DE102020202598A1 - Verfahren zum Herstellen einer elektrischen Anordnung - Google Patents

Verfahren zum Herstellen einer elektrischen Anordnung Download PDF

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Publication number
DE102020202598A1
DE102020202598A1 DE102020202598.3A DE102020202598A DE102020202598A1 DE 102020202598 A1 DE102020202598 A1 DE 102020202598A1 DE 102020202598 A DE102020202598 A DE 102020202598A DE 102020202598 A1 DE102020202598 A1 DE 102020202598A1
Authority
DE
Germany
Prior art keywords
circuit board
conductor track
primary side
track structure
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102020202598.3A
Other languages
German (de)
English (en)
Inventor
Mario Bresecke
Henri Krüger
Dieter Wengertsmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility GmbH
Original Assignee
Siemens Mobility GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Mobility GmbH filed Critical Siemens Mobility GmbH
Priority to DE102020202598.3A priority Critical patent/DE102020202598A1/de
Priority to CN202180016588.8A priority patent/CN115211239A/zh
Priority to EP21708130.6A priority patent/EP4074148A1/fr
Priority to PCT/EP2021/053160 priority patent/WO2021170407A1/fr
Publication of DE102020202598A1 publication Critical patent/DE102020202598A1/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE102020202598.3A 2020-02-28 2020-02-28 Verfahren zum Herstellen einer elektrischen Anordnung Pending DE102020202598A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102020202598.3A DE102020202598A1 (de) 2020-02-28 2020-02-28 Verfahren zum Herstellen einer elektrischen Anordnung
CN202180016588.8A CN115211239A (zh) 2020-02-28 2021-02-10 制造电气装置的方法
EP21708130.6A EP4074148A1 (fr) 2020-02-28 2021-02-10 Procédé de fabrication d'un ensemble électrique
PCT/EP2021/053160 WO2021170407A1 (fr) 2020-02-28 2021-02-10 Procédé de fabrication d'un ensemble électrique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102020202598.3A DE102020202598A1 (de) 2020-02-28 2020-02-28 Verfahren zum Herstellen einer elektrischen Anordnung

Publications (1)

Publication Number Publication Date
DE102020202598A1 true DE102020202598A1 (de) 2021-09-02

Family

ID=74758742

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102020202598.3A Pending DE102020202598A1 (de) 2020-02-28 2020-02-28 Verfahren zum Herstellen einer elektrischen Anordnung

Country Status (4)

Country Link
EP (1) EP4074148A1 (fr)
CN (1) CN115211239A (fr)
DE (1) DE102020202598A1 (fr)
WO (1) WO2021170407A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022119084A1 (de) 2022-07-29 2024-02-01 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174531A (en) 1977-11-14 1979-11-13 Rca Corporation Printed circuit board with increased arc track resistance
US4982376A (en) 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
EP0712157A2 (fr) 1994-11-09 1996-05-15 International Business Machines Corporation Empaquetage pour puce semi-conductrice ayant une conductivité thermique améliorée
DE102004030588A1 (de) 2003-10-20 2005-06-02 Hewlett-Packard Development Co., L.P., Houston Verbindungsmaterialschablone und Verfahren zur Verwendung
US20090223710A1 (en) 2008-03-07 2009-09-10 International Business Machines Corporation Method of Forming Solid Vias in a Printed Circuit Board
US20100236823A1 (en) 2009-03-18 2010-09-23 Sun Microsystems, Inc. Ring of power via
DE202016105142U1 (de) 2016-09-15 2016-12-08 Abb Schweiz Ag Batterieladegerät für ein spurgebundenes Fahrzeug

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0354889A (ja) * 1989-07-24 1991-03-08 Fujitsu Ltd 両面実装プリント配線板
DE10101359A1 (de) * 2001-01-13 2002-07-25 Conti Temic Microelectronic Verfahren zur Herstellung einer elektronischen Baugruppe
JP6021504B2 (ja) * 2012-08-08 2016-11-09 キヤノン株式会社 プリント配線板、プリント回路板及びプリント回路板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174531A (en) 1977-11-14 1979-11-13 Rca Corporation Printed circuit board with increased arc track resistance
US4982376A (en) 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
EP0712157A2 (fr) 1994-11-09 1996-05-15 International Business Machines Corporation Empaquetage pour puce semi-conductrice ayant une conductivité thermique améliorée
DE102004030588A1 (de) 2003-10-20 2005-06-02 Hewlett-Packard Development Co., L.P., Houston Verbindungsmaterialschablone und Verfahren zur Verwendung
US20090223710A1 (en) 2008-03-07 2009-09-10 International Business Machines Corporation Method of Forming Solid Vias in a Printed Circuit Board
US20100236823A1 (en) 2009-03-18 2010-09-23 Sun Microsystems, Inc. Ring of power via
DE202016105142U1 (de) 2016-09-15 2016-12-08 Abb Schweiz Ag Batterieladegerät für ein spurgebundenes Fahrzeug

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022119084A1 (de) 2022-07-29 2024-02-01 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung

Also Published As

Publication number Publication date
CN115211239A (zh) 2022-10-18
EP4074148A1 (fr) 2022-10-19
WO2021170407A1 (fr) 2021-09-02

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