EP3867006A1 - Composite alloy for solder and use of such an alloy - Google Patents

Composite alloy for solder and use of such an alloy

Info

Publication number
EP3867006A1
EP3867006A1 EP19797183.1A EP19797183A EP3867006A1 EP 3867006 A1 EP3867006 A1 EP 3867006A1 EP 19797183 A EP19797183 A EP 19797183A EP 3867006 A1 EP3867006 A1 EP 3867006A1
Authority
EP
European Patent Office
Prior art keywords
weight
alloy
silver
bismuth
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19797183.1A
Other languages
German (de)
French (fr)
Inventor
Anne Marie LAUGT
Aurélie DUCOLOMBIER
Marc WARY
Raphaël PESCI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dehon Sas
Original Assignee
Dehon Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dehon Sas filed Critical Dehon Sas
Publication of EP3867006A1 publication Critical patent/EP3867006A1/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth

Definitions

  • the present invention relates to a solder alloy composition which is free of lead.
  • solder alloy comprising lead and tin, which has a high melting point of approximately 300 ° C.
  • a brazing alloy for example Pb92.5Sn5Ag2.5, makes it possible to produce multiple and rapid assemblies.
  • such an alloy makes it possible to manufacture components or first printed circuits which will then themselves be assembled with a lead-free alloy with a lower reflow temperature.
  • this alloy or the components derived from this alloy are used for applications at more than 200 ° C. We are therefore looking for an alloy or process that does not melt below 230 ° C or ideally 270 ° C and as reliable in terms of thermal cycling, electrical and thermal conductivity and mechanical resistance as the leaded alloy.
  • the invention relates to a lead-free solder alloy having a composition comprising:
  • Ni nickel
  • Such an alloy is advantageous since it has a melting temperature between 260 ° C and 400 ° C. In addition, the alloy has very good mechanical and wetting properties.
  • the alloy comprises 93% -98% by weight of bismuth (Bi),
  • Ni nickel
  • the alloy comprises only bismuth (Bi), silver (Ag) and nickel
  • the alloy comprises 94% -96% by weight of bismuth (Bi), 3% -6% by weight of silver (Ag) and 0.2% -0.5% by weight of nickel (Ni ).
  • the alloy comprises 3% -6% by weight of silver (Ag) and 0.2% -0.5% by weight of nickel (Ni).
  • the alloy preferably comprises between 94% -96% by weight of bismuth (Bi), preferably between 93.5% -96.8% by weight of bismuth (Bi).
  • the alloy comprises more than 2.9% by weight of silver (Ag), more preferably less than 4.8% by weight of silver (Ag).
  • the alloy comprises 3% -6% by weight of silver (Ag).
  • the alloy comprises 0.2% -0.5% by weight of nickel (Ni).
  • the alloy comprises:
  • Ni nickel
  • a melting range of 260 ° C-330 ° C is obtained.
  • the alloy comprises:
  • Ni nickel
  • the alloy comprises:
  • the alloy consists of:
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy consists of 96% by weight of bismuth (Bi),
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy consists of:
  • Ni nickel
  • the alloy comprises: 94% -96% by weight of bismuth (Bi),
  • Ni nickel
  • the alloy comprises:
  • Ni nickel
  • the alloy consists of
  • Ni nickel
  • the invention also relates to a composite alloy for brazing comprising a brazing alloy as presented above and 5% -60% by weight of silver or copper particles.
  • the composite alloy comprises between 5% and 25% by weight of silver or copper particles.
  • the composite alloy comprises between 20% and 60% by weight of silver or copper particles, preferably silver.
  • the composite alloy for brazing consists only of an alloy of brazing and particles of silver or copper. Such a composite alloy of solder improves the thermal and electrical conductivity.
  • the silver or copper particles have dimensions between 1 and 30 micrometers.
  • the composite alloy for brazing consists of the alloy of brazing and particles of silver or copper.
  • the invention further relates to the use of a composite alloy as presented above for soldering a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied by means of welding. wave or selective soldering.
  • SMD surface mounting device
  • the invention further relates to the use of a composite alloy as presented above for soldering a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied in the form of a paste. .
  • the invention further relates to the use of a composite alloy as presented above for a method of remelting electronic components.
  • a brazing alloy is proposed for wave soldering, for selective soldering and in particular for a method of soldering electronic components by reflow.
  • Such an alloy can also be used for the manufacture or connection of electronic components, in particular, semiconductors.
  • a lead-free solder alloy having a composition comprising:
  • Ni nickel
  • Such a brazing alloy has a melting point which is between 260 ° C and 400 ° C and has very good properties in the mechanical, electrical and wetting fields. In addition, the absence of lead makes it possible to comply with the new environmental standards.
  • the alloy comprises
  • Ni nickel
  • brazing alloys have melting temperatures and phase diagrams which are optimal for implementing a reflow process.
  • the Bi96Ag3,8NiO, 2 alloy consists of: 96% by weight of bismuth (Bi),
  • a melting range of 260 ° C-275 ° C is obtained.
  • the alloy Bi96Ag3,5NiO, 5 consists of
  • the Bi94Ag5,8NiO, 2 alloy consists of:
  • the alloy Bi95Ag4,5NiO, 5 consists of
  • Ni nickel
  • the alloy Bi95Ag4,7NiO, 3 consists of
  • Ni nickel
  • a melting range of 260 ° C-300 ° C is obtained.
  • the alloy Bi97Ag2,9NiO, 1 consists of
  • Ni nickel
  • the alloy can be used in wave soldering, selective soldering, dip soldering, as part of wire, for placement of CMS and for applications dough-in-dough.
  • the alloy is packaged in the form of bars, preforms, ingots, powder, solder paste or solder cream.
  • the alloy according to the invention with silver or copper particles having a dimension between 1 and 30 micrometers in order to form a composite alloy.
  • silver or copper particles are added in an amount of 5 to 25% by weight of the mixture.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

The invention relates to a composite alloy for lead-free solder, having a composition comprising 92.4% - 98.4% by weight of bismuth (Bi), 1.5% - 7% by weight of silver (Ag) and 0.1% - 0.6% by weight of nickel (Ni). Such an alloy has good mechanical and electrical properties as well as good wetting properties.

Description

ALLIAGE COMPOSITE POUR BRASURE ET UTILISATION D’UN TEL ALLIAGE  COMPOSITE ALLOY FOR SOLDERING AND USE OF SUCH AN ALLOY
DOMAINE TECHNIQUE GENERAL ET ART ANTERIEUR GENERAL TECHNICAL AREA AND PRIOR ART
La présente invention concerne une composition d’alliage de brasure qui soit dépourvu de plomb. The present invention relates to a solder alloy composition which is free of lead.
De manière connue, pour fabriquer ou connecter des composants électroniques entre eux ou à une carte électronique, il est connu d’utiliser un alliage de brasure comportant du plomb et étain, qui a un haut point de fusion d'environ 300°C. Un tel alliage de brasure, par exemple Pb92.5Sn5Ag2.5, permet de réaliser des assemblages multiples et rapides. En particulier, un tel alliage permet de fabriquer des composants ou des premiers circuits imprimés qui seront ensuite eux-mêmes assemblés avec un alliage sans plomb avec une température de refusion plus basse. In known manner, to manufacture or connect electronic components to each other or to an electronic card, it is known to use a solder alloy comprising lead and tin, which has a high melting point of approximately 300 ° C. Such a brazing alloy, for example Pb92.5Sn5Ag2.5, makes it possible to produce multiple and rapid assemblies. In particular, such an alloy makes it possible to manufacture components or first printed circuits which will then themselves be assembled with a lead-free alloy with a lower reflow temperature.
Dans le domaine pétrolier, aéronautique, automobile ou autre, cet alliage ou les composants issus de cet alliage sont utilisés pour les applications à plus de 200°C. On recherche donc un alliage ou un procédé ne refondant pas en-dessous de 230°C ou idéalement de 270°C et aussi fiable en termes de cyclages thermiques, de conductivité électrique et thermique et de résistance mécanique que l’alliage plombé. In the petroleum, aeronautic, automotive or other fields, this alloy or the components derived from this alloy are used for applications at more than 200 ° C. We are therefore looking for an alloy or process that does not melt below 230 ° C or ideally 270 ° C and as reliable in terms of thermal cycling, electrical and thermal conductivity and mechanical resistance as the leaded alloy.
Un but de l'invention est donc de fournir un alliage de brasure dont la température de fusion est supérieure à 230°C, de préférence à 270°C avec une bonne fiabilité pour une utilisation dans une variété de procédés de soudage, tels que brasage à la vague, brasage par refusion, brasage au trempé, brasage de fil et brasage sélectif. It is therefore an object of the invention to provide a brazing alloy whose melting temperature is greater than 230 ° C, preferably 270 ° C with good reliability for use in a variety of welding processes, such as brazing wave soldering, reflow soldering, dip soldering, wire soldering and selective soldering.
PRESENTATION GENERALE DE L’INVENTION GENERAL PRESENTATION OF THE INVENTION
A cet effet, l’invention concerne un alliage de brasure sans plomb ayant une composition comprenant : To this end, the invention relates to a lead-free solder alloy having a composition comprising:
92,4%-98,4% en poids de bismuth (Bi),  92.4% -98.4% by weight of bismuth (Bi),
1 ,5%-7% en poids d'argent (Ag) et  1.5% -7% by weight of silver (Ag) and
0, 1 %-0,6% en poids de nickel (Ni).  0.1% -0.6% by weight of nickel (Ni).
Un tel alliage est avantageux étant donné qu’il possède une température de fusion comprise entre 260°C et 400°C. En outre, l’alliage possède de très bonnes propriétés mécaniques et de mouillage. Such an alloy is advantageous since it has a melting temperature between 260 ° C and 400 ° C. In addition, the alloy has very good mechanical and wetting properties.
De manière préférée, l’alliage comprend 93%-98% en poids de bismuth (Bi), Preferably, the alloy comprises 93% -98% by weight of bismuth (Bi),
1 ,5%-7% en poids d'argent (Ag) et  1.5% -7% by weight of silver (Ag) and
0, 1 %-0,6% en poids de nickel (Ni).  0.1% -0.6% by weight of nickel (Ni).
De manière préférée, l’alliage comprend uniquement du bismuth (Bi), de l'argent (Ag) et du nickelPreferably, the alloy comprises only bismuth (Bi), silver (Ag) and nickel
(Ni). (Or).
De préférence encore, l’alliage comprend 94%-96% en poids de bismuth (Bi), 3%-6% en poids d'argent (Ag) et 0,2%-0,5% en poids de nickel (Ni). More preferably, the alloy comprises 94% -96% by weight of bismuth (Bi), 3% -6% by weight of silver (Ag) and 0.2% -0.5% by weight of nickel (Ni ).
De préférence encore, l’alliage comprend 3%-6% en poids d'argent (Ag) et 0,2%-0,5% en poids de nickel (Ni). L’alliage comprend de préférence, entre 94%-96% en en poids de bismuth (Bi), de préférence, entre 93,5%-96,8% en poids de bismuth (Bi). More preferably, the alloy comprises 3% -6% by weight of silver (Ag) and 0.2% -0.5% by weight of nickel (Ni). The alloy preferably comprises between 94% -96% by weight of bismuth (Bi), preferably between 93.5% -96.8% by weight of bismuth (Bi).
De préférence, l’alliage comprend plus de 2,9% en poids d'argent (Ag), de préférence encore, moins de 4,8% en poids d'argent (Ag). Preferably, the alloy comprises more than 2.9% by weight of silver (Ag), more preferably less than 4.8% by weight of silver (Ag).
De préférence, l’alliage comprend 3%-6% en poids d'argent (Ag). Preferably, the alloy comprises 3% -6% by weight of silver (Ag).
De préférence, l’alliage comprend 0,2%-0,5% en poids de nickel (Ni). Preferably, the alloy comprises 0.2% -0.5% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend : According to one aspect of the invention, the alloy comprises:
94,5%-97% en poids de bismuth (Bi),  94.5% -97% by weight of bismuth (Bi),
- 2,9%-4,8% en poids d'argent (Ag), et  - 2.9% -4.8% by weight of silver (Ag), and
0, 1 %-0,7% en poids de nickel (Ni).  0.1% -0.7% by weight of nickel (Ni).
On obtient une plage de fusion de 260°C-330°C. A melting range of 260 ° C-330 ° C is obtained.
Selon un aspect de l’invention, l’alliage comprend : According to one aspect of the invention, the alloy comprises:
95%-97% en poids de bismuth (Bi),  95% -97% by weight of bismuth (Bi),
3%-4% en poids d'argent (Ag), et  3% -4% by weight of silver (Ag), and
0, 1 %-0,3% en poids de nickel (Ni).  0.1% -0.3% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend : According to one aspect of the invention, the alloy comprises:
95,7%-96,9% en poids de bismuth (Bi),  95.7% -96.9% by weight of bismuth (Bi),
3%-4% en poids d'argent (Ag), et  3% -4% by weight of silver (Ag), and
0, 1 %-0,3% en poids de nickel (Ni). De manière préférée, l’alliage est constitué de :0.1% -0.3% by weight of nickel (Ni). Preferably, the alloy consists of:
96% en poids de bismuth (Bi), 96% by weight of bismuth (Bi),
3,8% en poids d'argent (Ag) et de  3.8% by weight of silver (Ag) and
0,2% en poids de nickel (Ni).  0.2% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend : According to one aspect of the invention, the alloy comprises:
95%-97% en poids de bismuth (Bi), 95% -97% by weight of bismuth (Bi),
3%-4% en poids d'argent (Ag), 3% -4% by weight of silver (Ag),
0,4%-0,6% en poids de nickel (Ni).  0.4% -0.6% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend : According to one aspect of the invention, the alloy comprises:
95,4%-96,6% en poids de bismuth (Bi), 95.4% -96.6% by weight of bismuth (Bi),
3%-4% en poids d'argent (Ag), 3% -4% by weight of silver (Ag),
0,4%-0,6% en poids de nickel (Ni).  0.4% -0.6% by weight of nickel (Ni).
De manière préférée, l’alliage est constitué de 96% en poids de bismuth (Bi), Preferably, the alloy consists of 96% by weight of bismuth (Bi),
3,5% en poids d'argent (Ag) et de  3.5% by weight of silver (Ag) and
0,5% en poids de nickel (Ni).  0.5% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend : According to one aspect of the invention, the alloy comprises:
93%-95% en poids de bismuth (Bi), 93% -95% by weight of bismuth (Bi),
5%-6% en poids d'argent (Ag) et 5% -6% by weight of silver (Ag) and
0,1 -0, 3% en poids de nickel (Ni).  0.1 -0.3% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend : According to one aspect of the invention, the alloy comprises:
93,7%-94,9% en poids de bismuth (Bi), 93.7% -94.9% by weight of bismuth (Bi),
5%-6% en poids d'argent (Ag) et 5% -6% by weight of silver (Ag) and
0,1 -0, 3% en poids de nickel (Ni).  0.1 -0.3% by weight of nickel (Ni).
De manière préférée, l’alliage est constitué de : Preferably, the alloy consists of:
94% en poids de bismuth (Bi),  94% by weight of bismuth (Bi),
5,8% en poids d'argent (Ag) et de  5.8% by weight of silver (Ag) and
0,2% en poids de nickel (Ni).  0.2% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend : 94%-96% en poids de bismuth (Bi), According to one aspect of the invention, the alloy comprises: 94% -96% by weight of bismuth (Bi),
- 4%-5% en poids d'argent (Ag),  - 4% -5% by weight of silver (Ag),
0,4%-0,6% en poids de nickel (Ni).  0.4% -0.6% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend : According to one aspect of the invention, the alloy comprises:
94,4%-95,6% en poids de bismuth (Bi),  94.4% -95.6% by weight of bismuth (Bi),
- 4%-5% en poids d'argent (Ag),  - 4% -5% by weight of silver (Ag),
0,4%-0,6% en poids de nickel (Ni).  0.4% -0.6% by weight of nickel (Ni).
De manière préférée, l’alliage est constitué de Preferably, the alloy consists of
95% en poids de bismuth (Bi),  95% by weight of bismuth (Bi),
- 4,5% en poids d'argent (Ag) et de  - 4.5% by weight of silver (Ag) and
0,5% en poids de nickel (Ni).  0.5% by weight of nickel (Ni).
L’invention concerne aussi un alliage composite pour brasure comprenant un alliage de brasure tel que présenté précédemment et 5%-60% en poids de particules d’argent ou de cuivre. Selon un aspect, l’alliage composite comprend entre 5% et 25% en en poids de particules d’argent ou de cuivre. Selon un autre aspect préféré, l’alliage composite comprend entre 20% et 60% en en poids de particules d’argent ou de cuivre, de préférence, de l’argent. De manière préférée, l’alliage composite pour brasure est constitué uniquement d’un alliage de brasure et de particules d’argent ou de cuivre. Un tel alliage composite de brasure permet d’améliorer la conductivité thermique et électrique. The invention also relates to a composite alloy for brazing comprising a brazing alloy as presented above and 5% -60% by weight of silver or copper particles. According to one aspect, the composite alloy comprises between 5% and 25% by weight of silver or copper particles. According to another preferred aspect, the composite alloy comprises between 20% and 60% by weight of silver or copper particles, preferably silver. Preferably, the composite alloy for brazing consists only of an alloy of brazing and particles of silver or copper. Such a composite alloy of solder improves the thermal and electrical conductivity.
De manière préférée, les particules d’argent ou de cuivre possèdent des dimensions comprises entre 1 et 30 micromètres. Preferably, the silver or copper particles have dimensions between 1 and 30 micrometers.
De préférence, l’alliage composite pour brasure est constitué de l’alliage de brasure et de particules d’argent ou de cuivre. Preferably, the composite alloy for brazing consists of the alloy of brazing and particles of silver or copper.
L’invention concerne en outre l’utilisation d'un alliage composite tel que présenté précédemment pour souder un boîtier de composants électroniques et / ou un dispositif de montage en surface (SMD) à un substrat, l'alliage étant appliqué au moyen de soudage à la vague ou brasage sélectif. The invention further relates to the use of a composite alloy as presented above for soldering a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied by means of welding. wave or selective soldering.
L’invention concerne en outre l’utilisation d'un alliage composite tel que présenté précédemment pour souder un boîtier de composants électroniques et / ou un dispositif de montage en surface (SMD) à un substrat, l'alliage étant appliqué sous forme de pâte. L’invention concerne en outre l’utilisation d'un alliage composite tel que présenté précédemment pour un procédé de refusion de composants électroniques. The invention further relates to the use of a composite alloy as presented above for soldering a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied in the form of a paste. . The invention further relates to the use of a composite alloy as presented above for a method of remelting electronic components.
DESCRIPTION D’UN OU PLUSIEURS MODES DE REALISATION ET DE MISE EN OEUVRE DESCRIPTION OF ONE OR MORE MODES OF IMPLEMENTATION AND IMPLEMENTATION
Il est proposé un alliage de brasure pour le brasage à la vague, pour le brasage sélectif et notamment pour un procédé de brasage de composants électroniques par refusion. Un tel alliage peut également être utilisé pour la fabrication ou la connexion de composants électroniques, notamment, des semiconducteurs. A brazing alloy is proposed for wave soldering, for selective soldering and in particular for a method of soldering electronic components by reflow. Such an alloy can also be used for the manufacture or connection of electronic components, in particular, semiconductors.
Selon l’invention, il est proposé un alliage de brasure sans plomb ayant une composition comprenant : According to the invention, there is provided a lead-free solder alloy having a composition comprising:
92,4%-98,4% en poids de bismuth (Bi),  92.4% -98.4% by weight of bismuth (Bi),
1 ,5%-7% en poids d'argent (Ag) et  1.5% -7% by weight of silver (Ag) and
0, 1 %-0,6% en poids de nickel (Ni).  0.1% -0.6% by weight of nickel (Ni).
Un tel alliage de brasure présente un point de fusion qui se situe entre 260°C et 400°C et présente des très bonnes propriétés dans les domaines mécaniques, électrique et de mouillage. En outre, l’absence de plomb permet de respecter les nouvelles normes environnementales. Such a brazing alloy has a melting point which is between 260 ° C and 400 ° C and has very good properties in the mechanical, electrical and wetting fields. In addition, the absence of lead makes it possible to comply with the new environmental standards.
De manière préférée, l’alliage comprend Preferably, the alloy comprises
93%-98% en poids de bismuth (Bi),  93% -98% by weight of bismuth (Bi),
1 ,5%-7% en poids d'argent (Ag) et  1.5% -7% by weight of silver (Ag) and
0, 1 %-0,6% en poids de nickel (Ni).  0.1% -0.6% by weight of nickel (Ni).
Après une phase de test, quatre alliages de brasure particuliers ont été sélectionnés : After a test phase, four particular brazing alloys were selected:
- Bi96Ag3,8NiO,2  - Bi96Ag3,8NiO, 2
- Bi96Ag3,5NiO,5  - Bi96Ag3,5NiO, 5
- Bi94Ag5,8NiO,2  - Bi94Ag5,8NiO, 2
- Bi95Ag4,5NiO,5  - Bi95Ag4,5NiO, 5
- Bi95Ag4,7NiO,3  - Bi95Ag4,7NiO, 3
- Bi97Ag2,9NiO,1 .  - Bi97Ag2,9NiO, 1.
Ces alliages de brasure possèdent des températures de fusion et des diagrammes de phase qui sont optimaux pour mettre en oeuvre un procédé de refusion. These brazing alloys have melting temperatures and phase diagrams which are optimal for implementing a reflow process.
L’alliage Bi96Ag3,8NiO,2 est constitué de : 96% en poids de bismuth (Bi), The Bi96Ag3,8NiO, 2 alloy consists of: 96% by weight of bismuth (Bi),
3,8% en poids d'argent (Ag) et de 0,2% en poids de nickel (Ni).  3.8% by weight of silver (Ag) and 0.2% by weight of nickel (Ni).
On obtient une plage de fusion de 260°C-275°C. A melting range of 260 ° C-275 ° C is obtained.
L’alliage Bi96Ag3,5NiO,5 est constitué de The alloy Bi96Ag3,5NiO, 5 consists of
96% en poids de bismuth (Bi),  96% by weight of bismuth (Bi),
3,5% en poids d'argent (Ag) et de 0,5% en poids de nickel (Ni).  3.5% by weight of silver (Ag) and 0.5% by weight of nickel (Ni).
L’alliage Bi94Ag5,8NiO,2 est constitué de : The Bi94Ag5,8NiO, 2 alloy consists of:
94% en poids de bismuth (Bi),  94% by weight of bismuth (Bi),
5,8% en poids d'argent (Ag) et de 0,2% en poids de nickel (Ni).  5.8% by weight of silver (Ag) and 0.2% by weight of nickel (Ni).
L’alliage Bi95Ag4,5NiO,5 est constitué de The alloy Bi95Ag4,5NiO, 5 consists of
95% en poids de bismuth (Bi),  95% by weight of bismuth (Bi),
- 4,5% en poids d'argent (Ag) et de  - 4.5% by weight of silver (Ag) and
0,5% en poids de nickel (Ni).  0.5% by weight of nickel (Ni).
L’alliage Bi95Ag4,7NiO,3 est constitué de The alloy Bi95Ag4,7NiO, 3 consists of
95% en poids de bismuth (Bi),  95% by weight of bismuth (Bi),
- 4,7% en poids d'argent (Ag) et de  - 4.7% by weight of silver (Ag) and of
0,3% en poids de nickel (Ni).  0.3% by weight of nickel (Ni).
On obtient une plage de fusion de 260°C-300°C. A melting range of 260 ° C-300 ° C is obtained.
L’alliage Bi97Ag2,9NiO,1 est constitué de The alloy Bi97Ag2,9NiO, 1 consists of
97% en poids de bismuth (Bi),  97% by weight of bismuth (Bi),
- 2,9% en poids d'argent (Ag) et de  - 2.9% by weight of silver (Ag) and
0,1 % en poids de nickel (Ni).  0.1% by weight of nickel (Ni).
On obtient une plage de fusion de 260°C-300°C. Bien que l'utilisation en tant que pâte à braser soit particulièrement préférée, l'alliage peut être utilisé en soudage à la vague, brasage sélectif, brasage au trempé, en tant que partie de fil, pour le placement de CMS et pour des applications pâte-en-pâte. De manière préférée, l’alliage est conditionné sous forme de barres, de préformes, de lingots, de poudre, de pâte à braser ou de crème à braser. A melting range of 260 ° C-300 ° C is obtained. Although use as solder paste is particularly preferred, the alloy can be used in wave soldering, selective soldering, dip soldering, as part of wire, for placement of CMS and for applications dough-in-dough. Preferably, the alloy is packaged in the form of bars, preforms, ingots, powder, solder paste or solder cream.
De manière optionnelle, pour rendre une brasure plus conductrice thermiquement et électriquement, afin de faciliter notamment la dissipation de chaleur au niveau de la jonction, il est proposé de mélanger à l’alliage selon l’invention avec des particules d’argent ou de cuivre ayant une dimension comprise entre 1 et 30 micromètres afin de former un alliage composite. De préférence, des particules d’argent ou de cuivre sont ajoutées à hauteur de 5 à 25% en poids du mélange. Ces particules d’argent ou de cuivre contribuent à augmenter la conductivité thermique et électrique afin de faciliter notamment la dissipation de chaleur au niveau de la jonction avec des composants électroniques. Optionally, to make a solder more thermally and electrically conductive, in order to facilitate in particular the dissipation of heat at the junction, it is proposed to mix the alloy according to the invention with silver or copper particles having a dimension between 1 and 30 micrometers in order to form a composite alloy. Preferably, silver or copper particles are added in an amount of 5 to 25% by weight of the mixture. These silver or copper particles help to increase thermal and electrical conductivity, in particular to facilitate heat dissipation at the junction with electronic components.

Claims

REVENDICATIONS
1. Alliage composite pour brasure comprenant : 1. Composite alloy for brazing comprising:
• un alliage de brasure sans plomb ayant une composition comprenant :  • a lead-free solder alloy having a composition comprising:
i. 92,4%-98,4% en poids de bismuth (Bi),  i. 92.4% -98.4% by weight of bismuth (Bi),
ii. 1 ,5%-7% en poids d'argent (Ag) et  ii. 1.5% -7% by weight of silver (Ag) and
iii. 0,1 %-0,7% en poids de nickel (Ni), et  iii. 0.1% -0.7% by weight of nickel (Ni), and
• 5%-60% en poids de particules d’argent ou de cuivre, de préférence, entre 20 et 60%.  • 5% -60% by weight of silver or copper particles, preferably between 20 and 60%.
2. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend :2. Composite alloy according to claim 1, in which the brazing alloy comprises:
• 92,4%-98,4% en poids de bismuth (Bi), • 92.4% -98.4% by weight of bismuth (Bi),
• 1 ,5%-7% en poids d'argent (Ag) et  • 1.5% -7% by weight of silver (Ag) and
• 0, 1 %-0,7% en poids de nickel (Ni), de préférence, entre 0, 1 %-0,6%.  • 0.1% -0.7% by weight of nickel (Ni), preferably between 0.1% -0.6%.
3. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend :3. Composite alloy according to claim 1, in which the brazing alloy comprises:
• 94,5%-97% en poids de bismuth (Bi), 94.5% -97% by weight of bismuth (Bi),
• 2,9%-4,8% en poids d'argent (Ag) et  • 2.9% -4.8% by weight of silver (Ag) and
• 0, 1 %-0,7% en poids de nickel (Ni).  • 0.1% -0.7% by weight of nickel (Ni).
4. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend uniquement du bismuth (Bi), de l'argent (Ag) et du nickel (Ni). 4. The composite alloy according to claim 1, in which the brazing alloy only comprises bismuth (Bi), silver (Ag) and nickel (Ni).
5. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend 93,5%-96,8% en poids de bismuth (Bi). 5. A composite alloy according to claim 1 wherein the brazing alloy comprises 93.5% -96.8% by weight of bismuth (Bi).
6. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend 3%- 6% en poids d'argent (Ag). 6. Composite alloy according to claim 1 wherein the brazing alloy comprises 3% - 6% by weight of silver (Ag).
7. Alliage selon l’une des revendications 1 à 6 comprenant 0,2-0, 5% en poids de nickel (Ni). 7. Alloy according to one of claims 1 to 6 comprising 0.2-0.5% by weight of nickel (Ni).
8. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend :8. Composite alloy according to claim 1, in which the brazing alloy comprises:
• 93,5%-96,8% en poids de bismuth (Bi), • 93.5% -96.8% by weight of bismuth (Bi),
• 3%-6% en poids d'argent (Ag) et  • 3% -6% by weight of silver (Ag) and
• 0,2%-0,5% en poids de nickel (Ni).  • 0.2% -0.5% by weight of nickel (Ni).
9. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend : • 95,7%-96,9% en poids de bismuth (Bi), 9. Composite alloy according to claim 1, in which the brazing alloy comprises: • 95.7% -96.9% by weight of bismuth (Bi),
• 3%-4% en poids d'argent (Ag),  • 3% -4% by weight of silver (Ag),
• 0, 1 %-0,3% en poids de nickel (Ni).  • 0.1% -0.3% by weight of nickel (Ni).
10. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure est constitué de : 10. Composite alloy according to claim 1, in which the brazing alloy consists of:
• 96% en poids de bismuth (Bi),  • 96% by weight of bismuth (Bi),
• 3,8% en poids d'argent (Ag),  • 3.8% by weight of silver (Ag),
• 0,2% en poids de nickel (Ni).  • 0.2% by weight of nickel (Ni).
11. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend :11. Composite alloy according to claim 1, in which the brazing alloy comprises:
• 95,4%-96,6% en poids de bismuth (Bi), • 95.4% -96.6% by weight of bismuth (Bi),
• 3%-4% en poids d'argent (Ag),  • 3% -4% by weight of silver (Ag),
• 0,4-0, 6% en poids de nickel (Ni).  • 0.4-0.6% by weight of nickel (Ni).
12. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure est constitué de : 12. Composite alloy according to claim 1, in which the brazing alloy consists of:
• 96% en poids de bismuth (Bi),  • 96% by weight of bismuth (Bi),
• 3,5% en poids d'argent (Ag),  • 3.5% by weight of silver (Ag),
• 0,5% en poids de nickel (Ni).  • 0.5% by weight of nickel (Ni).
13. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend :13. A composite alloy according to claim 1 in which the brazing alloy comprises:
• 93,7%-94,9% en poids de bismuth (Bi), • 93.7% -94.9% by weight of bismuth (Bi),
• 5%-6% en poids d'argent (Ag),  • 5% -6% by weight of silver (Ag),
• 0, 1 %-0,3% en poids de nickel (Ni).  • 0.1% -0.3% by weight of nickel (Ni).
14. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure est constitué de : 14. Composite alloy according to claim 1, in which the brazing alloy consists of:
• 94% en poids de bismuth (Bi),  94% by weight of bismuth (Bi),
• 5,8% en poids d'argent (Ag),  • 5.8% by weight of silver (Ag),
• 0,2% en poids de nickel (Ni).  • 0.2% by weight of nickel (Ni).
15. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure comprend :15. A composite alloy according to claim 1 in which the brazing alloy comprises:
• 94,4%-95,6% en poids de bismuth (Bi), 94.4% -95.6% by weight of bismuth (Bi),
• 4%-5% en poids d'argent (Ag),  • 4% -5% by weight of silver (Ag),
• 0,4%-0,6% en poids de nickel (Ni). • 0.4% -0.6% by weight of nickel (Ni).
16. Alliage composite selon la revendication 1 dans lequel l’alliage de brasure est constitué de : 16. Composite alloy according to claim 1, in which the brazing alloy consists of:
• 95% en poids de bismuth (Bi),  • 95% by weight of bismuth (Bi),
• 4,5% en poids d'argent (Ag),  • 4.5% by weight of silver (Ag),
· 0,5% en poids de nickel (Ni).  0.5% by weight of nickel (Ni).
17. Alliage composite pour brasure selon l’une des revendications 1 à 16 dans lequel les particules d’argent ou de cuivre possèdent des dimensions comprises entre 1 et 30 micromètres. 17. Composite alloy for brazing according to one of claims 1 to 16 wherein the silver or copper particles have dimensions between 1 and 30 micrometers.
18. Utilisation d'un alliage composite selon l’une des revendications 1 à 17 pour un procédé de refusion de composants électroniques. 18. Use of a composite alloy according to one of claims 1 to 17 for a process for remelting electronic components.
19. Utilisation d'un alliage composite selon l’une des revendications 1 à 17 pour souder un boîtier de composants électroniques et / ou un dispositif de montage en surface (SMD) à un substrat, l'alliage étant appliqué sous forme de pâte. 19. Use of a composite alloy according to one of claims 1 to 17 for welding a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied in the form of a paste.
EP19797183.1A 2018-10-19 2019-10-17 Composite alloy for solder and use of such an alloy Pending EP3867006A1 (en)

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FR1859694A FR3087369B1 (en) 2018-10-19 2018-10-19 SOLDERING ALLOY AND USE OF SUCH ALLOY
PCT/EP2019/078217 WO2020079151A1 (en) 2018-10-19 2019-10-17 Composite alloy for solder and use of such an alloy

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FR3087369A1 (en) 2020-04-24

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