EP4074148A1 - Procédé de fabrication d'un ensemble électrique - Google Patents

Procédé de fabrication d'un ensemble électrique

Info

Publication number
EP4074148A1
EP4074148A1 EP21708130.6A EP21708130A EP4074148A1 EP 4074148 A1 EP4074148 A1 EP 4074148A1 EP 21708130 A EP21708130 A EP 21708130A EP 4074148 A1 EP4074148 A1 EP 4074148A1
Authority
EP
European Patent Office
Prior art keywords
conductor track
circuit board
track structure
primary side
vias
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21708130.6A
Other languages
German (de)
English (en)
Inventor
Mario BRESECKE
Henri KRÜGER
Dieter WENGERTSMANN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility GmbH
Original Assignee
Siemens Mobility GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Mobility GmbH filed Critical Siemens Mobility GmbH
Publication of EP4074148A1 publication Critical patent/EP4074148A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method for producing electrical assemblies and to electrical assemblies as such.
  • the invention relates to a method for producing an electrical arrangement on the basis of a printed circuit board, which has: a first conductor track structure having conductor tracks on one side of the circuit board, hereinafter referred to as the primary side, a conductor track having a second conductor track structure on the other Side of the circuit board, hereinafter referred to as the secondary side, and / or is arranged as an internal conductor track structure in an intermediate layer of the circuit board, and a number of through-holes by means of which a conductor track of the first conductor track structure can be electrically connected to a conductor track of the second conductor track structure, with the Primary side, at least one first electrical component is arranged, which is soldered to the first conductor track structure by means of a first soldering step.
  • circuit boards are well known in the field of circuit board technology. It is also known to have at least one electrical component, for example in the form of a surface-mounted component (also called SMD (Surface Mounted Device) component) or a through-hole component, also known as a THD (Through-Hole Device) component put on the primary side and soldered to the first or second conductor track structure.
  • SMD Surface Mounted Device
  • THD Through-Hole Device
  • the invention is based on the object of providing a method that provides better results than previously known methods with regard to corrosion protection of through-contacts. According to the invention, this object is achieved by a method having the features according to patent claim 1. Advantageous embodiments of the method according to the invention are given in subclaims Un.
  • At least one of the through contacts is closed exclusively on the primary side by means of a protective layer before at least one first electrical component is arranged on the primary side and soldered by means of the first soldering step.
  • a significant advantage of the method according to the invention is that by closing the through-contacts that remain unpopulated, the protective layer ensures that reliable corrosion protection is also achieved with regard to the primary side. If, for example, through contacts that remain unassembled are covered by components to be attached to the circuit board or later attached, it is not ensured that reliable corrosion protection can be guaranteed later in the context of later steps.
  • the vias on the primary side are coated with the protective layer before components are attached to the primary side ensures that no hidden vias can remain that are not protected with a suitable protective layer on the primary side.
  • any corrosion-inhibiting material that can withstand subsequent processing steps can be used for the protective layer.
  • the protective layer is formed by a solder stop layer, which acts as a solder stop in particular in the first soldering step.
  • solder mask coating step can be used in an advantageous manner - with the creation of a synergy effect - in order to also close the unpopulated through contacts on the primary side.
  • the solder mask has a double function in this case: on the one hand, it coats and protects the conductor tracks from solder material that could wet the conductor tracks in subsequent soldering steps, and on the other hand it serves as a top or primary-side seal for the through contacts that remain unpopulated ; Both protective functions can be achieved with this coating step.
  • Epoxy resin is preferably used as the solder mask.
  • the primary side of the circuit board is coated at least in areas with through-contacts with a cover layer, which is in particular an acrylate resin or a varnish containing acrylate resin.
  • a cover layer which is in particular an acrylate resin or a varnish containing acrylate resin.
  • the resulting arrangement on both sides of the circuit board can be coated with such a cover layer over the entire area or at least in partial areas.
  • any material that is suitable for the electrical operation of the arrangement and offers good corrosion protection can be used as the material for the cover layer, for example silicone or silicone-containing paint.
  • silicone or silicone-containing paint With a view to particularly good protective properties, especially good corrosion protection, it is considered advantageous if, after the circuit board has been fitted with electrical components, the resulting arrangement on both sides of the circuit board over the entire surface or at least in areas that are provided with through contacts is coated with a cover layer in the form of acrylate resin or an acrylate resin ent containing paint.
  • Acrylate resin or acrylate resin The paint it contains is robust and not very gas-permeable, at least more robust and less gas-permeable than silicone.
  • the secondary side is coated over the whole area or at least in areas with through-contacts by means of a cover layer made of in particular acrylic resin or of a lacquer containing acrylic resin.
  • the first electrical component is soldered to one or more conductor tracks of the first conductor track structure.
  • At least one second electrical component is arranged on the primary side and soldered to, in particular, one or more conductor tracks of the second conductor track structure by means of a second soldering step.
  • plated-through holes are excluded from the coating by means of the protective layer and remain unsealed, which are used to arrange the at least one second electrical component.
  • all those electrically conductive through contacts on the inside wall side remain excluded from the coating by means of the protective layer and not closed, which - after assembly and after soldering of the first electrical component or components - for mounting the second electrical component or components on the primary side and for soldering the second electrical component or components to at least one of the second conductor tracks of the second conductor track structure.
  • through contacts which are located below the second compo after the assembly of the at least one second electrical component, are closed by means of the protective layer on the primary side before the at least one first electrical component is arranged on the primary side and by means of the first Soldering step is soldered.
  • the second conductor track structure is an inner conductor track structure which is arranged in an intermediate layer of the circuit board, it is advantageous if the electrically conductive through contacts or at least a subgroup thereof extend to the intermediate layer and the primary side and the intermediate layer extend electrically connect with each other.
  • the through-contacts or at least a subgroup thereof can extend through the circuit board and electrically connect the primary side to the secondary side.
  • the at least one second electrical component has connection contacts which, when the second component is arranged, are introduced into through-holes that are not covered by the coating with the protective layer, and the connection contacts are soldered to the second conductor track structure by means of the second soldering step.
  • a diameter of the through contacts is dimensioned such that by means of the Second soldering step, solder material is drawn from the secondary side in the direction of the primary side due to a Kapillaref fect and the vias are completely or at least partially filled with solder material.
  • a reflow soldering process is preferably carried out in the first soldering step and / or a wave soldering or wave soldering process is preferably carried out in the second soldering step.
  • the first components are preferably surface mount components.
  • the second components are preferably through plug-in components.
  • the invention also relates to an electrical arrangement with a printed circuit board, the printed circuit board having: a first conductor track structure having a conductor track on one side of the circuit board, hereinafter referred to as the primary side, a second conductor track structure having a conductor track on the other side of the circuit board , hereinafter referred to as the secondary side, and / or is arranged as an internal conductor track structure in an intermediate layer of the circuit board, and a number of vias, by means of which a conductor track of the first conductor track structure can be electrically connected to a conductor track of the second conductor track structure, and at least one electrical component is arranged on the primary side and soldered to the first and / or second conductor track structure.
  • At least one of the vias which is arranged below the at least one electrical component, is closed exclusively on the primary side by means of a protective layer.
  • the protective layer is a solder resist layer.
  • the primary side of the printed circuit board is coated in areas with vias with a cover layer, which consists in particular of acrylic resin or of a varnish containing acrylic resin, and / or the secondary side of the printed circuit board is over the whole area or coated at least in areas with through contacts with a cover layer, which consists in particular of an acrylate resin or of a lacquer containing acrylate resin.
  • the invention also relates to a rail vehicle, in particular one with at least one traction converter.
  • the rail vehicle in particular its or one of its traction converters, has an electrical arrangement as described above and / or produced as described above.
  • Figure 1 shows an embodiment of a circuit board that can be used to produce an embodiment for an inventive arrangement
  • FIG. 2 shows an exemplary embodiment of an arrangement according to the invention which can be produced on the basis of the printed circuit board according to FIG. 1,
  • FIG. 3 in the form of a flowchart, method steps of an exemplary embodiment for an inventive ßes method for producing the arrangement according to Figure 2, and
  • FIG. 4 shows an exemplary embodiment for a rail vehicle according to the invention.
  • FIG. 1 shows, in a schematic cross section, a section of a printed circuit board 10 which is to be processed further to produce an electrical arrangement.
  • the printed circuit board 10 has on one of its sides, hereinafter referred to as the primary side 11, a first conductor track structure 11a, which comprises a plurality of conductor tracks.
  • first conductor track structure 11a which comprises a plurality of conductor tracks.
  • secondary side 12 On the opposite side, hereinafter referred to as secondary side 12, there is a second conductor track structure 12a, which also comprises a plurality of conductor tracks.
  • the through contacts 21 to 25 are also through contacts coated on the inside wall side with conductive material B and thus electrically conductive on the inside wall side as vias, of which the through contacts 21 to 25 are used to electrically connect conductor tracks of the first conductor track structure 11a with conductor tracks of the second conductor track structure 12a connect to.
  • the through contacts 21 to 25 thus remain unassembled and are not used to accommodate connection contacts of components to be placed on the circuit board 10.
  • the through contacts 26 and 27 are used to enable connection contacts of so-called through plug-in components to be passed through.
  • Such vocationalsteckbauele elements can be placed on the primary side 11 of the circuit board 10 and their connection contacts are passed through the fürgangskon contacts 26 and 27 in order to connect them to the second conductor track structure 12a.
  • the generally relatively thin conductor track structures 11a and 12a are not shown to scale in FIG. 1, but are shown very much thicker than they actually are, in order to illustrate the interaction with the through contacts.
  • FIG. 2 shows an exemplary embodiment of an electrical arrangement 50 produced on the basis of circuit board 10 according to FIG. 1, which includes circuit board 10 according to FIG. 1 as well as a first component 100 and a second component 200.
  • the first component 100 is preferably a surface-mounted component, also called an SMD (Surface Mounted Device) component;
  • the second component 200 is preferably a plug-in component, also called a THD (Through-Hole Device) component.
  • circuit board 10 can also carry more surface-mounted components and more push-through components than shown here; 2 is limited to the components 100 and 200 mentioned only for reasons of clarity. Likewise only for reasons of clarity, the illustration according to FIG. 2 lacks the two conductor track structures 11a and 12a, which are shown in FIG. 1 and whose thickness is very small is.
  • FIG. 2 The arrangement according to FIG. 2 is preferably produced using method steps that are shown in the form of a flow diagram in FIG. In the following, FIGS. 2 and 3 are referred to jointly.
  • a protective layer in the form of a solder stop layer 30 is first applied to the primary side 11 of the printed circuit board 10 provided with the conductor track structures 11a and 12a.
  • the solder stop layer 30 preferably covers all sections of the first conductor track structure 11a that are not to be covered with solder in the course of a subsequent first soldering step.
  • the through contacts 26 and 27 merely remain free of the solder stop layer 30, since these are subsequently intended to be used for inserting connection contacts 210 and 220 of the plug-in component 200.
  • the printed circuit board 10 is fitted on the primary side 11 with the first component 100 or all surface-mounted construction elements.
  • the component assembly according to method step 1200 preferably includes the application of soldering paste to those conductor track sections of the first conductor track structure 11a that are to be soldered to connection contacts 110 and 120 of the first component 100.
  • the first component 100 is "reflow" soldered to the first conductor track structure 11a of the circuit board 10 as part of a first soldering step 1300, preferably within a reflow oven.
  • connection contacts 210 and 220 are placed on the primary side 11 of the circuit board 10, the connection contacts 210 and 220 being inserted into the through- gang contacts 26 and 27 are inserted into and preferably through them. It is advantageous if the connection contacts 210 and 220 extend as far as the second conductor track structure 12a on the secondary side 12.
  • a subsequent second soldering step 1500 which is preferably a wave soldering or wave soldering process step
  • the second component 200 with its connection contacts 210 and 220 with the second conductor track structure 12a (see Figure 1) on the secondary side 12 of the circuit board 10 soldered.
  • the solder 35 can pull itself up from the bottom or the secondary side 12 wetted with solder 35 by the capillary effect upwards into the through contacts 26 and 27;
  • the same also applies to the through contacts 21 to 25 which are open at the bottom, if the cross-section is sufficiently large, even if this is not explicitly shown in FIG.
  • the resulting assembly is preferably cleaned on both sides as part of a cleaning step 1600.
  • a subsequent drying step 1700 the assembly is dried.
  • the entire assembly is provided with a covering layer 40 in the form of protective varnish, which is a silicone varnish or silicone-containing varnish, over the entire surface, both on the primary side 11 and on the secondary side 12 of the circuit board 10, as part of a painting step 1800 can.
  • a covering layer 40 in the form of protective varnish, which is a silicone varnish or silicone-containing varnish, over the entire surface, both on the primary side 11 and on the secondary side 12 of the circuit board 10, as part of a painting step 1800 can.
  • the cover layer 40 is acrylate resin or at least contains acrylate resin, that is to say forms an acrylate resin lacquer.
  • the painting in painting step 1800 also closes the unassembled vias 21 to 25 on the secondary side 12, so that all unassembled vias 21 to 25 of the circuit board 10 are now sealed or closed on both sides, namely on the Primary side 11 through the solder stop layer 30 and the overlying cover layer 40 and on the secondary side 12 through the cover layer 40 alone.
  • the resulting arrangement 50 according to FIG. 2 is dried in a drying step 1900.
  • FIG. 4 shows an exemplary embodiment for a rail vehicle 500 according to the invention, which has one or more traction converters 510.
  • the traction converters 510 each have one or more arrangements 50, as have been described above in connection with FIGS. 1 to 3.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un ensemble électrique à partir d'une carte de circuits imprimés. La carte de circuit imprimé présente une première structure de piste conductrice qui présente des pistes conductrices et est disposée sur une face de la carte de circuit imprimé, ci-après désignée face primaire ; une seconde structure de piste conductrice, qui présente des pistes conductrices et qui est disposée sur l'autre face de la carte de circuit imprimé, ci-après appelée face secondaire, et/ou dans une couche intermédiaire de la carte de circuit imprimé en tant que structure de piste conductrice interne ; et un certain nombre de trous d'interconnexion, au moyen desquels chaque piste conductrice de la première structure de piste conductrice peut être électriquement connectée à une piste conductrice de la seconde structure de piste conductrice, au moins un premier composant électrique étant disposé sur la face primaire, ledit composant électrique étant brasé à la première structure de piste conductrice au moyen d'une première étape de brasage. Selon l'invention, au moins un des trous d'interconnexion est fermé uniquement sur la face primaire par une couche de protection avant qu'au moins un premier composant électrique soit disposé sur la face primaire et est brasé au moyen de la première étape de brasage.
EP21708130.6A 2020-02-28 2021-02-10 Procédé de fabrication d'un ensemble électrique Pending EP4074148A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020202598.3A DE102020202598A1 (de) 2020-02-28 2020-02-28 Verfahren zum Herstellen einer elektrischen Anordnung
PCT/EP2021/053160 WO2021170407A1 (fr) 2020-02-28 2021-02-10 Procédé de fabrication d'un ensemble électrique

Publications (1)

Publication Number Publication Date
EP4074148A1 true EP4074148A1 (fr) 2022-10-19

Family

ID=74758742

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21708130.6A Pending EP4074148A1 (fr) 2020-02-28 2021-02-10 Procédé de fabrication d'un ensemble électrique

Country Status (4)

Country Link
EP (1) EP4074148A1 (fr)
CN (1) CN115211239A (fr)
DE (1) DE102020202598A1 (fr)
WO (1) WO2021170407A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022119084A1 (de) 2022-07-29 2024-02-01 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174531A (en) 1977-11-14 1979-11-13 Rca Corporation Printed circuit board with increased arc track resistance
US4982376A (en) 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
JPH0354889A (ja) * 1989-07-24 1991-03-08 Fujitsu Ltd 両面実装プリント配線板
US5561322A (en) 1994-11-09 1996-10-01 International Business Machines Corporation Semiconductor chip package with enhanced thermal conductivity
DE10101359A1 (de) * 2001-01-13 2002-07-25 Conti Temic Microelectronic Verfahren zur Herstellung einer elektronischen Baugruppe
US20050085007A1 (en) 2003-10-20 2005-04-21 Chuong Vu Joining material stencil and method of use
US7987587B2 (en) 2008-03-07 2011-08-02 International Business Machines Corporation Method of forming solid vias in a printed circuit board
US20100236823A1 (en) 2009-03-18 2010-09-23 Sun Microsystems, Inc. Ring of power via
DE202016105142U1 (de) 2016-09-15 2016-12-08 Abb Schweiz Ag Batterieladegerät für ein spurgebundenes Fahrzeug

Also Published As

Publication number Publication date
DE102020202598A1 (de) 2021-09-02
CN115211239A (zh) 2022-10-18
WO2021170407A1 (fr) 2021-09-02

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