | Surface mount electrical contacts |
| US6254422B1 (en) * | 1997-08-25 | 2001-07-03 | Phoenix Contact Gmbh & Co. | Electronic terminal for use on circuit boards |
| US6179631B1 (en) * | 1997-11-21 | 2001-01-30 | Emc Corporation | Electrical contact for a printed circuit board |
| JP3643002B2 (ja) * | 2000-01-31 | 2005-04-27 | 株式会社オートネットワーク技術研究所 | 基板実装型端子の実装方法 |
| US6623283B1 (en) * | 2000-03-08 | 2003-09-23 | Autosplice, Inc. | Connector with base having channels to facilitate surface mount solder attachment |
| JP3866631B2 (ja) | 2002-07-30 | 2007-01-10 | 三菱電線工業株式会社 | 雄型棒状接続端子及びその製造方法 |
| US6997727B1 (en) * | 2003-03-14 | 2006-02-14 | Zierick Manufacturing Corp | Compliant surface mount electrical contacts for circuit boards and method of making and using same |
| JP4274528B2 (ja) * | 2003-04-28 | 2009-06-10 | 協伸工業株式会社 | タブ端子 |
| DE102007028811A1 (de) * | 2007-06-20 | 2008-12-24 | Phoenix Contact Gmbh & Co. Kg | Zwangsführung eines Verbindungsmaterials |
| JP4954050B2 (ja) * | 2007-12-20 | 2012-06-13 | モレックス インコーポレイテド | 端子及びコネクタ |
| DE102008005547B4 (de) * | 2008-01-23 | 2013-08-29 | Infineon Technologies Ag | Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul |
| JP5268786B2 (ja) * | 2009-06-04 | 2013-08-21 | 三菱電機株式会社 | 半導体モジュール |
| DE102010014294A1 (de) * | 2010-04-08 | 2011-10-13 | Phoenix Contact Gmbh & Co. Kg | Kontaktfeld für Steckverbinder |
| US20120190247A1 (en) * | 2011-01-20 | 2012-07-26 | Earl Anthony Daughtry | Two-Piece Connector Assembly |
| EP2639894B1 (de) * | 2012-03-12 | 2014-01-15 | Coninvers GmbH | Elektrischer Steckverbinder mit Toleranzausgleich |
| PL2690721T3 (pl) * | 2012-07-23 | 2015-08-31 | Phoenix Contact Connector Tech Gmbh | Elektryczne złącze wtykowe lutowane na płytkach drukowanych z kompensacją tolerancji |
| DE102013101823B4 (de) * | 2013-02-25 | 2016-04-28 | Phoenix Contact Gmbh & Co. Kg | Kontaktträger mit einem Unterteil |
| DE112014001516B4 (de) * | 2013-03-21 | 2023-07-06 | Fuji Electric Co., Ltd. | Kontaktbauteil und Halbleitermodul |
| DE102013103446A1 (de) * | 2013-04-05 | 2014-10-09 | Phoenix Contact Gmbh & Co. Kg | Steckverbindungsvorrichtung |
| CN105981167B (zh) | 2014-08-12 | 2019-05-28 | 富士电机株式会社 | 半导体装置 |
| JP6076952B2 (ja) * | 2014-11-21 | 2017-02-08 | 矢崎総業株式会社 | 基板用端子及び端子付き基板 |
| WO2016140844A1 (en) * | 2015-03-03 | 2016-09-09 | Fci Asia Pte. Ltd | Insulation displacement connector |
| JP6569293B2 (ja) | 2015-05-18 | 2019-09-04 | 富士電機株式会社 | 半導体装置、金属部材および半導体装置の製造方法 |
| DE102016102036B4 (de) * | 2016-02-05 | 2026-01-29 | Phoenix Contact Gmbh & Co. Kg | Elektrischer Steckkontakt, elektrische Anschlussklemme und Verfahren zur Herstellung eines elektrischen Steckkontakts |
| JP6559739B2 (ja) * | 2017-06-26 | 2019-08-14 | 矢崎総業株式会社 | 電線と端子との接続構造および電線と端子との接続方法 |
-
2020
- 2020-02-19 BE BE20205108A patent/BE1028071B1/de not_active IP Right Cessation
- 2020-12-17 CN CN202080097027.0A patent/CN115136418B/zh active Active
- 2020-12-17 US US17/799,940 patent/US12334663B2/en active Active
- 2020-12-17 WO PCT/DE2020/101074 patent/WO2021164800A1/de not_active Ceased
- 2020-12-17 KR KR1020227030964A patent/KR102876663B1/ko active Active
- 2020-12-17 EP EP20853596.3A patent/EP4107817A1/de active Pending
- 2020-12-17 BR BR112022014871A patent/BR112022014871A2/pt unknown
- 2020-12-17 JP JP2022549734A patent/JP7485773B2/ja active Active
- 2020-12-17 CA CA3167412A patent/CA3167412A1/en active Pending
- 2020-12-23 TW TW109145736A patent/TWI891697B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023515452A (ja) | 2023-04-13 |
| KR20220134021A (ko) | 2022-10-05 |
| BR112022014871A2 (pt) | 2022-09-20 |
| US12334663B2 (en) | 2025-06-17 |
| JP7485773B2 (ja) | 2024-05-16 |
| KR102876663B1 (ko) | 2025-10-24 |
| CN115136418B (zh) | 2025-05-06 |
| BE1028071A1 (de) | 2021-09-10 |
| WO2021164800A1 (de) | 2021-08-26 |
| TWI891697B (zh) | 2025-08-01 |
| BE1028071B1 (de) | 2021-09-13 |
| US20230062066A1 (en) | 2023-03-02 |
| CN115136418A (zh) | 2022-09-30 |
| TW202203510A (zh) | 2022-01-16 |
| CA3167412A1 (en) | 2021-08-26 |
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