EP3867006A1 - Composite alloy for solder and use of such an alloy - Google Patents
Composite alloy for solder and use of such an alloyInfo
- Publication number
- EP3867006A1 EP3867006A1 EP19797183.1A EP19797183A EP3867006A1 EP 3867006 A1 EP3867006 A1 EP 3867006A1 EP 19797183 A EP19797183 A EP 19797183A EP 3867006 A1 EP3867006 A1 EP 3867006A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- weight
- alloy
- silver
- bismuth
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 104
- 239000000956 alloy Substances 0.000 title claims abstract description 104
- 239000002131 composite material Substances 0.000 title claims abstract description 31
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 125
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910052709 silver Inorganic materials 0.000 claims abstract description 56
- 239000004332 silver Substances 0.000 claims abstract description 56
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 42
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 42
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 238000005219 brazing Methods 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000009736 wetting Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 15
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
Definitions
- the present invention relates to a solder alloy composition which is free of lead.
- solder alloy comprising lead and tin, which has a high melting point of approximately 300 ° C.
- a brazing alloy for example Pb92.5Sn5Ag2.5, makes it possible to produce multiple and rapid assemblies.
- such an alloy makes it possible to manufacture components or first printed circuits which will then themselves be assembled with a lead-free alloy with a lower reflow temperature.
- this alloy or the components derived from this alloy are used for applications at more than 200 ° C. We are therefore looking for an alloy or process that does not melt below 230 ° C or ideally 270 ° C and as reliable in terms of thermal cycling, electrical and thermal conductivity and mechanical resistance as the leaded alloy.
- the invention relates to a lead-free solder alloy having a composition comprising:
- Ni nickel
- Such an alloy is advantageous since it has a melting temperature between 260 ° C and 400 ° C. In addition, the alloy has very good mechanical and wetting properties.
- the alloy comprises 93% -98% by weight of bismuth (Bi),
- Ni nickel
- the alloy comprises only bismuth (Bi), silver (Ag) and nickel
- the alloy comprises 94% -96% by weight of bismuth (Bi), 3% -6% by weight of silver (Ag) and 0.2% -0.5% by weight of nickel (Ni ).
- the alloy comprises 3% -6% by weight of silver (Ag) and 0.2% -0.5% by weight of nickel (Ni).
- the alloy preferably comprises between 94% -96% by weight of bismuth (Bi), preferably between 93.5% -96.8% by weight of bismuth (Bi).
- the alloy comprises more than 2.9% by weight of silver (Ag), more preferably less than 4.8% by weight of silver (Ag).
- the alloy comprises 3% -6% by weight of silver (Ag).
- the alloy comprises 0.2% -0.5% by weight of nickel (Ni).
- the alloy comprises:
- Ni nickel
- a melting range of 260 ° C-330 ° C is obtained.
- the alloy comprises:
- Ni nickel
- the alloy comprises:
- the alloy consists of:
- Ni nickel
- the alloy comprises:
- Ni nickel
- the alloy comprises:
- Ni nickel
- the alloy consists of 96% by weight of bismuth (Bi),
- Ni nickel
- the alloy comprises:
- Ni nickel
- the alloy comprises:
- Ni nickel
- the alloy consists of:
- Ni nickel
- the alloy comprises: 94% -96% by weight of bismuth (Bi),
- Ni nickel
- the alloy comprises:
- Ni nickel
- the alloy consists of
- Ni nickel
- the invention also relates to a composite alloy for brazing comprising a brazing alloy as presented above and 5% -60% by weight of silver or copper particles.
- the composite alloy comprises between 5% and 25% by weight of silver or copper particles.
- the composite alloy comprises between 20% and 60% by weight of silver or copper particles, preferably silver.
- the composite alloy for brazing consists only of an alloy of brazing and particles of silver or copper. Such a composite alloy of solder improves the thermal and electrical conductivity.
- the silver or copper particles have dimensions between 1 and 30 micrometers.
- the composite alloy for brazing consists of the alloy of brazing and particles of silver or copper.
- the invention further relates to the use of a composite alloy as presented above for soldering a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied by means of welding. wave or selective soldering.
- SMD surface mounting device
- the invention further relates to the use of a composite alloy as presented above for soldering a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied in the form of a paste. .
- the invention further relates to the use of a composite alloy as presented above for a method of remelting electronic components.
- a brazing alloy is proposed for wave soldering, for selective soldering and in particular for a method of soldering electronic components by reflow.
- Such an alloy can also be used for the manufacture or connection of electronic components, in particular, semiconductors.
- a lead-free solder alloy having a composition comprising:
- Ni nickel
- Such a brazing alloy has a melting point which is between 260 ° C and 400 ° C and has very good properties in the mechanical, electrical and wetting fields. In addition, the absence of lead makes it possible to comply with the new environmental standards.
- the alloy comprises
- Ni nickel
- brazing alloys have melting temperatures and phase diagrams which are optimal for implementing a reflow process.
- the Bi96Ag3,8NiO, 2 alloy consists of: 96% by weight of bismuth (Bi),
- a melting range of 260 ° C-275 ° C is obtained.
- the alloy Bi96Ag3,5NiO, 5 consists of
- the Bi94Ag5,8NiO, 2 alloy consists of:
- the alloy Bi95Ag4,5NiO, 5 consists of
- Ni nickel
- the alloy Bi95Ag4,7NiO, 3 consists of
- Ni nickel
- a melting range of 260 ° C-300 ° C is obtained.
- the alloy Bi97Ag2,9NiO, 1 consists of
- Ni nickel
- the alloy can be used in wave soldering, selective soldering, dip soldering, as part of wire, for placement of CMS and for applications dough-in-dough.
- the alloy is packaged in the form of bars, preforms, ingots, powder, solder paste or solder cream.
- the alloy according to the invention with silver or copper particles having a dimension between 1 and 30 micrometers in order to form a composite alloy.
- silver or copper particles are added in an amount of 5 to 25% by weight of the mixture.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1859694A FR3087369B1 (en) | 2018-10-19 | 2018-10-19 | SOLDERING ALLOY AND USE OF SUCH ALLOY |
PCT/EP2019/078217 WO2020079151A1 (en) | 2018-10-19 | 2019-10-17 | Composite alloy for solder and use of such an alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3867006A1 true EP3867006A1 (en) | 2021-08-25 |
Family
ID=65494361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19797183.1A Pending EP3867006A1 (en) | 2018-10-19 | 2019-10-17 | Composite alloy for solder and use of such an alloy |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3867006A1 (en) |
CN (1) | CN112867582A (en) |
FR (1) | FR3087369B1 (en) |
WO (1) | WO2020079151A1 (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000288772A (en) * | 1999-02-02 | 2000-10-17 | Nippon Genma:Kk | Lead-free solder |
JP3671815B2 (en) * | 2000-06-12 | 2005-07-13 | 株式会社村田製作所 | Solder composition and soldered article |
KR100700233B1 (en) * | 2001-05-28 | 2007-03-26 | 허니웰 인터내셔날 인코포레이티드 | Compositions, methods and devices for high temperature lead-free solder |
TW504427B (en) * | 2001-09-25 | 2002-10-01 | Honeywell Int Inc | Composition, methods and devices for high temperature lead-free solder |
CN101537545A (en) * | 2008-03-21 | 2009-09-23 | 喜星素材株式会社 | Lead-free alloy for low-temperature welding welder |
CN101332544A (en) * | 2008-05-28 | 2008-12-31 | 广州瀚源电子科技有限公司 | High-melting point lead-free solder and production technique thereof |
CN102233488A (en) * | 2010-05-07 | 2011-11-09 | 宁波卓诚焊锡科技有限公司 | Lead-free solder |
MX2014001204A (en) * | 2011-08-02 | 2014-08-22 | Alpha Metals | Solder compositions. |
CN106392366B (en) * | 2016-12-02 | 2019-07-19 | 北京康普锡威科技有限公司 | A kind of BiSbAg system high temperature lead-free solder and preparation method thereof |
-
2018
- 2018-10-19 FR FR1859694A patent/FR3087369B1/en active Active
-
2019
- 2019-10-17 CN CN201980068588.5A patent/CN112867582A/en active Pending
- 2019-10-17 WO PCT/EP2019/078217 patent/WO2020079151A1/en unknown
- 2019-10-17 EP EP19797183.1A patent/EP3867006A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN112867582A (en) | 2021-05-28 |
FR3087369A1 (en) | 2020-04-24 |
WO2020079151A1 (en) | 2020-04-23 |
FR3087369B1 (en) | 2021-06-04 |
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