EP3867006A1 - Verbundlegierung für lot und verwendung solch einer legierung - Google Patents

Verbundlegierung für lot und verwendung solch einer legierung

Info

Publication number
EP3867006A1
EP3867006A1 EP19797183.1A EP19797183A EP3867006A1 EP 3867006 A1 EP3867006 A1 EP 3867006A1 EP 19797183 A EP19797183 A EP 19797183A EP 3867006 A1 EP3867006 A1 EP 3867006A1
Authority
EP
European Patent Office
Prior art keywords
weight
alloy
silver
bismuth
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19797183.1A
Other languages
English (en)
French (fr)
Inventor
Anne Marie LAUGT
Aurélie DUCOLOMBIER
Marc WARY
Raphaël PESCI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dehon Sas
Original Assignee
Dehon Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dehon Sas filed Critical Dehon Sas
Publication of EP3867006A1 publication Critical patent/EP3867006A1/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth

Definitions

  • the present invention relates to a solder alloy composition which is free of lead.
  • solder alloy comprising lead and tin, which has a high melting point of approximately 300 ° C.
  • a brazing alloy for example Pb92.5Sn5Ag2.5, makes it possible to produce multiple and rapid assemblies.
  • such an alloy makes it possible to manufacture components or first printed circuits which will then themselves be assembled with a lead-free alloy with a lower reflow temperature.
  • this alloy or the components derived from this alloy are used for applications at more than 200 ° C. We are therefore looking for an alloy or process that does not melt below 230 ° C or ideally 270 ° C and as reliable in terms of thermal cycling, electrical and thermal conductivity and mechanical resistance as the leaded alloy.
  • the invention relates to a lead-free solder alloy having a composition comprising:
  • Ni nickel
  • Such an alloy is advantageous since it has a melting temperature between 260 ° C and 400 ° C. In addition, the alloy has very good mechanical and wetting properties.
  • the alloy comprises 93% -98% by weight of bismuth (Bi),
  • Ni nickel
  • the alloy comprises only bismuth (Bi), silver (Ag) and nickel
  • the alloy comprises 94% -96% by weight of bismuth (Bi), 3% -6% by weight of silver (Ag) and 0.2% -0.5% by weight of nickel (Ni ).
  • the alloy comprises 3% -6% by weight of silver (Ag) and 0.2% -0.5% by weight of nickel (Ni).
  • the alloy preferably comprises between 94% -96% by weight of bismuth (Bi), preferably between 93.5% -96.8% by weight of bismuth (Bi).
  • the alloy comprises more than 2.9% by weight of silver (Ag), more preferably less than 4.8% by weight of silver (Ag).
  • the alloy comprises 3% -6% by weight of silver (Ag).
  • the alloy comprises 0.2% -0.5% by weight of nickel (Ni).
  • the alloy comprises:
  • Ni nickel
  • a melting range of 260 ° C-330 ° C is obtained.
  • the alloy comprises:
  • Ni nickel
  • the alloy comprises:
  • the alloy consists of:
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy consists of 96% by weight of bismuth (Bi),
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy consists of:
  • Ni nickel
  • the alloy comprises: 94% -96% by weight of bismuth (Bi),
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy consists of
  • Ni nickel
  • the invention also relates to a composite alloy for brazing comprising a brazing alloy as presented above and 5% -60% by weight of silver or copper particles.
  • the composite alloy comprises between 5% and 25% by weight of silver or copper particles.
  • the composite alloy comprises between 20% and 60% by weight of silver or copper particles, preferably silver.
  • the composite alloy for brazing consists only of an alloy of brazing and particles of silver or copper. Such a composite alloy of solder improves the thermal and electrical conductivity.
  • the silver or copper particles have dimensions between 1 and 30 micrometers.
  • the composite alloy for brazing consists of the alloy of brazing and particles of silver or copper.
  • the invention further relates to the use of a composite alloy as presented above for soldering a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied by means of welding. wave or selective soldering.
  • SMD surface mounting device
  • the invention further relates to the use of a composite alloy as presented above for soldering a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied in the form of a paste. .
  • the invention further relates to the use of a composite alloy as presented above for a method of remelting electronic components.
  • a brazing alloy is proposed for wave soldering, for selective soldering and in particular for a method of soldering electronic components by reflow.
  • Such an alloy can also be used for the manufacture or connection of electronic components, in particular, semiconductors.
  • a lead-free solder alloy having a composition comprising:
  • Ni nickel
  • Such a brazing alloy has a melting point which is between 260 ° C and 400 ° C and has very good properties in the mechanical, electrical and wetting fields. In addition, the absence of lead makes it possible to comply with the new environmental standards.
  • the alloy comprises
  • Ni nickel
  • brazing alloys have melting temperatures and phase diagrams which are optimal for implementing a reflow process.
  • the Bi96Ag3,8NiO, 2 alloy consists of: 96% by weight of bismuth (Bi),
  • a melting range of 260 ° C-275 ° C is obtained.
  • the alloy Bi96Ag3,5NiO, 5 consists of
  • the Bi94Ag5,8NiO, 2 alloy consists of:
  • the alloy Bi95Ag4,5NiO, 5 consists of
  • Ni nickel
  • the alloy Bi95Ag4,7NiO, 3 consists of
  • Ni nickel
  • a melting range of 260 ° C-300 ° C is obtained.
  • the alloy Bi97Ag2,9NiO, 1 consists of
  • Ni nickel
  • the alloy can be used in wave soldering, selective soldering, dip soldering, as part of wire, for placement of CMS and for applications dough-in-dough.
  • the alloy is packaged in the form of bars, preforms, ingots, powder, solder paste or solder cream.
  • the alloy according to the invention with silver or copper particles having a dimension between 1 and 30 micrometers in order to form a composite alloy.
  • silver or copper particles are added in an amount of 5 to 25% by weight of the mixture.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
EP19797183.1A 2018-10-19 2019-10-17 Verbundlegierung für lot und verwendung solch einer legierung Pending EP3867006A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1859694A FR3087369B1 (fr) 2018-10-19 2018-10-19 Alliage de brasure et utilisation d'un tel alliage
PCT/EP2019/078217 WO2020079151A1 (fr) 2018-10-19 2019-10-17 Alliage composite pour brasure et utilisation d'un tel alliage

Publications (1)

Publication Number Publication Date
EP3867006A1 true EP3867006A1 (de) 2021-08-25

Family

ID=65494361

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19797183.1A Pending EP3867006A1 (de) 2018-10-19 2019-10-17 Verbundlegierung für lot und verwendung solch einer legierung

Country Status (4)

Country Link
EP (1) EP3867006A1 (de)
CN (1) CN112867582A (de)
FR (1) FR3087369B1 (de)
WO (1) WO2020079151A1 (de)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004025232A (ja) * 2002-06-25 2004-01-29 Murata Mfg Co Ltd Ｐｂフリーはんだ組成物およびはんだ付け物品
US20100243107A1 (en) * 2006-11-13 2010-09-30 Sulzer Metco (Us), Inc. Material and method of manufacturing of a solder joint with high thermal conductivity and high electrical conductivity
US20140199115A1 (en) * 2011-08-02 2014-07-17 Alpha Metals, Inc. Solder compositions
CN106392366A (zh) * 2016-12-02 2017-02-15 北京康普锡威科技有限公司 一种BiSbAg系高温无铅焊料及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000288772A (ja) * 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ
JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品
EP1399600B1 (de) * 2001-05-28 2007-01-17 Honeywell International Inc. Zusammensetzungen; verfahren und vorrichtungen für bleifreies hochtemperaturlötmittel
TW504427B (en) * 2001-09-25 2002-10-01 Honeywell Int Inc Composition, methods and devices for high temperature lead-free solder
CN101537545A (zh) * 2008-03-21 2009-09-23 喜星素材株式会社 低温焊接焊用无铅合金
CN101332544A (zh) * 2008-05-28 2008-12-31 广州瀚源电子科技有限公司 高熔点无铅焊料及其生产工艺
CN102233488A (zh) * 2010-05-07 2011-11-09 宁波卓诚焊锡科技有限公司 一种无铅焊料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004025232A (ja) * 2002-06-25 2004-01-29 Murata Mfg Co Ltd Ｐｂフリーはんだ組成物およびはんだ付け物品
US20100243107A1 (en) * 2006-11-13 2010-09-30 Sulzer Metco (Us), Inc. Material and method of manufacturing of a solder joint with high thermal conductivity and high electrical conductivity
US20140199115A1 (en) * 2011-08-02 2014-07-17 Alpha Metals, Inc. Solder compositions
CN106392366A (zh) * 2016-12-02 2017-02-15 北京康普锡威科技有限公司 一种BiSbAg系高温无铅焊料及其制备方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
FIMA PRZEMYSLAW ET AL: "Microstructure and Thermal Analysis of As-Cast Ag-Bi-Ni alloys", JOURNAL OF ELECTRONIC MATERIALS, SPRINGER US, NEW YORK, vol. 45, no. 1, 1 December 2015 (2015-12-01), pages 136 - 144, XP035591514, ISSN: 0361-5235, [retrieved on 20151201], DOI: 10.1007/S11664-015-4219-1 *
See also references of WO2020079151A1 *

Also Published As

Publication number Publication date
CN112867582A (zh) 2021-05-28
WO2020079151A1 (fr) 2020-04-23
FR3087369B1 (fr) 2021-06-04
FR3087369A1 (fr) 2020-04-24

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